JPS5819226B2 - How to inspect the solder surface of a printed board unit - Google Patents
How to inspect the solder surface of a printed board unitInfo
- Publication number
- JPS5819226B2 JPS5819226B2 JP52153200A JP15320077A JPS5819226B2 JP S5819226 B2 JPS5819226 B2 JP S5819226B2 JP 52153200 A JP52153200 A JP 52153200A JP 15320077 A JP15320077 A JP 15320077A JP S5819226 B2 JPS5819226 B2 JP S5819226B2
- Authority
- JP
- Japan
- Prior art keywords
- board unit
- printed board
- solder
- solder surface
- display film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明はプリント板ユニットの外観を確認検査してその
半田面の半田ショート、半田付状態を検査する方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for confirming and inspecting the appearance of a printed board unit to check for solder shorts and soldering conditions on the solder surface thereof.
従来プリント板ユニットの半田面を検査する場合には特
別な治具もな（パターンの状態から判断して半田ショー
トの有無、半田付状態の良否等を確認しているため、パ
ターン、ランドの形状によっては本当にショートなのか
、それともパターン自体なのか判断が難しく、更には半
田付状態についても見る範囲が多すぎてミスを起こし易
（、多大な時間を費やすと（・う問題があった。Conventionally, when inspecting the solder surface of a printed board unit, there is no special jig. Depending on the situation, it is difficult to judge whether it is really a short circuit or the pattern itself, and there is also the problem that there are too many areas to look at when looking at the soldering condition, making it easy to make mistakes (and to spend a lot of time).
本発明はこのような問題を解消すべ（、信頼性の高い検
査を迅速に行うことを目的とし、プリント板ユニットの
基板製作時に使用される半田面フィルムのネガ表示フィ
ルムとポジ表示フィルムを用い、上記ネガ表示フィルム
を上記プリント板ユニット半田面上に当てて当該ネガ表
示フィルムの配線パターンから透過されるプリント板ユ
ニット半田面上の半田付状態の検査を行い、上記ポジ表
示フィルムを上記プリント板ユニット半田面上に当てて
当該ポジ表示フィルムの配線パターンからはみ出した半
田による半田ショートの検査を行うことを特徴とするプ
リント板ユニットの半田面検査方法を提供するものであ
る。The present invention aims to solve such problems (to quickly perform highly reliable inspections), and uses a negative display film and a positive display film of the solder surface film used when manufacturing the board of a printed circuit board unit. The negative display film is placed on the solder surface of the printed board unit to inspect the soldering condition on the solder surface of the printed board unit that is transmitted through the wiring pattern of the negative display film, and the positive display film is applied to the solder surface of the printed board unit. This invention provides a method for inspecting a solder surface of a printed board unit, which is characterized by inspecting for solder shorts due to solder protruding from the wiring pattern of the positive display film by applying the film to the solder surface.
以下に本発明を図面の実施例により説明すると、第１図
のようにプリント板ユニットの基板製作時に使用される
半田面フィルムのネガ１とポジ２が作られる。The present invention will be explained below with reference to the embodiments shown in the drawings. As shown in FIG. 1, negative 1 and positive 2 of solder film used in manufacturing a board for a printed board unit are made.
このネガ１はユニット基板と逆の関係で透明の部分３が
パターンを示し、ポジ２はユニット基板と同様に黒い部
分４がパターンを示すようになっている。In the negative 1, the transparent part 3 shows the pattern in the opposite relationship to the unit board, and in the positive 2, the black part 4 shows the pattern similarly to the unit board.
そこでこれらのうちの例えばネガ１を第２図のようにプ
リント板ユニツト５０半田面上に位置合わせして当て−
と、透明な部分３を通して半田部分が透過されて半田付
状態が確認される。Therefore, among these, for example, negative 1 is aligned and applied onto the solder surface of the printed board unit 50 as shown in FIG.
Then, the solder portion is transmitted through the transparent portion 3, and the soldered state can be confirmed.
次いでポジ２を同様にしてプリント板ユニツト５０半田
面上に当てると、黒い部分４で半田部分が覆われるよう
になり、これにより黒い部分４からはみ出した半田によ
るショート等が確認され、こうして半田面の半田付状態
、半田ショート等が区別して検査されるのである。Next, when the positive 2 is placed on the solder surface of the printed board unit 50 in the same manner, the solder portion is covered with the black portion 4, and short circuits due to the solder protruding from the black portion 4 are confirmed. The soldering condition, solder shorts, etc. are separately inspected.
このように本発明によると、プリント板ユニットの基板
製作時に使用される正確な半田フィルムのネガ１とポジ
２を用℃・、更にそれらを直接半田面に当て一見ながら
検査するようになっているので、従来のものに比べて確
認洩れや判定ミスが減じて作業性も向上する。As described above, according to the present invention, the precise solder film negative 1 and positive 2 used when manufacturing the board of the printed board unit are used, and furthermore, they are inspected at a glance by directly applying them to the solder surface. Therefore, compared to conventional methods, omissions in confirmation and judgment errors are reduced and work efficiency is improved.
また正確なものと見比べるので判定に手間どることもな
い。Also, since it is compared with the accurate one, there is no need to take time to judge.
第１図は本発明による方法に用いられるネガとポジを示
す斜視図、第２図は本発明による検査状態を示す斜視図
である。
１・・、・−、ネガ、２・・・・・・ポジ、３・・・・
・・透明な部分、４・・・・・・黒い部分、５・・・・
・・プリント板ユニット。FIG. 1 is a perspective view showing a negative and a positive used in the method according to the invention, and FIG. 2 is a perspective view showing an inspection state according to the invention. 1...,...-, negative, 2...positive, 3...
...Transparent part, 4...Black part, 5...
...Printed board unit.
Claims (1)
面フィルムのネガ表示フィルムとポジ表示フィルムを用
い、上記ネガ表示フィルムを上記プリント板ユニット半
田面上に当てて当該ネガ表示フィルムの配線パターンか
ら透過されるプリント板ユニット半田面上の半田付状態
の検査を行い、上記ポジ表示フィルムを上記プリント板
ユニット半田面上に当てて当該ポジ表示フィルムの配線
パターンからはみ出した半田による半田ショートの検査
を行うことを特徴とするプリント板ユニットの半田面検
査方法。1 Using a negative display film and a positive display film of the solder side film used when manufacturing the board of the printed board unit, place the negative display film on the solder side of the printed board unit and measure the amount of light that is transmitted through the wiring pattern of the negative display film. Inspect the soldering condition on the solder surface of the printed board unit, and apply the positive display film on the solder surface of the printed board unit to inspect for solder shorts due to solder protruding from the wiring pattern of the positive display film. A method for inspecting the solder surface of a printed board unit, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52153200A JPS5819226B2 (en) | 1977-12-20 | 1977-12-20 | How to inspect the solder surface of a printed board unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52153200A JPS5819226B2 (en) | 1977-12-20 | 1977-12-20 | How to inspect the solder surface of a printed board unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5485378A JPS5485378A (en) | 1979-07-06 |
| JPS5819226B2 true JPS5819226B2 (en) | 1983-04-16 |
Family
ID=15557220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52153200A Expired JPS5819226B2 (en) | 1977-12-20 | 1977-12-20 | How to inspect the solder surface of a printed board unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5819226B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH073395B2 (en) * | 1985-07-30 | 1995-01-18 | 弘道 藤田 | Soldering inspection method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49124556A (en) * | 1973-04-02 | 1974-11-28 |
-
1977
- 1977-12-20 JP JP52153200A patent/JPS5819226B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5485378A (en) | 1979-07-06 |
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