JP7822348B2 - Holding member, cutting table, cutting device, and method for manufacturing semiconductor device - Google Patents

Description

The present invention relates to a holding member, a cutting table, a cutting device, and a method for manufacturing a semiconductor device.

As shown in Patent Document 1, a conventional cutting device for cutting wafers has a chuck table that suction-holds the wafer and includes a disk-shaped holder made of porous ceramic and an outer ring surrounding the holder. The outer ring is positioned to correspond to the outer edge of the wafer and is constructed by laminating quartz glass layers with low surface roughness. This configuration prevents cutting debris generated when cutting the wafer from remaining on the surface of the quartz glass layer.

JP 2013-084755 A

On the other hand, from the standpoints of water resistance, ability to follow warping of the workpiece, and prevention of misalignment of the workpiece, elastic resins such as silicone-based resins and fluorine-based resins are used for the holding member (holding layer) that holds the workpiece. The holding member also has suction holes formed to adsorb and hold the workpiece.

However, because the above-mentioned holding member holds the workpiece in close contact with the elastic resin, there is a problem in that non-product parts that are produced when the workpiece is cut can stick to the holding member. While it is possible to wash away non-product parts that have stuck to the holding member with machining fluid such as cutting water, there are cases in which the non-product parts cannot be washed away. Furthermore, if the workpiece remains stuck to the holding member, there is a risk that the rotating blade of the cutting mechanism may be damaged.

The present invention was developed to solve the above problems, and its main objective is to prevent non-product parts resulting from cutting the object from sticking to the holding member.

In other words, the holding member of the present invention is a holding member that adsorbs and holds the workpiece on the cutting table, and is characterized in that multiple recesses are formed on the surface of the contact area that comes into contact with the non-product parts that are produced when the workpiece is cut, and the multiple recesses are connected to the outside of the contact area.

This invention, configured in this way, can prevent non-product parts that are generated when cutting the object to be cut from sticking to the holding member.

1 is a schematic diagram illustrating a configuration of a cutting device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view schematically showing the configuration of a cutting table of the embodiment. 1A is a plan view schematically showing the configuration of a substrate in the embodiment, and FIG. 1B is a plan view schematically showing the configuration of a holding member (particularly, a holding area). FIG. 2 is a plan view schematically illustrating the configuration (particularly the contact area) of the holding member of the embodiment. FIG. 2 is a partially enlarged plan view schematically showing the configuration of the holding member of the embodiment. FIG. 2 is a partially enlarged cross-sectional view schematically illustrating the configuration of a holding member of the embodiment. FIG. 10 is a partially enlarged plan view schematically showing the configuration of a holding member according to a modified embodiment. FIG. 10 is a partially enlarged cross-sectional view schematically illustrating the configuration of a holding member according to a modified embodiment.

Next, the technology related to the present invention will be explained in more detail using examples. However, the present invention is not limited to the following technology.

The holding member of Technology 1 of the present invention is a holding member that adsorbs and holds an object to be cut on a cutting table, and is characterized in that multiple recesses are formed on the surface of the contact area that comes into contact with the non-product parts that are produced when the object to be cut is cut, and the multiple recesses are connected to the outside of the contact area.

With this holding member, multiple recesses are formed on the surface of the contact area that comes into contact with the non-product parts, reducing the contact area between the holding member and the non-product parts, thereby reducing the sticking force and making it easier to remove the non-product parts. Furthermore, because the multiple recesses are connected to the outside of the contact area, processing fluid can easily flow between the holding member and the non-product parts, making it easier to remove the non-product parts. Therefore, non-product parts resulting from cutting the workpiece can be prevented from sticking to the holding member. Furthermore, the amount of processing fluid supplied can be reduced, thereby conserving processing fluid.

Specific embodiments of the holding member include a configuration in which multiple recesses are formed in a regular pattern, a configuration in which multiple recesses are formed irregularly, or a configuration in which multiple recesses are formed in an irregular shape. A configuration in which multiple recesses are formed in a regular pattern makes it easier to process the holding member. Therefore, in addition to the configuration of Technology 1 above, the holding member of Technology 2 according to the present invention preferably has multiple recesses that form a grid, stripe, or dot pattern in a planar view.

The cutting table of the third aspect of the present invention is a cutting table that holds an object by suction, and is characterized by having a holding member having the configuration of the first or second aspect of the present invention.
With this configuration, it is possible to prevent non-product parts that are generated when the object to be cut is cut from sticking to the holding member, and therefore it is possible to easily remove the non-product parts from the cutting table.

A cutting device according to Technology 4 of the present invention includes a cutting table that adsorbs and holds an object to be cut, and a cutting mechanism that cuts the object held on the cutting table, and the cutting table has a holding member having the configuration of Technology 1 or 2 above.
This configuration prevents non-product parts that are generated when the cutting object is cut from sticking to the holding member, making it easy to remove the non-product parts from the cutting table. Furthermore, preventing non-product parts from sticking also prevents damage to the rotary blade of the cutting mechanism that may result from the non-product parts sticking.

Technical Technique 5 of the present invention is a semiconductor device manufacturing method that uses the cutting device of Technical Technique 4 described above to cut a substrate on which multiple semiconductor devices are formed to produce individual semiconductor devices, and is characterized in that the substrate is held on the cutting table, and the substrate held on the cutting table is cut by the cutting mechanism.

<One embodiment of the present invention>
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a cutting device according to the present invention will be described below with reference to the drawings.
In addition, in all of the drawings shown below, for the sake of clarity, some parts are omitted or exaggerated as appropriate, and the same components are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

<Overall configuration of cutting device 100>
The cutting apparatus 100 of this embodiment cuts a substrate W, which is an object to be cut, into a plurality of cut products P.
Here, examples of the substrate W include a flip-chip substrate or a sealed substrate. A flip-chip substrate is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are flip-chip connected. A sealed substrate is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are connected, and which is molded with resin so as to seal at least the electronic elements. Examples of substrates that constitute the sealed substrate include lead frames and printed wiring boards, and other substrates that may also be used, such as semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, ceramic substrates, glass substrates, and resin substrates. Furthermore, the substrates that constitute the sealed substrate may or may not be wired.

Specifically, as shown in FIG. 1, the cutting device 100 comprises, as its components, a supply module 100A that supplies substrates W, a cutting module 100B that cuts the substrates W, and an inspection module 100C that inspects the cut products P that have been cut and separated. Each component is detachable and replaceable with respect to the other components. Note that when the substrates W are substrates on which multiple semiconductor devices are formed, the cutting device 100 can be considered a semiconductor manufacturing device that produces separated semiconductor devices.

Operational control of the cutting device 100, which includes the modules 100A-100C described below, is performed by a control unit CTL provided in the supply module 100A. This control unit CTL may also be provided in modules 100B and 100C other than the supply module 100A. Furthermore, the control unit CTL may be divided into multiple units and provided in at least two of the supply module 100A, cutting module 100B, and inspection module 100C.

The supply module 100A receives the substrates W to be cut from the outside and accommodates the substrates W. This supply module 100A is provided with a substrate accommodation section 2 that accommodates the substrates W. The substrates W are transported from the supply module 100A to the cutting module 100B by a transport mechanism (loader) 3. The loader 3 transports the substrates W to the cutting module 100B using guide rails 31. The cutting device 100 of this embodiment is equipped with three substrate accommodation sections 2, but the number of substrate accommodation sections 2 is not particularly limited.

The cutting module 100B cuts the substrate W into a plurality of cut pieces P. This cutting module 100B has a cutting table 4 that holds the substrate W by suction, and a cutting mechanism 5 that cuts the substrate W held on the cutting table 4.

The cutting mechanism 5 is configured by attaching a rotary blade 52 to a spindle 51. The cutting table 4 and the cutting mechanism 5 are moved relative to each other, causing the rotary blade 52 to cut the substrate W into individual pieces P. A machining fluid supply unit 50 supplies cutting water, a machining fluid, to the rotary blade 52 and the substrate W to suppress frictional heat generated when the substrate W is cut. The individual pieces P are then transported from the cutting module 100B to the inspection module 100C by a transport mechanism (unloader) 6. The unloader 6 has a holder 61 that individually suctions and holds multiple pieces P, and a moving mechanism 62 that moves the holder 61. The cutting device 100 of this embodiment is equipped with two cutting mechanisms 5, but may also have a single cutting mechanism 5.

Inspection module 100C inspects and captures images of the cut products P singulated by cutting module 100B. This inspection module 100C includes an inspection table 7 that holds multiple cut products P by suction, and an inspection camera 8 that captures images of the multiple cut products P held on the inspection table 7. Based on the images captured by the inspection camera 8, inspection module 100C then classifies the cut products P into good and defective products. A transport mechanism (not shown) then transports and stores the good products in a tray 9a for good products and the defective products in a tray 9b for defective products. (See Figure 1)

<Configuration of cutting table 4>
2 to 5, the cutting table 4 has a holding member 10 that adsorbs and holds the substrate W. A blade avoidance groove 10M is formed in the holding member 10 to avoid the rotary blade 52 during cutting. The holding member 10 is made of an elastic resin (rubber material), such as a silicone-based resin or a fluorine-based resin.

This holding member 10 is formed with suction holes 10a that suction-hold the substrate W or multiple cut pieces P. In this embodiment, to increase the suction force of the suction holes 10a, the opening size of the suction-side opening of the suction holes 10a is enlarged to form pocket portions 10b. Note that while the pocket portions 10b in Figures 2 to 5 are rectangular in plan view, the shape of the pocket portions 10b in plan view is not limited to this.

As shown in FIG. 3(a), the substrate W has product portions Wx that are used as products after cutting, and non-product portions Wy that are not used as products after cutting. In this embodiment, multiple product portions Wx are arranged in the center, for example, in a vertical and horizontal matrix pattern (overall rectangular shape), and non-product portions Wy are arranged on the periphery of the multiple product portions Wx. Note that the arrangement of the product portions Wx and non-product portions Wy is not limited to the above. For example, the non-product portions Wy may be arranged somewhere other than the periphery of the substrate W.

For this reason, as shown in Figures 3(b) and 4, the blade protection grooves 10M are formed in a grid pattern corresponding to the product portions Wx and non-product portions Wy, and the rectangular areas surrounded by the blade protection grooves 10M become holding areas 10R (see Figure 3(b)) that hold each product portion Wx of the substrate W. In addition, contact areas 10S (see Figure 4) that come into contact with the non-product portions Wy are formed on the four sides of the holding member 10 surrounding the multiple holding areas 10R.

As shown in Figures 5 and 6, the holding member 10 has multiple recesses 10c formed on the surface of the contact region 10S that comes into contact with the non-product portion Wy resulting from cutting the substrate W. The multiple recesses 10c reduce the contact area between the surface of the contact region 10S and the non-product portion Wy. By forming the multiple recesses 10c, the contact area is reduced to, for example, 20% to 30%, assuming that the contact area would be 100% if the recesses 10c were not formed.

Furthermore, as shown in Figures 5 and 6, the multiple recesses 10c are connected to the outside of the contact area 10S when the non-product area Wy is in contact with the contact area 10S. This allows the machining fluid supplied by the machining fluid supply unit 50 to flow between the non-product area Wy and the contact area 10S (see Figure 6).

Here, "communicating with the outside of the contact area 10S" includes (1) when viewed from above, the recess 10c extends outside the non-product portion Wy (contact area 10S) and opens onto the surface of the holding member 10, or (2) when viewed from above, the recess 10c is covered by the non-product portion Wy but opens onto the side of the holding member 10 or the inner surface of the blade groove 10M. Also, when viewed from above, both ends of the recess 10c may be configured to communicate with the outside of the contact area 10S, or one end of the recess 10c may be configured to communicate with the outside of the contact area 10S. Note that if one end of the recess 10c is configured to communicate with the outside of the contact area 10S, it is desirable to configure, for example, the end on the side where the machining fluid is supplied to communicate with the outside of the contact area 10S so that machining fluid can easily flow in.

Specifically, as shown in Figures 5 and 6, the multiple recesses 10c are arranged in a grid, stripe, or dot pattern in plan view. Note that Figures 5 and 6 show an example in which the multiple recesses 10c are arranged in a grid pattern. By arranging the multiple recesses 10c in a grid pattern, the number of inflow points for the processing liquid can be increased, making it easier for the processing liquid to flow in. Note that the multiple recesses 10c can be arranged in various shapes, such as a grid pattern, stripe pattern, or dot pattern, depending on the type of substrate W, the material of the holding member 10, or the water flow conditions of the processing liquid (e.g., flow rate or supply direction, etc.).

The width and depth of each recess 10c should be small enough to prevent foreign matter from being trapped within the recess 10c, and should be large enough to avoid wear caused by cutting the substrate W (producing the cut product P) and cleaning. Specifically, the width and depth of each recess 10c may be, for example, several tens to several hundreds of microns. The pitch between multiple recesses 10c may be, for example, several tens of microns. These multiple recesses 10c may be formed by irradiating them with laser light, by machining such as cutting, by chemical treatment using a chemical solution, or by mold transfer molding.

<Effects of this embodiment>
According to the cutting device 100 of this embodiment, multiple recesses 10c are formed on the surface of the contact region 10S that contacts the non-product portion Wy. This reduces the contact area between the holding member 10 and the non-product portion Wy, reducing the sticking force and making it easier to remove the non-product portion Wy. Furthermore, since the multiple recesses 10c are connected to the outside of the contact region 10S, processing liquid can easily flow between the holding member 10 and the non-product portion Wy, making it easier to remove the non-product portion Wy. This prevents the non-product portion Wy resulting from cutting the substrate W from sticking to the holding member 10. Furthermore, the amount of processing liquid supplied can be reduced, thereby saving processing liquid.

<Other Modified Embodiments>
The present invention is not limited to the above-described embodiment.

For example, the opening (e.g., width or depth) at the end of the recess 10c that communicates with the contact area 10S may be enlarged to allow the machining fluid to flow in more easily.

Also, as shown in Figures 7 and 8, the holding member 10 may have multiple second recesses 10e formed on the surface of the holding region 10R that holds the product portion Wx of the substrate W. These multiple second recesses 10e reduce the contact area between the surface of the holding region 10R and the product portion Wx (cut product P). By forming multiple second recesses 10e, the contact area is reduced to, for example, 50% to 60%, assuming that the contact area when the second recesses 10e are not formed is 100%. Note that Figure 7 does not show the recesses 10c in the contact region 10S of the above embodiment.

The second recesses 10e are formed so that the suction holes 10a and the outer space of the holding area 10R are not connected when the substrate W or the cut pieces P is held therein. Specifically, the second recesses 10e are arranged in a grid, stripe, or dot pattern in plan view. Figures 7 and 8 show an example in which the second recesses 10e are arranged in a dot pattern. The width and depth of each second recess 10e are preferably small enough to prevent foreign matter from being trapped within the second recess 10e, and large enough to be unaffected by wear caused by cutting the substrate W (producing the cut pieces P) and cleaning. Specifically, the width and depth of each second recess 10e may be several tens to several hundreds of micrometers. These second recesses 10e may be formed by laser irradiation, machining such as cutting, chemical treatment using a chemical solution, or mold transfer molding.

Furthermore, as shown in Figures 7 and 8, the surface of the holding region 10R of the holding member 10 other than the multiple second recesses 10e may be made into a roughened surface 10d. This roughened surface 10d improves peeling against vacuum adhesion. The roughened surface 10d has irregularities smaller than the width and depth of the second recesses 10e, for example, in a striped pattern with a pitch of several tens of micrometers. The roughened surface 10d may be formed by irradiation with laser light, by machining such as cutting, by blasting, or by mold transfer molding.

Furthermore, in the above embodiment, the holding member 10 is configured to have a pocket portion 10b, but it may also be configured without the pocket portion 10b.

It goes without saying that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the invention.

100...Cutting device W...Substrate (object to be cut)
P: Cut product (semiconductor device)
4: Cutting table 5: Cutting mechanism 10: Holding member 10a: Suction hole 10S: Contact area 10c: Recess

Claims (5)

A holding member that adsorbs and holds an object to be cut on a cutting table,
a plurality of groove-like recesses are formed along the surface of a contact area that contacts a non-product portion resulting from cutting the object to be cut,
A holding member, wherein the plurality of recesses are formed so as to open to the outside of the contact area when the non-product portion is in contact with the contact area . The holding member according to claim 1 , wherein the plurality of recesses are arranged in a grid or stripe pattern in a plan view. A cutting table that adsorbs and holds an object to be cut,
A cutting table comprising the holding member according to claim 1 or 2. a cutting table that adsorbs and holds the workpiece;
a cutting mechanism that cuts the object held on the cutting table,
3. A cutting device, wherein the cutting table comprises the holding member according to claim 1 or 2. A method of manufacturing a semiconductor device, comprising: cutting a substrate on which a plurality of semiconductor devices are formed using the cutting device according to claim 4 to manufacture individual semiconductor devices;
The substrate is held by the cutting table;
The method for manufacturing a semiconductor device includes cutting the substrate held on the cutting table by the cutting mechanism.