JPS5823945B2 - semiconductor equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device, and particularly to an electrode lead-out structure thereof.

Conventionally, in this type of semiconductor device, a plurality of electrodes and a connecting portion of an external lead conductor facing the plurality of electrodes are connected in a one-to-one relationship.

According to this structure, even when a plurality of adjacent electrodes of a semiconductor element having a plurality of electrodes are used at the same potential in a circuit, these plurality of electrodes are connected to the corresponding external lead conductors. Since the electrodes are connected to each other, a potential drop inside the device between these plurality of electrodes was unavoidable.

Furthermore, in order to reduce costs, some semiconductor devices have standardized the size and arrangement of electrodes and have different internal circuits, but in this case, depending on the circuit of the indoor bath, multiple electrodes are not necessarily made of gold. There were electrodes that were not used and remained electrically unused.

If there are electrodes that are not used in this way, the number of connection points will differ depending on the type of element when connecting the element electrodes and lead wires, so the connection conditions such as heating temperature, heating time,
Pressure forces, etc. are different, and conditions must be set depending on the type of element, and standardization of work is essential, as it leads to lower yields, more complicated work, increased work time, and a rise in manufacturing costs due to these. There were drawbacks.

The present invention solves these problems and provides a highly reliable and inexpensive semiconductor device.

FIG. 1 is a plan view of a conventional semiconductor device, in which an electrode 10
2 and the electrode 103 are connected to the same potential for circuit operation, but a potential drop occurs due to an unavoidable resistance component 117 inside the element.

The electrode 101 and the corresponding external lead conductor 109 are connected to the connecting portion 109' by a ribbon-shaped lead 121.

Similarly, the electrode 102 and the external lead conductor 110 are connected to the connecting portion 11.
0' with a ribbon-like lead 122.

There is a drawback that the potential drop due to the resistance 117 occurring inside the element directly affects the area between the external lead conductors 110 and 111.

Further, electrodes 105 and 106 are not used for circuit operation and are not connected to external lead conductors 113 and 114.

Other electrodes 107 and 108 are external lead conductors 115 and 1, respectively.
16 through ribbon-like leads 127 and 128.

In this case, there are six connection points.

As described above, differences in the number of connection points occur depending on the internal circuit, and it is necessary to increase or decrease connection conditions such as heating temperature, time, or pressure.

FIG. 2 shows the basic structure of a semiconductor device according to the present invention.

The electrodes 202 and 203, which have the same potential in terms of circuit operation, have a potential drop due to the resistance 217 inside the element, but they are unified at an appropriate point 218 before reaching the connection point 211' of the external lead conductor 211. Since the ribbon-shaped lead wire 222 is connected to the external lead conductor 211, the potential drop due to the resistance 217 is ignored.

Furthermore, as is clear from FIG. 2, although the electrode 202 is connected to the external conductor 211 via the lead wire 222, the external conductor 211 is connected to the external conductor 211 corresponding to the electrode 202.
10 is provided.

That is, the semiconductor device according to the present invention is manufactured using a certain standard group of external lead-out conductors, and the lead wires 221°22
2. Since there is no need to change the number of external lead-out conductors in response to a change in the number of . . . , it also contributes to a low price range.

Further, the electrodes 205, 206 that are not used for circuit operation and the adjacent electrode 207 are connected to the external lead conductor 215, and the ribbon-shaped lead wire 227 is connected to the connection point 215' at an appropriate point 219. It is formed.

Since the unused electrodes are connected to the lead wires along with any other electrodes, the number of connection points between the electrodes of element 2 and the lead wires is always constant (8 points in this case).
The connection conditions can be set constant regardless of the type of element.

According to the present invention, for the above-mentioned reasons, it is possible to prevent a decrease in reliability due to the potential drop effect inside the element, and furthermore, since the connection conditions can be set constant, the reliability is improved by stabilizing the connection conditions, and furthermore, the connection operation is improved. Due to the ease of processing, working time can be reduced, making it possible to provide a more reliable and inexpensive semiconductor device.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a conventional semiconductor device, and FIG. 2 is a plan view showing an embodiment according to the present invention. 1...Semiconductor element, 101-108...
・Electrode, 109-116... External lead conductor, 1
09'-112'. 115', 116'...Connection points as above, 117
...Resistance inside the element, 121 to 124, 12
7,128... Lead wire, 2... Semiconductor element, 201-208... Electrode, 207-2
16...External drawer conductor, 209', 211
', 212', 215', 216'...
Connection point (same as above) 217...Resistance inside the element,
221゜222.224,227,228...
Lead.

Claims (1)

[Claims] 1. It has a semiconductor element having a plurality of electrodes, a plurality of external conductors, and a lead wire connecting these, and one end of the lead wire is connected to a predetermined external conductor, and the other end is branched. In the semiconductor device, which is connected to at least two of the electrodes of the semiconductor element, an external lead-out conductor is provided corresponding to each of the electrodes to which a lead wire whose other end is branched is connected. A semiconductor device characterized in that some external conductors are connected to the semiconductor element via the lead wire whose other end is branched, and others are not connected to the lead wire.