JPS5917980B2 - Method for manufacturing protrusions on substrate conductor layer - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a protrusion for electrical connection to a substrate, which is used to obtain an electrical connection between an electrode of an electronic component element such as a semiconductor device and an external substrate.

Conventionally, as a method for electrically connecting an electrode of an electronic component element such as a semiconductor element to an external substrate, as shown in FIG. A semiconductor element 1 except for a portion where an At electrode 2 is formed and electrically connected to the At electrode 2 and an external substrate.
An insulating film 3 of SiO2 is formed on the entire surface of the device by photolithography to protect the element surface, and electrical connections with an external substrate on which the insulating film 3 is not formed are coated with Cu,
A metal layer consisting of one or two types of Au, solder, etc. is deposited and formed by plating, thereby forming a 0 bump 4.
It is configured to make an electrical connection with an external board. However, in such a process, many man-hours are required to manufacture electronic components, and the yield is also low.
The plating process had an adverse effect on the electrical characteristics of the electronic component itself. The present invention has been made to eliminate such drawbacks. An embodiment of the present invention is shown in FIGS. 5a and 5b.

To explain FIG. 2 using an example of application to a tape carrier substrate for a watch, 1 is a first step of applying a photo-iO resist on the surface of a conductor layer. 5 is photoresist, 6
is a conductor layer made of metal foil such as copper.

1 is an insulating layer such as a flexible polyimide film.

Since the photoresist 5 must be uniformly coated to a thickness of several microns, it is coated using a special roll coater as shown in FIG. Photoresist 15 scraped up by coater roller 13
of. It is applied to the tape carrier 16 sandwiched between the pressing roller 14 and the tape carrier 16 . 2 is a second step in which 30 photo-etchings are made on the back surface of the conductor layer 6.

8 is a protrusion made by photoetching.

In the case of the back side of the conductor layer 6, it is difficult to apply the photoresist 51 because there is a clearance equal to the thickness of the insulating layer T, but the conditions such as the number of rotations of the roll coater (35 rotations) and the roller pressing pressure as explained in the first step 1. is set to an appropriate value and applied. For exposure, a 1/2 projection exposure method is used to ensure component accuracy. Next, development is performed for several minutes to form a photoresist pattern, and then about half of the conductor layer is etched by immersing it in a suitable etching solution for several minutes. 3 is a third step of patterning the surface of the conductor layer 6.

The position of the protrusion on the back surface of the conductor layer 6 is determined, and the
Exposure is performed using a /2 projection exposure method, and development is performed for several minutes to form a pattern 9 of photoresist. 4
teeth. The fourth step is to apply a coating agent to protect the back surface of the conductor layer 6 from being etched when the surface of the conductor layer 6 is etched in step 5.

10 is a coating agent.

5 is a fifth step of etching the surface of the conductor layer 6.

Reference numeral 11 indicates a portion that has been etched away, and reference numeral 12 indicates a connection terminal having an electrical connection protrusion formed by etching.

6B This is a sixth step in which the photoresist applied in steps 1, 2, and 4 and the coating agent on the back surface of the conductor layer 6 are removed.

Au (not shown) is attached to the tape carrier on which connection terminals with electrical connection protrusions are formed by the above process.
After performing a desired process such as plating, as shown in FIG. 4, the semiconductor element is positioned with respect to the semiconductor element and thermocompression bonding is performed (6) to establish electrical connection between the semiconductor element and the external substrate.

By providing electrical connection protrusions on the tape carrier through such a process, it is no longer necessary to form bumps 4 on the semiconductor element side.

In the above explanation. Although it has been explained that a roll coater is used to apply the photoresist, a spinner, screen printing, tacho printing, dropping method and squeegee method, etc. may be used, but the method is not limited to the above method.

or. Although a semiconductor element has been described as an electronic component element, it can also be applied to resistors, capacitors, etc. As described above, according to the present invention, protrusions are provided on the conductive layer of the substrate that makes electrical connection between the electrodes of the electronic component element and the external substrate, and in the portion that is connected to the electrode of the electronic component element. V) 6 The bumps that were formed on the electrodes of conventional electronic component elements are no longer required.There is no need for plating processing to form resistor bumps. The adverse effects of the plating process are eliminated, the reliability of the electronic component element itself is improved, the number of man-hours for manufacturing the six-pronged electronic component is reduced, and the yield is also improved.

Zhou. According to the present invention, six second steps of the present invention are added to the conventional board manufacturing process, but it is more effective to reduce the man-hour load and eliminate the need for bumps.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a main part for explaining a conventional semiconductor element, and FIG. 2 is a cross-sectional view of a main part by step of an embodiment of the method of manufacturing a protrusion for electrical connection to a tape carrier according to the present invention. FIG. 3 is a cross-sectional view of a main part of the roll coater used in the present invention, and FIG. . FIGS. 5A and 5B are explanatory diagrams showing a part of a tape carrier board for a watch as an embodiment of the present invention. a is the front surface and b is the back surface. 1... semiconductor element,
2...At electrode. 3... Insulating film, 4... Bump,
5... Photoresist, 6... Conductor layer 67...
Insulating layer. 8... Protrusion. 9... Pattern by photoresist, 10... Coding agent. 12... Connection terminal.

Claims (1)

[Claims] 1. An insulating layer made of a resin material having an opening into which an electronic component element can be inserted, and a conductor layer made of a metal foil such as copper coated on the insulating layer so as to cover the opening. In a substrate for electrically connecting an electronic component element and an external substrate, a method for manufacturing a protrusion on a portion of the conductor layer to be connected to an electrode of the electronic component element includes coating a surface of the conductor layer with a photoresist. a first step; a second step of photo-etching the back surface of the conductor layer, which consists of photoresist coating, exposure, development, and etching; and a third step, which involves patterning the surface of the conductor layer, which consists of exposure and development. a fourth step of applying a coating agent to the back surface of the conductor layer; a fifth step of etching the surface of the conductor layer; and peeling off the photowaste and coating agent on the front and back surfaces of the conductor layer. A method for manufacturing protrusions on a substrate conductor layer, comprising a sixth step.