JPS5917855B2 - Semiconductor support and method for manufacturing a semiconductor device using the semiconductor support - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor support that enables highly accurate and automated manufacturing of semiconductor devices, and a manufacturing method using this semiconductor support.

5. Conventionally, there has been known a manufacturing method called the tape carrier method, in which a film or the like is formed into a tape, and semiconductor elements are successively assembled thereon.

This conventional tape carrier method can automate the process up to the point where lead wires are attached to semiconductor devices.
In order to make a semiconductor device by attaching the assembled semiconductor elements to a circuit board, etc., each semiconductor element is cut out from the tape, aligned on the circuit board, and then connected to the lead wires of the semiconductor element. Each bond to the circuit board must be made 15 times.
This conventional method is easy to handle if the circuit board of the semiconductor device is relatively large and the semiconductor element has a large lead wire shape and the spacing between the lead wires is rough. Now, the semiconductor element itself is
The size of the semiconductor device also became smaller, making it difficult to handle during alignment and lead bonding in actual manufacturing, and it was also impossible to automate the manufacturing process of semiconductor devices. The present invention solves the above-mentioned conventional drawbacks by assembling a semiconductor element on a tape-shaped semiconductor support, attaching the semiconductor element to a circuit board in that order, and then attaching the semiconductor element and the semiconductor support. We provide a semiconductor support that can be separated and a method for manufacturing a semiconductor device using this semiconductor support, and an example thereof will be explained below with drawings. This is a semiconductor support formed into a shape.

Reference numeral 2 denotes a hole formed in the semiconductor support 1 so as to have a substantially E shape, leaving two cantilevered projecting pieces 3, 3, and the holes 2 are spaced apart from each other in the tape direction. Many, “5
- Provided in series.

Reference numerals 4 and 4 denote lead wires made of thin metal foil conductors, which intersect each of the protruding pieces 3 at right angles and are fixed in large numbers in parallel to each other, and both ends of the lead wires 4 are The space ◆ of the hole 2 protrudes beyond the width of the protruding piece 3.

Reference numerals 5 and 5 designate sprocket holes provided in a row on both edges of the semiconductor support 1, respectively.

Here, a polyimide resin film having a thickness of about 0.1 mm was used as the organic insulating film formed on the semiconductor support 1, but other flexible insulating films such as polyester film may also be used. The lead wires 4 are formed by photoetching using copper foil with a thickness of about 35 microns to have a width of about 50 microns and a pitch between the leads of about 100 microns, and are plated with tin or gold. FIG. 2 shows the process of attaching the semiconductor element 6 to the semiconductor support 1. As shown in FIG.

The semiconductor element 6 is, for example, a diode array, a semiconductor integrated circuit element, etc. formed on a silicon chip 7, and one surface thereof is provided with protruding connection terminals 8 made of gold. The semiconductor elements 6 are provided one by one on other tape-like bodies at the same intervals so that they can be sequentially attached to the approximately E-shaped holes 2. The connection terminals 8, 8 of the semiconductor element 6 and the lead wires 4, 4 of the semiconductor support 1 are joined by thermocompression bonding. At this time, if the lead wire 4 is tin-plated, it will be bonded to the gold protrusion of the connection terminal 8 by gold-tin eutectic, and if the lead wire 4 is gold-plated, it will be bonded with gold-tin eutectic. The result is thermocompression bonding. A joining method using solder is also possible. This process is automated, and the semiconductor elements 6 are sequentially assembled on the semiconductor support 1 with the lead wires 4, 4 joined together. FIG. 3 shows the process of bonding the semiconductor element 6 to the circuit board 9 using the semiconductor support 1 to which the assembled semiconductor element 6 is attached.

The circuit board 9 is a board on which printed wiring and the like are provided. On top of this, the semiconductor support 1 is brought close so that the surfaces on the lead wires 4, 4 side face each other, and by moving the semiconductor support 1, the semiconductor element 6 and the wiring pattern of the circuit board 9 are aligned. After performing this, the lead wires 4, 4 and the wiring portion are joined by a method such as thermocompression bonding or soldering. After the bonding between the lead wires 4, 4 and the circuit board 9 for one semiconductor element is completed, the protruding pieces 3, 3 of the semiconductor support 1 are cut near the base of the protruding pieces 3, 3, and the semiconductor support The semiconductor element 6 is separated from the semiconductor element 1. In this way, the semiconductor elements 6 are sequentially bonded onto the circuit board 9 to manufacture a semiconductor device. In the above embodiment, the sprocket holes 5, 5 are used to hold, align, and feed the semiconductor element 6 when the leads are bonded onto the circuit board 9 in preparation for manufacturing a semiconductor device. Since this can be carried out by holding the semiconductor element 6, a reliable and highly accurate manufacturing technique can be realized regardless of the shape and dimensions of the semiconductor element 6.

Particularly, as shown in FIG. 3, in a high-density semiconductor device in which semiconductor elements 6 are bonded very close to each other on a circuit board 9, the semiconductor support 1 has a substantially E-shaped hole 2; What holds the semiconductor element inside are two cantilevered protruding pieces 3, 3, and one end of these protruding pieces 3, 3 is separated from the main body of the semiconductor support 1. By greatly bending the semiconductor support 1 made of a film by taking advantage of its flexibility, it is possible to bring the semiconductor elements 6 close to each other and make it easier to bond them onto the circuit board 9. That is, since the protruding pieces 3, 3 are cantilevered, the distance 12 between the semiconductor elements 6 after being bonded on the circuit board 9 is smaller than the distance 11 between the semiconductor elements 6 on the semiconductor support 1. This makes it easier to make the size smaller, which has a particularly great effect on high-density automation. For example, in a thermal recording head, which is a high-density semiconductor device and uses a large number of diode arrays to form a matrix circuit, in order to increase the recording density,
It is necessary to connect ~10 hard diode arrays,
In this case, if the semiconductor support 1 of the above embodiment is used, the effect is particularly great, and an efficiency several times higher than that of the conventional method can be achieved. Further, while holding the semiconductor support 1, the semiconductor element 6 is
Since it can be assembled and bonded to semiconductor devices, it has an excellent feature that allows automation of the entire process from semiconductor elements to semiconductor devices. As described above, the present invention provides a series of approximately E-shaped holes provided at intervals in a flexible organic insulating film body, and two cantilevered protrusions forming the approximately E-shaped holes. A semiconductor support formed by having each of the shaped protruding pieces with lead wires made of a large number of narrow metal conductors intersecting with the protruding pieces and having both ends protruding from the width of the protruding pieces; Even when semiconductor elements are bonded at high density by a manufacturing method in which a semiconductor element is attached to this semiconductor support, the lead wire is bonded onto a circuit board, and then the semiconductor element is cut and separated from the semiconductor support, Since the protruding piece has a cantilevered shape, it is possible to hold the semiconductor support while bending it and perform it with high precision and efficiency, and it is also advantageous in that it can realize consistent automation of processes from semiconductor elements to semiconductor devices. The present invention provides a semiconductor support and a method for manufacturing a semiconductor device using the semiconductor support.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing one embodiment of the semiconductor support of the present invention, Fig. 2 is an explanatory diagram of the process of attaching a semiconductor element to the semiconductor support, and Fig. 3 is a circuit diagram of a semiconductor element using the semiconductor support. FIG. 3 is an explanatory diagram of a process of bonding to a substrate. 1... Semiconductor support, 2... Hole, 3.
...Protruding piece, 4...Lead wire, 6...
...Semiconductor element, 9...Circuit board.

Claims (1)

[Scope of Claims] 1. A series of approximately E-shaped holes provided at intervals in a flexible organic insulating film body, and 2.
Each of the book's cantilever-shaped protruding pieces has lead wires made of a large number of narrow metal conductors that intersect with the protruding pieces and have both ends protruding from the width of the protruding pieces. A semiconductor support. 2 A series of approximately E-shaped holes provided at intervals in a flexible organic insulating film body, and 2 holes forming the approximately E-shaped holes.
A semiconductor support having, on each of the cantilever-shaped protruding pieces of a book, lead wires made of a large number of narrow metal conductors that intersect with the protruding pieces and have both ends protruding from the width of the protruding pieces. , the semiconductor element is attached by bonding the lead wires and connection terminals of the semiconductor element, and further, after the lead wires are bonded onto the circuit board, the semiconductor element is cut and separated from the semiconductor support. A method for manufacturing a semiconductor device using a semiconductor support.