JPS5841359B2 - Submerged treatment method for metal wire - Google Patents
Submerged treatment method for metal wireInfo
- Publication number
- JPS5841359B2 JPS5841359B2 JP9391479A JP9391479A JPS5841359B2 JP S5841359 B2 JPS5841359 B2 JP S5841359B2 JP 9391479 A JP9391479 A JP 9391479A JP 9391479 A JP9391479 A JP 9391479A JP S5841359 B2 JPS5841359 B2 JP S5841359B2
- Authority
- JP
- Japan
- Prior art keywords
- metal wire
- plating
- magnetic field
- alternating magnetic
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 title claims description 32
- 238000011282 treatment Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 title claims description 8
- 230000005291 magnetic effect Effects 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 description 32
- 239000000243 solution Substances 0.000 description 17
- 238000009713 electroplating Methods 0.000 description 8
- 238000013019 agitation Methods 0.000 description 4
- 150000001768 cations Chemical class 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005294 ferromagnetic effect Effects 0.000 description 2
- 230000005298 paramagnetic effect Effects 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 210000001015 abdomen Anatomy 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- ing And Chemical Polishing (AREA)
Description
【発明の詳細な説明】
この発明は、各種処理液を用いて金属線を処理する方法
、更に詳しくは、金属線に対する電気メッキや電解処理
を行うための方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for treating a metal wire using various treatment liquids, and more specifically to a method for electroplating or electrolytically treating a metal wire.
被加工物を液中に浸漬して各種処理を施す場合、例えば
電気メッキを施すにはメッキ液中において、加工物を電
極に、金属板を陽極にして浸漬し、加工物表面に金属イ
オンを析出させて行うものであるが、被加工物の表面近
傍では陽イオンの欠亡が起り、いわゆる濃度勾配ができ
る。When a workpiece is immersed in a liquid and subjected to various treatments, for example, for electroplating, the workpiece is immersed in a plating solution with the electrode as an electrode and a metal plate as an anode, and metal ions are applied to the surface of the workpiece. Although this is done by precipitation, cations are depleted near the surface of the workpiece, creating a so-called concentration gradient.
従って常に陽イオンを充分に供給しないと、析出が難し
くなって電流効率が低下し、また析出の状態も局部的に
凹凸が激しくなり、いわゆるメッキのヤケが生じて良好
なメッキとはいえなくなる。Therefore, if a sufficient amount of cations are not supplied at all times, deposition becomes difficult and current efficiency decreases, and the deposition condition also becomes locally uneven, resulting in so-called plating discoloration, which results in poor plating.
これを防止するため、メッキ流を激しく攪拌し、被加工
物とメッキ液の相対的動きを増大して、メッキ表面へ常
に完全なるメッキ液を供給することが普通に行われてい
る。To prevent this, it is common practice to vigorously agitate the plating stream to increase the relative movement between the workpiece and the plating solution, thereby constantly supplying a complete plating solution to the plating surface.
例えば第1図のようにワイヤのような金属線に電気メッ
キを施す場合、槽1内のメッキ液2内に陽極金属板3と
陰極の金属線4を浸漬し、金属線4の直下にパイプ5を
配置し、このパイプ5に設けられた
上部の噴射孔から圧縮エヤあるいはメッキ液を噴出させ
、エヤ攪拌あるいは噴流攪拌を行なっている。For example, when applying electroplating to a metal wire such as a wire as shown in FIG. 5 is arranged, and compressed air or plating liquid is ejected from the upper injection hole provided in this pipe 5 to perform air agitation or jet agitation.
このように、メッキ液と金属線の相対的動きの増大を行
うには従来はずべてメッキ液を攪拌流動させるようにし
ている。In this way, in order to increase the relative movement between the plating solution and the metal wire, conventionally the plating solution is stirred and flowed.
しかし乍ら、メッキ液をエヤ攪拌した場合、メッキ工場
内にメッキ液のミストが充満しやすく、衛生上に問題が
あり、また噴流攪拌の場合は、メッキ液中のスラッジな
どにより配管系統のつまりが起る問題があり、しかもメ
ッキ槽内に均等あるいは所望位置や所望通りにエヤブロ
ー又は噴流を与えることは配管系統と圧損により技術的
にもかなり難しいものである。However, when the plating solution is stirred by air, the plating factory is likely to be filled with mist of the plating solution, which poses a sanitary problem.Also, when the plating solution is stirred by jet stream, the piping system gets clogged due to sludge in the plating solution. Furthermore, it is technically quite difficult to apply an air blow or jet flow uniformly or at a desired position or in a desired manner within the plating tank due to the piping system and pressure loss.
この発明は、上記のような問題点に鑑みてなされたもの
であり、処理液は浸漬する金属線に処理液中で振動を与
えて液との相対的動きを増大するようにし、処理効率が
向上し、ミストや配管トラブルの発生がない処理方法を
提供することを目的とする。This invention was made in view of the above-mentioned problems, and the processing efficiency is improved by applying vibration to the metal wire immersed in the processing solution to increase the relative movement with the solution. The purpose is to provide a treatment method that improves the quality of water and eliminates mist and piping troubles.
以下、この発明の実施例を第2図乃至第4図に基いて説
明する。Embodiments of the present invention will be described below with reference to FIGS. 2 to 4.
図面は、ワイヤのような金属線に電気メッキを施す場合
の例であり、メッキ槽1内のメッキ液2に陽極の金属板
3と陰極の金属線4が浸漬されている。The drawing shows an example of electroplating a metal wire such as a wire, in which an anode metal plate 3 and a cathode metal wire 4 are immersed in a plating solution 2 in a plating bath 1.
金属線4はメッキ槽1を貫通し、メッキ槽1の両側外部
において支持体となる電極6のロールで支持される。The metal wire 4 passes through the plating tank 1 and is supported by rolls of electrodes 6 serving as supports outside both sides of the plating tank 1.
前記電極6のロール間におCブるメッキ槽1の内部で、
金属線4に生じる固イ」”振動の腹部の位置に交番磁界
発生器7を設け、上記固有振動数に等しい周波数の交番
磁界をかけ、金属線4に高周波振動を与えるようにして
いる。Inside the plating tank 1 where the electrode 6 is placed between the rolls,
An alternating magnetic field generator 7 is provided at the abdomen of the hard vibrations generated in the metal wire 4, and an alternating magnetic field with a frequency equal to the natural frequency is applied to give high frequency vibration to the metal wire 4.
上記の交番磁界発生器7による交番磁界により、メッキ
液2中で金属線4は振動し、この振動によって金属線4
とメッキ液2の接触は増大し、メッキ表面に対して常に
充分なメッキ液が供給されることになり、析出界面に陽
イオンの供給力が充分に行えて良好なメッキを施すこと
ができる。The metal wire 4 vibrates in the plating solution 2 due to the alternating magnetic field generated by the alternating magnetic field generator 7, and this vibration causes the metal wire 4 to vibrate.
The contact between the plating solution 2 and the plating solution 2 is increased, and a sufficient amount of plating solution is always supplied to the plating surface, so that a sufficient amount of cations can be supplied to the precipitation interface, and good plating can be performed.
なお金属線4が常磁性である場合、上下方向の交番磁束
の中の金属線4を、メッキ電流は第4図において2つの
電極6の中心点を境とし、左側は左の電極6に、右側は
右の電極6に向って流れる。In addition, when the metal wire 4 is paramagnetic, the plating current is applied to the metal wire 4 in the alternating magnetic flux in the vertical direction, with the center point of the two electrodes 6 as the boundary in FIG. The right side flows toward the right electrode 6.
このときフレミングの法則により、金属線4に対して水
平方向の力が働き、磁界は交番であるので、その周期と
同じ周期で、力は左右交互に働き、金属線4は振動数や
加振位置によって異なるが、第4図に示すような平面的
な振動状態となる。At this time, according to Fleming's law, a horizontal force acts on the metal wire 4, and since the magnetic field is alternating, the force acts alternately on the left and right with the same period as that period, and the metal wire 4 is affected by the frequency and excitation. Although it varies depending on the position, a planar vibration state as shown in FIG. 4 is obtained.
なお、このとき電極間の中心を境に互いに反対の方向に
電流が流れるので交番磁界発生器7は、中心点に対して
対称の位置にもう1個位相が逆の交番磁界発生器を設け
れば、一層激しい振動が得られる。Note that at this time, since currents flow in opposite directions with the center between the electrodes as a boundary, the alternating magnetic field generator 7 is provided with another alternating magnetic field generator having an opposite phase at a symmetrical position with respect to the center point. If you do so, you will get even more intense vibrations.
また金属線4が強磁性である場合、前記常磁性の場合と
同様の水平方向の振動と同時に、強磁性であるから磁気
による誘引によって第3図上下方向の振動が同じ周期で
加振され、従って金属線4には水平と垂直の合成された
三次元方向の振動が与えられることになる。Furthermore, if the metal wire 4 is ferromagnetic, at the same time as the horizontal vibration as in the paramagnetic case, since it is ferromagnetic, the vertical vibration in FIG. 3 is excited at the same period due to magnetic attraction. Therefore, the metal wire 4 is given a three-dimensional vibration that is a combination of horizontal and vertical vibrations.
なお実施例では金属線の電気メッキに用いた場合を示し
たが、このような用途に限定されるものではなく、例え
ば電気メッキの前処理としての酸洗、陽極あるいは陰極
の溶解処理、メッキとは逆の電解処理、前記各処理の水
洗工程など、液体を使用する場合に用いることができる
。In addition, although the example shows the case where it is used for electroplating of metal wire, it is not limited to this kind of use.For example, it can be used for pickling as a pre-treatment for electroplating, dissolving treatment for an anode or cathode, and plating. can be used when a liquid is used, such as reverse electrolytic treatment and the water washing step of each of the above-mentioned treatments.
また、従来から用いられているエヤ攪拌や噴流攪拌手段
を併用するようにしてもよく、より一層の効果を得るこ
とができる。Further, conventionally used air agitation or jet agitation means may be used in combination, and further effects can be obtained.
以上のように、この発明の方法によると、処理液中に浸
漬する金属線に交番磁界発生器で振動を与えるようにし
たので、処理液中で金属線が振動して処理液との接触が
増大し、メッキや電解等の処理が効果的に行えるように
なる。As described above, according to the method of the present invention, the metal wire immersed in the processing liquid is vibrated by an alternating magnetic field generator, so that the metal wire vibrates in the processing liquid and does not come into contact with the processing liquid. This increases the effectiveness of treatments such as plating and electrolysis.
また交番磁界発生器で振動を与えるのでミストや配管ト
ラブルの発生が全くなく、複数本が同時であっても一様
の振動を与えることができ、効果も常に安定しているの
である。In addition, since the vibration is applied by an alternating magnetic field generator, there is no mist or piping trouble, and uniform vibration can be applied even when multiple pipes are used at the same time, and the effect is always stable.
第1図は従来の電気メッキの方法を示す説明図、第2図
はこの発明の処理方法を電気メッキに用いた例を示す縦
断正面図、第3図は同縦断側面図、第4図は金属線の振
動状態を示す平面図である。
1・・・・・・メッキ槽、2・・・・・・メッキ液、3
・・・・・・金属板、4・・・・・・金属線、6・・・
・・・電極、7・・・・・・交番磁界発生器。Fig. 1 is an explanatory diagram showing a conventional electroplating method, Fig. 2 is a longitudinal sectional front view showing an example in which the treatment method of the present invention is used for electroplating, Fig. 3 is a longitudinal sectional side view of the same, and Fig. 4 is It is a top view which shows the vibration state of a metal wire. 1...Plating tank, 2...Plating solution, 3
...Metal plate, 4...Metal wire, 6...
...electrode, 7...alternating magnetic field generator.
Claims (1)
れる間で、この金属線に生じる固有振動の腹部の位置に
交番磁界発生器を配置し、前記交番磁界発生器に固有振
動数と等しい周波数の交番磁界を発生させて処理液中で
金属線に振動を与え、この振動によって金属線と処理液
の相対的動きを増大する事を特徴とする金属線の液中処
理方法。1. While the metal wire immersed in the treatment liquid is supported by a support, an alternating magnetic field generator is placed at the midpoint of the natural vibration occurring in the metal wire, and the alternating magnetic field generator has a frequency equal to the natural vibration. A method for submerged processing of a metal wire, characterized by generating an alternating magnetic field of frequency to give vibration to the metal wire in a processing solution, and increasing relative movement between the metal wire and the processing solution by the vibration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9391479A JPS5841359B2 (en) | 1979-07-23 | 1979-07-23 | Submerged treatment method for metal wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9391479A JPS5841359B2 (en) | 1979-07-23 | 1979-07-23 | Submerged treatment method for metal wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5616694A JPS5616694A (en) | 1981-02-17 |
| JPS5841359B2 true JPS5841359B2 (en) | 1983-09-12 |
Family
ID=14095731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9391479A Expired JPS5841359B2 (en) | 1979-07-23 | 1979-07-23 | Submerged treatment method for metal wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5841359B2 (en) |
-
1979
- 1979-07-23 JP JP9391479A patent/JPS5841359B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5616694A (en) | 1981-02-17 |
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