Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JPS5851409B2 - Capacitor manufacturing method - Google Patents
[go: Go Back, main page]

JPS5851409B2 - Capacitor manufacturing method - Google Patents

Capacitor manufacturing method

Info

Publication number
JPS5851409B2
JPS5851409B2 JP9834478A JP9834478A JPS5851409B2 JP S5851409 B2 JPS5851409 B2 JP S5851409B2 JP 9834478 A JP9834478 A JP 9834478A JP 9834478 A JP9834478 A JP 9834478A JP S5851409 B2 JPS5851409 B2 JP S5851409B2
Authority
JP
Japan
Prior art keywords
metal foil
capacitor
heat
laminate film
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9834478A
Other languages
Japanese (ja)
Other versions
JPS5524493A (en
Inventor
博 島田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marcon Electronics Co Ltd
Original Assignee
Marcon Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marcon Electronics Co Ltd filed Critical Marcon Electronics Co Ltd
Priority to JP9834478A priority Critical patent/JPS5851409B2/en
Publication of JPS5524493A publication Critical patent/JPS5524493A/en
Publication of JPS5851409B2 publication Critical patent/JPS5851409B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【発明の詳細な説明】 本発明はプラスチックフィルムのヒートシールにより外
装を施してなるコンデンサの製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a capacitor which is packaged by heat sealing a plastic film.

一般にコンデンサの外装は外囲器としてアルミニウムケ
ースやプラスチック成形ケースが多用されているが、最
近プラスチックフィルムの性能向上にともないコンデン
サ素子を金属プラスチックラミネートフィルムで直接包
みヒートシールする方法が提案されている。
In general, an aluminum case or a plastic molded case is often used as the exterior of a capacitor, but as the performance of plastic films has improved recently, a method has been proposed in which the capacitor element is directly wrapped in a metal-plastic laminate film and heat-sealed.

前記ラミネートフィルムに用いる各プラスチックフィル
ムの厚さは通常10〜250μの範囲内にあるが第1図
に示すようにコンデンサ素子のリード線1直径が0.5
〜1.0mmと太いためヒートシールしたときラミネー
トフィルム2とリード線1との融着部に隙間3が生じや
すい。
The thickness of each plastic film used for the laminate film is usually within the range of 10 to 250 μm, but as shown in FIG.
Since it is as thick as ~1.0 mm, a gap 3 is likely to occur at the fused portion between the laminate film 2 and the lead wire 1 when heat sealing is performed.

またアルミニウムのような金属箔を中間に介在させたラ
ミネートフィルムでは金属箔とリード線1との接触ある
いは金属箔を介してのリード線1相互間の短絡をひきお
こしやすいという欠点があった。
In addition, a laminate film in which a metal foil such as aluminum is interposed has a drawback that contact between the metal foil and the lead wire 1 or a short circuit between the lead wires 1 via the metal foil is likely to occur.

本発明は上記のような実情に鑑みてなされたものでリー
ド線を取着したコンデンサ素子の上下にプラスチックフ
ィルム−金属箔−プラスチックフィルムのように中間に
金属箔を介在させたラミネートフィルムを配置して、該
ラミネートフィルムをヒートシールする場合少なくとも
リード線融着部側の金属箔幅をプラスチックフィルム幅
より狭くし該プラスチックフィルム端面から金属箔が露
出しないようにすることによってリード線融着部に隙間
の生じることがなくなるため密閉性がよくかつ金属箔と
リード線との接触を防止し小形で量産加工性がよく安価
なコンデンサの製造方法を提供せんとするものである。
The present invention was made in view of the above-mentioned circumstances, and consists of arranging a laminate film with a metal foil interposed in between, such as plastic film-metal foil-plastic film, above and below a capacitor element to which lead wires are attached. When heat-sealing the laminate film, at least the width of the metal foil on the side where the lead wires are fused is made narrower than the width of the plastic film to prevent the metal foil from being exposed from the end surface of the plastic film, thereby creating a gap at the fusion portion of the lead wires. It is an object of the present invention to provide a method for manufacturing a capacitor that is small, easy to mass-produce, and inexpensive, with good airtightness and prevention of contact between metal foil and lead wires.

以下本発明の一実施例につき図面を参照しながら説明す
る。
An embodiment of the present invention will be described below with reference to the drawings.

すなわち第2図に示すようにリード線11を取着したコ
ンデンサ素子12の上下にラミネートフィルム13を配
置する。
That is, as shown in FIG. 2, laminate films 13 are placed above and below the capacitor element 12 to which the lead wires 11 are attached.

該ラミネートフィルム13はポリプロピレン、ポリアミ
ド、ポリエステル、ポリ弗化ビニリデン、ポリ塩化ビニ
リデン、ポリカーボネート、アイオノマー、ポリサルホ
ン、ポリ三弗化毛チレン、ポリ四弗化エチレン、ポリエ
チレンナフタレート、ポリブチレンテレフタレート、ポ
リフェニリンオキサイド、ポリ弗化ビニル、ポリ塩化ビ
ニル、ポリパラキシレン、エチレン−酢酸ビニル共重合
体、ビニロンなどのプラスチックフィルムのうち同種ま
たは異種の2枚のプラスチックフィルム14の中間にア
ルミニウム、錫などの金属箔15を介在させて貼り合わ
せたもので少なくとも一端面、すなわちリード線11融
着部側の金属箔15の幅をプラスチックフィルム14の
幅よりも狭くする。
The laminate film 13 is made of polypropylene, polyamide, polyester, polyvinylidene fluoride, polyvinylidene chloride, polycarbonate, ionomer, polysulfone, polytrifluoroethylene, polytetrafluoroethylene, polyethylene naphthalate, polybutylene terephthalate, polyphenyline. A metal foil such as aluminum or tin is placed between two plastic films 14 of the same or different types of plastic films such as oxide, polyvinyl fluoride, polyvinyl chloride, polyparaxylene, ethylene-vinyl acetate copolymer, vinylon, etc. The width of the metal foil 15 on at least one end surface, that is, the side of the fused portion of the lead wire 11 is made narrower than the width of the plastic film 14.

この場合融着部の寸法が1〜4朋程度になるので金属箔
15の幅はプラスチックフィルム14の幅よりも1.5
〜5mm程度狭くしておく。
In this case, the width of the metal foil 15 is 1.5 mm larger than the width of the plastic film 14 because the size of the fused portion is about 1 to 4 mm.
Make it narrower by ~5mm.

また金属箔15はリード線11融着部側だけでなく両端
面を狭くしておいて何等支障はなくリード線反射方向形
コンデンサにも適用できる。
Furthermore, the metal foil 15 can be applied to a lead wire reflection direction type capacitor without any problem by narrowing not only the fused portion side of the lead wire 11 but also both end faces.

しかして前記ラミネートフィルム13を上下に対向させ
その間にリード線11を取着したコンデンサ素子12を
装填して熱板や圧子などの加熱装置でヒートシールして
密封し、要すればヒートシールしたのち冷却して外装を
形成するものである。
Then, the capacitor element 12 with the lead wire 11 attached thereto is loaded between the laminate films 13 facing each other vertically, and the capacitor element 12 is sealed by heat sealing with a heating device such as a hot plate or an indenter. It is cooled to form an exterior.

金属箔15の幅を少なくともリード線11融着部側にお
いてプラスチックフィルム14の幅より狭くしてヒート
シールしたことによってリード線11融着部に生じる隙
間が完全になくなり、かつ金属箔15とリード線11と
の接触あるいは金属箔15を介してのリード線11相互
間の短絡を完全に防止することができる。
By making the width of the metal foil 15 narrower than the width of the plastic film 14 at least on the fused portion side of the lead wire 11 and heat-sealing it, the gap that occurs at the fused portion of the lead wire 11 is completely eliminated, and the gap between the metal foil 15 and the lead wire is 11 or a short circuit between the lead wires 11 through the metal foil 15 can be completely prevented.

金属箔15とプラスチックフィルム14との幅寸法差が
1.5間未満では融着部において金属箔15端面が露出
してリード線11と接触することがあるので少なくとも
1.5間以上に設定しなげればならない。
If the width dimension difference between the metal foil 15 and the plastic film 14 is less than 1.5 mm, the end face of the metal foil 15 may be exposed at the fused portion and come into contact with the lead wire 11, so it should be set to at least 1.5 mm. I have to throw it.

しかし幅寸法差が5間を越えると融着部付近がプラスチ
ックフィルム14だげのラミネートフィルムでヒートシ
ールしたものと同じになり金属箔15を介在させた防湿
効果が減少するので5間以内に設定しなげればならない
However, if the width dimension difference exceeds 5 mm, the area near the fused portion will be the same as that of a laminate film heat-sealed with just the plastic film 14, and the moisture-proofing effect of interposing the metal foil 15 will be reduced, so it is set within 5 mm. I have to do it.

前記ラミネートフィルム13を第3図に示すように内側
面のプラスチックフィルム16に厚いフィルム好ましく
はリード線11の半径寸法以上の厚さく250〜100
0μ)のものを用いるとリード線11融着部の隙間発生
の防止と短絡防止に一層効果的である。
As shown in FIG. 3, the laminate film 13 is coated with a plastic film 16 on the inner surface, preferably having a thickness of 250 to 100 mm, which is equal to or larger than the radius of the lead wire 11.
0μ) is more effective in preventing the occurrence of gaps at the fused portion of the lead wire 11 and preventing short circuits.

また第4図に示すように少なくとも一枚のラミネートフ
ィルム13をあらかじめ熱成形してコンデンサ素子12
を収容できる形状に加工しておきそれをヒートシールし
てもよい。
Further, as shown in FIG. 4, at least one laminate film 13 is thermoformed in advance to form the capacitor element 12.
It is also possible to process it into a shape that can accommodate it and then heat seal it.

さらに第5図および第6図に示すようにコンデンサ素子
12の外周にラミネートフィルム13を巻回して片側と
両端面をヒートシールするようにしてもよい。
Furthermore, as shown in FIGS. 5 and 6, a laminate film 13 may be wound around the outer periphery of the capacitor element 12, and one side and both end surfaces may be heat-sealed.

本発明におけるラミネートフィルム13のヒートシール
には熱板溶接(温度120−180℃、時間2〜7秒)
、インパルス溶接(温度120〜180℃、時間2〜8
秒)、超音波溶接(周波数15〜30 KHz 、荷重
10〜20kg/c111時間1〜10秒)または高周
波溶接(周波数10〜70MHz、荷重2〜15 kg
/cyd、時間1〜7秒)などいずれの方法でもよい。
In the present invention, the laminate film 13 is heat-sealed by hot plate welding (temperature 120-180°C, time 2-7 seconds).
, impulse welding (temperature 120-180℃, time 2-8
seconds), ultrasonic welding (frequency 15-30 KHz, load 10-20 kg/c111 time 1-10 seconds) or high frequency welding (frequency 10-70 MHz, load 2-15 kg
/cyd, time 1 to 7 seconds).

前記ラミネートフィルム13はラミネートする前にあら
かじめ電子線照射、コロナ放電処理、二軸延伸などの二
次加工を施すと機械的、熱的特性を向上することもでき
ヒートシールも能率よく行うことができる。
If the laminate film 13 is subjected to secondary processing such as electron beam irradiation, corona discharge treatment, and biaxial stretching before lamination, mechanical and thermal properties can be improved and heat sealing can be performed efficiently. .

またプラスチックフィルム14と金属箔15とのラミネ
ート方法は加熱融着するか接着剤で貼り合わせるかある
いは金属箔15の両面にそれぞれ加熱溶融した材料をシ
ャワ一式または帯状に滴下せしめこれを圧延ローラか延
伸ローラを通して一体化するかあるいは加熱溶融した材
料をローラ塗布して一体化するものである。
The plastic film 14 and the metal foil 15 may be laminated by heat-sealing or bonding with an adhesive, or by dropping heated and molten materials on both sides of the metal foil 15 in the form of showers or strips, which are then stretched using a rolling roller. They are integrated by passing through a roller, or by applying heated and melted material with a roller.

つぎに本発明の実施例と従来の参考例との比較の一例を
第1表に示す。
Next, Table 1 shows an example of comparison between the embodiment of the present invention and a conventional reference example.

第1表から明らかなように本発明の実施例はいずれも従
来の参考例よりも耐湿試験後の静電容量変化率が小さく
リード線11とラミネートフィルム13との融着部に隙
間の生じることがなくなるため必然的に吸湿に起因する
特性の劣化が少なく密閉性が優れ、しかも金属箔15と
リード線11との接触による短絡の発生が絶無となるこ
とがわかる。
As is clear from Table 1, all of the examples of the present invention have a smaller capacitance change rate after the humidity test than the conventional reference examples, and a gap occurs at the fused portion between the lead wire 11 and the laminate film 13. It can be seen that since there is no deterioration of characteristics due to moisture absorption, the sealing performance is excellent, and short circuits due to contact between the metal foil 15 and the lead wire 11 are completely eliminated.

以上詳述したように本発明はリード線を取着したコンデ
ンサ素子の上下に2枚のプラスチックフィルムの中間に
金属箔を介在させたラミネートフィルムを配置して該ラ
ミネートフィルムをヒートシールする場合、少なくとも
リード線融着部側の金属箔幅をプラスチックフィルム幅
より狭くし該プラスチックフィルム端面力)ら金属箔が
露出しないようにしたことによってリード線融着部に隙
間の生じることがなくなるため密閉性がよく、かつ金属
箔とリード線との接触を防止し小形で量産力ロ工性がよ
く安価なコンデンサの製造方法を提供することができる
As described in detail above, the present invention provides a method for disposing a laminate film with a metal foil interposed between two plastic films above and below a capacitor element to which lead wires are attached, and heat-sealing the laminate film. By making the width of the metal foil on the lead wire fusion part side narrower than the plastic film width so that the metal foil is not exposed from the edge of the plastic film, there is no gap in the lead wire fusion part, which improves airtightness. It is possible to provide a method for manufacturing a capacitor that is small, easy to mass-produce, and inexpensive, while preventing contact between a metal foil and a lead wire.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の方法によるコンデンサのリード線融着部
を示す断面図、第2図は本発明の一実施例に係るコンデ
ンサを示す断面図、第3図は本発明の他の実施例に係る
コンデンサを示す断面図、第4図は本発明の別の実施例
に係るヒートシール方法を示す斜視図、第5図はさらに
別の実施例に係るヒートシール方法を示す斜視図、第6
図は第5図の方法によって得られたコンデンサを示す斜
視図である。 11・・・・・・リード線、12・・・・・・コンデン
サ素子、13・・・・・・ラミネートフィルム、14・
・・・・・プラスチックフィルム、15・・・・・・金
属箔。
FIG. 1 is a sectional view showing a lead wire fusion part of a capacitor according to a conventional method, FIG. 2 is a sectional view showing a capacitor according to an embodiment of the present invention, and FIG. 3 is a sectional view showing a capacitor according to another embodiment of the present invention. 4 is a sectional view showing such a capacitor; FIG. 4 is a perspective view showing a heat sealing method according to another embodiment of the present invention; FIG. 5 is a perspective view showing a heat sealing method according to yet another embodiment;
The figure is a perspective view showing a capacitor obtained by the method of FIG. 5. 11... Lead wire, 12... Capacitor element, 13... Laminate film, 14...
...Plastic film, 15...Metal foil.

Claims (1)

【特許請求の範囲】 1 リード線を取着したコンデンサ素子の上下に2枚の
プラスチックフィルムの中間に金属箔を介在させたラミ
ネートフィルムを配置し、該ラミネートフィルムをヒー
トシールして外装を施すコンデンサの製造方法において
、少なくとも前記リード線の融着部側の金属箔幅をプラ
スチックフィルム幅より狭<シ、該プラスチックフィル
ム端面かう金属箔が露出しないようにしてヒートシール
したことを特徴とするコンデンサの製造方法。 2 ラミネートフィルムをあらかじめ熱成形してコンデ
ンサ素子を収容しうる形状に加工してヒートシールした
ことを特徴とする特許請求の範囲第1項記載のコンデン
サの製造方法。 3 ラミネートフィルムをコンデンサ素子の外周に巻回
してヒートシールして外装を形成したことを特徴とする
特許請求の範囲第1項記載のコンデンサの製造方法。
[Claims] 1. A capacitor in which a laminate film with a metal foil interposed between two plastic films is placed above and below a capacitor element to which a lead wire is attached, and the laminate film is heat-sealed to provide an exterior packaging. In the manufacturing method of the capacitor, the width of the metal foil at least on the fused portion side of the lead wire is narrower than the width of the plastic film, and the end face of the plastic film is heat-sealed so that the metal foil is not exposed. Production method. 2. The method of manufacturing a capacitor according to claim 1, wherein the laminate film is previously thermoformed into a shape capable of accommodating a capacitor element, and then heat-sealed. 3. The method of manufacturing a capacitor according to claim 1, wherein the outer casing is formed by wrapping a laminate film around the outer periphery of the capacitor element and heat-sealing it.
JP9834478A 1978-08-11 1978-08-11 Capacitor manufacturing method Expired JPS5851409B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9834478A JPS5851409B2 (en) 1978-08-11 1978-08-11 Capacitor manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9834478A JPS5851409B2 (en) 1978-08-11 1978-08-11 Capacitor manufacturing method

Publications (2)

Publication Number Publication Date
JPS5524493A JPS5524493A (en) 1980-02-21
JPS5851409B2 true JPS5851409B2 (en) 1983-11-16

Family

ID=14217277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9834478A Expired JPS5851409B2 (en) 1978-08-11 1978-08-11 Capacitor manufacturing method

Country Status (1)

Country Link
JP (1) JPS5851409B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57147234A (en) * 1981-03-06 1982-09-11 Marukon Denshi Kk Capacitor and method of producing same

Also Published As

Publication number Publication date
JPS5524493A (en) 1980-02-21

Similar Documents

Publication Publication Date Title
CN108428814B (en) Packaging film and soft pack battery
JP4534638B2 (en) Vacuum insulation
US4238263A (en) Edge sealing of laminate
JPS5851409B2 (en) Capacitor manufacturing method
EP0598922B1 (en) Method of manufacturing a package
JPS5851408B2 (en) Capacitor manufacturing method
JP2997687B2 (en) Method of manufacturing film / foil panel and film / foil panel manufactured by the method
JPS6017885Y2 (en) capacitor
JP2004079464A (en) Battery packaging
JP2555763B2 (en) Manufacturing method of sealed lead-acid battery
JPH0245308A (en) Production apparatus of treated liquid pod
US11011789B2 (en) Package sealing structure, preparation method thereof and flexible packaging battery
JP2002310554A (en) System and method for producing vacuum thermal insulation material, vacuum thermal insulation material, and thermal insulation box
KR101647812B1 (en) Antistatic bag with low heat conduction and manufacturing method of the same
JPS623970B2 (en)
JPS5915371B2 (en) Capacitor manufacturing method
CN107293652A (en) Pack seal structure and preparation method thereof and flexible-packed battery
CN114829828B (en) Vacuum insulation and thermal insulation boxes
JPS6317235Y2 (en)
JPH0339237Y2 (en)
JP2002111081A (en) Peltier module
JPH0649384U (en) Conductive bag
JPS6317236Y2 (en)
JPH1191796A (en) Packaging bag for microwave oven and method for producing the same
JPH0230829Y2 (en)