JPS5830764B2 - waveguide mount - Google Patents
waveguide mountInfo
- Publication number
- JPS5830764B2 JPS5830764B2 JP12512378A JP12512378A JPS5830764B2 JP S5830764 B2 JPS5830764 B2 JP S5830764B2 JP 12512378 A JP12512378 A JP 12512378A JP 12512378 A JP12512378 A JP 12512378A JP S5830764 B2 JPS5830764 B2 JP S5830764B2
- Authority
- JP
- Japan
- Prior art keywords
- waveguide
- dielectric substrate
- waveguide mount
- mount
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
Landscapes
- Waveguide Connection Structure (AREA)
Description
【発明の詳細な説明】
本発明は気密構造を有する導波管マウントに関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a waveguide mount having an airtight structure.
マイクロ波からミリ波に及ぶ周波数帯では誘電体基板を
使用したＭＩＣ回路と導波管回路との結合に誘電体基板
上に形成したストリップアンテナを直接、導波管内に挿
入する方法がとられている３第１図および第２図は、Ｍ
ＩＣ回路を組込んだ導波管マウントを示し、１は誘電体
基板、２および３は誘電体基板１上に形成されたＭＩＣ
回路およびストリップアンテナ、４はＭＩＣ回路２に取
付けられた半導体素子、５は誘電体基板１の裏側に設け
られた接地導体、６は導波管マウント、７は導波管、８
は出力端子で、誘電体基板１はＭＩＣ回路形成面が導波
管開口面側になるように導波管マウントに取付けられて
いる。In frequency bands ranging from microwaves to millimeter waves, a method is used to couple a MIC circuit using a dielectric substrate to a waveguide circuit by inserting a strip antenna formed on a dielectric substrate directly into the waveguide. 3 Figures 1 and 2 are M
A waveguide mount incorporating an IC circuit is shown, 1 is a dielectric substrate, 2 and 3 are MICs formed on the dielectric substrate 1.
circuit and strip antenna, 4 is a semiconductor element attached to the MIC circuit 2, 5 is a ground conductor provided on the back side of the dielectric substrate 1, 6 is a waveguide mount, 7 is a waveguide, 8
is an output terminal, and the dielectric substrate 1 is attached to a waveguide mount so that the MIC circuit forming surface faces the waveguide opening side.
このようにＭＩＣ回路２に半導体素子４が取付けられて
いる場合には、半導体素子４の長寿命化のために気密構
造とすることが望ましく、そのために従来は、第３図に
示すように誘電体材料よりなるシール板９を用いてシー
ルを行っている。When the semiconductor element 4 is attached to the MIC circuit 2 in this way, it is desirable to have an airtight structure in order to prolong the life of the semiconductor element 4, and for this purpose conventionally, a dielectric structure is used as shown in FIG. Sealing is performed using a sealing plate 9 made of body material.
しかし、このような構成にすると、シールのために余分
にシール板を必要とし、かつ誘電体基板を接着し、さら
にシール板を接着するという二重の手間をとることにな
る。However, with such a configuration, an extra seal plate is required for sealing, and it takes double effort to bond the dielectric substrate and then bond the seal plate.
本発明はこのような問題点を解決するためのもので、製
作工数、材料の節約および小型化をはかることのできる
導波管マウントを提供することを目的としたものである
。The present invention is intended to solve these problems, and it is an object of the present invention to provide a waveguide mount that can save manufacturing man-hours, materials, and be miniaturized.
以下、第４図および第５図に関連して本発明の詳細な説
明する。The invention will now be described in detail with reference to FIGS. 4 and 5.
第４図および第５図は本発明の一実施例を示すもので、
誘電体基板１をそのＭＩＣ回路形戒形成導波管マウント
６に対向するようにして導波管マウント６に接着固定し
、該誘電体基板１で導波管気密窓を兼用させ、基板用誘
電体をそのままシール材料として利用するようにしてい
る。4 and 5 show an embodiment of the present invention,
The dielectric substrate 1 is adhesively fixed to the waveguide mount 6 so as to face the MIC circuit-forming waveguide mount 6, and the dielectric substrate 1 is also used as a waveguide airtight window. The body is used as a sealing material.
したがって本発明によれば余分に誘電体材料よりなるシ
ール板を必要とせず、ＭＩＣ回路の誘電体基板でシール
を行うことができるので、単に誘電体基板を導波管マウ
ントに接着するだけですみ、製作工数、材料を節約する
ことができ、ＭＩＣ回路の高信頼性を図り、小型・低価
格を実現することができるという。Therefore, according to the present invention, sealing can be performed with the dielectric substrate of the MIC circuit without requiring an extra sealing plate made of dielectric material, so it is sufficient to simply adhere the dielectric substrate to the waveguide mount. It is said that it is possible to save manufacturing man-hours and materials, improve the reliability of MIC circuits, and realize smaller size and lower cost.
すぐれた効果を奏する。It has excellent effects.
第１図は従来のＭ’ＩＣ回路を組込んだ導波管マウント
の正面図、第２図は同、側面断面図、第３図は従来の密
封型導波管マウントの側面断面図、第４図は本発明に係
る導波管マウントの実施例の正面図、第５図は同、側面
断面図である。
図中、１は誘電体基板、２はＭＩＣ回路、３はストリッ
プアンテナ、４は半導体素子、５は接地導体、は導波管
マウント、７は導波管である。Figure 1 is a front view of a waveguide mount incorporating a conventional M'IC circuit, Figure 2 is a side sectional view of the same, and Figure 3 is a side sectional view of a conventional sealed waveguide mount. FIG. 4 is a front view of an embodiment of the waveguide mount according to the present invention, and FIG. 5 is a side sectional view of the same. In the figure, 1 is a dielectric substrate, 2 is an MIC circuit, 3 is a strip antenna, 4 is a semiconductor element, 5 is a ground conductor, is a waveguide mount, and 7 is a waveguide.
Claims (1)
波管マウントにおいて、前記誘電体基板をそのＭＩＣ回
路形成面が導波管マウントに対向するように該導波管マ
ウントに取付け、前記誘電体基板が導波管気密を兼ねる
ようにしたことを特徴とする導波管マウント。1. In a waveguide mount incorporating a MIC circuit formed on a dielectric substrate, the dielectric substrate is attached to the waveguide mount such that the MIC circuit forming surface thereof faces the waveguide mount, and the dielectric substrate is A waveguide mount characterized in that the body substrate also serves as waveguide airtightness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12512378A JPS5830764B2 (en) | 1978-10-13 | 1978-10-13 | waveguide mount |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12512378A JPS5830764B2 (en) | 1978-10-13 | 1978-10-13 | waveguide mount |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5552602A JPS5552602A (en) | 1980-04-17 |
| JPS5830764B2 true JPS5830764B2 (en) | 1983-07-01 |
Family
ID=14902406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12512378A Expired JPS5830764B2 (en) | 1978-10-13 | 1978-10-13 | waveguide mount |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5830764B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5725703A (en) * | 1980-07-22 | 1982-02-10 | Nec Corp | Miniisolator |
| JPS58178265A (en) * | 1982-04-12 | 1983-10-19 | Nec Corp | Power detecting method, waveguide circuit and power detector |
| JPS58178609A (en) * | 1982-04-12 | 1983-10-19 | Nec Corp | Detector |
| JPS58215802A (en) * | 1982-06-09 | 1983-12-15 | Fujitsu Ltd | Package for mic |
| JPS61143305U (en) * | 1985-02-26 | 1986-09-04 | ||
| JPH0248801A (en) * | 1988-08-10 | 1990-02-19 | Nec Corp | Package for ultrahigh frequency |
| DE19725492C1 (en) * | 1997-06-17 | 1998-08-20 | Bosch Gmbh Robert | Square hollow conductor to microstripline coupling arrangement |
-
1978
- 1978-10-13 JP JP12512378A patent/JPS5830764B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5552602A (en) | 1980-04-17 |
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