JPS5923110B2 - Film carrier type electronic component mounting device - Google Patents

Description

[Detailed description of the invention] The present invention relates to an electronic component mounting device.

Currently, many methods have been developed for wire S bonding, one example of which is the minimod method.

This method uses a polyimide film with a diameter of several tens of microns.
A method in which a predetermined hole is press punched in the center of a tape cut to a certain width, and a film with conductor electrodes formed on this tape is used to connect a semiconductor element and an external lead. It is. That is, as shown in FIGS. 1a and 1b, a through hole 3 into which an electronic component 2 can be inserted is formed in an insulating substrate 1.
A beam-shaped electrode 5 of a lead conductor 4 is formed on the insulating substrate 1 so as to protrude above the through-hole 3 .

In this case, after inserting and aligning the electronic component 2 from the direction of the arrow at the bottom of the through hole 3, the beam-shaped electrode 5 and the electrode 6 on the semiconductor element 2 are connected by thermocompression bonding or the like. . However, in this method, the beam-shaped electrode 5 is formed only of a thin metal layer, so when the semiconductor element is inserted from the bottom and aligned, the beam-shaped electrode is easily bent, resulting in poor yield and height. The drawbacks were that it was difficult to regulate the positions of the devices, etc., and the alignment was unstable. In addition, the method for manufacturing electronic component mounting equipment includes
There is also a method proposed in Japanese Patent No. 32543, but this method uses chemicals and uses a predetermined spacer, so it has the disadvantage that it requires a large number of steps such as a spacer forming step.

The present invention has been made to eliminate such drawbacks, and embodiments of the present invention will be described below with reference to the drawings.

FIGS. 2A and 2B are diagrams for explaining the electronic component mounting apparatus of the present invention.

FIG. 2a shows an electronic component 2 connected to a flexible conductor wiring 1.
1 (e.g., polyimide film, etc.)
12 is a cross-sectional view when inserted into a leaded insulating board (hereinafter referred to as an insulating board with leads) 12. FIG. Here, the insulating board 12 with leads is fixed in a deformed state on a bending fixing base 13, and the electronic component 2 (for example, a semiconductor element, a module, etc.) is placed in the central recess of the insulating board 12 with leads. After inserting from above as shown in and gluing or fixing, as shown in FIG. The structure allows the end of the lead (hereinafter referred to as lead electrode) to be brought into contact with or approached. Note that the groove 16 is provided here to make it easier to bend the insulating board with leads at this position.

FIG. 3 shows the electronic component mounting device formed on the film carrier. Here, stopper 21
The electrode 14 on the electronic component 2 when the electronic component 2 is inserted,
This is to facilitate alignment with the lead electrode 23 on the film carrier 22. Further, the recess 24 is a space for easily inserting the electronic component 2, and the recesses 25 at both ends are grooves for making it easier to bend the film carrier 22 at both ends of the electronic component 2. Furthermore, sprocket holes 26 are provided on both sides of the film carrier 22, making it convenient for mechanization. The above example is an example in which the lead electrodes protrude from two directions, which facilitates alignment, but an example in which the lead electrodes are provided in four directions is shown in FIGS. 4A and 4B.

Here, the lead electrodes 4 protrude above the electronic component 2 from four directions and are bonded onto the film carrier 31. Then, there is a cut 3 that penetrates from the front surface of the insulating substrate to the back surface.
2 is for making it possible to bend the insulating substrates 33 with leads on the side sides of the film carrier 31 independently, and a groove 34 on the side of the sprocket hole 26 and a bottom of the recess for inserting electronic components. At this position, the side groove 35 is
This is to make the film carrier 31 easier to bend. Note that the features of this embodiment are very effective when there are many electrodes on an electronic component. Figures 5A and b are Figure 4A
, b, but in order to give strength to the lead electrodes 4 protruding from the electronic component 2, they are connected with a transparent insulating protective layer 41 to strengthen the lead electrodes 4. Therefore, the strength of the lead electrode is increased, and the yield during bonding is also improved. Furthermore, if the recess 42 for inserting the electrode component 2 is made slightly shallower than the thickness of the electronic component 2,
After insertion, the electrode 14 on the electronic component 2 and the lead electrode 4 can be pressed or brought into close contact. 6A, b, and c are also roughly the same as FIG. 4, but the lead electrode 51 does not protrude into the flexible insulating substrate recess 42 into which the electronic component 2 is to be inserted, and the electronic component 2 The depth of the recess 42 is set so that the upper electrode 14 and the lead electrode 51 are approximately at the same height. Therefore, the gap between the side surface of the electronic component 2 and the recess 42 can be minimized or they can be brought into close contact with each other, and the electrode 14 on the electronic component 2 and the lead electrode 51 can then be connected by the plating method.
The biggest feature of this shape is that it is suitable for continuous mass production.
Since the lead electrode does not protrude, the lead electrode does not bend easily. Further, in FIG. 6c, the protruding lead electrode 14 is bent into the electronic component insertion recess 42, thereby eliminating the need for positioning in the depth direction. In this case, since the electrode joint portion does not protrude upward, it is convenient to insert the electronic component 2 into the recess 42 and then mold the recess 42 with an insulating material. Note that when using the electronic component mounting device of the present invention, the closer the electrodes on the electronic component are made to the outer edge of the electronic component, the shorter the protruding portion of the external lead electrode can be. The effect will be greater.
Next, FIG. 7 shows a method for manufacturing an electronic component mounting device according to the present invention.
This will be explained using FIGS. 8 and 9.

In FIGS. 7A, b, and c, a through hole for inserting an electronic component and a cut for bending are punched out using a press in an insulating substrate 71 having approximately the same thickness as the electronic component (FIG. 7 a), and a small piece is punched out. is used as a spacer and is sandwiched between a lead conductive metal film 72 and a reinforcing substrate 73 together with an insulating substrate 71, and after bonding each with an adhesive layer 74, a conductor is wired using a photolithography method to form a conductor 75 ( Figure b). Next, spacer part 7
6 and the reinforcing substrate 73 (Figure c), a flexible film substrate 77 with grooves or cuts for bending is formed.
This is a method of manufacturing an electronic component mounting device as shown in FIG.

This method also serves to prevent the conductor wiring 75 from being bent by the spacer portion 76. Figure 8 A, b, c, d
First, a protruding portion 82 corresponding to the lower part of the lead electrode is removed from a flexible insulating film 81 having approximately the same thickness as the electronic component (process diagram a), and a lead conductor wiring 83 is formed by photolithography. After that, protective film 84 is applied to both sides (process diagram b), plasma etching is performed from both sides to form through holes, the protective film is removed (process diagram c), and finally bending grooves 85 and Cut and expansion buffer groove 86
In this method, an electronic component mounting device is manufactured by adhering to a flexible film 87 formed with (FIG. d).

In this method, grooves 82 are provided and etched, so
A lead electrode of the wiring 83 is completely formed in the opening of the recess.

In addition, in FIGS. 9A, b, c, and d, portions corresponding to the conductor wiring projections C have been photo-etched in advance.

After adhering a conductor metal film 92 for leads onto a flexible insulating film 91 (Figure a), a conductor wiring 93 is formed by photolithography (Figure b), and then a first protective film 94 is formed. is coated on both the front and back surfaces, and a second protective film 95 having a faster etching speed than the first protective film is formed thinly, leaving the outer edge part on the central surface where etching is to be performed (process diagram c), and then plasma etching is performed. After performing the above steps, the protective film is removed (process diagram d), and an electronic component mounting device having a groove 96 at the outer edge of the bottom of the recess can be manufactured. This method utilizes grooves 82 for etching, similar to the method shown in FIG.

Although the above has been described with respect to devices with conductor wiring formed, electronic component mounting devices without conductor wiring can also be wired after mounting electronic components, so they can be placed in a fixed position. Moreover, the gap between the insulation board and the
The fact that it can be installed with a smaller number is a very big advantage in the subsequent process of forming conductor wiring.

As explained above, the present invention is composed of a flexible insulating substrate having a concave portion on the main surface that substantially matches the shape of an electronic component,
In the electronic component mounting device, the flexible insulating substrate is deformed so that the opening of the recess is widened, and the electronic component is inserted and installed into the recess from above.

Therefore, according to the apparatus of the present invention, electronic components can be easily and accurately aligned with respect to the insulating substrate, and even when electrode wires are attached to the edge board, the electronic components can be inserted into the recess. The electrode wire is not deformed during the process, and the yield is extremely high.

Furthermore, by using the apparatus of the present invention, it is possible to mechanize the assembly of electronic parts, that is, to perform continuous mass production, and a significant cost reduction effect can be achieved.

[Brief explanation of the drawing]

FIGS. 1A and 1B are a top view and a sectional view of a conventional electronic component mounting device, respectively; FIGS. 2A and 2B are a main part sectional view and a sectional view, respectively, illustrating the electronic component mounting device of the present invention;
FIG. 3 is a top view of an electronic component mounting device which is an embodiment of the present invention, and FIGS. 4A and 4B are a top view and a sectional view of an electronic component mounting device which is another embodiment of the present invention, respectively. 5A and 5B are a top view and a sectional view of an electronic component mounting device which is another embodiment of the present invention, respectively, and FIGS. Top view, cross-sectional view, and cross-sectional view of parts mounting device, Figures 7A, b, and c
, d to FIGS. 9A, b, c, and d are process diagrams showing each example of the method for manufacturing the electronic component mounting device of the present invention. 2...Electronic components, 4...Lead electrodes,
12... Insulated board with leads, 14...
Electrode, 42... recess.

Claims (1)

[Scope of Claims] 1. Consists of a tape-shaped flexible insulating substrate having a plurality of recesses that substantially match the shape of the electronic component and a sprocket hole for positioning on the main surface, and the opening of the recess is A mounting device for a film carrier-shaped electronic component, characterized in that the flexible insulating substrate is deformed so as to expand, and the electronic component is inserted into the recess from above and installed. 2. Providing cuts or grooves in a tape-shaped flexible insulating substrate,
2. The device for attaching a film carrier-like electronic component according to claim 1, wherein the film carrier-like electronic component is bent and deformed using the cut or groove as a fulcrum. 3. The electronic component has an electrode at the peripheral edge of the upper main surface, and a conductive pair wire corresponding to the electrode is provided on the main surface of the tape-shaped flexible insulating substrate, and the electronic component is installed in the recess. 2. The device for mounting a film carrier-like electronic component according to claim 1, wherein the electrode and the conductor wiring are adjacent to each other at substantially the same height. 4. The electronic component has an electrode on the peripheral edge of the upper main surface, and a conductor wiring on the main surface of the flexible insulating substrate that corresponds to the electrode and has a protruding electrode portion on the opening side of the recess, and the electronic component 3. The mounting device for a film carrier-like electronic component according to claim 1, wherein the electrode and the protruding electrode portion are joined after the electrode is placed in the recess. 5. The mounting device for a film carrier-like electronic component according to claim 4, wherein a plurality of protruding electrode portions are connected by an insulator. 6. The electronic component has an electrode at the peripheral edge of the upper main surface, and a conductor wiring corresponding to the electrode is provided on the main surface of the flexible insulating substrate, one end of which is provided from the opening side of the recess to a predetermined position, 3. The mounting device for a film carrier-like electronic component according to claim 1 or 2, wherein the electrode and the conductor wiring are joined within the recess.