JP2832366B2 - Semiconductor wafer stretching equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a semiconductor wafer stretching apparatus.

[Prior Art] A semiconductor pellet is obtained by attaching a semiconductor wafer to a flexible sheet, scribing the wafer, and then dicing. Then, a large number of pellets obtained by the dicing are taken out of the sheet by a pickup device and bonded to a predetermined position on a substrate such as a lead frame.

By the way, the operation of taking out the pellets by the pickup device is to detect the position of the pellets in the pellet recognition unit, pass / fail, then push up the pellets set at the pickup position from the back surface of the sheet, and push the pushed up pellets to the collet. To be absorbed. For this reason, a large number of pellets must be arranged at predetermined intervals between the pellets so that the pellets can be easily detected by the pellet recognition unit, and further, can be sequentially and reliably adsorbed by the collet.

Therefore, as a means for arranging the above-mentioned pellets at predetermined intervals, a stretching apparatus as described in Japanese Patent Publication No. Sho 58-46859 has been proposed. This stretching device, in a state where the wafer attached to the flexible sheet is diced and divided into a large number of pellets, the sheet is heated by hot air blown out from a heating device, and then the sheet is stretched. The pellets are arranged at predetermined intervals.

[Problems to be Solved by the Invention] However, in the above-described conventional stretching device, the temperature distribution of the hot air blown out from the heating device to each part of the sheet is uneven, and as a result, the stretch amount of the sheet becomes uneven. There will be a difference in the spacing between the pellets. This means that each pellet cannot be easily detected by the pellet recognition unit, the collet which the collet adsorbs this time interferes with other adjacent pellets to give cracks or the like, and the adjacent pellets interfere with each other to cause chipping. Inconveniences such as flaws.

The present invention uniformly heats the entire sheet to which the wafer is adhered, and as a result, makes the amount of stretching of the sheet uniform over the entire area of the sheet, and arranges the pellets at a predetermined interval from each other. The purpose is to:

Means for Solving the Problems According to the present invention, in a state where a wafer attached to a flexible sheet is diced and divided into a large number of pellets, when the sheet is stretched, the sheet is heated by a heating device. And
A plurality of pellets are arranged at predetermined intervals by stretching the sheet. In a stretching apparatus for a semiconductor wafer, a moving means for relatively moving the flexible sheet and the heating device in a direction along a surface of the flexible sheet is provided. The flexible sheet and the heating device are relatively moved in the above-described direction when the flexible sheet is heated.

[Operation] According to the present invention, when the flexible sheet is heated, the flexible sheet and the heating device are relatively moved in a direction along the surface of the flexible sheet, so that the heating device changes the heat from the heating device to the flexible sheet. The applied heating energy is equalized in each part of the flexible sheet. Accordingly, the heating device uniformly heats the entire sheet, and as a result, the sheet can be stretched uniformly over the entire area, and the pellets can be arranged so as to have a predetermined interval between the pellets. Therefore, when each pellet is detected using the pellet recognition unit, the detection can be easily performed. Even when the pellet is suctioned from the sheet using the collet, the pellet that is currently adsorbed is adjacent. There are effects such as that there is no flaw such as crack due to interference with other pellets, and there is no flaw such as chipping due to adjacent pellets interfering with each other.

Embodiment FIG. 1 is a schematic diagram showing a stretching device according to an embodiment of the present invention, FIG. 2 is a schematic diagram showing a main part of a heating device, and FIG.
The figure is a schematic view showing another embodiment of the present invention.

As shown in FIG. 1, the stretching device 10 rotatably holds an annular rotary table 13 above a support table 12 installed on an XY table 11 on a gantry 10A, and controls a rotary table drive motor 14 to rotate. Fixed. At this time, a pinion 15 fixed to an output shaft of the motor 14 meshes with a gear 16 provided on an outer peripheral portion of the rotary table 13 so that the rotary table 13 can be rotated by driving the motor 14.

In the stretching device 10, an inner ring 17 and an outer ring 18 are attached to an outer peripheral portion of a rotary table 13.

The inner ring 17 is connected to the outer peripheral portion of the turntable 13 so as to be able to slide only up and down. At this time, the inner ring 17 has a spring 19 interposed between the rotating table 13 and the inner ring 17,
And a stopper bolt 20 for regulating the rising end level of the inner ring 17 with respect to the elastic force of the spring 19, and can move up and down against the elastic force of the spring 19.

The outer ring 18 is also coupled to the outer periphery of the turntable 13 so as to be slidable only up and down.
The distance from the inner ring 17 can be increased or decreased. The stretching device 10 includes an outer ring drive cylinder 21
And the outer ring operation fork 22 is swingably supported so that the cylinder 21 can swing the fork 22. At this time, the pin 23 provided at the tip of the fork 22 is engaged with the groove 24 provided on the outer peripheral portion of the outer ring 18, and the outer ring 18 can be moved up and down by the swing of the fork 22.

That is, when the outer ring 18 is at the rising end as shown in FIG.
The wafer ring 25 can be inserted from the direction perpendicular to the plane of FIG. At this time, the wafer ring 25 holds the flexible sheet 26, and the sheet 27 has the wafer 27 adhered thereto. Wafer 27
Is diced and divided into a number of pellets 28. Then, as shown in FIGS. 1 (A) and 1 (B), the stretching device 10 lowers the outer ring 18 by the swing of the fork 22 driven by the cylinder 21 to thereby lower the outer ring 18 and the inner ring 17. By holding the wafer ring 25 in between, and by further lowering the outer ring 18, the periphery of the flexible sheet 26 held by the wafer ring 25 can be stretched around the rotary table 13.

Further, the stretching device 10 is provided with a hot air generator
30 is fixed. The hot-air generator 30 has a hot-air blowing nozzle 31 for blowing hot air from below the rotary table 13 into the inner peripheral area thereof. At this time, the nozzle 31
As shown in the figure, a hot air diffusing plate 32 having a large number of small holes is provided so that hot air can be blown out in a diffused state.

Accordingly, the stretching apparatus 10 stretches the wafer 27 by the following (1) to (3) by the above-described apparatus configuration.

(1) Wafer ring 25 holding wafer 27 diced on flexible sheet 26 and divided into a number of pellets 28
Is inserted between the inner ring 17 and the outer ring 18 (see FIG. 1A).

(2) The sheet 26 is heated by the hot air generator 30. At this time, the stretching device 10 drives the rotary table drive motor 14 to rotate the rotary table 13, and moves the flexible sheet 26 on the rotary table 13 to the hot air blowing region by the nozzle 31 of the hot air generating device 30. The flexible sheet
Relative movement in the direction along the plane of 26.

(3) Next, the outer ring drive cylinder 21 is driven, the wafer ring 25 is sandwiched between the inner ring 17 and the outer ring 18, and the outer ring 18 is further lowered. The periphery of the sheet 26 is stretched around the turntable 13 (see FIG. 1B). Thereby, the stretching device 10 can arrange a large number of pellets 28 at a predetermined interval.

In FIG. 1, reference numerals 41 and 42 denote needles and collets constituting a pellet pickup device, and reference numeral 43 denotes a television camera constituting a pellet recognition unit. That is, in the stretching device 10, the television camera 43 detects the position of the pellet 28, the quality of the pellet 28, and then pushes up the pellet 28 set at the pickup position from the back surface of the sheet 26 by the needle 41, and is pushed up. After the pellet 28 is adsorbed by the collet 42, the pellet 28 is transferred onto a substrate and bonded.

 Next, the operation of the above embodiment will be described.

According to the above embodiment, the heating energy from the nozzle 31 of the hot air generator 30 to the sheet 26 is applied to each part of the sheet 26 by the relative movement of the hot air generator 30 and the sheet 26 in the direction along the surface of the sheet 26. Are mutually homogenized. Thereby, the hot air generator 30 heats the sheet 26 uniformly, and as a result, the sheet 26 is stretched uniformly, and the pellets 28 are heated.
The pellets 28 can be arranged so that they are at a predetermined distance from each other.

Also, in the above embodiment, the nozzle of the hot air generator 30
Since the hot air diffuser 31 has a hot air diffusing plate 32 and is configured to blow hot air from below the rotary table 13 into the inner peripheral area thereof, the hot air is closed by the sheet 26 so that the cup-shaped rotary table 13 is closed. And the temperature distribution of the sheet 26 can be made more uniform.

In the embodiment of the present invention, the heating device is not limited to the hot air generating device, and may use a radiant heating device such as a far infrared ray.

In the embodiment of the present invention, for example, a heating device is fixedly arranged on the side of the gantry 10A of the stretching device 10, and the sheet is moved and rotated in XY by the XY table 11 and the rotary table 13 of the stretching device 10, for example. There may be.

Further, in the embodiment of the present invention, as shown in FIG. 3, the heating device 50 may be arranged above the turntable 51 and the heating energy may be supplied from the side of the sheet 52 on which the pellets 53 are provided. At this time, either the heating device 50 or the sheet 52 may be the movable side.

In the embodiment of the present invention, the relative movement between the heating device and the sheet may be any of only XY movement, only rotation, or a combination of XY movement and rotation.

[Effects of the Invention] As described above, according to the present invention, a sheet to which a wafer is attached is uniformly heated, and as a result, the amount of stretching of the sheet is made uniform, and a predetermined interval is set between the pellets. The pellets can be arranged.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a stretching device according to one embodiment of the present invention, FIG. 2 is a schematic diagram showing a main part of a heating device, and FIG. 3 is a schematic diagram showing another embodiment of the present invention. . 10 ... Stretcher, 11 ... XY table, 13 ... Rotary table, 26 ... Flexible sheet, 27 ... Wafer, 28 ...
Pellets, 30: Hot air generator, 31: Hot air blowing nozzle, 50: Heating device, 51: Rotary table, 52: Sheet, 53: Pellets.

Claims (1)

(57) [Claims] In a state where a wafer stuck on a flexible sheet is diced and divided into a large number of pellets, the sheet is heated by a heating device when the sheet is stretched, and a large number of pellets are stretched by stretching the sheet. Are arranged at predetermined intervals, in a semiconductor wafer stretching device,
A moving means for relatively moving the flexible sheet and the heating device in a direction along a surface of the flexible sheet is provided, and when the flexible sheet is heated, the flexible sheet and the heating device are connected to each other. An apparatus for stretching a semiconductor wafer, wherein said apparatus is relatively moved in said direction.