JPS5846859B2 - How to align semiconductor pellets - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor pellet arranging method for arranging a large number of semiconductor pellets attached to a flexible sheet at predetermined intervals.

Generally, semiconductor pellets are obtained by adhering a semiconductor wafer to a flexible sheet, scribing the wafer, and then dicing the wafer.

A large number of semiconductor pellets thus obtained are taken out one by one from the sheet and mounted in the next step.

On the other hand, in order to take out the semiconductor pellets one by one from the sheet, the positions of the pellets are stored in a reading device or the like, and this device drives a jig to automatically take out the pellets.

Therefore, a large number of pellets are arranged in a regular manner so that the jig can pick them one by one in sequence according to the signal from the reader, and the pellets are spaced apart from each other at a predetermined interval so that the jig can reliably pick one pellet. It must be thrown in a lined manner.

Conventionally, the method for arranging the pellets at predetermined intervals was to dice a semiconductor wafer and then simply stretch the sheet to which the wafer was attached using a heated piston or the like.

Therefore, according to such means, the sheet has different heat conductivity between the peripheral edge and the center of the semiconductor wafer,
Since the periphery of the sheet tends to be hotter, there is a problem in that the sheet does not lie uniformly, resulting in an error in the spacing between the pellets.

Furthermore, the adhesive used to attach the semiconductor wafer to the sheet is
Since it does not collapse like a sheet, it has the disadvantage that the difference in elongation causes the pellet to peel off from the sheet and shift from its predetermined position.

This invention was made based on the above-mentioned circumstances, and its purpose is to be able to uniformly stretch a sheet, and even if the semiconductor pellets are peeled off from the sheet by stretching the sheet, the pellets are It is an object of the present invention to provide a method for arranging semiconductor pellets in which the pellets can be positioned with high precision without being shifted on a sheet.

Hereinafter, one embodiment of the present invention will be described based on the drawings.

First, as shown in FIG. 1, a semiconductor wafer 1 is attached to a flexible sheet 2 made of a polymeric material such as vinyl chloride, and scribing is performed to carve a large number of dividing lines 3 on the wafer 1. do.

Next, the semiconductor wafer -1 is diced and divided into a large number of semiconductor pellets 4 along the dividing line 3 as shown in FIG.

Thereafter, the flexible sheet 2 is held in a stretching device 5 shown in FIG.

This enlarging device 5 includes a base 7 in which a cylindrical hole 6 is bored, a holder 8 consisting of a pair of clamping pieces 8a and 8b provided on the upper surface of the base 7, and a holder 8 consisting of a pair of clamping pieces 8a and 8b provided on the upper surface of the base 7, and a hole 6 in the base 7.
The sheet 2 is held by the holder 8 and the cylinder 9 disposed opposite to the cylinder 9 .

Further, the cylinder 9 has a piston 10 connected to its rod 9a as a force-reducing heating element.

The piston 10 has a built-in heater 11, and a plurality of air passages 11 are formed in the circumferential wall of the piston 10.

This air passage 11 is connected to a blower (not shown) via a flexible member 12, and hot air is supplied from the blower.

Further, on the upper surface of the piston 10, a raised plate 15, which has a groove 13 carved in the peripheral wall and an engagement shaft 14 provided on the lower surface side, connects the engagement shaft 14 to the piston. 10 A hole 16 bored in the upper surface of the piston 10 is fitted and mounted 0 However, when hot air is blown out from the air passage 11 of the piston 10, this hot air flows through the hole in the base 7 as shown by the arrow in the figure. 6 to uniformly heat the sheet 2 and also rub the sheet 2 to charge the sheet 2 with static electricity.

Thereafter, as shown in FIG. 4, when the cylinder 9 is actuated and the piston 10 heated by the heater 11 is raised by a predetermined stroke, the seat 2 is heated by the heat transfer from the piston 10 to the heat storage plate 15. And because it has been heated with hot air beforehand, it is drawn out.

At this time, since the sheet 2 is uniformly heated by the hot air, it stretches uniformly according to the heating state.

Therefore, the semiconductor pellet 4 attached to this sheet 2
... are spaced at equal intervals, so these pellets 4...
・Can be aligned with high precision.

In addition, since the hot air rubs the sheet 2 and charges the sheet 2 with static electricity, the sheet 2 is pulled and f
EI] When doing Irf, pellet 4 from sheet 2...
Even if the pellets 4 are peeled off, the pellets 4 are attracted to the sheet 2 by static electricity, so the pellets 4 are attached to the sheet 2.
It won't shift on top.

Thereafter, when a lifting device (not shown) is activated, a wire (not shown) fits into the groove 13 formed in the circumferential wall of the lifting plate 150 from above the sheet 2 and is fastened.
is fixed to the raised plate 15, and the peripheral edge of the sheet 2 is cut.

Thereafter, the lifting plate 15 is removed from the piston 10 and transported to the next process.

Also, during this conveyance, the pellets 4 are attracted to the sheet 2 by static electricity, so that they do not shift on the sheet 2.

As described above, in this invention, the periphery of a flexible sheet to which a large number of semiconductor pellets formed by Guishifugu are adhered is held, hot air is blown onto the sheet, and then the sheet is pulled with a heating element. Since the sheet is flattened, the sheet is uniformly heated with hot air and then pulled and flung, so there is no difference in the flattening of the sheet as in the conventional method.

Therefore, the semiconductor pellets can be aligned with high precision with respect to their mutual spacing.

Furthermore, by blowing hot air onto the sheet, static electricity is generated on the sheet and attracts the pellets, so even if the pellets are peeled off from the sheet when the sheet is stretched, the position of the pellets on the sheet will not shift due to the static electricity. There are advantages such as:

[Brief explanation of drawings]

The drawings show one embodiment of the present invention, and FIGS.
The figures are explanatory diagrams sequentially showing the steps of the alignment method. 1...Semiconductor sea urchin...-12...Flexible sheet, 4
... Semiconductor pellet, 5... Pulling device, 8...
-Holder, 10... Piston (heating body).

Claims (1)

[Claims] 1 A process of attaching a semiconductor wafer to a flexible sheet, a process of scribing and dicing the wafer and dividing it into a large number of semiconductor pellets, a process of holding the periphery of the sheet and blowing hot air onto the sheet. A method for arranging semiconductor pellets, which comprises the step of arranging a large number of semiconductor pellets at predetermined intervals by stretching this sheet with a heating element.