JPS5847880B2 - printed circuit board - Google Patents
printed circuit boardInfo
- Publication number
- JPS5847880B2 JPS5847880B2 JP50107677A JP10767775A JPS5847880B2 JP S5847880 B2 JPS5847880 B2 JP S5847880B2 JP 50107677 A JP50107677 A JP 50107677A JP 10767775 A JP10767775 A JP 10767775A JP S5847880 B2 JPS5847880 B2 JP S5847880B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- circuit board
- printed circuit
- solder resist
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
本発明は電気機器等に用いることのできる印刷回路板に
関し、銀粉一樹脂系印刷導体、銀めっき銅導体などを有
する印刷回路板において銀の移行を抑制し、はんだ加熱
から銀を保護することを目的とする。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed circuit board that can be used in electrical equipment, etc., and it suppresses silver migration in a printed circuit board having a silver powder-resin printed conductor, a silver-plated copper conductor, etc., and prevents solder heating. The purpose is to protect silver from
従来、銅のエッチングまたは銅のめつき導体で絶縁板の
表面に複数本の銅体部分を形戒し、この絶縁板の表面の
上記銅導体の間に炭素粉一樹脂系抵抗体用の銀粉一樹脂
系電極や銀粉一樹脂系導体を形成して、上記銅導体に接
続する形状の印刷回路板は第１図に示す形状であった。Conventionally, multiple copper parts were formed on the surface of an insulating board using copper etching or copper plating conductors, and carbon powder and silver powder for resin-based resistors were added between the copper conductors on the surface of the insulating board. A printed circuit board in which one resin-based electrode and one silver powder-resin conductor were formed and connected to the copper conductor had the shape shown in FIG.
つまり１は絶縁板であり、この表面に銀移行を抑制する
ため有機インヒビツクを含むエポキシ樹脂等の被覆層２
を印刷して形威し、この被覆層２の上面に銀粉一樹脂系
電極３，４を一定間隔をおいて形成する。In other words, 1 is an insulating plate, and on this surface is a coating layer 2 of epoxy resin or the like containing an organic inhibitor to suppress silver migration.
is printed and shaped, and silver powder-resin electrodes 3 and 4 are formed at regular intervals on the upper surface of this coating layer 2.
上記銀糸電極３，４の表面およびこれら銀糸電極３，４
の間の被覆層２の表面を覆ってはんだレジスト５を印刷
する。The surfaces of the silver thread electrodes 3 and 4 and these silver thread electrodes 3 and 4
A solder resist 5 is printed covering the surface of the coating layer 2 between the two.
しかしながらこのはんだレジスト５はメラミン樹脂、フ
ェノール樹脂、フェノール樹脂変性エポキシ樹脂等であ
り、これらの樹脂は全て銀の移行に対し加速的である欠
点を有していた。However, this solder resist 5 is made of melamine resin, phenol resin, phenol resin-modified epoxy resin, etc., and all of these resins have the drawback of accelerating silver migration.
本発明はこの欠点を改良したものであり、以下本発明の
一実施例を図面とともに説明する。The present invention improves this drawback, and one embodiment of the present invention will be described below with reference to the drawings.
第２図において第１図と同一個所には同一番号を付し説
明を省略する。In FIG. 2, the same parts as in FIG. 1 are given the same numbers and their explanations will be omitted.
６は被覆層２と同じ材質の被覆層であり、銀の移行を防
ぎ、上記はんだレジスト５の下層に位置して、銀糸電極
３，４およびこれら銀糸電極３，４の間の被覆層２の表
面を覆う。Reference numeral 6 denotes a covering layer made of the same material as the covering layer 2, which prevents silver migration, and is located below the solder resist 5 to protect the silver thread electrodes 3, 4 and the covering layer 2 between the silver thread electrodes 3, 4. Cover the surface.
絶縁板１は紙基材フェノール樹脂積層板、紙基材エポキ
シ樹脂積層板、ガラス布基材エポキシ樹脂積層板、ガラ
スマット基材エポキシ樹脂積層板、ガラスマット基材ポ
リエステル樹脂積層板等を用いることができる。The insulating board 1 may be a paper-based phenolic resin laminate, a paper-based epoxy resin laminate, a glass cloth-based epoxy resin laminate, a glass mat-based epoxy resin laminate, a glass mat-based polyester resin laminate, or the like. I can do it.
銀糸電極３，４はこれにより直接はんだレジスト５に接
触しないので銀の移行を防ぐことができる。This prevents the silver thread electrodes 3 and 4 from directly contacting the solder resist 5, thereby preventing silver migration.
なおこれら被覆層２，６およびはんだレジスト５の樹脂
層の硬化条件は温度１０５〜１５０°Ｃ１時間１０〜６
０分で絶縁板１を熱的に損傷しない範囲で選ばれる。The curing conditions for the resin layer of these coating layers 2 and 6 and the solder resist 5 are: temperature 105-150°C 1 hour 10-6
It is selected within a range that does not thermally damage the insulating plate 1 in 0 minutes.
またこれらの各層はそれぞれ独立して硬化させてもよく
、また、準硬化の形にとどめ最後に完全硬化させてもよ
く、樹脂の性質によっては、表層に近い層ほど硬化温度
を低くすることもできる。Furthermore, each of these layers may be cured independently, or may be left in a semi-cured state and completely cured at the end.Depending on the properties of the resin, the curing temperature may be lower for layers closer to the surface layer. can.
なお具体的には導体ペイント（デュポン社５５０４Ａ）
を１．Ｏｗ／ｌの間隔で対向させ４ ０’Ｃ． ９
０ 〜９ ５％ＲＨの相対温度で直流電圧１００Ｖを印
加した結果、ポリベンゾイミタゾールＯ．１重量パーセ
ント添加のエポキシ樹脂系、銀移行抑制層の厚さ１５μ
を用いた場合、メラミン樹脂系はんだレジスト（印刷厚
さ１２μ）で従来の構造では２４０時間で銀移行が生じ
たが、本発明の構造では１５００時間以上で銀移行が生
じた。Specifically, conductor paint (DuPont 5504A)
1. 4 0'C. 9
As a result of applying a DC voltage of 100 V at a relative temperature of 0 to 95% RH, polybenzimitazole O. Epoxy resin system containing 1% by weight, thickness of silver migration suppressing layer 15μ
When using a melamine resin solder resist (printing thickness 12 μm), silver migration occurred in 240 hours in the conventional structure, but silver migration occurred in 1500 hours or more in the structure of the present invention.
以上のように本発明は絶縁板の表面に銀移行を抑制する
有帰糸インヒビツクを含む被覆層を形成し、この被覆層
の表面に複数本の銀糸電極を互いに間隔をおいて形成し
、この銀糸電極の表面を覆う銀移行を抑制する有機系イ
ンヒビツクを含む被覆層を形成し、この被覆層の表面に
はんだレジストを形成することを特徴とする印刷回路板
であり、銀糸電極が絶縁板の表面にもはんだレジストに
も接しないため、どのような材質の絶縁板であっても絶
縁板を介しての銀の移行は防止され、またはんだレジス
トによる銀移行の加速現象も受けることがなく、安価で
信頼性の高い印刷回路板を提供でき、工業的価値の高い
ものである。As described above, the present invention forms a coating layer containing a fiber inhibitor that suppresses silver migration on the surface of an insulating plate, and forms a plurality of silver thread electrodes at intervals on the surface of this coating layer. This is a printed circuit board characterized by forming a coating layer containing an organic inhibitor that suppresses silver migration covering the surface of a silver thread electrode, and forming a solder resist on the surface of this coating layer. Since it does not come into contact with the surface or the solder resist, silver migration through the insulating board is prevented no matter what material it is made of, and there is no acceleration of silver migration caused by the solder resist. It is possible to provide a printed circuit board that is inexpensive and highly reliable, and has high industrial value.
第１図は従来の印刷回路板の断側面図、第２図は本発明
の一実施例における印刷回路板の断側面図である。
１・・・・・・絶縁板、２・・・・・・被覆層、３，４
・・・・・・銀糸電極、５・・・・・・はんだレジスト
、６・・・・・・被覆層。FIG. 1 is a sectional side view of a conventional printed circuit board, and FIG. 2 is a sectional side view of a printed circuit board according to an embodiment of the present invention. 1... Insulating plate, 2... Covering layer, 3, 4
. . . Silver thread electrode, 5 . . . Solder resist, 6 . . . Covering layer.
Claims (1)
タを含む被覆層を形威し、この被覆層の表面に複数本の
銀糸電極を互いは間隔をおいて形成し、この銀糸電極の
表面を覆う銀移行を抑制する有機系インヒビツタを含む
被覆層を形成し、この被覆層の表面にはんだレジストを
形成し、前記銀糸電極が絶縁板の表面にもはんだレジス
トにも接しないように構成したことを特徴とする印刷回
路板。1 A coating layer containing an organic inhibitor that suppresses silver migration is formed on the surface of an insulating plate, a plurality of silver thread electrodes are formed at intervals on the surface of this coating layer, and the surface of the silver thread electrode is A covering layer containing an organic inhibitor that suppresses silver migration is formed, and a solder resist is formed on the surface of this covering layer, so that the silver thread electrode does not come into contact with either the surface of the insulating plate or the solder resist. A printed circuit board featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50107677A JPS5847880B2 (en) | 1975-09-04 | 1975-09-04 | printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50107677A JPS5847880B2 (en) | 1975-09-04 | 1975-09-04 | printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5231381A JPS5231381A (en) | 1977-03-09 |
| JPS5847880B2 true JPS5847880B2 (en) | 1983-10-25 |
Family
ID=14465174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50107677A Expired JPS5847880B2 (en) | 1975-09-04 | 1975-09-04 | printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5847880B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0543183U (en) * | 1991-11-08 | 1993-06-11 | 進 佐久間 | Seat order determination tool |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877291A (en) * | 1981-11-02 | 1983-05-10 | 松下電器産業株式会社 | Method of producing printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524241B2 (en) * | 1973-02-16 | 1980-06-27 |
-
1975
- 1975-09-04 JP JP50107677A patent/JPS5847880B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0543183U (en) * | 1991-11-08 | 1993-06-11 | 進 佐久間 | Seat order determination tool |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5231381A (en) | 1977-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR900000509B1 (en) | How to form a conductive circuit on a substrate | |
| US4342020A (en) | Electrical network | |
| CN1976556B (en) | Wiring circuit board | |
| GB1407201A (en) | Printed electric wiring arrangements | |
| US4900602A (en) | Printed wiring board | |
| JPS5847880B2 (en) | printed circuit board | |
| JP4036176B2 (en) | Wiring board and manufacturing method thereof | |
| JP2551123Y2 (en) | Flexible circuit board | |
| JPH0538940U (en) | Double-sided flexible printed wiring board | |
| JPS6215777A (en) | Film-like connector and manufacture thereof | |
| JPS62130595A (en) | Manufacture of electric circuit device | |
| JPH0471358B2 (en) | ||
| JPS587075B2 (en) | Insatsu High Senban | |
| JPS5841799B2 (en) | printed wiring board | |
| JP2551223B2 (en) | Organic resin multilayer wiring board | |
| JP2681205B2 (en) | Printed wiring board with membrane element | |
| JPS6310592Y2 (en) | ||
| JPH0348483A (en) | Flexible printed wiring board | |
| JPH0666171B2 (en) | Method of manufacturing circuit board with resistance | |
| GB1062046A (en) | Improvements in or relating to components for electrical circuits and to circuits formed with said components | |
| JPS62264693A (en) | Printed circuit board | |
| JPH06105643B2 (en) | Method of manufacturing circuit board with resistance | |
| JPH0828559B2 (en) | Printed wiring board | |
| JPS6398179A (en) | Metal base printed wiring board | |
| JPS5877296A (en) | Heat sink board |