JPS6161705B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to lead tapes, and more particularly to metal single-layer tape carriers or multi-layer metal and insulating tape carriers for semiconductor devices.

A semiconductor device using a conventional tape carrier method is designed such that a group of leads formed on a tape carrier is arranged in advance so that each lead portion is placed in a position corresponding to the electrode of a semiconductor element, and then bonded by thermocompression or bonding in a batch. They were manufactured by joining them using weld joints, etc. This thermocompression bonding or weld bonding is performed by aligning the tape carrier lead and the electrode of the semiconductor element and then pressing the heater chip.
At this time, the lead and electrode were aligned by bringing the distance between them closer. During this positioning, if the guide of the tape carrier is planar, if the wafer is bonded in a diced state, the bonded semiconductor element and the wafer-shaped semiconductor element collide with each other. As a result, the distance between the tape carrier and the semiconductor element cannot be brought sufficiently close, making alignment extremely difficult, and assembly failures often occur due to misalignment of the electrodes and leads of the semiconductor element.

In order to prevent this, the guide of the tape carrier is bent as shown in the schematic cross-sectional view of Figure 1.
By bending the tape carrier along a guide, the bonded semiconductor element and the wafer-shaped semiconductor element are prevented from colliding with each other, and the distance between the leads of the tape carrier and the semiconductor element is brought closer. That is, the first
In the figure, 1 is a bonding tool, 2 is a tape guide, 3 is a tape carrier, 4 is a lead, 5 is a semiconductor element, 6 is a support substrate for the semiconductor element, and 7 is a stage. , on the stage 7, the semiconductor element 5
The electrodes of the semiconductor element 5 and the tape carrier 3 are fixed by placing the support plate 6 on which the electrodes of the semiconductor element 5 and the tape carrier 3 are fixed, and by moving the guide 2 while observing with an enlarged field of view from above. A method was used in which bonding was performed after alignment with the lead 4 above. At this time, the tape carrier 3
Since it is guided along the curved shape of the guide 2, it is possible to prevent a semiconductor element for which bonding has been completed from colliding with another semiconductor element for which bonding has not been completed. Furthermore, the tape carrier does not collide with other semiconductor devices in the vicinity of the semiconductor device to be bonded, making it possible to bring the tape carrier leads closer to the target semiconductor device. This makes it easy to align the tape carrier lead with the tape carrier lead.

However, in this case, since the tape carrier 3 is bent along the shape of the guide 2, its lead portion 4 is deformed in the direction of the curved surface of the guide 2. For this reason, the electrodes of the semiconductor element 5 and the leads 4 cannot be accurately aligned, and the leads 4 are likely to be misaligned or abnormally deformed during bonding.

The present invention eliminates this drawback, makes the alignment of the tape carrier lead and the semiconductor element electrode accurate, and enables stable assembly of the semiconductor element.

The lead tape of the present invention has a device hole as shown in the semiconductor device connection diagram in the center, a plurality of unit carriers arranged in parallel in one direction, and one end protruding into the device hole and the other end protruding outside the unit carrier. The plurality of leads integrated into the unit carrier and each unit carrier are connected only through the connecting part, and the strip-shaped film extending on both sides of the unit carrier and the adjacent unit carriers are separated from each other. The device has a plurality of openings, the connecting portion has a width narrower than the device hole, and each unit carrier is separated from an adjacent unit carrier only by the opening.

The present invention will be explained below using the drawings. FIG. 2 is a schematic cross-sectional view of a bonding portion when a tape carrier according to an example of the present invention is used, and FIGS. 3 and 4 are plan views of an embodiment of the tape carrier according to the present invention. FIG. 3 shows a plan view of the multilayer tape carrier. In FIG. 3, 8 is a polyimide film strip, 9 is a copper inner lead formed by etching, and one end thereof is integrally connected to the unit carrier. 10 is an opening for separating each unit carrier processed by a press; 12 is a connecting portion; 1
3 is a device hole provided in the center of the unit carrier. Unit carrier is device hole 1
3 at the center, and are integrally connected and held so that one end of the inner lead does not protrude outward. Figure 4 shows a plan view of the single layer tape carrier.
8' is a strip copper tape, 9' is a lead formed on the copper tape, 10' is an etched opening, 1
2' is a connecting portion, and 13' is a device hole. One end of the leads 9, 9' protrudes into a device hole in the unit carrier, and the other end is integrally connected to the unit carrier, and only this unit carrier is connected in the direction perpendicular to the longitudinal direction of the strip tape, and the other end is connected integrally to the unit carrier. It is supported at the center by two band-like tapes via connecting portions 12, 12'.

When bonding is performed using these tape carriers, the tape carrier bends along the bent tape guide 2' as shown in Figure 2, but the leads surrounded by the openings of the tape carrier The parts are kept parallel to stage 7' in the bonding position. For this reason, the lead portion does not deform in the direction of the curved surface of the guide 2' as in the conventional case, and the alignment between the semiconductor element 5', the electrode, and the lead 4' becomes accurate. Abnormal deformation of can be eliminated.

Here, in order to keep the lead part surrounded by the opening of the tape carrier parallel to the stage at the bonding position, the connecting part of the tape carrier must be provided at right angles to the longitudinal direction of the tape carrier. Furthermore, the smaller the width of the connecting portion, the greater the effect, and it is necessary to make it at least smaller than the device hole of the tape carrier.

Although the above-mentioned effects were obtained in these Examples, it is clear that the present invention is not limited to these Examples, and that support portions having different shapes are also effective. Various modifications are possible, some examples of which are shown in FIGS. 5a and 5b. FIG. 5a shows one with a pair of supporting parts (connecting parts) (on the left), one with two pairs (two in the middle), and one with a relatively wide width (on the right). Figure 5b
In the following, examples of linear and curved modifications of the support portion are shown.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view showing the assembly of a conventional tape carrier. FIG. 2 is a schematic cross-sectional view of an assembled tape carrier according to the present invention. FIG. 3, FIG. 4, and FIG. 5 a and b are plan views each showing an embodiment of the present invention. In the figure, 1, 1'... bonding tool, 2, 2'... tape guide, 3, 3'... tape carrier, 4, 4'... lead, 5, 5'... semiconductor element, 6, 6 '...Substrate, 7,7'...Stage, 8,8'...Tape carrier, 9,9',9''
...Lead, 10,10',10''...Opening, 1
1...Supporting part for connecting the tape carrier frame, 12,1
2'...Connection part, 13, 13'...Device hole.

Claims (1)

[Claims] 1 A plurality of unit carriers having a device hole in the center and arranged in parallel in one direction, one end protruding into the device hole and the other end integrated into each unit carrier without protruding outside the unit carrier. a plurality of leads connected to each other, a band-like film extending on both sides of the plurality of unit carriers arranged in parallel, a plurality of openings separating adjacent unit carriers from each other, and each unit carrier a connecting portion having a width narrower than the device hole provided for connecting the strip film, the strip film is connected to each unit carrier only by the connecting portion, and each unit carrier is connected to the opening. A lead tape characterized in that it faces an adjacent unit carrier only through a hole.