JPS5828232B2 - Tokebuhinnoketsugohouhou - Google Patents
TokebuhinnoketsugohouhouInfo
- Publication number
- JPS5828232B2 JPS5828232B2 JP50083318A JP8331875A JPS5828232B2 JP S5828232 B2 JPS5828232 B2 JP S5828232B2 JP 50083318 A JP50083318 A JP 50083318A JP 8331875 A JP8331875 A JP 8331875A JP S5828232 B2 JPS5828232 B2 JP S5828232B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- chromium
- layer
- baladium
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 229910010272 inorganic material Inorganic materials 0.000 claims description 9
- 239000011147 inorganic material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 15
- 229910052804 chromium Inorganic materials 0.000 description 10
- 239000011651 chromium Substances 0.000 description 10
- 238000005476 soldering Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Landscapes
- Electric Clocks (AREA)
- Electromechanical Clocks (AREA)
- Ceramic Products (AREA)
- Joining Of Glass To Other Materials (AREA)
Description
【発明の詳細な説明】
本発明は、ガラス、水晶、セラ□ツク等の非金属無機材
料の表面に、金属層を形成し、この金属層に半田付けを
して接合する時計部品の結合方法じ関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for joining watch parts, in which a metal layer is formed on the surface of a non-metal inorganic material such as glass, crystal, ceramic, etc., and the metal layer is joined by soldering. This is related to the same thing.
従来、時計部品の結合方法としてクロームと金を蒸着し
た非金属無機材料同志、あるいは非金属無機材料と金属
とに半田付けして結合する方法が行われてきた。Conventionally, watch parts have been joined by soldering to nonmetallic inorganic materials on which chromium and gold are vapor-deposited, or to nonmetallic inorganic materials and metals.
しかし時計部品の結合が多種にわたって応用されるに至
り、例えば極度な引張り強度を必要とする水晶振動子の
保持線取付は部の接合、あるいは半田付けする際に半田
が金属に良く濡れることを必要とする液晶時計にむける
セル部液晶注入口の封止、また相方を兼ね備えた接合等
には適さない。However, the connection of watch parts has come to be used in a wide variety of applications, for example, the attachment of a holding wire for a crystal unit that requires extreme tensile strength requires the solder to wet the metal well when joining or soldering the parts. It is not suitable for sealing the cell part liquid crystal inlet for liquid crystal watches, or for bonding with a partner.
クロームと金から成る薄膜構造による場合、半田付けす
る際の熱により半田と金とが合金をつくり、クロームと
金の界面より剥離し易く保持線の引張り強度は1.0k
g/−以下であり、時計用部品の結合方法として難があ
った。In the case of a thin film structure consisting of chromium and gold, the solder and gold form an alloy due to the heat during soldering, and the tensile strength of the holding wire is 1.0K, which makes it easy to peel off from the interface between the chrome and gold.
g/- or less, which was difficult as a method for joining watch parts.
以下、図面に基づき本発明の詳細な説明する。Hereinafter, the present invention will be explained in detail based on the drawings.
第1図は従来の接合方法の概略図であり、
ガラス、水晶、セラミック等の非金属無機材料1を真空
度10〜10 Torr の真空蒸着槽内で250
〜300°Cに加熱し、その表面にクローム2を300
〜600A着け、続いて金7を2000〜3000Aの
膜厚に蒸着し、金属線6を半田5にて接合する方法をと
っていた。FIG. 1 is a schematic diagram of a conventional bonding method, in which a non-metallic inorganic material 1 such as glass, crystal, or ceramic is heated at 250 m
Heat to ~300°C and apply 300% chromium 2 on the surface.
~600A, then gold 7 was deposited to a thickness of 2000~3000A, and the metal wire 6 was bonded with solder 5.
従来技術において、ガラスに対して密着性が良いクロー
ムと半田に対して密着性、濡れ性の良いバラジュウムの
二層膜では半田付けする際の半田コテ熱、または熱風に
よる熱でクロームとバラジュウムが極度に拡散し、ガラ
スとの密着力が弱いバラジュウムがガラス基板面上に現
われ、ガラス基板面とクロームとの界面の密着力が劣り
その結果界面から剥離現象が生じ再現性が乏しい問題が
あった。In conventional technology, with a two-layer film of chrome, which has good adhesion to glass, and baladium, which has good adhesion and wettability to solder, the chrome and baladium are extremely susceptible to heat from the soldering iron or hot air during soldering. Baladium, which has a weak adhesion to the glass, appears on the glass substrate surface, and the adhesion at the interface between the glass substrate surface and the chrome is poor, resulting in a peeling phenomenon from the interface, resulting in poor reproducibility.
その構造にむいて引張り強度は2.0kg/m4前後で
ある。The tensile strength of the structure is around 2.0 kg/m4.
第2図は本発明による時計部品の接合の一実施例である
。FIG. 2 shows an embodiment of joining timepiece parts according to the present invention.
ガラス基板21を真空度10〜10Torr の真空蒸
着槽内に配置し基板加熱温度300℃前後において、真
空蒸着法によりガラス等の非金属無機材料に対して密着
性が良いクローム22を約30OA蒸着し、次にクロー
ムと親和性に優れているニッケル23を約200OA、
次に半田との密着性、濡れ性が良いバラジュウム24を
約20OA蒸着した。The glass substrate 21 is placed in a vacuum evaporation tank with a vacuum degree of 10 to 10 Torr, and at a substrate heating temperature of around 300°C, approximately 30 OA of chromium 22, which has good adhesion to non-metallic inorganic materials such as glass, is evaporated by a vacuum evaporation method. Next, approximately 200OA of nickel-23, which has excellent affinity with chromium,
Next, about 20 OA of Baladium 24, which has good adhesion and wettability with solder, was deposited.
クローム、ニッケル、バラジュウムの三層膜上に保持線
26を半田25を熱風またはコテにより接合する。A holding wire 26 is bonded to the three-layer film of chromium, nickel, and baladium using solder 25 using hot air or a soldering iron.
本発明の目的は従来技術の欠点を排除し、非金属無機材
料と金属あるいは非金属無機材料同志を半田付けに強固
に結合させることであり、本発明の方法においては、ニ
ッケルをクロームとパラジュウムの中間層に挾むことに
よりニッケルのシールド効果で半田付けする際の熱に対
してもクロームとバラジュウムの極度な拡散をさけ、且
つ親和性に優れているため強固な金属膜を提供すること
が出来る。The purpose of the present invention is to eliminate the drawbacks of the prior art and to firmly bond non-metallic inorganic materials to metals or non-metallic inorganic materials by soldering. By sandwiching it in the intermediate layer, the shielding effect of nickel prevents the extreme diffusion of chromium and baladium against the heat during soldering, and its excellent affinity makes it possible to provide a strong metal film. .
また、クロームと同じ性質をもっておりクロームと置き
換える金属材料としてニッケルークローム合金、チタン
、タングステン、モリブデン等があり、同様にバラジュ
ウムに置き換えられ金属材料としては銅、金、鉛、錫、
銀、インジュウム、カドミニュウム、アンチモン等があ
りいずれも半田と親和性が良く桟材として用いられるこ
とは自明のことである。In addition, metal materials that have the same properties as chromium and can be replaced with chromium include nickel-chromium alloy, titanium, tungsten, and molybdenum. Similarly, metal materials that can be replaced with baladium include copper, gold, lead, tin,
It is obvious that silver, indium, cadmium, antimony, etc. all have good affinity with solder and can be used as crosspiece materials.
板厚0. ] mrnで数カ所に1■径の穴を開けた金
属マスクを使用して、本発明の方法によりガラス基板面
へ上記条件にてクローム、ニッケル、バラジュウムを順
次蒸着し、実験を繰返した結果、付着力が強靭な蒸着膜
を得られることを確認した。Plate thickness 0. ] Using a metal mask with 1-diameter holes drilled in several places using mrn, chromium, nickel, and baladium were sequentially deposited on the glass substrate surface under the above conditions by the method of the present invention, and as a result of repeated experiments, the results were as follows. It was confirmed that a deposited film with strong adhesion could be obtained.
この条件にて形成された時計部品の接合部の引張り強度
は5〜61cg/maである。The tensile strength of the joint of the watch component formed under these conditions is 5 to 61 cg/ma.
本発明による接合部品の引張り強度を従来の方法と比較
して表に示す。The tensile strength of the joined parts according to the invention is shown in the table in comparison with the conventional method.
第3図は本発明方法で形成された金属膜を水晶振動子支
持部電極、水晶振動子の外容器への応用であり第4図は
液晶時計のセル部の液晶注入口封止部、ガラスケースの
接合部への応用である。Figure 3 shows the application of the metal film formed by the method of the present invention to a crystal oscillator support electrode and an outer container of a crystal oscillator. This is an application to the joints of cases.
この様に非金属無機材料の表面への接合方法として多種
にわたり応用が可能である。In this way, a wide variety of applications are possible as a method for bonding to the surface of nonmetallic inorganic materials.
第1図は従来の時計部品の接合方法の眠略断面図、第2
図は本発明による実施例の構造概略断面図、第3、第4
図は接合方法の応用実施例を示す斜視図及びその断面図
である。
1.21・・・ガラス基板、2,22・・・クローム層
、3.23・・・ニッケル層、4・・・バラジュウム層
、5゜25・・・半田、6・・・金属保持線、7・・・
金属。Figure 1 is a schematic cross-sectional view of the conventional method of joining watch parts;
The figure is a schematic cross-sectional view of the structure of the embodiment according to the present invention, the third and fourth
The figures are a perspective view and a sectional view showing an applied example of the joining method. 1.21... Glass substrate, 2,22... Chrome layer, 3.23... Nickel layer, 4... Baladium layer, 5°25... Solder, 6... Metal holding wire, 7...
metal.
Claims (1)
面に、三層構造金属膜を形成し、該三層の内の中間の一
層をニッケル金属とした半田付は可能な金属層を有する
ことを特徴とする時計部品の結合方法。1 A three-layer structure metal film is formed on the surface of a non-metallic inorganic material such as glass, crystal, ceramic, etc., and one layer in the middle of the three layers is a nickel metal and has a metal layer that can be soldered. A method for joining watch parts, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50083318A JPS5828232B2 (en) | 1975-07-07 | 1975-07-07 | Tokebuhinnoketsugohouhou |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50083318A JPS5828232B2 (en) | 1975-07-07 | 1975-07-07 | Tokebuhinnoketsugohouhou |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS527273A JPS527273A (en) | 1977-01-20 |
| JPS5828232B2 true JPS5828232B2 (en) | 1983-06-14 |
Family
ID=13799065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50083318A Expired JPS5828232B2 (en) | 1975-07-07 | 1975-07-07 | Tokebuhinnoketsugohouhou |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5828232B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853405U (en) * | 1981-10-08 | 1983-04-11 | 本田技研工業株式会社 | Vehicle lamp cover mounting structure |
| JPS5943481U (en) * | 1982-09-17 | 1984-03-22 | 株式会社東芝 | Lighting cover mounting structure for escalator landing lights |
-
1975
- 1975-07-07 JP JP50083318A patent/JPS5828232B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS527273A (en) | 1977-01-20 |
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