JPS5914559B2 - Composite plating method - Google Patents
Composite plating methodInfo
- Publication number
- JPS5914559B2 JPS5914559B2 JP5305776A JP5305776A JPS5914559B2 JP S5914559 B2 JPS5914559 B2 JP S5914559B2 JP 5305776 A JP5305776 A JP 5305776A JP 5305776 A JP5305776 A JP 5305776A JP S5914559 B2 JPS5914559 B2 JP S5914559B2
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- fine particles
- plating
- dispersion
- eutectoid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明はメッキ液中に含まれた共析微粒子の分散を促進
し得る複合メッキ方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite plating method capable of promoting the dispersion of eutectoid fine particles contained in a plating solution.
従来、共析微粒子を含むメッキ液中においてメッキを行
う複合メッキにおいて、通常メッキ槽の底部に空気噴出
管などの撹拌機構を配設し、該撹拌機構により上記共析
微粒子をメッキ液中に分散させている。Conventionally, in composite plating in which plating is performed in a plating solution containing eutectoid fine particles, a stirring mechanism such as an air jet tube is usually installed at the bottom of the plating tank, and the stirring mechanism disperses the eutectoid fine particles into the plating solution. I'm letting you do it.
しかしながら、たとえば、空気噴出管は噴出孔の上部で
は良好に撹拌されるが、底部の噴出孔の間あるいは噴出
管の間では空気の撹拌が十分に行なわれず、メッキ槽の
底部に共析微粒子をしだいに沈降させてしまう欠点を有
していた。したがつて、メッキ液中に共析微粒子を十分
に分散させることができないので、メッキを実施された
被メッキ物における共析微粒子の分布が不均一ι ゛に
なる不具合を有していた。However, for example, although air jet pipes are well agitated at the top of the nozzle holes, the air is not sufficiently agitated between the nozzles at the bottom or between the nozzle pipes, resulting in eutectoid fine particles at the bottom of the plating tank. It had the disadvantage that it gradually settled. Therefore, since the eutectoid fine particles cannot be sufficiently dispersed in the plating solution, there has been a problem that the distribution of the eutectoid fine particles in the plated object becomes non-uniform.
本発明は、上記事情に鑑みてなされたもので、共析微粒
子を含むメッキ液中に、メッキ液に対して無反応で比重
がやや大きく、かつその粒子の大きさが共析微粒子より
も明らかに大きい物質からなる分散促進材料を混入して
メッキを施すことにある。The present invention has been made in view of the above circumstances, and the present invention has been made in the plating solution containing eutectoid fine particles, which do not react with the plating solution, have a slightly larger specific gravity, and whose size is more obvious than that of the eutectoid fine particles. The method is to mix a dispersion-promoting material made of a large substance into the plating material and apply plating.
以下、図示の実施例を参照しながら本発明を詳細に説明
する。Hereinafter, the present invention will be explained in detail with reference to illustrated embodiments.
図面において、１はメッキ槽で、このメッキ槽１はその
底部に空気噴出管などの攪拌機構２を配設している。In the drawings, reference numeral 1 denotes a plating tank, and the plating tank 1 has an agitation mechanism 2 such as an air jet pipe disposed at its bottom.
この撹拌機構２は空気噴出管の他プロペラなどを回転さ
せる撹拌扇でもよい。３は上記メッキ槽１内に収容され
た複合メッキ液で、この複合メッキ液３はそのメッキ液
４に共析微粒子５とともにメッキ液に対して無反応で比
重がわずかに大きく、かつその粒子の大きさが共析微粒
子よりも明らかに大きい物質からなる分散促進材料６を
混入してある。The stirring mechanism 2 may be an air jet pipe or a stirring fan that rotates a propeller or the like. Reference numeral 3 denotes a composite plating solution contained in the plating tank 1, and the composite plating solution 3 is in the plating solution 4 together with eutectoid fine particles 5, which do not react with the plating solution, have a slightly high specific gravity, and have a slightly larger specific gravity. A dispersion promoting material 6 made of a substance whose size is clearly larger than that of the eutectoid fine particles is mixed.
この分散促進材料６は上記メッキ液４に対して比重がや
ゝ大きいもの、たとえば０．１程度大きいものを使用し
、該メッキ液４中において浮遊性が最も高い状態に設定
する。たとえば、メッキ液４にＳｉＣ−スルファミン酸
ニッケル浴を用いた場合にはその比重が１．３〜１．５
程度であるので、分散促進材料６としては比重１．４〜
１．６程度のものを使用する。分散促進材料６としては
、たとえばアセチルセルロース：比重１．２８〜１．３
２、塩化ビニル：比重１．３５〜１．４５、塩化ビニリ
ラン共重合体：比重１．６５〜１．７２などの高分子材
料を使用する。その粒度としては共析微粒子５よりも明
らかに大きいもので、たとえば５．０〜１０肩Ｉ程度の
もの、その形状は球状以外にも種々のタイプが考えられ
る。この分散促進材料６は上記ポリ塩化ビニルなどを単
味で用いる場合もあるが、鉄などの金属にポリ塩化ビニ
ルなどの材料を被覆したものでもよい。いずれの場合も
一定の大きさ、重量に形成することがのぞましい。７は
上記複合メッキ液３中において揺動機８などにより揺動
されながらメッキを行なわれる被メッキ物である。The dispersion promoting material 6 used has a specific gravity slightly higher than that of the plating solution 4, for example, about 0.1, and is set to have the highest buoyancy in the plating solution 4. For example, when a SiC-nickel sulfamate bath is used as the plating solution 4, the specific gravity is 1.3 to 1.5.
Therefore, as the dispersion promoting material 6, the specific gravity is 1.4~
Use one with a size of about 1.6. As the dispersion promoting material 6, for example, acetylcellulose: specific gravity 1.28 to 1.3
2. Polymer materials such as vinyl chloride: specific gravity of 1.35 to 1.45 and vinylylane chloride copolymer: specific gravity of 1.65 to 1.72 are used. The particle size is obviously larger than the eutectoid fine particles 5, for example, about 5.0 to 10 shoulders I, and various types of shapes other than spherical can be considered. The dispersion promoting material 6 may be made of polyvinyl chloride or the like alone, but may also be a metal such as iron coated with a material such as polyvinyl chloride. In either case, it is desirable to form it to a certain size and weight. Reference numeral 7 designates an object to be plated while being rocked in the composite plating solution 3 by a rocker 8 or the like.
しかして、上記本発明の複合メッキ方法によれば、撹拌
機構２により空気を噴出させると、複合メッキ液３中に
混入された分散促進材料６がメッキ液４中に乱流的に攪
拌され、この分散促進材料６の分散によつて、共析微粒
子５も分散を促進される。According to the composite plating method of the present invention, when the stirring mechanism 2 blows out air, the dispersion promoting material 6 mixed into the composite plating solution 3 is turbulently stirred into the plating solution 4. Due to the dispersion of the dispersion promoting material 6, the dispersion of the eutectoid fine particles 5 is also promoted.
この分散促進材料６はメッキ液４に比べて比重がわずか
に重く、しかも粒度などにおいて浮遊性が最も高い状態
に設定してあるので、撹拌機構２からの空気によつて十
分にメッキ液４中に分散されるものである。そこで、共
析微粒子５は該分散促進材料６の分散によつてメッキ液
４中に均一に分散されるものである。そして、分散促進
材料６は共析微粒子５の粒子の大きさに比べて明らかに
大きいので、共析微粒子５と共に被膜中に共析されるこ
とはない。したがつて、被メッキ物７にメッキを行つた
場合、共析微粒子５が均一に共析した複合メッキ層が得
られる。なお、酸化が進行するなどの理由により空気な
どとの接触を好まない鉄系メッキ（たとえば、硫酸第一
鉄浴）などにおいては、鉄などの金属を包含したポリ塩
化ビニルなどの分散促進材料６をメッキ液４中に混入し
、外部から磁力を加えて上記分散促進材料６の分散を促
進すればよい。This dispersion-promoting material 6 has a slightly heavier specific gravity than the plating solution 4, and is set to have the highest buoyancy in terms of particle size, etc. Therefore, the dispersion promoting material 6 is sufficiently dispersed in the plating solution 4 by the air from the stirring mechanism 2. It is distributed in Therefore, the eutectoid fine particles 5 are uniformly dispersed in the plating solution 4 by dispersion of the dispersion promoting material 6. Since the dispersion promoting material 6 is clearly larger than the particle size of the eutectoid fine particles 5, it is not eutectoided into the film together with the eutectoid fine particles 5. Therefore, when the object 7 to be plated is plated, a composite plating layer in which the eutectoid fine particles 5 are uniformly eutectoid is obtained. In addition, for iron-based plating (e.g. ferrous sulfate bath), which does not like contact with air due to oxidation, dispersion promoting materials such as polyvinyl chloride containing metals such as iron6 are used. The dispersion promoting material 6 may be mixed into the plating solution 4 and a magnetic force may be applied from the outside to promote dispersion of the dispersion promoting material 6.
以上、詳述したように本発明の複合メッキ方法によれば
、分散促進材料を混入したのでメッキ液中に含まれた共
析微粒子を良好に分散でき、これにより共析微粒子が均
一に共析した複合メッキ層を得ることができる。As detailed above, according to the composite plating method of the present invention, since the dispersion promoting material is mixed, the eutectoid fine particles contained in the plating solution can be well dispersed, and as a result, the eutectoid fine particles are uniformly eutectoid. A composite plating layer can be obtained.
図面は本発明の複合メッキ方法の実施例を示す概念図で
ある。
１・・・メッキ槽、２・・・撹拌機構、３・・・複合メ
ッキ液、４・・・メッキ液、５・・・共析微粒子、６・
・・分散促進材料、７・・・被メッキ物、８・・・揺動
機。The drawing is a conceptual diagram showing an embodiment of the composite plating method of the present invention. DESCRIPTION OF SYMBOLS 1... Plating tank, 2... Stirring mechanism, 3... Composite plating solution, 4... Plating solution, 5... Eutectoid fine particles, 6...
... Dispersion promoting material, 7... Object to be plated, 8... Shaking machine.
Claims (1)
無反応で比重がメッキ液よりやや大きく、かつその粒子
の大きさが共析微粒子よりも明らかに大きい物質からな
る分散促進材料を混入し、撹拌機構によりメッキ液を撹
拌しながらメッキを施すことを特徴とする複合メッキ方
法。1. Into the plating solution containing eutectoid fine particles, mix a dispersion promoting material consisting of a substance that does not react with the plating solution, has a specific gravity slightly larger than that of the plating solution, and whose particle size is clearly larger than the eutectoid fine particles. A composite plating method characterized by applying plating while stirring the plating solution using a stirring mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5305776A JPS5914559B2 (en) | 1976-05-10 | 1976-05-10 | Composite plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5305776A JPS5914559B2 (en) | 1976-05-10 | 1976-05-10 | Composite plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52135837A JPS52135837A (en) | 1977-11-14 |
| JPS5914559B2 true JPS5914559B2 (en) | 1984-04-05 |
Family
ID=12932212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5305776A Expired JPS5914559B2 (en) | 1976-05-10 | 1976-05-10 | Composite plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5914559B2 (en) |
-
1976
- 1976-05-10 JP JP5305776A patent/JPS5914559B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52135837A (en) | 1977-11-14 |
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