JPS5711141B2 - - Google Patents
Info
- Publication number
- JPS5711141B2 JPS5711141B2 JP6404774A JP6404774A JPS5711141B2 JP S5711141 B2 JPS5711141 B2 JP S5711141B2 JP 6404774 A JP6404774 A JP 6404774A JP 6404774 A JP6404774 A JP 6404774A JP S5711141 B2 JPS5711141 B2 JP S5711141B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6404774A JPS5711141B2 (en) | 1974-06-07 | 1974-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6404774A JPS5711141B2 (en) | 1974-06-07 | 1974-06-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50155968A JPS50155968A (en) | 1975-12-16 |
| JPS5711141B2 true JPS5711141B2 (en) | 1982-03-02 |
Family
ID=13246784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6404774A Expired JPS5711141B2 (en) | 1974-06-07 | 1974-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5711141B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020067627A1 (en) * | 2018-09-27 | 2020-04-02 | 주식회사 아이센스 | Sensor member for continuous blood glucose measurement |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649543A (en) * | 1979-09-28 | 1981-05-06 | Hitachi Ltd | Method for forming solder bump |
| JP3307262B2 (en) * | 1997-02-26 | 2002-07-24 | 松下電器産業株式会社 | Method of forming solder bumps |
-
1974
- 1974-06-07 JP JP6404774A patent/JPS5711141B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020067627A1 (en) * | 2018-09-27 | 2020-04-02 | 주식회사 아이센스 | Sensor member for continuous blood glucose measurement |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50155968A (en) | 1975-12-16 |