JPS5843763B2 - Kurikaeshiundoukikouto Serbokikou Niyor Fukugou Undoukikou - Google Patents
Kurikaeshiundoukikouto Serbokikou Niyor Fukugou UndoukikouInfo
- Publication number
- JPS5843763B2 JPS5843763B2 JP49086996A JP8699674A JPS5843763B2 JP S5843763 B2 JPS5843763 B2 JP S5843763B2 JP 49086996 A JP49086996 A JP 49086996A JP 8699674 A JP8699674 A JP 8699674A JP S5843763 B2 JPS5843763 B2 JP S5843763B2
- Authority
- JP
- Japan
- Prior art keywords
- movement mechanism
- movement
- cam
- servo
- undoukikou
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Control Of Position Or Direction (AREA)
Description
【発明の詳細な説明】
本発明は、一定のくり返し運動をしている物体に、任意
の時間にサーボ機構で微小運動を付加することにより、
くり返し運動を微小補正することを目的とした複合運動
機構に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention enables a servo mechanism to add micro-movements to objects that are in constant repetitive motion at arbitrary times.
This invention relates to a complex motion mechanism aimed at making minute corrections to repeated motions.
従来、たとえばトランジスタの組立においては、金線を
案内するキャピラリーをカム機構により一定くり返し運
動させワイヤーボンディングを行なっている。Conventionally, for example, when assembling a transistor, wire bonding is performed by moving a capillary that guides a gold wire repeatedly using a cam mechanism.
この場合、組立てのために供給されるトランジスタの位
置にばらつきがあるため、一定のくり返し運動では正し
い位置にボンディングができない。In this case, due to variations in the positions of the transistors supplied for assembly, constant repeated movements cannot bond in the correct position.
そこでカムによる移動機構の下に手動位置合わせ機構を
設置し、操作員の手作業によりボンディング位置合わせ
を行なっている。Therefore, a manual positioning mechanism is installed below the cam-based moving mechanism, and bonding positioning is performed manually by an operator.
しかしこの方法では、操作員が疲労した場合には、十分
な位置合わせができず、ミスボンディングをしたり、未
経験者には伺らかの学習が必要である点など問題がある
。However, this method has problems such as insufficient positioning if the operator is fatigued, resulting in incorrect bonding, and the need for inexperienced operators to learn from the beginning.
本発明は、以上のような一定のくり返し運動中にサーボ
機構により微小運動を付加し、くり返し運動の一部を補
正することを目的とした複合運動機構を提供するもので
ある。The present invention provides a compound motion mechanism that aims to correct a portion of the repetitive motion by adding minute motions using a servo mechanism during the above-described constant repetitive motion.
以下本発明を実施例によって詳細に説明する。The present invention will be explained in detail below using examples.
第1図は、トランジスタ組立機のボンディング機構の構
成を示す。FIG. 1 shows the configuration of a bonding mechanism of a transistor assembly machine.
1はテレビカメラ、2は特願昭48−21636の手段
を用いた認識および判定装置、3はサーボ機構、4はパ
ルスモータ、5はカム機構で運動する移動機構、6はア
ーム、7はキャピラリー、8はトランジスタペレット、
9はベース電極、10はエミッタ電極、11はコレクタ
リード、12はベースリード、13はエミッタリードで
ある。1 is a television camera, 2 is a recognition and determination device using the means described in Japanese Patent Application No. 48-21636, 3 is a servo mechanism, 4 is a pulse motor, 5 is a moving mechanism operated by a cam mechanism, 6 is an arm, and 7 is a capillary. , 8 is a transistor pellet,
9 is a base electrode, 10 is an emitter electrode, 11 is a collector lead, 12 is a base lead, and 13 is an emitter lead.
キャピラリー7は、アームにとりつけられ、カム機構で
運動する移動機構5により、第2図に示す破線の矢印の
方向に一定の往復運動をしてトランジスタペレット8の
ベース電極9とベースリード12、エミッタ電極10と
エミッタリード13に金線14をボンディングする。The capillary 7 is attached to an arm and moves in a constant reciprocating manner in the direction of the dashed arrow shown in FIG. A gold wire 14 is bonded to the electrode 10 and emitter lead 13.
ここで、供給されるトランジスタペレット8の位置にば
らつきがあるため、ベース電極9とエミッタ電極10に
金線14が接触する直前に、キャピラリー7を正しいボ
ンディング位置に合わせる必要がある。Here, since there are variations in the positions of the supplied transistor pellets 8, it is necessary to align the capillary 7 to the correct bonding position immediately before the gold wire 14 contacts the base electrode 9 and the emitter electrode 10.
従来は、カム機構で運動する移動機構5の下に手動位置
合わせ機構を設け、操作員により位置合わせを行なって
いた。Conventionally, a manual positioning mechanism was provided below the moving mechanism 5 that moves using a cam mechanism, and positioning was performed by an operator.
本発明では、手動位置合わせ機構の代わりにサーボ機構
3を設け、テレビカメラ1により、トランジスタペレッ
ト8の画像をとり込み、特願昭48−21636の手段
を用いた認識および判定装置2により、トランジスタペ
レット8のベース電極9およびエミッタ電極10の位置
を認識し、判定結果でサーボ機構3のパルスモータ4を
駆動する。In the present invention, a servo mechanism 3 is provided in place of the manual positioning mechanism, an image of the transistor pellet 8 is captured by a television camera 1, and an image of the transistor pellet 8 is captured by a recognition and determination device 2 using the means disclosed in Japanese Patent Application No. 48-21636. The positions of the base electrode 9 and emitter electrode 10 of the pellet 8 are recognized, and the pulse motor 4 of the servo mechanism 3 is driven based on the determination result.
第3図にサーボ機構3の断面図を示す。FIG. 3 shows a sectional view of the servo mechanism 3.
15は送りねじ、16は固定テーブル、11は鋼球、1
8はXテーブル、19はYテーブルである。15 is a feed screw, 16 is a fixed table, 11 is a steel ball, 1
8 is an X table, and 19 is a Y table.
認識および判定装置2により、パルスモータ4が駆動さ
れると、パルスモータ4の軸に結合された送りねじ15
が回転し、これにかみあっているXテーブル18または
、Yテーブル19を鋼球17を案内にして送りねじ15
の軸方向に移動させ、正しい電極の位置にボンディング
する。When the pulse motor 4 is driven by the recognition and determination device 2, the feed screw 15 coupled to the shaft of the pulse motor 4
rotates, and the X table 18 or Y table 19 meshing with it is guided by the steel ball 17 to drive the feed screw 15.
axially and bond to the correct electrode position.
サーボ機構3による位置修正は、それぞれの電極ヘボン
デイングする直前に行なわれる。The position correction by the servo mechanism 3 is performed immediately before bonding to each electrode.
なお、上記実施例では、カムによる一定くり返し運動に
サーボ機構で、特定の時間に微小変位を与えたが、本発
明による複合運動機構は、一定のくり返し運動をしてい
る物体の、任意の時間の変位、速度、加速度、角度、角
速度、角加速度等を補正することも可能である。In the above embodiment, the servo mechanism gives a minute displacement at a specific time to the constant repetitive movement of the cam, but the compound motion mechanism according to the present invention can apply a minute displacement to an object that is making a constant repetitive motion at any given time. It is also possible to correct displacement, velocity, acceleration, angle, angular velocity, angular acceleration, etc.
第1図は、本発明のトランジスタ組立機のボンディング
機構の構成を示す図。
第2図は、キャピラリーの運動軌跡を示す図。
第3図は、サーボ機構の断面図を示す図である。
1はテレビカメラ、2は特願昭48−21636の手段
を用いた認識および判定装置、3はサーボ機構、4はパ
ルスモータ、5はカム機構で運動する移動機構、6はア
ーム、7はキャピラリー8はトランジスタペレット、9
はベース電極、10はエミッタ電極、11はコレクタリ
ード、12はベースリード、13はエミッタリード、1
4は金線、15は送りねじ、16は固定テーブル、17
は鋼球、18はXテーブル、19はYテーブルである。FIG. 1 is a diagram showing the configuration of a bonding mechanism of a transistor assembly machine according to the present invention. FIG. 2 is a diagram showing the movement trajectory of the capillary. FIG. 3 is a diagram showing a cross-sectional view of the servo mechanism. 1 is a television camera, 2 is a recognition and judgment device using the means described in Japanese Patent Application No. 48-21636, 3 is a servo mechanism, 4 is a pulse motor, 5 is a moving mechanism operated by a cam mechanism, 6 is an arm, and 7 is a capillary. 8 is a transistor pellet, 9
is a base electrode, 10 is an emitter electrode, 11 is a collector lead, 12 is a base lead, 13 is an emitter lead, 1
4 is a gold wire, 15 is a feed screw, 16 is a fixed table, 17
is a steel ball, 18 is an X table, and 19 is a Y table.
Claims (1)
のカム運動機構と、該カム運動機構全体を搭載保持する
サーボ運動機構とを有し、上記被動体が前記サーボ運動
機構上で上記カム運動機構による一定りくり返し運動を
付与されている間の任意の時間に上記のカム運動機構全
体に対し前記のサーボ運動機構による微小運動を付加す
ることにより、上記被動体が上記カム運動機構による一
定のくり返し運動と前記サーボ運動機構による微小運動
との合成された運動を行なうようにしてなるこことを特
徴とする複合運動機構。1. A cam movement mechanism for causing a driven body to perform a certain repetitive motion, and a servo movement mechanism that mounts and holds the entire cam movement mechanism, wherein the driven body moves the cam movement mechanism on the servo movement mechanism. By adding a minute movement by the servo movement mechanism to the entire cam movement mechanism at any time while the driven body is being subjected to a certain repetition movement by the cam movement mechanism, A compound movement mechanism characterized by performing a movement that is a combination of movement and a minute movement by the servo movement mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49086996A JPS5843763B2 (en) | 1974-07-31 | 1974-07-31 | Kurikaeshiundoukikouto Serbokikou Niyor Fukugou Undoukikou |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49086996A JPS5843763B2 (en) | 1974-07-31 | 1974-07-31 | Kurikaeshiundoukikouto Serbokikou Niyor Fukugou Undoukikou |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5115791A JPS5115791A (en) | 1976-02-07 |
| JPS5843763B2 true JPS5843763B2 (en) | 1983-09-29 |
Family
ID=13902474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49086996A Expired JPS5843763B2 (en) | 1974-07-31 | 1974-07-31 | Kurikaeshiundoukikouto Serbokikou Niyor Fukugou Undoukikou |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5843763B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04107922U (en) * | 1991-02-28 | 1992-09-17 | 日本特殊陶業株式会社 | Ladder type electric filter |
| JPH04110025U (en) * | 1991-03-12 | 1992-09-24 | 日本特殊陶業株式会社 | Ladder type electric filter case |
| JPH0528122U (en) * | 1991-09-18 | 1993-04-09 | 日本特殊陶業株式会社 | Piezoelectric filter |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6092560U (en) * | 1983-11-30 | 1985-06-24 | 株式会社ダイキンゴルフ | Utsudo club head |
-
1974
- 1974-07-31 JP JP49086996A patent/JPS5843763B2/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04107922U (en) * | 1991-02-28 | 1992-09-17 | 日本特殊陶業株式会社 | Ladder type electric filter |
| JPH04110025U (en) * | 1991-03-12 | 1992-09-24 | 日本特殊陶業株式会社 | Ladder type electric filter case |
| JPH0528122U (en) * | 1991-09-18 | 1993-04-09 | 日本特殊陶業株式会社 | Piezoelectric filter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5115791A (en) | 1976-02-07 |
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