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JPS5746226B2 - - Google Patents
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JPS5746226B2 - - Google Patents

Info

Publication number
JPS5746226B2
JPS5746226B2 JP2140578A JP2140578A JPS5746226B2 JP S5746226 B2 JPS5746226 B2 JP S5746226B2 JP 2140578 A JP2140578 A JP 2140578A JP 2140578 A JP2140578 A JP 2140578A JP S5746226 B2 JPS5746226 B2 JP S5746226B2
Authority
JP
Japan
Prior art keywords
groove
type
electrode
laminated
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2140578A
Other languages
Japanese (ja)
Other versions
JPS54114094A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2140578A priority Critical patent/JPS54114094A/en
Publication of JPS54114094A publication Critical patent/JPS54114094A/en
Publication of JPS5746226B2 publication Critical patent/JPS5746226B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To ensure formation of the luminous semiconductor chip containing the electrode on the same plane with the minimum frequency of the photo etching. CONSTITUTION:The n-type GaP21 and p-type GaP22 are laminated on n-type GaP20 and ohmic electrode 23 is provided to be isolated by the groove reaching layer 21. Then Au-Si electrode 25 and copper 26 are laminated, and groove 27 which is adjacent to groove 24 and bites a little layer 21. Then grid-like notched groove 28 is formed deeply than groove 24, and formed wafer 30 is dipped into the solder to form vamp 29 and 29'. After this, groove 28 is notched more deeply to produce luminous semiconductor chip 31. In such constitution, the luminous element can be produced with the minimum frequency of the photo etching, thus obtaining a highly reliable device with reduced linear junctions.
JP2140578A 1978-02-24 1978-02-24 Luminous semiconductor device and its manufacture Granted JPS54114094A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2140578A JPS54114094A (en) 1978-02-24 1978-02-24 Luminous semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2140578A JPS54114094A (en) 1978-02-24 1978-02-24 Luminous semiconductor device and its manufacture

Publications (2)

Publication Number Publication Date
JPS54114094A JPS54114094A (en) 1979-09-05
JPS5746226B2 true JPS5746226B2 (en) 1982-10-01

Family

ID=12054127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2140578A Granted JPS54114094A (en) 1978-02-24 1978-02-24 Luminous semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS54114094A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5789274A (en) * 1980-11-25 1982-06-03 Hitachi Ltd Manufacture of light emitting element

Also Published As

Publication number Publication date
JPS54114094A (en) 1979-09-05

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