JPS5829638B2 - Wiring board equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a wiring board device in which a flexible wiring board comprising a hard wiring board to which circuit elements are fixed and a flexible wiring board with through holes formed in a portion facing the circuit elements is superimposed and electrically connected. Regarding this, special measures have been taken to prevent the circuit element sealing coating material from flowing into the periphery of the through hole of the flexible wiring board.

An example of such a wiring board device is one in which a glass wiring board of a liquid crystal cell and a flexible board are connected, as shown in FIG.

1 First, to explain Fig. 1, Fig. 1A is a plan view, Fig. 1A is a side sectional view taken along line a-b of Fig. 1A,
Figure C is a side cross-sectional view of the button which has been coated with a resin material.

In Figure a, 1 and 2 are glass substrates;
A liquid crystal cell 3 is formed by the overlapping portions of the glass substrates.

In addition, circuit wiring is applied to a portion of one glass substrate 2 outside the cell display area, and an integrated circuit element 4 such as an LSI is attached thereto.

Further, a flexible substrate 5 having a through hole in the integrated circuit element portion is overlapped and bonded to the circuit wiring portion.

Then, the integrated circuit element 4 is coated with a black resin 6 made of epoxy resin with pigment added.

However, since the flexible substrate 5 is thin, the resin flows onto the substrate 5 as shown in FIG. In addition, there were manufacturing and quality problems, such as the edges of the circuit elements 4 being easily exposed.

The present invention was developed in view of these problems, and it is an object of the present invention to provide a wiring board device that can prevent the flow of circuit element coating material without adding any other components.

The present invention will be explained in detail below based on the drawings.

FIG. 2 is a side sectional view of one embodiment of the wiring board device according to the present invention.

As shown in the figure, by diverting the area around the through hole of the flexible substrate 5 at the position of the integrated circuit element 4 upward, wasteful flow of the resin material 6 is prevented.

Therefore, in this manner, the thickness of the resin material 6 for coating the integrated circuit element 4 can be easily obtained.

In other words, the flow of the resin material 6 can be prevented by simply lifting the peripheral portion of the through hole by pressing the flexible substrate 5 or the like, without having to take the trouble to provide a separate support member to prevent the resin material 6 from flowing. It becomes possible.

FIG. 3a is a plan view of FIG. 2, showing the wiring 7 on the glass substrate 2 (dashed line portion) and the wiring 8 on the flexible substrate (
(solid line part) is shown.

The remaining Figure 3 is a partially cutaway sectional view taken along the line a'-b' of Figure 3a.

As shown in FIG. 3, thin film wiring is provided on the glass substrate 2 (flexible) and wiring can also be provided on the substrate 5 (for example, soldering battery terminals, chip capacitors, etc.). Because of this, two-layer wiring is formed.

An adhesive is applied to the back of the transparent flexible substrate 5, and an overcoat such as insulation is applied to the thin film wiring T of the glass substrate 2.
It serves as a coat.

If the conductive portion of the thin film wiring 7 with the flexible substrate 5 is plated with gold and soldered through the small hole provided in the flexible substrate 5, electrical continuity can be established between the upper and lower substrates.

As described above, according to the wiring board device of the present invention, it is possible to easily prevent the circuit element coating material from flowing in without adding any other components, and therefore, the conventional defects in manufacturing quality can be solved. I can do it.

[Brief explanation of the drawing]

Figure 1 is an explanatory diagram for explaining a conventional wiring board device.
Figure a is a plan view, Figure C is a side cross-sectional view taken along line a-b in Figure A, Figure C is a side cross-sectional view of the same figure coated with a resin material, and Figure 2 is the book. A side sectional view of an embodiment of the wiring board device according to the invention, FIG. 3a is a plan view of FIG. 2,
FIG. 3 shows a partially cutaway sectional view taken along the line a'-b' of FIG. 3a. In the figure, 1 and 2 glass substrates, 3: liquid crystal cell, 4: integrated circuit element, 5: flexible substrate, 6: resin material, 7, 8:
Wiring section.

Claims (1)

[Scope of Claims] 1. In a wiring board device in which a flexible wiring board, which has a hard wiring board to which a circuit element is fixed, and a flexible wiring board with a through hole formed in a portion facing the circuit element, is superimposed and electrically connected. A wiring board device, characterized in that a peripheral portion of the through hole of the flexible wiring board is bent and raised to form a flow stopper for the circuit element sealing coating material.