JPH073395B2 - Soldering inspection method - Google Patents
Soldering inspection methodInfo
- Publication number
- JPH073395B2 JPH073395B2 JP60168290A JP16829085A JPH073395B2 JP H073395 B2 JPH073395 B2 JP H073395B2 JP 60168290 A JP60168290 A JP 60168290A JP 16829085 A JP16829085 A JP 16829085A JP H073395 B2 JPH073395 B2 JP H073395B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- circuit board
- printed circuit
- negative
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、プリント基板に電子部品を半田付けしたと
き、当該電子部品が正確に半田付けされているか否かを
検査する方法に関するものである。Description: TECHNICAL FIELD The present invention relates to a method for inspecting, when an electronic component is soldered to a printed circuit board, whether or not the electronic component is correctly soldered. .
従来より、プリント基板は限られたスペース内に多数の
電子部品が半田付けされているが、近年のIC、LSIの高
集積化により隣接する電子部品の半田先端がブリッジ状
に連続して（以下、単にブリッジという。）ショートの
原因となっていた。Conventionally, many electronic components are soldered in a limited space on a printed circuit board, but due to the high integration of ICs and LSIs in recent years, the soldering tips of adjacent electronic components continue to form a bridge (see below). , Simply called a bridge.) It caused a short circuit.
そこで、プリント基板に正確に半田付けされているか否
かを検査するために、簡単な回路にあっては、電圧をか
けながらチェッカーに通して検査していたが、非常に煩
瑣であり、また、スルホール基板などのように、メモリ
ーIC付き基板、または、多種回路付基板などでは、パタ
ーンが細かいことから容易に電圧をかけることができな
いことから、ブリッジの有無を目で確認するほかはな
く、長時間を要するばかりでなく、作業能率の悪いもの
であった。Therefore, in order to inspect whether or not it is correctly soldered to the printed circuit board, in a simple circuit, it was passed through a checker while applying a voltage, but it was very troublesome. With memory IC substrates, such as through-hole substrates, or substrates with multiple circuits, it is not possible to easily apply a voltage due to the fine pattern, so there is no choice but to visually check the presence or absence of a bridge. Not only did it take time, but the work efficiency was poor.
本発明は、上記諸点にかんがみ、プリント基板の裏面を
撮影したフィルムを利用することによって、電圧をかけ
ることなく検査でき、しかも、異なるプリント基板につ
いて検査する場合であっても、フィルムを交換するだけ
で簡単に対応できるプリント基板の裏面の検査方法を提
供することを目的とする。In view of the above points, the present invention can be inspected without applying a voltage by using a film obtained by photographing the back surface of a printed circuit board, and even when inspecting a different printed circuit board, the film is simply exchanged. It is an object of the present invention to provide a method for inspecting the back surface of a printed circuit board, which can be easily dealt with.
本発明は、電子部品を正常な状態で半田付けしたプリン
ト基板の裏面に光を照射し、この状態を撮影してなるネ
ガを予め作成しておき、半田付け作業の終了した検査す
べきプリント基板の裏面に対して上記ネガを介して光を
拡大照射して、そのときの反射光を検出することにより
ブリッジの有無を確認することを特徴とする半田付け検
査方法を要旨とする。The present invention illuminates the back surface of a printed circuit board to which electronic components are soldered in a normal state, creates a negative by photographing this state in advance, and prints the printed circuit board to be inspected after the soldering work is completed. SUMMARY OF THE INVENTION A gist of a soldering inspection method is characterized in that the presence or absence of a bridge is confirmed by irradiating light on the back surface of the above through the negative and detecting reflected light at that time.
次に、本発明の実施例について説明する。まず、正常に
半田付けされたプリント基板の裏面に光を照射した状態
を撮影したネガを作成する。このときの撮影において
は、半田の存在する部分（以下、半田面という。）が光
を強く反射することとなり、この状態を白黒フィルムで
撮影すると、被写体の白い部分は白く写り、黒い部分は
黒く写る。従って、半田面を白く撮影することができ
る。このときのネガの状態は、撮影の状態とは逆で、被
写体の白い部分は黒く写り、黒い部分は白く写る。従っ
て、半田面が黒くなったネガを作成することができる。
そして、このパターンを写したネガを介する状態で光を
プリント基板の裏面へ向けて照射すると、ネガの黒い部
分を通過する光は非常に弱く、ネガの白い部分を通過す
る光は強くプリント基板の裏面に当たるのである。Next, examples of the present invention will be described. First, a negative in which a state in which the back surface of the normally soldered printed circuit board is irradiated with light is photographed is created. In shooting at this time, the portion where solder is present (hereinafter referred to as the solder surface) strongly reflects light. When shooting in this state with black and white film, the white portion of the subject appears white and the black portion turns black. Be reflected. Therefore, the solder surface can be photographed in white. The negative state at this time is the reverse of the shooting state, in which the white portion of the subject appears black and the black portion appears white. Therefore, a negative having a black solder surface can be produced.
Then, when the light is directed toward the back surface of the printed circuit board through the negative on which this pattern is copied, the light passing through the black portion of the negative is very weak and the light passing through the white portion of the negative is strong. It hits the back side.
次に、上記のようにして作成したネガを介して検査すべ
きプリント基板の裏面に光を拡大照射するのである。こ
のとき、ネガを写真用引き伸ばし機を用いて引き伸ば
し、集光点に元の同じプリント基板で半田付けしたもの
を所定の方向に置いて光を拡大照射する（ネガの像をプ
リント基板と同じ大きさに同時に写す）と、正常な半田
面には非常に弱い光が到達するので、その部分の反射光
も非常に弱いものとなる。そして、その他の部分には強
い光が到達するが、基板本体は暗色のものを用いれば、
反射光が比較的弱くなる。従って、仮に、不良の個所に
ブリッジがあるとすれば、このブリッジは本来の半田面
でない部分に半田が存在している状態であるので、その
部分に対しては強い光が到達することとなるので、ブリ
ッジ部分にはその他の部分より光が強く反射され、その
部分が光ってみえる。Next, the back surface of the printed circuit board to be inspected is enlargedly irradiated with light through the negative formed as described above. At this time, the negative is stretched by using a photographic stretcher, and the same printed circuit board as the original is soldered to the condensing point in a predetermined direction to magnify and irradiate the light (the negative image has the same size as the printed circuit board). When reflected at the same time), very weak light reaches the normal solder surface, and the reflected light at that portion is also very weak. Then, although strong light reaches the other parts, if the substrate body is dark,
The reflected light becomes relatively weak. Therefore, if there is a bridge at a defective portion, the bridge is in a state where solder is present in a portion that is not the original solder surface, so that strong light reaches that portion. Therefore, light is reflected more strongly in the bridge portion than in other portions, and that portion seems to shine.
そして、この反射する光をセンサによって、パルス符号
変調（PCM）回路、増幅回路、比較回路、スイッチング
制御回路を通すことによって、どの部分にブリッジが存
在するかを探知させることができるものである。Then, the reflected light is passed through a pulse code modulation (PCM) circuit, an amplification circuit, a comparison circuit, and a switching control circuit by a sensor, so that it is possible to detect in which part the bridge exists.
以上のように、本発明の検査方法は、予め正確に半田付
けされたプリント基板を作成し、これに光を照射して撮
影してなるネガを用いるものであることから、発光体に
よる光の照射のみによって検査でき、電圧をかけて導通
テストを行う必要がなく、また、目による確認をも要し
ないので、容易に、しかも素早く検査できるものであ
る。As described above, the inspection method of the present invention uses the negative formed by preparing the printed circuit board which is accurately soldered in advance, and irradiating the printed circuit board with the light to take a picture. It can be inspected only by irradiation, does not need to conduct a continuity test by applying a voltage, and does not require visual confirmation, and therefore can be inspected easily and quickly.
Claims (1)
ント基板の裏面に光を照射し、この状態を撮影してなる
ネガを予め作成しておき、半田付け作業の終了した検査
すべきプリント基板の裏面に対して上記ネガを介して光
を拡大照射して、そのときの反射光を検出することによ
りブリッジの有無を確認することを特徴とする半田付け
検査方法。1. A print to be inspected after the soldering work has been completed by previously creating a negative formed by irradiating the back surface of a printed circuit board on which an electronic component is normally soldered with light and photographing this state. A soldering inspection method characterized in that the presence or absence of a bridge is confirmed by irradiating the back surface of a board with light through the negative and detecting reflected light at that time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60168290A JPH073395B2 (en) | 1985-07-30 | 1985-07-30 | Soldering inspection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60168290A JPH073395B2 (en) | 1985-07-30 | 1985-07-30 | Soldering inspection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6228648A JPS6228648A (en) | 1987-02-06 |
| JPH073395B2 true JPH073395B2 (en) | 1995-01-18 |
Family
ID=15865275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60168290A Expired - Lifetime JPH073395B2 (en) | 1985-07-30 | 1985-07-30 | Soldering inspection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073395B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07102488B2 (en) * | 1988-09-14 | 1995-11-08 | 日電アネルバ株式会社 | Electrostatic adsorption mechanism |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5819226B2 (en) * | 1977-12-20 | 1983-04-16 | 富士通株式会社 | How to inspect the solder surface of a printed board unit |
-
1985
- 1985-07-30 JP JP60168290A patent/JPH073395B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6228648A (en) | 1987-02-06 |
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