JPS5828740B2 - Lead molding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION This invention is applicable to, for example, DIP (Dual Inline P).
ackage'.

The present invention relates to a lead molding device for molding leads of integrated circuit devices.

Figure 1 a and b are each lead frame IC (J product circuit)
FIG. 2 is a plan view and a side view of the DIP type integrated open circuit device 10 after the chip mounting portion is molded with ceramic or insulating resin.

As shown in the figure, n leads 1 extend from the bottom 12 of the package 11 of the integrated circuit device 10 toward both sides.
3. , 132...13n and 141,14
□...14n has been derived.

D after molding as shown in Figure 1 a and b
IP type integrated integrated circuit device 10 leads 131゜132...
...13n and 140,14□...14
n are connected by plate pieces 15 and 16, respectively, so that plate pieces 15 and 16 must be cut out after this.

In addition, since the device is generally used for printed wiring boards, etc. of the DIP type integrated integrated circuit device 10, after the plate pieces 15 and 16 are cut and removed, each lead 131° 13 as shown in FIGS.
2...13n and 140.142...
・14n is bent and formed.

FIG. 3 shows the plate portions 15.16 removed and the leads 131.13□...13n and 14. .

14 is a partial sectional view showing the configuration of a conventional lead forming apparatus used for bending and forming 14□...14n.

In FIG. 3, a die holder 20 is fixed as a lower die of a press machine, for example, and a knockout 21 having a U-shaped groove on its upper surface is held in the center of the die holder 20. 21 is attached to a knockout pin 22 passing through the bottom of the die 20.

Further, the bottom of the knockout pin 22 is pressed by a spring 23.

The pressing force of the spring 23 causes the upper part of the knockout 21 and the upper part of the die 20 to coincide with each other.

Then, the package part 1 of the integrated circuit device 10 before lead molding is inserted into the U-shaped groove provided in the knockout 21.
1 into the knockout 21 so as to insert the integrated circuit device 1 into the knockout 21.
0 is placed there.

Furthermore, a pair of lower cutting blades 24 extending in the longitudinal direction are provided on the outer side near the top of the gooey holder 20.

Furthermore, the punch 25 is fixed, for example, as an upper die of a press machine, and the punch 25 is loosely fitted into the inner peripheral part of a die holder 20 that holds the knockout 21 when the upper die of the press machine is lowered, and 21 as well as the leads 131.13° of the integrated circuit device 10...1
3n and 141, 14□...14n are provided with a pair of protrusions 26 that clamp the bases of the bent portions, and on the outside of the pair of protrusions 26 is the die. 2
A pair of upper cutting blades 27 are provided which are in sliding contact with each of the pair of lower cutting blades 24 provided at 0.

The integrated circuit device 10 before lead molding is placed on the knockout 21 currently held by the die holder 20, and then the press machine is operated to lower the upper die, that is, the punch 25.

As the punch 25 descends, the lower cutting edge 24 and the upper cutting edge 2T first come into sliding contact, and the leads 13□, 132...13n and 14. .

Each end of 14□...14n and plate piece part 15,1
6 is cut and removed.

When the punch 25 further descends, the protrusion 2 of the punch 25
The tips of 6 are the leads 131, 132 and 132 of the integrated circuit device 10.
...13n and 141.142...1
The base of the bent portion 4n is pressed against the upper surface of the knockout 21.

After this, the punch 25 further descends, pushing down the knockout 21, and as a result, the leads 131, 132...13n are pushed down between the die holder 20 and the punch 250.
And 14□, 14°...14n are bent and formed while being squeezed.

Then, when the punch 25 rises, the knockout 21 rises again to its original position due to the pressing force of the spring 23.

By the way, the lead 13 can be formed using the conventional lead molding device described above.
1.13□...13n and 14. ．． 14□・
...When bending 14n, the package portion 11 is pressed with the knockout 21 and the punch 25.

In addition, as shown in FIG. 4, the package part 11 has warpage, which is particularly noticeable in the longitudinal direction.For this reason, the leads 13□, 13□...
-・13n and 14□.

When molding 142...14n, there is a drawback that the package portion 11 may break.

Furthermore, during lead molding, the inner circumference of the die holder 20 and the punch 2
Each lead 13
□, 132...13n and 141,14□・
...14n is squeezed and each lead 131, 132...13n and 14□,
142...14n may peel off, and furthermore, the plating on the pressed portion may peel off.

Also, each lead 131, 132...13n and 14. , 142, . . . , 14n have the disadvantage that a predetermined molding size cannot be obtained because the bending returns due to springback.

The present invention has been made in consideration of the above-mentioned circumstances, and its purpose is to provide a lead molding device that can obtain a predetermined molding size without damaging the object to be molded.

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 5 is a partial cross-sectional configuration diagram showing the lead forming apparatus of the present invention, and FIG. 6 is a perspective view thereof.

The die holder 30 is fixed, for example, as a lower mold of a press machine, and a knockout 31 having a U-shaped groove M provided in its upper surface is held in the center of the die holder 30.

As shown in FIG. 6, this knockout 31 has a plurality of partial knockouts in the width direction.
...It is divided into 31h.

The above knockout 310 partial knockout 31 a?
An elastic body such as rubber 32a, 32b, .

Furthermore, this rubber rubber 32a. 32b... are adhesively fixed to a metal plate 33, and this plate 33 is constantly pressed by a spring 34.

Also, on the side of the knockout holding part of the die holder 30, there is a
A pair of rollers 35 and 36 are mounted oppositely and rotatably in the horizontal direction.

Similarly, a pair of attack pars 37 and 38 are rotatably attached to the side surface of the knockout holding portion of the die holder 30 in parallel with the pair of rollers 35 and 36, and normally this pair of attack pars 37 .38 is open outward with the knockout 31 as the center, as shown in the figure.

The punch 39 is attached and fixed to a punch holder 40, for example, as an upper die of a press machine.

The punch 39 is divided into a plurality of partial punches 39a, 39b, .

Also, between the partial punches 39a, 39b, . . . and the punch holder 40, an elastic body such as a rubber rubber 41a
... is inserted.

When the press machine is operated, the punch 39 pushes down the knockout 31 held by the die holder 30.

The punch holder 40 also includes a pair of cam levers 42,
43 is attached.

The pair of cam levers 42 and 43 are activated when the tip of the punch 39 reaches the bottom dead center of the press machine.
A pair of attack pars 37 and 38 attached to the ball are pressed.

Next, we will discuss the operation of the device configured as described above in the seventh section.
This will be explained using figures.

First, the plate portions 15 and 16 of the integrated circuit device 10 shown in FIGS. 1a and 1b are cut out in advance by some method.

Next, insert the package 11 upside down into the U-shaped groove M provided in the knockout 31.
The integrated circuit device 10 is placed on the substrate.

Next, the press machine is operated to lower the punch 39 and the pair of cam levers 42, 43.

First, the tip of the punch 39 comes into contact with the integrated circuit device 10 placed on the knockout 31.

After the contact, the punch 39 further descends.

At this time, the knockout 3 on which the integrated circuit device 10 is placed
1 also descends while resisting the pressing force of the spring 34.

Package portion 11 of integrated circuit device 10 when punch 39 descends
If there is warpage, the partial knockouts 31a to 31h and partial punches 39a to 39h are applied according to the warp.
has left and this sled has rubber rubber 32a, 32b, respectively.
. . . and 41a . . . held by partial knockers) 31a to 31h,
39h, the package portion 11 will not be broken due to compression by the knockout 31 and punch 39 as in the conventional case.

When the punch 39 further descends, the leads 13□ to 13n and 141 to 14n of the integrated circuit device 10 are gradually bent and formed by a pair of rollers 35 and 36 while their bases are pressed by the knockout 31 and the punch 39. be done.

Leads 13□~13n, 14□~14 during lead bending molding
n and the pair of rollers 35° and 36 make point contact, and the leads 131 to 13n and 141 to 14n are not squeezed and no excessive force is applied, unlike in the conventional case, so that the leads do not peel off from the package portion 11 or the plating peels off. never happens.

Then, when the tip of the punch 39 reaches the bottom dead center, a pair of cam levers 42 attached to the punch holder 40,
43 hits a pair of attack pars of 37°38.

Figure 7 is a partial cross-sectional view showing the state in which a pair of cam levers 42 and 43 have pressed a pair of attack pars 37 and 38, and the pressed pair of attack pars 37 and 38 are further bent and formed. Press the leads 13□ to 13n, 14, to 14n.

Therefore, the leads 13, ~13n, and 14□~14n are remolded, and no springback occurs after molding.

Therefore, the lead molding dimensions can be finished to predetermined dimensions.

Note that the present invention is not limited to the one embodiment described above; for example, in the embodiment described above, a case has been described in which leads are bent and molded for an integrated circuit device, but this may be applied to molding general parts. Of course.

As explained above, according to the present invention, there is provided a mounting table divided into a plurality of parts on which a molded object from which leads to be bent and formed are placed, an elastic body that holds this mounting table, and a The leads are drawn out from the molded object together with the roller by pressing the molded object placed on the mounting table with a roller provided horizontally opposite to the lead-out surface of the molded object to be placed. A punch that bends and forms a lead and is divided into a plurality of parts corresponding to the mounting table, an elastic body that holds the punch, and a molded object that is provided in parallel with the roller and is bent and formed by the punch and the roller. It is equipped with a pressing body that presses the lead of the body toward the punch side, and the warping of the object to be molded is absorbed by the mounting table and the punch, each of which is divided into a plurality of parts, and when the punch is lowered, it is Bending and forming the lead of the object to be formed.

Further, by re-shaping the lead bent and formed by the pressing body, it is possible to provide a lead-forming device which can obtain a predetermined lead bending dimension without damaging the object to be formed.

[Brief explanation of the drawing]

Fig. 1 a, b and Fig. 2 a, b are respectively a plan view and a side view showing an integrated circuit device, Fig. 3 is a partial sectional view showing the configuration of a conventional lead molding device, and Fig. 4 is an integrated circuit device. 5 and 6 are a partial cross-sectional view and a perspective view, respectively, showing the structure of an embodiment of the present invention, and FIG. 7 is a partial cross-sectional view for explaining the above embodiment. be. 30... Gui holder, 31... Knockout, 32 a to 32 h, 41 a to 41 h
-Rubber rubber 33...Freight, 34...
...Spring, 35°36 ...Roller, 37
, 38... Attack par 39... Punch, 40... Punch holder, 42° 43...
...Cam lever, M...Groove.

Claims (1)

[Claims] 1. A mounting table divided into multiple parts on which a molded object from which leads to be bent and formed are placed, an elastic body that holds this mounting table, and a lead of the molded object placed on the mounting table. A roller provided horizontally opposite to the lead-out surface presses the molded object placed on the mounting table to bend and form the lead led out from the molded object together with the roller and the mounting table. a punch divided into a plurality of parts corresponding to the above, an elastic body for holding the punch, and a lead of the object to be formed, which is provided in parallel with the roller and is bent and formed by the punch and the roller, and is pressed against the punch side. A linear molding device characterized by comprising a pressing body.