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JPS5823933B2 - Support device for spool for supplying fine metal wire - Google Patents
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JPS5823933B2 - Support device for spool for supplying fine metal wire - Google Patents

Support device for spool for supplying fine metal wire

Info

Publication number
JPS5823933B2
JPS5823933B2 JP51115004A JP11500476A JPS5823933B2 JP S5823933 B2 JPS5823933 B2 JP S5823933B2 JP 51115004 A JP51115004 A JP 51115004A JP 11500476 A JP11500476 A JP 11500476A JP S5823933 B2 JPS5823933 B2 JP S5823933B2
Authority
JP
Japan
Prior art keywords
spool
metal wire
thin metal
support shaft
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51115004A
Other languages
Japanese (ja)
Other versions
JPS5348460A (en
Inventor
政夫 住吉
久雄 近藤
愛一郎 奈良
秀彰 池川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP51115004A priority Critical patent/JPS5823933B2/en
Publication of JPS5348460A publication Critical patent/JPS5348460A/en
Publication of JPS5823933B2 publication Critical patent/JPS5823933B2/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H49/00Unwinding or paying-out filamentary material; Supporting, storing or transporting packages from which filamentary material is to be withdrawn or paid-out
    • B65H49/18Methods or apparatus in which packages rotate
    • B65H49/20Package-supporting devices
    • B65H49/26Axial shafts or spigots
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H49/00Unwinding or paying-out filamentary material; Supporting, storing or transporting packages from which filamentary material is to be withdrawn or paid-out
    • B65H49/18Methods or apparatus in which packages rotate
    • B65H49/20Package-supporting devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00Handled material; Storage means
    • B65H2701/30Handled filamentary material
    • B65H2701/36Wires
    • B65H2701/361Semiconductor bonding wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07168Means for storing or moving the material for the connector
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07502Connecting or disconnecting of bond wires using an auxiliary member
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires
    • H10W72/552Materials of bond wires comprising metals or metalloids, e.g. silver

Landscapes

  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 この発明は半導体装置の製造工程において必要な接続用
金属細線を供給するためのスプールの支持装置に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a spool support device for supplying thin metal wires for connection necessary in the manufacturing process of semiconductor devices.

半導体装置の半導体チップ上の電極とパッケージ間等の
電気的接続には、金やアルミニウム等の金属細線が用い
られる。
A thin metal wire made of gold, aluminum, or the like is used for electrical connection between an electrode on a semiconductor chip of a semiconductor device and a package.

これらの金属細線は通常第1図のようなスプール1に多
層に巻回されている。
These thin metal wires are usually wound in multiple layers around a spool 1 as shown in FIG.

このスプールの材質は通常アルミニウム軽合金で、図に
おいて2は巻胴、3は両端の鍔部、4は中心部にもうけ
られた支軸用の貫通孔である。
The material of this spool is usually aluminum light alloy, and in the figure, 2 is the winding body, 3 is the flanges at both ends, and 4 is a through hole for a support shaft provided in the center.

第2図はスプール1を支軸6にはめ込んだ図で、金属細
線5が巻かれた状態を示したものである。
FIG. 2 is a diagram showing the spool 1 fitted onto the support shaft 6, and shows the state in which the thin metal wire 5 is wound.

この状態で金属細線が必要に応じて引き出され、キャピ
ラリーを通じて必要な接続個所に導かれ、熱圧着、超音
波接続等の接続力法で所望の接続がなされる。
In this state, the thin metal wire is pulled out as necessary, guided through the capillary to the required connection point, and the desired connection is made by a connection force method such as thermocompression bonding or ultrasonic bonding.

これらの接続に用いられる金属細線5は極めて細いもの
では10〜20μm径である。
The thin metal wire 5 used for these connections has a diameter of 10 to 20 μm if it is extremely thin.

従って金属細線のほどけ力、スプールと支軸間の引出し
抵抗などが、微妙に作用し、作業中金属細線か断線する
事故が多発している。
Therefore, the unraveling force of the thin metal wire, the pull-out resistance between the spool and the support shaft, etc. act delicately, and accidents frequently occur in which the thin metal wire breaks during work.

これらの事故を少なくする目的で、第3図A、B、C及
びD等のスプールの支持装置が工夫されている。
In order to reduce these accidents, spool support devices such as those shown in FIG. 3A, B, C, and D have been devised.

第3図Aは溝をつけた支軸7にスプール1をはめ込んだ
もので、第3図Bは逆にスプール1の貫通孔4の内壁に
多条の溝8をつけたもの、第3図Cは貫通孔4にはめ込
まれた部分を小さくした支軸9でいづれもスプール1と
支軸の接触面積をできるだけ少なくして摩擦抵抗が小さ
くなる工夫がなされている。
Fig. 3A shows the spool 1 fitted into the grooved support shaft 7, and Fig. 3B shows the spool 1 with multiple grooves 8 formed on the inner wall of the through hole 4 of the spool 1. Reference numeral C denotes a support shaft 9 with a smaller portion inserted into the through hole 4, and in both cases, the contact area between the spool 1 and the support shaft is minimized to reduce frictional resistance.

一刀スプールの支持を無接触で行ない摩擦抵抗を著しく
減少させる方法として特公昭43−7367号が公知と
なっている。
Japanese Patent Publication No. 43-7367 is known as a method for significantly reducing frictional resistance by supporting the one-tooth spool without contact.

これは第3図りのような加圧気体10を支軸11の小孔
12から噴出し、スプールと支軸を無接触にして摩擦抵
抗を減少させるものである。
This is to eject pressurized gas 10 from the small hole 12 of the support shaft 11 as shown in the third diagram, thereby reducing frictional resistance by making the spool and the support shaft non-contact.

この方法では、スプールの横すべりが大きくスプール1
がストッパ13a、13bに接触してしまい上述のよう
な断線事故がしばしば発生し作業性を著しく悪くしてい
る。
With this method, the side slip of the spool is large and the spool 1
contact with the stoppers 13a, 13b, and the above-mentioned disconnection accident often occurs, significantly impairing work efficiency.

(支軸11とストッパ13bはネジ式等の脱着式とする
(The support shaft 11 and the stopper 13b are of a removable type such as a screw type.

)この発明はこのような金属細線の断線事故をなくする
ためにスプールの横すべり防止機構を有する支持装置に
関するものである。
) This invention relates to a support device having a spool side-slip prevention mechanism in order to eliminate such wire breakage accidents of thin metal wires.

以下、この発明による金属細線供給用スプールの支持装
置を図面を用いさらに詳細に説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The supporting device for a thin metal wire supply spool according to the present invention will be explained in more detail below with reference to the drawings.

第4図Aは本発明による金属細線供給用スプールの支軸
14にスプール1をはめ込んだ状態を示したもので一部
断面で示しである。
FIG. 4A shows a state in which the spool 1 is fitted into the support shaft 14 of the spool for supplying fine metal wire according to the present invention, and is partially shown in cross section.

支軸14には横すべり防止用孔15をもうけ圧力気体1
0をスプール1の両側の鍔部3に吹き付けるようにして
スプール1を無接触状態で所定の位置に保持するように
したものである。
The support shaft 14 is provided with a hole 15 for preventing side slip, and a pressurized gas 1 is provided.
The spool 1 is held in a predetermined position in a non-contact state by spraying zero onto the flanges 3 on both sides of the spool 1.

また第4図Bは、支軸14にストッパ構造16a、16
bを設けたものでこの部分よりスプール1の鍔部3の圧
力気体10を吹き付けるようにしたものである。
In addition, FIG. 4B shows stopper structures 16a and 16 on the support shaft 14.
b, from which the pressurized gas 10 of the collar 3 of the spool 1 is blown.

なおこの場合はこのストッパ構造16bと軸14とは脱
着式とする必要がある。
In this case, the stopper structure 16b and the shaft 14 need to be detachable.

第4図Cはスプール1の貫通孔4に垂直な中心線17を
中心に支軸14に左右対称に同数で中心線17に向って
傾けた斜め孔18を設けたものである。
In FIG. 4C, the same number of diagonal holes 18 are provided on the support shaft 14 symmetrically with respect to the center line 17 perpendicular to the through hole 4 of the spool 1, and the oblique holes 18 are inclined toward the center line 17.

この斜め孔18は、スプール1を支軸14から浮上させ
ると共にスプール1の横すべりを防止する働きをする。
This diagonal hole 18 functions to float the spool 1 from the support shaft 14 and to prevent the spool 1 from sliding sideways.

ここで使用する圧力気体としてN2ガス等の不活性ガス
を利用すれば金属細線の酸化防止にも役立てることがで
きる。
If an inert gas such as N2 gas is used as the pressurized gas here, it can also be used to prevent oxidation of the thin metal wire.

以上この発明によればスプールを支軸より完全に無接触
状態でしかも、横すべりすることなく保持することがで
きるためスプールが支軸に接触することにより発生する
金属細線の断線事故は無くなり、作業性を著しく高める
ことができる。
As described above, according to this invention, the spool can be held in a completely non-contact state with respect to the spindle and without slipping sideways, so there is no accident of breakage of the fine metal wire caused by the spool coming into contact with the spindle, and work efficiency is improved. can be significantly increased.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はスプールの外観図、第2図及び第3図ABCD
は従来の支軸とスプールの保持状態を示す断面図、第4
図ABCはそれぞれ本発明によるスプールの横すべり防
止機構を備えた支軸の断面構造図である。 図において1はスプール、2は巻胴、3は鍔部、4は貫
通孔、5は金属細線、6,7,9,11゜14は支軸、
10は圧力気体、12は小孔、13a。 13b、16a、16bはストッパ、15は横すべり防
止用の小孔、17はスプールの貫通孔に垂直な中心線、
18は浮上用及び横すべり防止用小孔である。 なお図中同一符号は同一または相当部分を示す。
Figure 1 is an external view of the spool, Figures 2 and 3 ABCD
is a cross-sectional view showing the conventional support shaft and spool holding state;
Figures ABC are cross-sectional structural views of a support shaft provided with a spool side-slip prevention mechanism according to the present invention. In the figure, 1 is a spool, 2 is a winding drum, 3 is a collar, 4 is a through hole, 5 is a thin metal wire, 6, 7, 9, 11° 14 is a spindle,
10 is a pressure gas, 12 is a small hole, and 13a. 13b, 16a, 16b are stoppers, 15 is a small hole for preventing side slipping, 17 is a center line perpendicular to the through hole of the spool,
18 is a small hole for levitation and side slip prevention. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】 1 巻胴の中心部に貫通孔を有し、上記巻胴に金属細線
を巻回したスプール、上記貫通孔を貫通する支軸、上記
金属細線の巻解時に上記スプールと上記支軸が所定位置
で無接触状態を保つための保持手段を備え、さらに無接
触槽すべり防止機構を備えた金属細線供給用スプールの
支持装置。 2 無接触槽すべり防止機構として支軸の小孔から噴出
する圧力気体をスプールの鍔部に吹きつけて上記スプー
ルを所定位置に保つようにした特許請求の範囲第1項記
載の金属細線供給用スプールの支持装置。 3 支軸はストッパ用小孔を有し、この小孔から圧力気
体をスプールの鍔部に吹きつけて上記スプールを所定の
位置に保つようにしたことを特徴とする特許請求の範囲
第2項記載の金属細線供給用スプールの支持装置。
[Scope of Claims] 1. A spool having a through hole in the center of the winding drum, a spool with a thin metal wire wound around the winding drum, a support shaft passing through the through hole, and a shaft that connects to the spool when the thin metal wire is unwound. A support device for a thin metal wire supply spool, comprising a holding means for maintaining the spindle at a predetermined position in a non-contact state, and further comprising a non-contact tank slip prevention mechanism. 2. A thin metal wire supply device according to claim 1, wherein the spool is maintained in a predetermined position by blowing pressure gas ejected from a small hole in the spindle onto the flange of the spool as a non-contact tank slip prevention mechanism. Spool support device. 3. Claim 2, characterized in that the support shaft has a small hole for a stopper, and pressurized gas is blown from the small hole onto the flange of the spool to keep the spool in a predetermined position. A supporting device for the metal thin wire supply spool described above.
JP51115004A 1976-09-25 1976-09-25 Support device for spool for supplying fine metal wire Expired JPS5823933B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51115004A JPS5823933B2 (en) 1976-09-25 1976-09-25 Support device for spool for supplying fine metal wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51115004A JPS5823933B2 (en) 1976-09-25 1976-09-25 Support device for spool for supplying fine metal wire

Publications (2)

Publication Number Publication Date
JPS5348460A JPS5348460A (en) 1978-05-01
JPS5823933B2 true JPS5823933B2 (en) 1983-05-18

Family

ID=14651900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51115004A Expired JPS5823933B2 (en) 1976-09-25 1976-09-25 Support device for spool for supplying fine metal wire

Country Status (1)

Country Link
JP (1) JPS5823933B2 (en)

Also Published As

Publication number Publication date
JPS5348460A (en) 1978-05-01

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