JP7837593B2 - Precision positioning device and optical device - Google Patents

Description

This invention relates to a precision positioning device and an optical device that can provide three-dimensional mobility for optical elements.

Since the invention of the laser in the 1960s, optical measurement technology has developed remarkably. Following the invention of semiconductor lasers in the 1970s, research and development of miniaturized measuring devices intensified, and in the 1980s, measuring devices incorporating semiconductor lasers were put into practical use. In recent years, there has been a surge in the development of portable measuring devices that maintain the same functionality and performance as previously expensive and large measuring devices. These methods can be broadly divided into two categories: those using microfabrication technology and those using optical waveguides.

The former involves MEMS (Micro Electro Mechanical Systems), and as shown in Non-Patent Document 1, for example, optical elements at the wafer level, especially those with mobility, are the mainstream. However, because they are fabricated at the wafer level, many are two-dimensional structures, and when a spring mechanism is incorporated, while large displacement can be obtained by utilizing resonance characteristics, static movement is difficult, which presents problems.

In the latter case, the optical waveguide is formed in a wafer shape, and the light passes through materials such as SiN, resulting in greater losses than when passing through air. There are also significant losses where the light is introduced. For example, in the case of sensor use as described in Non-Patent Document 2, this can be solved by increasing the light intensity. However, when controlling weak light, such as photons, the losses have a significant impact on the measurement.

O. Solgaard, A. A. Godil, R. T. Howe, L. P. Lee, Y. Peter and H. Zappe, "Optical MEMS: From Micromirrors to Complex Systems," in Journal of Microelectromechanical Systems, vol. 23, no. 3, pp. 517-538, June 2014, doi: 10.1109/JMEMS.2014.2319266. Sepulveda, Borja, et al. "Optical biosensor microsystems based on the integration of highly sensitive Mach-Zehnder interferometer devices." Journal of Optics A: Pure and Applied Optics 8.7 (2006): S561.

Thus, precise control of weak light like photons is difficult using only MEMS technology or only optical waveguides, and the challenge lies in miniaturizing and automatically controlling large optical systems.

The present invention is based on these problems and aims to provide a precision positioning device and an optical device using the same that can also control light of very low intensity, such as photons.

The precision positioning device of the present invention comprises an optical element and a support portion that supports the optical element. The support portion is configured to allow the optical element to rotate around multiple rotation axes and to move in at least one direction of the rotation axes by joining a plurality of structures on which electrical wiring is arranged three-dimensionally with a plurality of piezoelectric actuators electrically connected to the electrical wiring.

The optical device of the present invention comprises a laser oscillator, a photodiode for receiving laser light from the laser oscillator, a circuit board on which the laser oscillator and the photodiode are arranged, and at least one precision positioning device of the present invention, which is arranged on the circuit board and positioned on the optical path from the laser oscillator to the photodiode.

According to the present invention, by joining multiple structures in which electrical wiring is arranged three-dimensionally with multiple piezoelectric actuators electrically connected to the electrical wiring, the optical element is made rotatable around multiple rotation axes and movable in at least one direction of the rotation axes. Therefore, by utilizing microfabrication technology, particularly mounting technology, it is possible to create three-dimensional electrical wiring and structures, enabling the control of light of weak intensity, such as photons. Furthermore, it is possible to control not only weak light but also high-intensity light, thus providing broad versatility. Moreover, since it can be integrated on a circuit board, an electromechanical optical control system can be realized, and miniaturization of the entire system can be achieved.

This figure shows the configuration of a precision positioning device according to one embodiment of the present invention. Figure 1 shows the wiring configuration of the precision positioning device. These are the coordinates representing the position of the precision positioning device shown in Figure 1. Figure 1 shows the manufacturing process for the mirror of the precision positioning device. This diagram shows the manufacturing process of the element-side first structure of the precision positioning device shown in Figure 1. This diagram shows the manufacturing process of the first support structure of the precision positioning device shown in Figure 1. Figure 1 shows the manufacturing process for the second structure of the precision positioning device. This figure shows the manufacturing process for joining the various structures of the precision positioning device shown in Figure 1. Figure 1 shows the configuration of an optical device using the precision positioning device. Figure 1 illustrates an example of how to use the precision positioning device shown in the diagram. This figure shows the configuration of Modified Example 1 of the present invention. This figure shows another configuration of Modification 1 of the present invention. This figure illustrates an example of using Modification 1 of the present invention. This figure shows the configuration of a modified example 2 of the present invention.

Embodiments of the present invention will be described in detail below with reference to the drawings.

(First Embodiment)
Figure 1 shows the overall configuration of the precision positioning device 1 according to the first embodiment of the present invention. Figure 1(A) shows the configuration of the precision positioning device 1 viewed from above, Figure 1(B) shows the configuration viewed from direction I shown in Figure 1(A), and Figure 1(C) shows the configuration viewed from direction II shown in Figure 1(A). Figure 2 shows the wiring configuration of the precision positioning device 1. Figure 2(A) shows the configuration of the element-side first structure 53 as seen from the optical element 2 side, Figure 2(B) shows the configuration of the optical element 2 as seen from the element-side first structure 53 side, Figure 2(C) shows the configuration of the element-side first structure 53 as seen from the support-side first structure 54 side, Figure 2(D) shows the configuration of the support-side first structure 54 as seen from the element-side first structure 53 side, Figure 2(E) shows the configuration of the second structure 52 as seen from the support-side first structure 54 side, Figure 2(F) shows the configuration of the support-side first structure 54 as seen from the second structure 52 side, and Figure 2(G) shows the configuration of the second structure 52 as seen from the opposite side of the second structure 52.

This precision positioning device 1 comprises an optical element 2 and a support part 3 that supports the optical element 2, and allows the optical element 2 to have three-dimensional mobility. The optical element 2 is, for example, one of the elements that constitute an optical device, such as a mirror, lens, prism, filter, or diffraction grating. The size of the optical element 2 is preferably 20 mm or less, more preferably 10 mm or less, and even more preferably 100 μm or more and 10 mm or less, because it can be miniaturized. The size of the optical element 2 is, for example, the maximum length of the optical element 2. In this embodiment, the case in which a mirror is used as the optical element 2 will be explained in detail as an example. The mirror has a reflective film 22 made of a dielectric multilayer film such as _SiO2 or _Ta2O3 formed on one surface of an element substrate 21 made of ceramics such as silica glass, borosilicate glass, or low thermal expansion crystallized glass, or a dielectric such as _silicon , and an element-side electrode part 23 formed on the other surface.

The support section 3 comprises multiple structures on which electrical wiring is arranged three-dimensionally, and multiple piezoelectric actuators electrically connected to the electrical wiring. The support section 3 is configured to allow the optical element 2 to rotate around multiple rotation axes and to move in at least one direction of the rotation axes by combining and joining the multiple structures and the multiple piezoelectric actuators.

Specifically, for example, the support section 3 has a first structure 51 and a second structure 52 as structural components, and has a plurality of first piezoelectric actuators 61 and a plurality of second piezoelectric actuators 62 as piezoelectric actuators. The first piezoelectric actuators 61 are disposed between the first structure 51 and the optical element 2. There are, for example, three or more first piezoelectric actuators 61, and they are arranged to allow rotation around the X and Z axes with respect to the optical element 2, as well as movement in the Y axis direction. The second piezoelectric actuators 62 are disposed between the first structure 51 and the second structure 52. There are, for example, three or more second piezoelectric actuators 62, and they are arranged to allow rotation around the X and Y axes with respect to the optical element 2, as well as movement in the Z axis direction.

As a result, the support portion 3 is configured to allow the optical element 2 to rotate around the X, Y, and Z axes, and to move in the Y and Z directions. Figures 1 and 2 show the case where four first piezoelectric actuators 61 and four second piezoelectric actuators 62 are arranged. Also, in Figures 1 and 2, the first piezoelectric actuators 61 and second piezoelectric actuators 62 are shown with a textured finish for clarity.

The first structure 51 is made of ceramics such as silica glass, borosilicate glass, or low thermal expansion crystallized glass, or a dielectric material such as silicon. The first structure 51 has, for example, an element-side first structure 53 to which the first piezoelectric actuator 61 is joined, and a support-side first structure 54 to which the second piezoelectric actuator 62 is joined and which supports the element-side first structure 53. The element-side first structure 53 has, for example, a surface perpendicular to the Y-axis, to which the first piezoelectric actuator 61 is joined. The support-side first structure 54 has, for example, a surface perpendicular to the Z-axis, to which the second piezoelectric actuator 62 is joined. The second structure 52 is made of ceramics such as silica glass, borosilicate glass, or low thermal expansion crystallized glass, or a dielectric material such as silicon, and supports the first structure 51. The second structure 52 has, for example, a surface perpendicular to the Z-axis, and the second piezoelectric actuator 62 is joined to this surface perpendicular to the Z-axis.

The element-side first structure 53, the support-side first structure 54, and the second structure 52 are, for example, plate-shaped and have a pair of planes and four sides. The thickness of the element-side first structure 53, the support-side first structure 54, and the second structure 52 is preferably, for example, 0.1 mm or more and 5 mm or less. The size of these planes is preferably, for example, 0.1 mm × 0.1 mm or more and 20 mm × 20 mm or less, and more preferably 0.1 mm × 0.1 mm or more and 10 mm × 10 mm or less.

The element-side first structure 53 is, for example, arranged with one side facing the support-side first structure 54, and the first piezoelectric actuator 61 is joined to one of its planes. The element-side first structure 53 is provided with a plurality of first electrical wirings 41 as electrical wiring, extending from the plane to which the first piezoelectric actuator 61 is joined to the side facing the support-side first structure 54. The corner between the plane and the side where the first electrical wirings 41 are provided is preferably chamfered, at least in the region where the first electrical wirings 41 are provided, because this allows for easy formation of the first electrical wirings 41.

First electrode portions 42 are provided at both ends of the first electrical wiring 41. One of the first electrical wirings 41 is electrically connected to the optical element 2 side of the first piezoelectric actuator 61. For example, at one of the first electrode portions 42, it is electrically connected to the element-side electrode portion 23 of the optical element 2 by a connection portion 63 made of a conductive polymer or the like. The other first electrical wiring 41 is individually electrically connected at one of its first electrode portions 42 to the element-side first structure 54 side of the first piezoelectric actuator 61. As a result, the first electrical wirings 41 can apply voltage to the first piezoelectric actuator 61.

The support-side first structure 54 has, for example, an element-side first structure 53 disposed on one plane and a second piezoelectric actuator 62 joined to the other plane. The support-side first structure 54 is provided with a plurality of second electrical wirings 43 as electrical wiring, extending from the plane on which the element-side first structure 53 is disposed, through the side surface, to the other plane on which the second piezoelectric actuator 62 is joined. It is preferable that the corners between the plane on which the second electrical wirings 43 are provided and the side surface, and the corners between the side surface and the other plane, are chamfered, at least in the region where the second electrical wirings 43 are provided. This is because the second electrical wirings 43 can be easily formed. The second electrical wirings 43 electrically connect the first electrical wiring 41 to a power source, and second electrode portions 44 are provided at both ends of the second electrical wirings 43. One second electrode portion 44 is individually electrically connected to the other first electrode portion 42 of the first electrical wiring 41. Furthermore, on the other plane of the support-side first structure 54, there is a first structure-side electrode portion 55 which is electrically connected to each second piezoelectric actuator 62.

The second structure 52 has, for example, a second piezoelectric actuator 62 joined to one of its planes. The second structure 52 is provided with a plurality of third electrical wires 45 and a plurality of fourth electrical wires 46 as electrical wiring, extending from one plane through the side to the other plane. It is preferable that the corners between the plane on which the third electrical wires 45 or fourth electrical wires 46 are provided and the side, and the corners between the side and the other plane, be chamfered in at least the area where the third electrical wires 45 or fourth electrical wires 46 are provided. This is because the third electrical wires 45 and fourth electrical wires 46 can be easily formed.

The third electrical wiring 45 electrically connects the first electrical wiring 41 to the power source via the second electrical wiring 43, and each end of the third electrical wiring 45 is provided with a third electrode portion 47. One of the third electrode portions 47 is individually electrically connected to the other second electrode portion 44 of the second electrical wiring 43 by a connection portion 64 made of a conductive polymer or the like. The other third electrode portion 47 is electrically connected, for example, to a circuit board (not shown) on which the precision positioning device 1 is installed.

Fourth electrode portions 48 are provided at both ends of the fourth electrical wiring 46. One of the fourth electrical wirings 46 is electrically connected to the support side first structure 54 of the second piezoelectric actuator 62, and one of the fourth electrode portions 48 is electrically connected to the first structure side electrode portion 55 by a connection portion 64 made of a conductive polymer or the like. The other fourth electrical wiring 46 is individually electrically connected to the second structure 52 of the second piezoelectric actuator 62 at one of its fourth electrode portions 48. As a result, the fourth electrical wiring 46 can apply voltage to the second piezoelectric actuator 62. The other fourth electrode portion 48 is electrically connected to, for example, a circuit board (not shown) on which the precision positioning device 1 is installed.

The first electrical wiring 41, the first electrode portion 42, the second electrical wiring 43, the second electrode portion 44, the third electrical wiring 45, the fourth electrical wiring 46, the third electrode portion 47, the fourth electrode portion 48, the element-side electrode portion 23, and the first structure-side electrode portion 55 are made of a metal such as gold (Au) or aluminum (Al). Their thickness is, for example, about 100 nm to 1000 nm. A bonding layer made of a metal such as titanium (Ti) or chromium (Cr) may be provided between these and the element-side first structure 53, the support-side first structure 54, or the second structure. The thickness of the bonding layer is, for example, about 1 nm to 20 nm. The first electrode portion 42 and the second electrode portion 44 can be connected and made electrically conductive by, for example, soldering or welding glass to glass using a YAG laser, or by using a conductive polymer.

The first piezoelectric actuator 61, the first electrode portion 42 and the element-side electrode portion 23, and the second piezoelectric actuator 62, the fourth electrode portion 48 and the first structure-side electrode portion 55 are preferably joined together by, for example, a conductive polymer. This is to allow for mobility. The first piezoelectric actuator 61 and the second piezoelectric actuator 62 are configured to expand and contract in the thickness direction, i.e., in the direction in which the voltage is applied, by adjusting the voltage, for example. As a result, the thickness of the first piezoelectric actuator 61 and the second piezoelectric actuator 62 changes according to the voltage, making the optical element 2 rotatable around the X, Y, and Z axes, and movable in the Y and Z axis directions.

For example, as shown in Figure 3, if the position of the precision positioning device 1 is represented in two coordinate systems separated by a distance l, the simultaneous transformation matrix ^0T1 with respect to coordinate system 0 (reference coordinates) is given by equation ₁ , the simultaneous transformation matrix ^1T2 with respect to coordinate system ₁ is given by equation 2, and the simultaneous transformation matrix ^0T2 with respect to the rotation/translation of coordinate system 0 and coordinate system 1 as seen from the reference coordinate system is given by equation 3. By multiplying each of _these simultaneous transformation matrices, the rotation of the optical element 2 around the X, Y, and Z axes, and the movement in the Y-axis direction and the Z-axis direction can be electrically controlled.

The precision positioning device 1 can be manufactured, for example, as follows. Figures 4 to 8 show the manufacturing process of the precision positioning device 1. First, for example, each component of the precision positioning device 1, namely the optical element 2, namely the mirror, the element-side first structure 53, the support-side first structure 54, and the second structure 52, is manufactured. For the mirror, for example, first, as shown in Figure 4(A), a substrate made of glass or the like is cut to a predetermined size to form an element substrate 21. Next, as shown in Figure 4(B), a reflective film 22 made of a dielectric multilayer film is formed on one surface of the element substrate 21 by sputtering or the like. Subsequently, as shown in Figure 4(C), an element-side electrode portion 23 made of a metal film is formed on the other surface of the element substrate 21 by sputtering or the like.

The element-side first structure 53 is first prepared by, for example, preparing a substrate 71 made of glass or the like, as shown in Figure 5(A), and forming through holes 72 by drilling or the like, corresponding to the formation positions of the first electrical wiring 41 on the side surface, as shown in Figures 5(B) and 5(C). At that time, it is preferable to form countersunk holes in the through holes 72 and chamfer the corners between the surface on which the first electrical wiring 41 is formed and the side surface. Note that Figure 5(C) is a view of Figure 5(B) from one side, and Figure 5(B) shows a cross-sectional configuration along the line III-III in Figure 5(C). Next, for example, as shown in Figure 5(D), a stencil mask 73 is formed on one surface of the substrate 71, with openings for the formation areas of the first electrical wiring 41 and the first electrode portion 42. Subsequently, for example, as shown in Figure 5(E), the first electrical wiring 41 and the first electrode portion 42 are formed by sputtering or the like, and the stencil mask 73 is removed. Subsequently, the substrate 71 is cut to a predetermined size, for example, as shown in Figure 5(F). At this time, one side is formed to cut through a through hole 72.

The support-side first structure 54 can be formed in the same manner as the element-side first structure 53. For example, first, as shown in Figure 6(A), a substrate 71 made of glass or the like is prepared, and through holes 72 are formed by drilling or the like in accordance with the formation positions of the second electrical wiring 43 on the side surface. In this case, it is preferable to form countersunk holes in the through holes 72 on both sides. Next, for example, as shown in Figure 6(B), a stencil mask with openings for the formation areas of the second electrical wiring 43 and the second electrode portion 44 is formed on one surface of the substrate 71, the second electrical wiring 43 and the second electrode portion 44 are formed by sputtering or the like, and the stencil mask is removed. Subsequently, for example, as shown in Figure 6(C), a stencil mask with openings for the formation areas of the second electrical wiring 43, the second electrode portion 44, and the first structure-side electrode portion 55 is formed on the other surface of the substrate 71, the second electrical wiring 43, the second electrode portion 44, and the first structure-side electrode portion 55 are formed by sputtering or the like, and the stencil mask is removed. Subsequently, the substrate 71 is cut to a predetermined size, for example, as shown in Figure 6(D). At this time, one side is formed to cut through a through hole 72.

The second structure 52 can also be formed in the same manner as the element-side first structure 53. For example, first, as shown in Figure 7(A), a substrate 71 made of glass or the like is prepared, and through holes 72 are formed by drilling or the like in accordance with the formation positions of the third electrical wiring 45 and the fourth electrical wiring 46 on the side surface. In this case, it is preferable to form countersunk holes in the through holes 72 on both sides. Next, for example, as shown in Figure 7(B), a stencil mask is formed on one surface of the substrate 71 with openings for the formation areas of the third electrical wiring 45, the fourth electrical wiring 46, the third electrode portion 47, and the fourth electrode portion 48, and the third electrical wiring 45, the fourth electrical wiring 46, the third electrode portion 47, and the fourth electrode portion 48 are formed by sputtering or the like, and the stencil mask is removed. Next, as shown in Figure 7(C), for example, a stencil mask is formed on the other side of the substrate 71, with openings for the formation areas of the third electrical wiring 45, the fourth electrical wiring 46, the third electrode portion 47, and the fourth electrode portion 48. The third electrical wiring 45, the fourth electrical wiring 46, the third electrode portion 47, and the fourth electrode portion 48 are formed by sputtering or the like, and the stencil mask is removed. After that, as shown in Figure 7(D), for example, the substrate 71 is cut to a predetermined size. At this time, the two sides are formed so as to cut through holes 72.

Next, for example as shown in Figure 8(A), the first piezoelectric actuator 61 is joined to the first electrode portion 42 of the element-side first structure 53 using a conductive polymer, and a connecting portion 63 made of a conductive polymer is also joined. Subsequently, for example as shown in Figure 8(B), the first piezoelectric actuator 61 and the element-side electrode portion 23 are joined using a conductive polymer, and the first electrode portion 42 and the element-side electrode portion 23 are joined using a connecting portion 63 made of a conductive polymer. Then, for example as shown in Figure 8(C), a connecting portion 64 made of a conductive polymer is joined to the third electrode portion 47 of the second structure 52, and furthermore, the second piezoelectric actuator 62 is joined to the fourth electrode portion 48 using a conductive polymer, and a connecting portion 65 made of a conductive polymer is also joined. Next, for example as shown in Figure 8(D), the second piezoelectric actuator 62 and the first structure-side electrode portion 55 are joined together with a conductive polymer, the fourth electrode portion 48 and the first structure-side electrode portion 55 are joined together with a connecting portion 65 made of a conductive polymer, and the third electrode portion 47 and the second electrode portion 44 are joined together with a connecting portion 64 made of a conductive polymer. After that, for example, the second electrode portion 44 and the first electrode portion 42 are brought into contact and electrically connected by soldering or glass-to-glass welding using a YAG laser or the like. This results in the precision positioning device 1 shown in Figure 1.

This precision positioning device 1 can be used in optical devices. For example, if the optical element 2 is made up of mirrors, the optical path of the laser light can be adjusted by adjusting the reflection direction of the laser light using the mirrors. As an example of an optical device, a sample measurement system using a Mach-Zehnder interferometer will be given for explanation.

Figure 9 shows the configuration of a sample measurement system using a Mach-Zehnder interferometer. This measurement system includes, for example, a laser oscillator 81, a photodiode 82 that receives laser light from the laser oscillator 81, a circuit board 83 on which the laser oscillator 81 and photodiode 82 are arranged, and two precision positioning devices 1 arranged on the circuit board 83 and positioned on the optical path from the laser oscillator 81 to the photodiode 82. Each precision positioning device 1 has a mirror as an optical element 2. On the optical path between the laser oscillator 81 and one of the precision positioning devices 1, a lens 84, a 1/2λ wave plate 85, and a half mirror 86 are arranged on the circuit board 83 in order from the laser oscillator 81 side. On the optical path between the other precision positioning device 1 and the photodiode 82, a half mirror 87, a polarizing plate 88, and a lens 89 are arranged on the circuit board 83 in order from the other precision positioning device 1 side.

The position of the mirror on one precision positioning device 1 is adjusted by the support part 3 of the one precision positioning device 1 so that the laser light emitted from the laser oscillator 81 passes through the half mirror 86, is reflected by the mirror of the one precision positioning device 1, is reflected by the half mirror 87, and enters the photodiode 82. Similarly, the position of the mirror on the other precision positioning device 1 is adjusted by the support part 3 of the other precision positioning device 1 so that the laser light emitted from the laser oscillator 81 is reflected by the half mirror 86, is reflected by the mirror of the other precision positioning device 1, passes through the half mirror 87, and enters the photodiode 82. In this measurement system, a sample M is placed between the half mirror 86 and the mirror of the one precision positioning device 1, and the refractive index of the sample M is measured from the optical path difference due to the difference between the refractive index of the sample M and the refractive index of air.

In this embodiment, the measurement system for a sample using a Mach-Zehnder interferometer was described in a case where two precision positioning devices 1 are provided. However, the optical device only needs to have at least one precision positioning device 1.

Furthermore, this precision positioning device 1 can be used for precise positioning of the optical element 2 in BBM92 quantum cryptography communication via the first satellite 93 between the first earth station 91 and the second earth station 92, as shown in Figure 10, or in BB84 quantum cryptography communication between the third earth station 94 and the second satellite 95. In BBM92 quantum cryptography communication, two entangled photons are split from the first satellite 93 and sent to the first earth station 91 and the second earth station 92, respectively. In BB84 quantum cryptography communication, a photon is sent from the third earth station 94 to the second satellite 95.

Thus, according to the precision positioning device 1 of this embodiment, by joining multiple structures on which electrical wiring is arranged three-dimensionally with multiple piezoelectric actuators electrically connected to the electrical wiring, the optical element 2 is made rotatable around multiple rotation axes and moves in at least one direction of the rotation axes. Therefore, by applying microfabrication technology, particularly mounting technology, it is possible to create a three-dimensional electrical wiring 4 and structure, enabling the control of light of weak intensity, such as photons. Furthermore, it is also possible to control high-intensity light in addition to weak light, thus providing broad versatility. Moreover, since it can be integrated on a circuit board, an electromechanical optical control system can be realized, and miniaturization of the entire system can be achieved.

In the first embodiment, the case was shown in which the element-side first structure 53 is arranged relative to the support-side first structure 54 with the side surface of the support-side first structure 54 and the surface of the mirror's reflective film 22 parallel. However, for example, as shown in Figure 11, the element-side first structure 53 may be arranged relative to the support-side first structure 54 by rotating the surface of the mirror's reflective film 22 by 45° around the Z-axis as the axis of rotation, with respect to the side surface of the support-side first structure 54. Figure 11(A) shows the configuration of the precision positioning device 1 viewed from above, and Figure 11(B) shows the wiring configuration of the element-side surface of the support-side first structure 54.

Furthermore, for example, as shown in Figure 12, two placement positions for the element-side first structure 53 may be provided on the element-side surface of the support-side first structure 54, allowing for the selection of either a configuration where the surface of the mirror's reflective film 22 is rotated 45° with respect to the side surface of the support-side first structure around the Z-axis, or a configuration where the surface of the mirror's reflective film 22 is parallel to the side surface of the support-side first structure 54. Figure 12(A) shows the configuration when the surface of the mirror's reflective film 22 is rotated 45° with respect to the side surface of the support-side first structure, Figure 12(B) shows the configuration when the surface of the mirror's reflective film 22 is parallel to the side surface of the support-side first structure 54, and Figure 12(C) shows the wiring configuration on the element-side surface of the support-side first structure 54.

In this modified example, as shown in Figure 12(C), two second electrode portions 44 are provided on each second electrical wiring 43 on the element-side surface of the support-side first structure 54, corresponding to the orientation of the element-side first structure 53. The first placement position of the element-side first structure 53 is a position where the surface of the mirror's reflective film 22 and the side surface of the support-side first structure are rotated 45° around the Z-axis as the axis of rotation, and the second placement position of the element-side first structure 53 is a position where the surface of the mirror's reflective film 22 and the side surface of the support-side first structure 54 are parallel. When the element-side first structure 53 is placed, it is preferable that the center position in the longitudinal direction along the reflective film 22 on the side surface where the first electrode portions 42 are provided coincides with the center position of the element-side surface of the support-side first structure 54.

Figure 13 shows the optical path when the precision positioning device 1 is used for reflecting laser light, indicated by arrows. When the element-side first structure 53 is positioned at the first position, the laser light is reflected as shown in Figure 13(A), for example. When the element-side first structure 53 is positioned at the second position, the laser light is reflected as shown in Figure 13(B), for example. In this way, the position of the element-side first structure 53 can be arbitrarily selected between the first and second positions depending on where the precision positioning device 1 is to be installed.

(Variation 2)
In the first embodiment, when forming the first electrical wiring 41, second electrical wiring 43, third electrical wiring 45, or fourth electrical wiring 46 on the side surfaces of the element-side first structure 53, the support-side first structure 54, and the second structure 52, a through hole 72 is provided in the substrate 71, a metal film is formed on its inner wall, and it is cut so as to pass through the through hole 72. However, the substrate 71 may be cut to a predetermined size, and then the first electrical wiring 41, second electrical wiring 43, third electrical wiring 45, and fourth electrical wiring 46 may be provided on the side surface of the second structure 52. Figure 14 shows an example of the configuration of Modification 2. In Modification 2, for example, it is preferable that the corner between one plane and the side surface where the first electrical wiring 41 of the element-side first structure 53 is formed is chamfered. Also, it is preferable that the corner between one plane and the side surface where the second electrical wiring 43 of the support-side first structure 54 is formed, and the corner between the side surface and the other plane are chamfered. Furthermore, it is preferable that the corners of the second structure 52 where one plane forming the third electrical wiring 45 or the fourth electrical wiring 46 meets the side surface, and where the side surface meets the other plane surface, be chamfered. This is because the first electrical wiring 41, the second electrical wiring, the third electrical wiring 45, and the fourth electrical wiring 46 can be easily formed.

The present invention has been described above with reference to embodiments, but the present invention is not limited to the above embodiments and can be modified in various ways. For example, although each component was described in detail in the above embodiments, other components may also be included. Furthermore, the descriptions of each component are merely examples and may differ.

1…Precision positioning device, 2…Optical element, 3…Support part, 21…Element substrate, 22…Reflective film, 23…Element-side electrode part, 41…First electrical wiring, 42…First electrode part, 43…Second electrical wiring, 44…Second electrode part, 45…Third electrical wiring, 46…Fourth electrical wiring, 47…Third electrode part, 48…Fourth electrode part, 51…First structure, 52…Second structure, 53…Element-side first structure, 54…Support-side first structure, 55…First structure-side electrode part, 61… First piezoelectric actuator, 62... Second piezoelectric actuator, 63, 64, 65... Connection part, 71... Substrate, 72... Through hole, 73... Stencil mask, 81... Laser oscillator, 82... Photodiode, 83... Circuit board, 84, 89... Lens, 85... 1/2λ wave plate, 86, 87... Half mirror, 88... Polarizer, 91... First earth station, 92... Second earth station, 93... First artificial satellite, 94... Third earth station, 95... Second artificial satellite

Claims (4)

It comprises an optical element and a support portion that supports the optical element,
The support portion is configured to allow the optical element to rotate around multiple rotation axes and to move in at least one direction of the rotation axes by joining a plurality of structures on which electrical wiring is arranged three-dimensionally with a plurality of piezoelectric actuators electrically connected to the electrical wiring .
The support portion has a first structure and a second structure as the structure, and has a plurality of first piezoelectric actuators and a plurality of second piezoelectric actuators as the piezoelectric actuator.
The first piezoelectric actuator is disposed between the first structure and the optical element, and is arranged so as to be rotatable with respect to the optical element with respect to the X and Z axes as rotation axes, and movable in the Y axis direction.
The second piezoelectric actuator is disposed between the first structure and the second structure, and is arranged so that the optical element can rotate around the X and Y axes as rotation axes and move in the Z axis direction.
A precision positioning device characterized by the following features. The precision positioning device according to claim 1, characterized in that the optical element is a mirror. The precision positioning device according to claim 2 , characterized in that the optical path of the laser beam is adjusted by adjusting the reflection direction of the laser beam with the aforementioned mirror. Laser oscillator and,
A photodiode that receives laser light from the aforementioned laser oscillator,
A circuit board on which the laser oscillator and the photodiode are arranged,
An optical apparatus comprising at least one precision positioning device according to claim 1, which is disposed on the circuit board and positioned on the optical path from the laser oscillator to the photodiode.