JPS5915371B2 - Capacitor manufacturing method - Google Patents
Capacitor manufacturing methodInfo
- Publication number
- JPS5915371B2 JPS5915371B2 JP6347978A JP6347978A JPS5915371B2 JP S5915371 B2 JPS5915371 B2 JP S5915371B2 JP 6347978 A JP6347978 A JP 6347978A JP 6347978 A JP6347978 A JP 6347978A JP S5915371 B2 JPS5915371 B2 JP S5915371B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- film
- heat
- ionomer resin
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229920000554 ionomer Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 239000005001 laminate film Substances 0.000 claims description 18
- 239000002985 plastic film Substances 0.000 claims description 16
- 229920006255 plastic film Polymers 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 11
- 239000004952 Polyamide Substances 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- -1 polypropylene Polymers 0.000 claims description 6
- 239000002033 PVDF binder Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 5
- 229920001328 Polyvinylidene chloride Polymers 0.000 claims description 4
- 239000005033 polyvinylidene chloride Substances 0.000 claims description 4
- 230000035699 permeability Effects 0.000 description 10
- 238000007789 sealing Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
本発明ハフラスチックフィルムのヒートシールにより外
装を施してなるコンデンサの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a capacitor which is covered with a plastic film by heat sealing.
一般にコンデンサの外装は外囲器としてアルミニウムケ
ースやプラスチック成形ケースが多用されているが、最
近プラスチックフィルムの性能向上にともないコンデン
サ素子をプラスチックフィルムで直接包みヒートシール
する方法が提案されている。In general, an aluminum case or a plastic molded case is often used as an envelope for capacitors, but recently, as the performance of plastic films has improved, a method has been proposed in which the capacitor element is directly wrapped in plastic film and heat-sealed.
この場合プラスチックフィルムには耐折、引裂強度、耐
湿、耐水性、ガス透過性、耐油性、ヒートシール性など
についてそれぞれ相反する長所、欠点があり単一のプラ
スチックフィルムでコンデンサの気密性を完全に保つこ
とは極めて困難である。In this case, plastic films have contradictory advantages and disadvantages in terms of folding durability, tear strength, moisture resistance, water resistance, gas permeability, oil resistance, heat sealability, etc., and a single plastic film can completely ensure the airtightness of the capacitor. It is extremely difficult to maintain.
ahばポリエチレンは吸水率や透湿度が小さくヒートシ
ール性も優れているがガス透過度が相当大きい。Although polyethylene has low water absorption and moisture permeability and excellent heat sealability, it has a considerably high gas permeability.
またポリアミドはガス透過度は小さいが透湿度が大きい
という欠点がある。Polyamide also has the disadvantage of low gas permeability but high moisture permeability.
水分はコンデンサの特性に重大な影響をおよぼし製造過
程や製品の吸湿、吸水は厳密に?1lJflしなければ
ならないので透湿度が大きいということはコンデンサの
外装材料として致命的欠陥となる。Moisture has a significant effect on the characteristics of capacitors, so is it strictly necessary to understand the manufacturing process and product moisture absorption? 1 lJfl, so the high moisture permeability is a fatal flaw as an exterior material for a capacitor.
また、端子とプラスチックフィルムとの密着性が悪いた
め端子導出部の密着性が悪く電解液の逃散によりコンデ
ンサの寿命が短くなるという欠点もあった。In addition, since the adhesion between the terminal and the plastic film is poor, the adhesion of the terminal lead-out portion is poor and the electrolyte escapes, resulting in a shortened capacitor life.
本発明は上記のような実情に鑑みてなされたものでコン
デンサ素子の上下にそれぞれアイオノマー樹脂フィルム
とポリアミド、ポリプロピレン、ポリエステル、ポリ弗
化ビニリデン、ポリ塩化ビニリデンのうちの少なくとも
一種のプラスチックフィルムとを貼り合わせたラミネー
トフィルムを前記アイオノマー樹脂フィルムが内側にな
るように配置し前記ラミネートフィルムをヒートシール
してアイオノマー樹脂フィルムと端子との密着性を改善
し外装を形成することによって小形で密閉性、量産力任
性がよく安価なコンデンサの製造方法を提供せんとする
ものである。The present invention has been made in view of the above-mentioned circumstances, and includes pasting an ionomer resin film and at least one plastic film selected from polyamide, polypropylene, polyester, polyvinylidene fluoride, and polyvinylidene chloride on the top and bottom of a capacitor element, respectively. The combined laminate film is placed so that the ionomer resin film is on the inside, and the laminate film is heat-sealed to improve the adhesion between the ionomer resin film and the terminal and form an exterior, which makes it compact, airtight, and capable of mass production. It is an object of the present invention to provide a method for manufacturing capacitors that is easy to use and inexpensive.
以下本発明の一実施例につき図面を参照しながら説明す
る。An embodiment of the present invention will be described below with reference to the drawings.
二種以上のプラスチックフィルムを貼り合わせたラミネ
ートフィルムは各フィルムの長所を生かし互いに欠点を
補い合ってコンデンサの外囲器材料として理想的な性能
を有する。A laminate film made by laminating two or more types of plastic films takes advantage of the strengths of each film and compensates for each other's weaknesses, making it ideal as a capacitor envelope material.
またアルミニウム箔にアイオノマー樹脂をコーテングす
ると機械的強度、耐薬品性の優れた透湿度やガス透過度
が小さく、かつヒートシール件のあるラミネートフィル
ムが得られる。Furthermore, by coating aluminum foil with an ionomer resin, a laminate film with excellent mechanical strength and chemical resistance, low moisture permeability and gas permeability, and heat sealability can be obtained.
このようなラミネートフィルムでコンデンサ素子を包み
外囲器とするには内側のフィルム、すなわちコンデンサ
素子に接触する側のフィルムは耐油、耐溶剤、耐薬品性
など化学的特性の優れていることが必要であり外側のフ
ィルムは機械的強度、耐熱性、耐湿性、ガス透過性、印
刷適性など主として物理的特性の優れていることが必要
である。In order to wrap a capacitor element with such a laminate film and use it as an envelope, the inner film, that is, the film that comes into contact with the capacitor element, must have excellent chemical properties such as oil resistance, solvent resistance, and chemical resistance. Therefore, the outer film must have excellent physical properties such as mechanical strength, heat resistance, moisture resistance, gas permeability, and printability.
そこで本発明者は種々実験の結果上記の各要件を満たす
ラミネートフィルムとして厚さ1〜1oooμのアイオ
ノマー樹脂フィルムをベースとし、これとポリアミド、
ポリプロピレン、ポリエステル、ポリ弗化ビニリデン、
ポリ塩化ビニリデンのうちの少なくとも一種の厚さ1〜
1000μのプラスチックフィルムとをラミネートした
ものを用い前記アイオノマー樹脂フィルムを内側、すな
わちコンデンサ素子に接触する側にして包みヒートシー
ルすることによって良好な特性のコンデンサが得られる
ことを見いだしたものである。Therefore, as a result of various experiments, the present inventor created a laminate film that satisfies each of the above requirements using an ionomer resin film with a thickness of 1 to 1 oooμ as a base, and combined this with polyamide,
polypropylene, polyester, polyvinylidene fluoride,
At least one type of polyvinylidene chloride has a thickness of 1 to
It has been discovered that a capacitor with good characteristics can be obtained by wrapping and heat-sealing a 1000 μm plastic film with the ionomer resin film on the inside, that is, on the side that contacts the capacitor element.
アイオノマー樹脂フィルムはα−オレフィン鎖とα、β
不飽和カルボン酸を金属イオン架橋したもので金属イオ
ンが溶出し金属と結合するため金属との密着性がよく、
内側すなわちコンデンサ素子に接触する側に配置する端
子との密着性がよく端子導出部の密封性が完全となるう
え、アイオノマー樹脂フィルムは耐油・耐溶剤性、耐薬
品性も優れているためコンデンサ素子に含浸しである電
解液との化学反応、腐蝕発生もなくコンデンサの寿命を
延長することができる。Ionomer resin film consists of α-olefin chains and α,β
It is a product of unsaturated carboxylic acid cross-linked with metal ions, and the metal ions elute and bond with the metal, so it has good adhesion to the metal.
It has good adhesion with the terminals placed on the inside, that is, the side that contacts the capacitor element, and the terminal lead-out part is completely sealed.Ionomer resin film also has excellent oil, solvent, and chemical resistance, so it is suitable for capacitor elements. It is impregnated with a chemical reaction with the electrolyte, which can extend the life of the capacitor without causing corrosion.
本発明をさらに詳述すると第1図に示すように端子1を
取着したコンデンサ素子2の上下にラミネートフィルム
3を配置する。To explain the present invention in more detail, as shown in FIG. 1, laminate films 3 are placed above and below a capacitor element 2 to which a terminal 1 is attached.
該ラミネートフィルム3は第2図に示すように前記コン
デンサ素子2に接触すれ側にアイオノマー樹脂フィルム
4が、外側にポリアミド、ポリプロピレン、ポリエステ
ル、ポリ弗化ビニリデン、ポリ塩化ビニリゾ7(1)う
ちの少なくとも一種のプラスチックフィルム5が配置さ
れるようにする。As shown in FIG. 2, the laminate film 3 has an ionomer resin film 4 on the side in contact with the capacitor element 2, and on the outside, at least one of polyamide, polypropylene, polyester, polyvinylidene fluoride, and polyvinylizo chloride 7(1). A kind of plastic film 5 is placed.
そして内側となるアイオノマー樹脂フィルム4面を対向
させた上下2枚のラミネートフィルム3の間にコンデン
サ素子2を装填して熱板や圧子の加熱装置6でヒートシ
ールして密封し要すればヒートシールしたのち冷却して
外装を形成するものである。Then, the capacitor element 2 is loaded between two upper and lower laminate films 3 with the 4 sides of the inner ionomer resin films facing each other, and the capacitor element 2 is sealed by heat-sealing with a heating device 6 such as a hot plate or an indenter. It is then cooled to form the exterior.
前記ラミネートフィルム3は第3図に示すように内側の
アイオノマー樹脂フィルム4と外側のプラスチックフィ
ルム5との間にアルミニウム、錫などの金属箔7を介在
させてラミネートしたものでもよくこの金属箔7を介在
させたものを用いれば透湿度が一層小さくなる。The laminate film 3 may be laminated with a metal foil 7 such as aluminum or tin interposed between an inner ionomer resin film 4 and an outer plastic film 5, as shown in FIG. If an intervening material is used, the moisture permeability will be further reduced.
また第4図に示すように少なくとも一枚のラミネートフ
ィルム3をあらかじめ熱成形してコンデンサ素子2を収
容できる形状に加工しておきそれをヒートシールしても
よい。Alternatively, as shown in FIG. 4, at least one laminate film 3 may be thermoformed in advance into a shape capable of accommodating the capacitor element 2, and then heat-sealed.
さらに第5図および第6図に示すようにコンデンサ素子
2の外周にラミネートフィルム3を巻回して片側と面端
面をヒートシールするようにしてもよい。Furthermore, as shown in FIGS. 5 and 6, a laminate film 3 may be wound around the outer periphery of the capacitor element 2, and one side and the end surfaces thereof may be heat-sealed.
本発明におけるアイオノマー樹脂フィルム4とプラスチ
ックフィルム5とのラミネートフィルム3のヒートシー
ルには熱板溶接(温度120〜180℃、時間2〜7秒
)、インパルス溶接(温度120〜180℃、時間2〜
8秒)、超音波溶接(周波数15〜30KHz、荷重1
0〜20 却/ctrl、時間1〜10秒)または高周
波溶接(周波数10〜70MHz、荷重2〜15kg/
cべ時間1〜7秒)ナトのいずれの方法でもよい。In the present invention, the heat sealing of the laminate film 3 of the ionomer resin film 4 and the plastic film 5 is performed by hot plate welding (temperature 120 to 180°C, time 2 to 7 seconds) or impulse welding (temperature 120 to 180°C, time 2 to 7 seconds).
8 seconds), ultrasonic welding (frequency 15-30KHz, load 1
0 to 20 cycles/ctrl, time 1 to 10 seconds) or high frequency welding (frequency 10 to 70 MHz, load 2 to 15 kg/
(C time: 1 to 7 seconds) Any method may be used.
前記ラミネートフィルム3はラミネートする前にあらか
じめ電子線照射、コロナ放電処理、二軸延伸などの二次
加工を施すと機械的、熱的特性を向上することもできヒ
ートシールも能率よく行うことができる。If the laminate film 3 is subjected to secondary processing such as electron beam irradiation, corona discharge treatment, and biaxial stretching before lamination, mechanical and thermal properties can be improved and heat sealing can be performed efficiently. .
またアイオノマー樹脂フィルム4とプラスチックフィル
ム5とのラミネート方法は2枚のフィルムを加熱融着さ
せるか接着剤で貼り合わせるかまたは一方のフィルムの
片面に加熱溶融した材料をシャワ一式または帯状に滴下
せしめこれを圧延ローラか延伸ローラを通して一体化す
るかあるいは一方のフィルムの片面に加熱溶融した材料
をローラ塗布して一体化するものである。The ionomer resin film 4 and the plastic film 5 can be laminated by heating and fusing the two films or pasting them together with an adhesive, or by dropping a heated and melted material onto one side of one film in the form of a shower set or a strip. They are integrated by passing them through rolling rollers or stretching rollers, or by applying heated and molten material to one side of one film using a roller.
次に本発明の実施例と従来の参考例との比較の一例を第
1表に示す。Next, Table 1 shows an example of comparison between the embodiment of the present invention and a conventional reference example.
第1表から明らかなように本発明の実施例はいずれも従
来の参考例より耐湿試験後の静電容量変化率が小さく外
装の吸湿に起因する特性の劣化が少なく密閉性が優れて
いることがわかる。As is clear from Table 1, all of the examples of the present invention have a smaller capacitance change rate after the humidity test than the conventional reference examples, and have excellent sealing performance with less deterioration of characteristics due to moisture absorption of the exterior. I understand.
以上詳述したように本発明によればコンデンサ素子の上
下にそれぞれアイオノマー樹脂フィルムとポリアミド、
ポリプロピレン、ポリエステル、ポリ弗化ビニリデン、
ポリ塩化ビニリデンのうちの少なくとも一種のプラスチ
ックフィルムとのラミネートフィルムを前記アイオノマ
ー樹脂フィルムを内側になるように配置してヒートシー
ルしてアイオノマー樹脂フィルムと端子との密着性を改
善し外装を形成したことによって小形で密閉性、量産加
工性がよく安価なコンデンサの製造方法を提供すること
ができる。As detailed above, according to the present invention, an ionomer resin film and a polyamide film are formed on the upper and lower sides of the capacitor element, respectively.
polypropylene, polyester, polyvinylidene fluoride,
A laminated film with at least one kind of plastic film of polyvinylidene chloride is arranged with the ionomer resin film on the inside and heat sealed to improve the adhesion between the ionomer resin film and the terminal to form an exterior. Accordingly, it is possible to provide a method for manufacturing a capacitor that is small, has good airtightness, is easy to mass-produce, and is inexpensive.
図面はいずれも本発明に係るコンデンサの製造方法を説
明するためのもので第1図はヒートシール方法を示す斜
視図、第2図は第1図の方法でヒートシールした一実施
例のコンデンサを示す断面図、第3図は他の実施例のコ
ンデンサを示す断面図、第4図は他の実施例のヒートシ
ール方法を示す斜視図、第5図はさらに他の実施例のヒ
ートシール方法を示す斜視図、第6図は第5図の方法で
ヒートシールしたコンデンサを示す斜視図である。
1・・・・・傭子、2・・・・・・コンデンサ素子、3
・・・・・・ラミネートフィルム、4・・・・・・アイ
オノマー樹脂フィルム、5・・・・・七のプラスチック
フィルム、6・・・・・・加熱装置、I・・・・・像属
箔。The drawings are for explaining the method of manufacturing a capacitor according to the present invention. Figure 1 is a perspective view showing the heat sealing method, and Figure 2 shows an example of a capacitor heat sealed by the method shown in Figure 1. 3 is a sectional view showing a capacitor according to another embodiment, FIG. 4 is a perspective view showing a heat sealing method according to another embodiment, and FIG. 5 is a sectional view showing a heat sealing method according to another embodiment. FIG. 6 is a perspective view showing a capacitor heat-sealed by the method shown in FIG. 5. 1...Merchandise, 2...Capacitor element, 3
... Laminate film, 4 ... Ionomer resin film, 5 ... 7 plastic film, 6 ... Heating device, I ... Image metal foil .
Claims (1)
フィルムとポリアミド、ポリプロピレン、ポリエステル
、ポリ弗化ビニリデン、ポリ塩化ビニリデンのうちの少
なくとも一種のプラスチックフィルムとのラミネートフ
ィルムを前記アイオノマー樹脂フィルムが内側になるよ
うに配置してヒートシールし外装を形成したことを特徴
とするコンデンサの製造方法。 2 ラミネートフィルムをあらかじめ熱成形してコンデ
ンサ素子を収容しうる形状に加工してヒートシールし外
装を形成したことを特徴とする特許請求の範囲第1項記
載のコンデンサの製造方法。 3 ラミネートフィルムをコンデンサ素子の外周に巻回
してヒートシールして外装を形成したことを特許請求の
範囲第1項記載のコンデンサの製造方法。[Scope of Claims] 1. A laminate film of an ionomer resin film and at least one plastic film selected from polyamide, polypropylene, polyester, polyvinylidene fluoride, and polyvinylidene chloride is placed on the top and bottom of the capacitor element, respectively, with the ionomer resin film on the inside. A method for manufacturing a capacitor, characterized in that the capacitor is arranged in such a manner that the capacitor is heat-sealed to form an exterior. 2. The method of manufacturing a capacitor according to claim 1, wherein the laminate film is previously thermoformed into a shape capable of accommodating a capacitor element, and then heat-sealed to form the exterior. 3. The method of manufacturing a capacitor according to claim 1, wherein the laminate film is wound around the outer periphery of the capacitor element and heat-sealed to form the exterior.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6347978A JPS5915371B2 (en) | 1978-05-27 | 1978-05-27 | Capacitor manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6347978A JPS5915371B2 (en) | 1978-05-27 | 1978-05-27 | Capacitor manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54155459A JPS54155459A (en) | 1979-12-07 |
| JPS5915371B2 true JPS5915371B2 (en) | 1984-04-09 |
Family
ID=13230405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6347978A Expired JPS5915371B2 (en) | 1978-05-27 | 1978-05-27 | Capacitor manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5915371B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889901U (en) * | 1981-12-11 | 1983-06-17 | 株式会社アドバンテスト | Moisture-proof fixed resistor |
| JPS58180629U (en) * | 1982-05-26 | 1983-12-02 | 松下電器産業株式会社 | Electrolytic capacitor |
-
1978
- 1978-05-27 JP JP6347978A patent/JPS5915371B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54155459A (en) | 1979-12-07 |
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