JPS5842872B2 - Method for producing diester diacid anhydride - Google Patents
Method for producing diester diacid anhydrideInfo
- Publication number
- JPS5842872B2 JPS5842872B2 JP1696977A JP1696977A JPS5842872B2 JP S5842872 B2 JPS5842872 B2 JP S5842872B2 JP 1696977 A JP1696977 A JP 1696977A JP 1696977 A JP1696977 A JP 1696977A JP S5842872 B2 JPS5842872 B2 JP S5842872B2
- Authority
- JP
- Japan
- Prior art keywords
- reaction
- anhydride
- acid anhydride
- epoxy resin
- diacid anhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 150000005690 diesters Chemical class 0.000 title description 4
- 150000008064 anhydrides Chemical class 0.000 title description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 15
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 15
- -1 aromatic tetracarboxylic acid Chemical class 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 8
- 239000007810 chemical reaction solvent Substances 0.000 claims description 7
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 4
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 4
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 claims description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims 1
- 239000012965 benzophenone Substances 0.000 claims 1
- 150000002009 diols Chemical class 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 239000007795 chemical reaction product Substances 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 150000008065 acid anhydrides Chemical class 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000005886 esterification reaction Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000921 elemental analysis Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000012456 homogeneous solution Substances 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Furan Compounds (AREA)
Description
【発明の詳細な説明】
本発明は一般にエポキシ樹脂硬化剤として用いられる中
央主鎖中にエステル結合をもつジエステルジ酸無水物の
製法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a diester dianhydride having an ester bond in the central main chain, which is generally used as an epoxy resin curing agent.
一般に芳香族テトラカルボン酸無水物として知られるピ
ロメリティックジ酸無水物(PMDA)や3・3′・4
・4′−ベンゾフェノンテトラカルボン酸無水物(BT
DA)はエポキシ樹脂と混合し硬化したとき、例えば毒
性の高いアミン系触媒を用いなくとも硬化反応性が高く
、しかも硬化エポキシ樹脂中量も優れた耐熱性及び耐薬
器性が得られることが知られている。Pyromellitic diacid anhydride (PMDA), which is generally known as aromatic tetracarboxylic anhydride, and 3,3',4
・4'-benzophenonetetracarboxylic anhydride (BT
It is known that when DA) is mixed with an epoxy resin and cured, it has high curing reactivity without using a highly toxic amine catalyst, and also has excellent heat resistance and chemical resistance even when the amount of cured epoxy resin is used. It is being
しかし特に上記芳香族テトラカルボッ酸無水物は融点が
高く、エポキシ樹脂との相溶性に劣り、しかもその混合
物は分離し易くポットライフが短い等の欠点をもってい
る。However, the aromatic tetracarboxylic anhydride has particularly high melting points, poor compatibility with epoxy resins, and has disadvantages such as easy separation of the mixture and short pot life.
とくに有機溶媒への溶解性に乏しいことは塗装、積層、
接着剤としての使用を困難にしている。In particular, poor solubility in organic solvents is important for painting, laminating,
This makes it difficult to use as an adhesive.
この点を改良するため芳香族テトラカルボン酸無水物1
モルと脂肪族ジオール0.5モルを反応させて、溶媒に
溶解する形に変えることが知られている。To improve this point, aromatic tetracarboxylic anhydride 1
It is known to react with 0.5 mole of aliphatic diol to convert it into a form that can be dissolved in a solvent.
従来反応溶媒としてはメチルエチルケトン(MEK)、
メチルイソブチルケトン(MIBK)酢酸セロソルブ等
が一般に知られている。Conventional reaction solvents include methyl ethyl ketone (MEK),
Methyl isobutyl ketone (MIBK), cellosolve acetate, and the like are generally known.
溶液反応によって得られる生成物は一般のエポキシ樹脂
とよく混合し、これを過半な溶媒にで希釈したのち塗装
、積層板、接着剤に用いている。The product obtained by solution reaction is mixed well with general epoxy resin, diluted with a majority solvent, and used for coatings, laminates, and adhesives.
有機溶媒中での反応は下記(1)式のように進む。The reaction in an organic solvent proceeds as shown in equation (1) below.
但しく1)式中Arは芳香族残基、Rは脂肪族残基な示
す。However, 1) In the formula, Ar represents an aromatic residue and R represents an aliphatic residue.
反応は不活性ガス雰囲気中で環流しながら行ない、反応
後室温に冷却し、不溶性のものを沢過する。The reaction is carried out under reflux in an inert gas atmosphere, and after the reaction is cooled to room temperature, insoluble materials are filtered off.
この化合物は乾燥雰囲気中にて保存すると数カ月間安定
である。This compound is stable for several months when stored in a dry atmosphere.
エポキシ樹脂と適度に混合すれば(1)式中のArおよ
びRの構造を適宜選択することにより、反応性に富む室
温付近での硬化が可能なエポキシ樹脂組成物や耐薬品性
、接着力、硬度等が優れたエポキシ樹脂組成物、可撓性
に富むエポキシ樹脂組成物等が得られる。By appropriately selecting the structures of Ar and R in formula (1), when mixed with an epoxy resin appropriately, an epoxy resin composition that is highly reactive and can be cured near room temperature, chemical resistance, adhesive strength, An epoxy resin composition with excellent hardness etc., an epoxy resin composition with high flexibility, etc. can be obtained.
また有機溶媒への溶解性が高まるために乾式積層法の適
用が容易となる。In addition, the increased solubility in organic solvents facilitates the application of dry lamination methods.
しかしながら(1)式の反応によって所望の反応生成物
であるジエステルジ酸無水物を得るための従来法は少な
くとも数時間の反応時間を要し、且つ収率が低く、脂肪
族ジオールの種類によっては十分な反応を行なうことも
困難であった。However, the conventional method for obtaining diester dianhydride, which is the desired reaction product, by the reaction of formula (1) requires a reaction time of at least several hours, has a low yield, and is insufficient depending on the type of aliphatic diol. It was also difficult to perform a similar reaction.
★★ 本発明は(1)式に示した溶液反応の改善に関す
る。★★ The present invention relates to improvement of the solution reaction shown in equation (1).
すなわち反応を従来よりも低温で且つ短時間で完結せし
め、収率を高めることにより所望の化合物を安定に、し
かも経済的に得ることを特徴とするものである。That is, it is characterized by completing the reaction at a lower temperature and in a shorter time than conventional methods, and by increasing the yield, the desired compound can be obtained stably and economically.
以下従来例と本発明の詳細な説明する。A detailed explanation of the conventional example and the present invention will be given below.
従来例
N2ガス導入管、温度計、攪拌機、冷却管を装備した3
1のセパラブルフラスコ内にPMDAと各種脂肪族ジオ
ールを反応溶媒と共に仕込み、N2ガス雰囲気中で環流
することによって(1)式に従って所望のジエステルジ
酸無水物を得る。Conventional example 3 equipped with N2 gas introduction pipe, thermometer, stirrer, and cooling pipe
PMDA and various aliphatic diols are charged together with a reaction solvent into a separable flask (No. 1), and the mixture is refluxed in an N2 gas atmosphere to obtain a desired diester di-acid anhydride according to formula (1).
反応溶媒および反応温度はそれぞれMEK(80℃)、
MIBK/MEK(9/1 )(100℃)酢酸セロソ
ルブ(120℃)、およびキシレン(140℃)を用い
た。The reaction solvent and reaction temperature were MEK (80°C),
MIBK/MEK (9/1) (100°C), cellosolve acetate (120°C), and xylene (140°C) were used.
結果を第1表に示す。但し溶液濃度は約40%である。The results are shown in Table 1. However, the solution concentration is approximately 40%.
チルホルムアミドを反応溶媒として用いたものについて
説明する。A method using chillformamide as a reaction solvent will be explained.
PMDA436F、エチレングリコール62グとN−N
’ジメチルホルムアミド100Oyを仕込み、N2 ガ
スでフラスコ内を置換したのち加熱攪拌した。PMDA436F, ethylene glycol 62g and N-N
100 Oy of dimethylformamide was charged, and the inside of the flask was replaced with N2 gas, followed by heating and stirring.
昇温は20〜30℃の室温から60℃まで約20分かげ
た。The temperature was raised from room temperature of 20 to 30°C to 60°C in about 20 minutes.
不透明な内容物8150〜60℃(10〜20分)で速
やかに進行するエステル化反応によって赤褐色の透明溶
液に変化する。The opaque contents 81 change to a reddish-brown transparent solution due to the esterification reaction that proceeds rapidly at 50-60°C (10-20 minutes).
この溶液を60℃±10 degで減圧蒸留するこ**
とによりもろい固体が得られる。Distill this solution under reduced pressure at 60°C ± 10 deg**
A brittle solid is obtained.
このものはアセトン及びMEKlooFに対し、それぞ
れ100を以上溶解し均一な溶液となる。This product dissolves more than 100% of each of acetone and MEKlooF, forming a uniform solution.
再結晶法によって精製して得た反応生成物の有機元素分
析結果と、前記反応生成物をメチルアルコールによるメ
チルエステル化並びに加水分解し、フェノールフタレイ
ンを指示薬として水酸化ナトリウムで滴定することによ
って求めた無水酸量(meg /f? )、前記無水酸
量から推定した反応生成物中の無水酸量(%)を第2表
に示す。The organic elemental analysis result of the reaction product obtained by purification by the recrystallization method, and the methyl esterification and hydrolysis of the reaction product with methyl alcohol, and the titration with sodium hydroxide using phenolphthalein as an indicator. Table 2 shows the amount of acid anhydride (meg/f?) and the amount of acid anhydride (%) in the reaction product estimated from the amount of acid anhydride.
元素分析における理論値は水素2,8%、炭素49.2
%であり測定結果とよく一致している。Theoretical values in elemental analysis are 2.8% hydrogen and 49.2% carbon.
%, which agrees well with the measurement results.
また反応生成物中の無水酸量の推定値は92〜96※
※%であり、反応生成物中の少なくとも90%以上の下
記2式の構造を有するジエステルジ酸無水物が従来法に
比し容易に得られる。In addition, the estimated amount of acid anhydride in the reaction product is 92-96* *%, and it is easier to obtain diester dianhydride having the structure of the following two formulas, which accounts for at least 90% of the reaction product, compared to the conventional method. can be obtained.
本発明実施例 2
前例の装置を用いBTDA644.4Pとエチレングリ
コール62Pを本発明に基づ<N −N’ジメチルホル
ムアミド200(lを反応溶媒として実施例1と同様な
操作により反応させた。Example 2 of the Present Invention Using the apparatus of the previous example, BTDA644.4P and ethylene glycol 62P were reacted according to the present invention in the same manner as in Example 1 using <N-N' dimethylformamide 200 (l) as the reaction solvent.
実施例1と同様に50〜60℃(10〜20分)で速や
かにエステル化反応が完結し赤褐色の透明溶液を得る。As in Example 1, the esterification reaction is quickly completed at 50-60°C (10-20 minutes) to obtain a reddish-brown transparent solution.
60℃±10 degで減圧蒸留したのち真空乾燥(2
0間Hg、80℃、4時間)した内容物は融点約115
℃のもろい固体である。After vacuum distillation at 60°C ± 10 deg, vacuum drying (2
0 Hg, 80°C, 4 hours) The contents have a melting point of approximately 115
It is a brittle solid at ℃.
赤外吸収スペクトルによりエステル、酸無水物、カルボ
キシル基の吸収が認められる。Absorption of esters, acid anhydrides, and carboxyl groups is observed in the infrared absorption spectrum.
そこでこれ等の内部標準物質として芳香族残基に基づく
1610CrIl−1を用い、別に加水分解した酸を混
入した試料を作り無水酸、エステル、遊離酸の濃度をそ
れぞれ既知量とし、実施例10滴定法による無水酸量(
%)との検量線を作成し、反応生成物中の無水酸量を推
定した。Therefore, using 1610CrIl-1, which is based on aromatic residues, as an internal standard substance, a sample was prepared in which separately hydrolyzed acid was mixed, and the concentrations of anhydrous acid, ester, and free acid were each known. Acid anhydride amount by method (
%) was created to estimate the amount of acid anhydride in the reaction product.
この結果、反応生成物中の無水酸量は92〜96%であ
り、アセトン及びMEK100f?に対し100P以上
の高濃度均一溶液が得られる。As a result, the amount of acid anhydride in the reaction product was 92 to 96%, including acetone and MEK100f? A highly concentrated homogeneous solution of 100P or more can be obtained.
従って下記3式の構造を有する所望のジエステルジ酸無
水物が少なくとも90%以上の収率で容易に得られる。Therefore, the desired diester di-acid anhydride having the structure of the following three formulas can be easily obtained with a yield of at least 90%.
本発明実施例 3
前例の装置を用いBTDA644.4F、エチレングリ
コール62?、N−N’ジメチルホルムアミドを主成分
とする混合溶媒2000S’をフラスコに仕込み実施例
1と同様な操作を行なった。Example 3 of the present invention Using the apparatus of the previous example, BTDA644.4F and ethylene glycol 62? , N-N' A mixed solvent 2000S' containing dimethylformamide as a main component was charged into a flask, and the same operation as in Example 1 was performed.
混合溶媒の組成と反応が完結に至る条件を第3表に示す
。Table 3 shows the composition of the mixed solvent and the conditions for completing the reaction.
実施例2と同様に回収した反応生成物の無水酸量な赤外
吸収スペクトルにより推定すればいずれの場合も91〜
95%であり、アセトン及びMEK100S’に対し1
001以上の高濃度均一溶液が得られる。As estimated from the infrared absorption spectrum of the acid anhydride amount of the reaction product recovered in the same manner as in Example 2, in each case 91 ~
95% and 1 for acetone and MEK100S'
A highly concentrated homogeneous solution of 0.001 or higher can be obtained.
従って実施例2.2式で示した構造を有する所望のジエ
ステル4□無水物が実施例2と同様に少なくとも90%
以上の収率で容易に得られる。Therefore, as in Example 2, at least 90% of the desired diester 4□ anhydride having the structure shown in formula 2.
It can be easily obtained with the above yield.
以上のように本発明によれば従来法で示した反応操作に
比し、低い反応温度で、且つ非常に短時間で所望の反応
生成物を高収率で得ることが可能である。As described above, according to the present invention, it is possible to obtain a desired reaction product in high yield at a lower reaction temperature and in a much shorter time than in the reaction operations shown in conventional methods.
また脂肪族ジオール類による制約も受けず、例工ばP−
P′−1so−プロピリデンビフェノール等の芳香族ジ
オール類とテトラカルボン酸無水物を反応させることも
できる。In addition, it is not limited by aliphatic diols, and for example, P-
It is also possible to react aromatic diols such as P'-1so-propylidene biphenol with tetracarboxylic acid anhydride.
従って本発明によれば従来法に比しテトラカルボン酸無
水物よりも溶解性が著しく優れた低融点のジエステルジ
酸無水物が安定に且つ経済的に得られるのでエポキシ樹
脂と混合し塗装、積層、接着等の用途に対し安定に、ま
た経済的で優れた性質のエポキシ樹脂組成物を提供する
ことができる。Therefore, according to the present invention, it is possible to stably and economically obtain diester dianhydride with a low melting point, which has significantly better solubility than tetracarboxylic anhydride, compared to conventional methods, so that it can be mixed with an epoxy resin, coated, laminated, etc. It is possible to provide an epoxy resin composition that is stable, economical, and has excellent properties for applications such as adhesion.
Claims (1)
ジメチルホルムアミドと酢酸セロソルブ、メチルエチル
ケトン、メチルイソブチルケトンのいずれかとの混合液
を反応溶媒とし、この反応溶媒中にて、芳香族テトラカ
ルボン酸無水物1モルとジオール0.5モルをエステル
化することにより(但しAr :ベンゼンまたはベンゾフェノン、R:★301エチレ
ン)なる構造のジエステルジ酸無水物を得ることを特徴
としたジエステルジ酸無水物の製造方法。[Claims] I N-N'dimethylformamide alone or NN'
By using a mixture of dimethylformamide and either cellosolve acetate, methyl ethyl ketone, or methyl isobutyl ketone as a reaction solvent, and esterifying 1 mole of aromatic tetracarboxylic acid anhydride and 0.5 mole of diol in this reaction solvent. (However, Ar: benzene or benzophenone, R: ★301 ethylene) A method for producing a diester dianhydride, characterized by obtaining a diester dianhydride having the following structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1696977A JPS5842872B2 (en) | 1977-02-17 | 1977-02-17 | Method for producing diester diacid anhydride |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1696977A JPS5842872B2 (en) | 1977-02-17 | 1977-02-17 | Method for producing diester diacid anhydride |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53101326A JPS53101326A (en) | 1978-09-04 |
| JPS5842872B2 true JPS5842872B2 (en) | 1983-09-22 |
Family
ID=11930908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1696977A Expired JPS5842872B2 (en) | 1977-02-17 | 1977-02-17 | Method for producing diester diacid anhydride |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5842872B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH035190U (en) * | 1989-05-31 | 1991-01-18 |
-
1977
- 1977-02-17 JP JP1696977A patent/JPS5842872B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH035190U (en) * | 1989-05-31 | 1991-01-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53101326A (en) | 1978-09-04 |
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