JPS586250B2 - Busbar mold insulation method - Google Patents
Busbar mold insulation methodInfo
- Publication number
- JPS586250B2 JPS586250B2 JP8334480A JP8334480A JPS586250B2 JP S586250 B2 JPS586250 B2 JP S586250B2 JP 8334480 A JP8334480 A JP 8334480A JP 8334480 A JP8334480 A JP 8334480A JP S586250 B2 JPS586250 B2 JP S586250B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- restraining
- insulating tape
- insulation method
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Insulated Conductors (AREA)
Description
【発明の詳細な説明】
本発明は、高電圧絶縁バスダクトなどに使用するブスバ
ーの、モールド絶縁方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mold insulation method for bus bars used in high voltage insulated bus ducts and the like.
このようなブスバーは、従来、絶縁テープの手巻きによ
って製造していた。Conventionally, such bus bars have been manufactured by hand-wrapping insulating tape.
そのため、内部に気゜泡が残り、信頼性が低くかった。As a result, air bubbles remained inside, resulting in low reliability.
本発明は、内部の気泡が非常に少ない、絶縁性の高い絶
縁ブスバーの、モールド方法の提供を目的とする。An object of the present invention is to provide a molding method for an insulating bus bar with very few internal air bubbles and high insulation properties.
実施例 「第1図」において、10は導体である。Example In "Fig. 1", 10 is a conductor.
帯状または角形で、銅またはアルミからなる。Strip-shaped or square, made of copper or aluminum.
20は絶縁テープである。20 is an insulating tape.
熱収縮性プラスチックからなり、導体10上に、絶縁に
必要な厚さだけ巻かれる。It is made of heat-shrinkable plastic and is wound on the conductor 10 to a thickness necessary for insulation.
材質は架橋ポリエチレン、ポリエチレン、塩化ビニル、
エチレンプロピレンゴムなどである。Materials are cross-linked polyethylene, polyethylene, vinyl chloride,
Examples include ethylene propylene rubber.
30は抑えテープである。30 is a restraining tape.
絶縁テープ20上に巻かれる。It is wrapped on an insulating tape 20.
引張り強さが犬で、側熱性の高い、プラスチック、たと
えば、四フツ化エチレン、ポリエステルなどを使用する
。Use plastics with high tensile strength and high heat resistance, such as tetrafluoroethylene and polyester.
特にそれらの不織布を使用すると具合いが良い。It is especially convenient to use these nonwoven fabrics.
以上のようにして、ブスバーのプレモールド品50を作
る。In the manner described above, a bus bar pre-molded product 50 is produced.
「第2図」の40は抑え金具である。40 in "Fig. 2" is a holding metal fitting.
たとえば鋼、銅、アルミなどの2枚の平板42.44の
片側をヒンジ46し、反対側にボルト48を取り付けた
ものである。For example, one side of two flat plates 42, 44 made of steel, copper, aluminum, etc. is hinged 46, and a bolt 48 is attached to the other side.
平板42と44を、プレモールド品50の両平面部52
に当て、ボルト48により適当に圧接する。The flat plates 42 and 44 are connected to both flat parts 52 of the pre-molded product 50.
, and press the bolt 48 appropriately.
なお、ばねの力で圧接することもできる。以上のように
したまま、全体を加熱炉の中に入れて加熱する。Note that pressure contact can also be made using the force of a spring. While doing the above, place the whole thing in a heating furnace and heat it.
あるいは、誘導加熱により導体10と抑え金具40を発
熱させてもよい。Alternatively, the conductor 10 and the holding fitting 40 may be heated by induction heating.
そして絶縁テープ20を加熱モールドする。Then, the insulating tape 20 is heat molded.
その際、抑えテープ20は熱収縮性なので、収縮する時
、内部の気泡を追い出す。At this time, since the pressure tape 20 is heat-shrinkable, when it shrinks, it expels the air bubbles inside.
なお絶縁テープ20の熱収縮性は30〜50%くらいが
適当であまり大きいと、裂ける心配がある。The appropriate heat shrinkage of the insulating tape 20 is about 30 to 50%; if it is too large, there is a risk of tearing.
また、抑えテープ30と抑え金具40とのうち抑えテー
プ30は、特に抑え金具40の力の及ばないプレモール
ド品50のエッジ部54に対して有効に働く。Further, between the restraining tape 30 and the restraining metal fitting 40, the restraining tape 30 works effectively particularly on the edge portion 54 of the pre-molded product 50, which is not affected by the force of the restraining metal fitting 40.
また、抑え金具40は、抑えテープ30だけでは力があ
まりかからない。Further, the restraining metal fitting 40 does not receive much force when the restraining tape 30 alone is used.
プレーモールド品50の平面部52に対して有効に作用
するこれら両者の協力により、絶縁テープ20が流動性
を持ってきた時その内圧を高め、気泡を更に追い出す。By the cooperation of these two members, which act effectively on the flat surface 52 of the play-molded product 50, when the insulating tape 20 becomes fluid, its internal pressure is increased and air bubbles are further expelled.
特に抑えテープ30に不織布を使用する時は、絶縁テー
プ20の外層に追い出された気泡が外に逃げやすく、抑
えテープ30の下に空気がたまるということが無くなる
。In particular, when a nonwoven fabric is used for the restraining tape 30, air bubbles expelled to the outer layer of the insulating tape 20 easily escape to the outside, and air accumulation under the restraining tape 30 is eliminated.
なお、ケーブルの場合のように、内部半導電層を設ける
場合は、「第3図」のように、導体10と絶縁テープ2
0の間に半導電性テープ60を巻く。In addition, when providing an internal semiconductive layer as in the case of a cable, as shown in "Fig. 3", the conductor 10 and the insulating tape 2
A semiconductive tape 60 is wound between the two ends.
それは絶縁テープ20と接着性のよいもの、たとえば絶
縁テープ20が架橋ポリエチレンの時は半導電性ポリエ
チレン、エチレンプロピレゴムの時は同種の半導電性ゴ
ムテープを使用する。It should be made of a material that has good adhesion to the insulating tape 20, for example, if the insulating tape 20 is made of crosslinked polyethylene, use semiconductive polyethylene, and if it is made of ethylene propylene rubber, use the same type of semiconductive rubber tape.
その他は上記の場合と同じである。Other details are the same as in the above case.
また製品になった時の内部半導電層の作用は、ケーブル
のものと同じである。Furthermore, the function of the internal semiconducting layer when it is turned into a product is the same as that of a cable.
発明の効果
(1)絶縁テープ20に熱収縮性のプラスチックを使用
するので、上記のように収縮に際して、気泡を追い出す
ように作用する。Advantages of the Invention (1) Since heat-shrinkable plastic is used for the insulating tape 20, it acts to expel air bubbles during shrinkage as described above.
また、絶縁層の厚みを均一にするうえにも有効である。It is also effective in making the thickness of the insulating layer uniform.
(2)たとえばケーブル接続部のモールドのように、モ
ールド部分の全体を金型で包もうとすると、ブスバーの
場合、それは非常に細長くて、大きなものになる。(2) For example, if you try to wrap the entire molded part with a mold, such as a mold for a cable connection part, in the case of a bus bar, it will be very elongated and large.
ところが本発明の場合は、抑えテープ30を使用してい
るので、単に平板42.44を両側から圧接するだけで
、金型使用と同じ目的が達せられる。However, in the case of the present invention, since the restraining tape 30 is used, the same purpose as using a mold can be achieved by simply pressing the flat plates 42, 44 from both sides.
すなわち、エッジ部54の部分の押えは、抑えテープ3
0が受け持ち、また、抑えテープ30だけでは、どうし
ても力のかかりにくい平面部52は、平板42,44が
押える。That is, the edge portion 54 is held down by the pressure tape 3.
Furthermore, the flat plates 42 and 44 hold down the flat portion 52, which is difficult to apply force with the holding tape 30 alone.
このように抑え金具40と抑えテープ30が協力して、
簡単な装置で、ブスバーの加熱モールドを可能にする。In this way, the restraining metal fitting 40 and the restraining tape 30 cooperate,
To enable heating molding of busbars with a simple device.
(3)上記のように必要な圧力を加えた状態で加熱モー
ルドするので、気泡の非常に少ない、特性の良い絶縁ブ
スバーを作ることができる。(3) Since heat molding is performed with the necessary pressure applied as described above, an insulating bus bar with very few bubbles and good characteristics can be produced.
第1図と第2図は本発明の実施例を工程順に示した説明
図、第3図は、内部半導電層を設ける場合の説明図であ
る。
10・・・・・・導体、20・・・・・・絶縁テープ、
30・・・・・・抑えテープ、40・・・・・・抑え金
具、42と44・・・・・・平板、50・・・・・・エ
ッジ部。FIGS. 1 and 2 are explanatory diagrams showing an example of the present invention in the order of steps, and FIG. 3 is an explanatory diagram in the case where an internal semiconducting layer is provided. 10... Conductor, 20... Insulating tape,
30: Pressing tape, 40: Holding metal fittings, 42 and 44: Flat plate, 50: Edge portion.
Claims (1)
圧接し、 圧接した状態を保ちながら、全体を加熱して絶縁テープ
20をモールドすることを特徴とする、ブスバーのモー
ルド絶縁方法。 2抑えテープ30が、プラスチックの不織布からなるこ
とを特徴とする、特許請求の範囲第1項に記載のブスバ
ーのモールド絶縁方法。[Claims] 1. An insulating tape 20 made of heat-shrinkable plastic is wound on a flat conductor 10, and a restraining tape 30 is wound on top of it to make a pre-molded bus bar 50, and both flat parts thereof are wrapped. 52, the flat plates 42 and 44 of the holding fitting 40 are pressed together, and while maintaining the pressed state, the whole is heated to mold the insulating tape 20. 2. The busbar mold insulation method according to claim 1, wherein the restraining tape 30 is made of a plastic nonwoven fabric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8334480A JPS586250B2 (en) | 1980-06-18 | 1980-06-18 | Busbar mold insulation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8334480A JPS586250B2 (en) | 1980-06-18 | 1980-06-18 | Busbar mold insulation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS579010A JPS579010A (en) | 1982-01-18 |
| JPS586250B2 true JPS586250B2 (en) | 1983-02-03 |
Family
ID=13799813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8334480A Expired JPS586250B2 (en) | 1980-06-18 | 1980-06-18 | Busbar mold insulation method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS586250B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59149044U (en) * | 1983-03-25 | 1984-10-05 | 三菱重工業株式会社 | Harmful gas detection device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5409159A (en) * | 1994-02-28 | 1995-04-25 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Apparatus and methods for inerting solder during wave soldering operations |
| TWI264020B (en) * | 2002-02-08 | 2006-10-11 | Hirakawa Hewtech Corp | Foamed coaxial cable with high precision and method of fabricating same |
| CN114803652B (en) * | 2022-03-28 | 2024-02-23 | 苏州科伦特电气有限公司 | Busbar adhesive winding device integrating adhesive feeding and adhesive winding and working method thereof |
-
1980
- 1980-06-18 JP JP8334480A patent/JPS586250B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59149044U (en) * | 1983-03-25 | 1984-10-05 | 三菱重工業株式会社 | Harmful gas detection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS579010A (en) | 1982-01-18 |
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