JPS5923441B2 - flexible resistor - Google Patents
flexible resistorInfo
- Publication number
- JPS5923441B2 JPS5923441B2 JP53043976A JP4397678A JPS5923441B2 JP S5923441 B2 JPS5923441 B2 JP S5923441B2 JP 53043976 A JP53043976 A JP 53043976A JP 4397678 A JP4397678 A JP 4397678A JP S5923441 B2 JPS5923441 B2 JP S5923441B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- resin
- polybutadiene
- phenol
- binder resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 239000005062 Polybutadiene Substances 0.000 claims description 17
- 229920002857 polybutadiene Polymers 0.000 claims description 17
- 239000011230 binding agent Substances 0.000 claims description 13
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 230000003254 anti-foaming effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 235000005338 Allium tuberosum Nutrition 0.000 description 1
- 244000003377 Allium tuberosum Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000011191 terminal modification Methods 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
Description
【発明の詳細な説明】
本発明は、導電性粉末とバインダ樹脂を主体とする抵抗
器に関するものであり、従来にない、可撓性に優れた抵
抗体を提供しようとするものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resistor mainly composed of conductive powder and binder resin, and aims to provide a resistor with excellent flexibility, which has never existed before.
従来より、導電性粉末、主として炭素粉末とバインダ樹
脂を主体とする、いわゆるレジン系の抵抗体は、体型あ
るいは皮膜型として多く使用されてきた。Conventionally, so-called resin-based resistors, which are mainly composed of conductive powder, mainly carbon powder and binder resin, have been widely used in the form of body or film type.
これらの中で、皮膜型の抵抗体は、セラミックス、金属
、あるいは樹脂積層板といった固い基板上に積層されて
使用されてきたため、抵抗体自体の可撓性に対する要求
は皆無であった。Among these, film-type resistors have been used by being laminated on a hard substrate such as a ceramic, metal, or resin laminate, so there has been no requirement for flexibility of the resistor itself.
しかしながら、近年、可撓性印刷配線板等可撓性を有す
る基材の需要が高まり、これにともなって可撓性抵抗体
の必要性が高まってきた。However, in recent years, demand for flexible base materials such as flexible printed wiring boards has increased, and along with this, the need for flexible resistors has increased.
しかし、従来の抵抗体用バインダ樹脂は、すべて、三次
元網目構造を有する固いものであるため、可撓性抵抗体
用バインダとして使用することはできなかった○抵抗体
用バインダ樹脂は、ただ可撓性があるだけでは不十分で
あり、種々の電気特性、熱的特性、耐湿特性等、通常の
樹脂材料とは異なった特性を必要とするものである。However, all conventional binder resins for resistors are hard and have a three-dimensional network structure, so they cannot be used as binders for flexible resistors. Flexibility alone is not enough; it requires properties different from those of ordinary resin materials, such as various electrical properties, thermal properties, and moisture resistance properties.
発明者らは、可撓性を有しつつ抵抗体用バインダ樹脂と
して適した材料を見出すべく研究の結果、従来、抵抗体
用バインダ樹脂として広く使用されてきたフェノール変
性キシレン樹脂に、液状ポリブタジェンを添加すること
により、従来にない可撓性に優れた抵抗体の得られるこ
とを見出した。As a result of our research to find a material that is flexible and suitable as a binder resin for resistors, we added liquid polybutadiene to phenol-modified xylene resin, which has been widely used as a binder resin for resistors. It has been found that by adding this, a resistor with unprecedented flexibility can be obtained.
本発明の組成にかかる抵抗体を使用した場合の第一の効
果は、抵抗体の可撓性が著るしく改良されることである
。The first effect of using a resistor according to the composition of the present invention is that the flexibility of the resistor is significantly improved.
すなわち、実施例にも述べるごとく、可撓性基体上に積
層した抵抗体は１８０°の折り曲げにも耐えることがで
きる。That is, as described in the examples, the resistor layered on the flexible substrate can withstand bending by 180 degrees.
本発明のもう一つの効果は、抵抗体の耐熱性が向上する
ことである。Another effect of the present invention is that the heat resistance of the resistor is improved.
ただし、ここに述べる耐熱性とは、抵抗体を高温環境中
に放置した場合に、抵抗値の変化が少ないことを意味す
る○すなわち、図面にて実線で示すごとく、本発明の組
成になる抵抗体は、ポリブタジェンを添加しない組成の
抵抗体（破線）に比べて、８５℃の耐熱試験において抵
抗値変化が少なく、しかも安定したものとなっている。However, the heat resistance mentioned here means that there is little change in resistance value when the resistor is left in a high-temperature environment. The resistance value of the resistor showed less change in the heat resistance test at 85° C. and was more stable than that of the resistor having a composition without adding polybutadiene (broken line).
本発明の組成にかかる抵抗体を使用した場合のさらに一
つの効果は、本発明にかかる組成の抵抗インキを印刷抵
抗体として使用する場合に発揮される。Another effect of using the resistor having the composition of the present invention is exhibited when the resistive ink having the composition of the present invention is used as a printed resistor.
すなわち、抵抗インキ中に液状ポリブタジェンを添加す
ることにより、抵抗インキの消泡性が著しく改善される
のである。That is, by adding liquid polybutadiene to the resistance ink, the antifoaming properties of the resistance ink are significantly improved.
抵抗インキの消泡効果は、液状ポリブタジェン添加量が
５重量係位から現われ、１０重重量以上の添加において
は印刷後の発泡は皆無に近くなる。The antifoaming effect of the resistance ink appears when the amount of liquid polybutadiene added is 5 weight or more, and when the amount of liquid polybutadiene added is 10 weight or more, foaming after printing becomes almost nonexistent.
本発明に述べるフェノール変性キシレン樹脂とは、メタ
キシレンとフェノールとをホルムアルデヒドと縮合し、
あるいはキシレン樹脂とフェノールとを反応させて得ら
れる樹脂であって、たとえばナショナルキシレン（松下
電工■商品名）、ニカノール（日本瓦斯化学工業■商品
名）などの商品名で市販されている樹脂をあげることが
できる。The phenol-modified xylene resin described in the present invention is obtained by condensing meta-xylene and phenol with formaldehyde,
Alternatively, examples include resins obtained by reacting xylene resin and phenol, which are commercially available under the trade names of National Xylene (product name of Matsushita Electric Works) and Nicanol (product name of Nippon Gas Chemical Industry Co., Ltd.). be able to.
液状ポリブタジェンとは、室温で液状のブクジエン重合
体あるいは他モノマとの共重合体であって、通常５００
〜４０００の分子量を有している。Liquid polybutadiene is a butadiene polymer or a copolymer with other monomers that is liquid at room temperature, and usually contains 500%
It has a molecular weight of ~4000.
液状ポリブタジェンの例としてニラ７−ＰＢ（ＥＥ本曹
達■商品名）、Ｐｏ１ｙｂｄ（出光石油■商品名）、Ｈ
ｙｃａｒ（宇部興産■商品名）などの商品名で市販され
ている樹脂をあげることができる。Examples of liquid polybutadiene include Nira 7-PB (EE Honsoda ■trade name), Polybd (Idemitsu Sekiyu ■trade name), H
Examples include resins commercially available under trade names such as ycar (trade name manufactured by Ube Industries, Ltd.).
液状ポリブタジェンの添加割合は、バインダ樹脂全量に
対し５〜３０重量係重量ましい。The addition ratio of liquid polybutadiene is preferably 5 to 30% by weight based on the total amount of binder resin.
５重量％より少ない添加では十分な可撓性を得ることは
できない。If the amount is less than 5% by weight, sufficient flexibility cannot be obtained.
また、３００重量％り多く添加した場合には、バインダ
中で相分離が起こり、抵抗体の表面状態が悪くなり、表
面硬度も低下する。Furthermore, if more than 300% by weight is added, phase separation occurs in the binder, resulting in poor surface condition of the resistor and decrease in surface hardness.
ポリブタジェン、特に、末端を変性していないポリブタ
ジェンは、一般に樹脂との相溶性がよくないものである
が、フェノール変性キシレン樹脂と少なくとも巨視的に
は相溶するのは、フェノールとブタジェンとが反応する
ためと考えられる。Polybutadiene, especially polybutadiene without terminal modification, generally has poor compatibility with resins, but it is macroscopically compatible with phenol-modified xylene resins due to the reaction between phenol and butadiene. It is thought that this is because of this.
この反応により、バインダ樹脂の硬化反応が加速され、
上に述べた耐熱性の向上も得られるものと考えられる。This reaction accelerates the curing reaction of the binder resin,
It is thought that the above-mentioned improvement in heat resistance can also be obtained.
以下、実施例により説明する。Examples will be explained below.
実施例 １
フェノール変性キシレン樹脂溶液（商品名ナショナルキ
シレンＪ−１０００） ２０．Ｏ，！ｉ’、ポリブタジ
ェン（商品名ニラソーＰＢ−Ｂ−１０００）３．３．！
ｉｌ（樹脂中の割合１９．０重量％）、炭素微粉末６．
５ｇ、ベンジルアルコール７．５ｇおよびシクロヘキサ
ノール７．５ｇを混合し、三本ロールで十分に混練して
均一な抵抗インキを製造した。Example 1 Phenol-modified xylene resin solution (trade name National Xylene J-1000) 20. O,! i', polybutadiene (trade name Nirasor PB-B-1000) 3.3. !
il (proportion in resin: 19.0% by weight), carbon fine powder6.
5 g of benzyl alcohol, 7.5 g of benzyl alcohol, and 7.5 g of cyclohexanol were mixed and thoroughly kneaded using a three-roll roll to prepare a uniform resistance ink.
このインキを２５μのポリイミドフィルム（商品名カプ
トン）に印刷し、１８０℃で１時間硬化して皮膜型抵抗
器を作製した。This ink was printed on a 25 μm polyimide film (trade name: Kapton) and cured at 180° C. for 1 hour to produce a film resistor.
ここに得られた抵抗器は十分な可撓性を有しており、抵
抗体を外側にして１８００の折り曲げをしても抵抗体に
ひび割れなどの異常はみられなかった。The resistor obtained here had sufficient flexibility, and no abnormalities such as cracks were observed in the resistor even when it was bent 1800 degrees with the resistor facing outside.
比較のため、バインダ樹脂としてフェノール変性キシレ
ン樹脂のみを使用して作った抵抗体は、抵抗体を外側に
して１韻径の丸棒に巻いて１８０゜曲げたのみでひび割
れを生じた。For comparison, a resistor made using only phenol-modified xylene resin as the binder resin cracked only when it was wound around a round bar with the resistor facing outside and bent 180 degrees.
また、上記の実施例および比較例につき８５℃の耐熱試
験を行なったところ、図面に示すごとく、本実施例（実
線）は比較例（破線）に比して抵抗値の変化が少なく、
かつ安定した傾向を示した。In addition, when we conducted a heat resistance test at 85°C for the above examples and comparative examples, as shown in the drawing, this example (solid line) showed less change in resistance value than the comparative example (broken line).
and showed a stable trend.
実施例 ２
実施例１において、ポリブタジェンの代りに末端カルボ
キシル化ブタジェン−アクリロニトリル共重合体（宇部
興産■商品名ＨｙｃａｒＣＴＢＮ）を使用して作った抵
抗体は可撓性と、基材への密着性に優れ、繰り返しの折
り曲げによっても基材からはがれることはなかった。Example 2 In Example 1, a resistor made using a terminally carboxylated butadiene-acrylonitrile copolymer (Ube Industries, Ltd., trade name: HycarCTBN) instead of polybutadiene had good flexibility and adhesion to the base material. It was excellent and did not peel off from the base material even after repeated bending.
抵抗体の耐熱性は実施例１と同等であった。The heat resistance of the resistor was equivalent to that of Example 1.
実施例 ３
実施例１において、ポリブタジェンの樹脂中に占める割
合を５重量％とした場合、抵抗体を外側にして１朋径の
丸棒に巻いて１８０°曲げた場合でも抵抗体に異常は認
められなかった。Example 3 In Example 1, when the proportion of polybutadiene in the resin was 5% by weight, no abnormality was observed in the resistor even when the resistor was wound around a 1 mm diameter round bar and bent 180° with the resistor on the outside. I couldn't.
実施例 ４
実施例１において、ポリブタジェンの樹脂中に占める割
合を３００重量％した場合、抵抗体の可撓性は十分ある
が表面硬度が実施例１（鉛筆硬度３Ｈ〜４Ｈ）に比して
低下し、Ｈ〜２Ｈの鉛筆硬度となった。Example 4 In Example 1, when the proportion of polybutadiene in the resin was increased to 300% by weight, the resistance element had sufficient flexibility, but the surface hardness was lower than in Example 1 (pencil hardness 3H to 4H). However, the pencil hardness was H to 2H.
以上実施例に見るごとく、抵抗体用バインダ樹脂として
、フェノール変性キシレン樹脂に液体ポリブタジェンを
添加することにより、抵抗体の可撓性が改善され、あわ
せて耐熱性も向上することができる。As seen in the examples above, by adding liquid polybutadiene to the phenol-modified xylene resin as the binder resin for the resistor, the flexibility of the resistor can be improved and the heat resistance can also be improved.
図面は本発明にかかる抵抗体、および比較例の、耐熱試
験における抵抗値変化を示す曲線図である。The drawing is a curve diagram showing resistance value changes in a heat resistance test of a resistor according to the present invention and a comparative example.
Claims (1)
って、前記バインダ樹脂が５〜３０重量係重量状ポリブ
タジェンを含有する、フェノール変性キシレン樹脂と液
状ポリブタジェンとの混合物であることを特徴とする可
撓性抵抗体。1. A resistor mainly composed of conductive powder and binder resin, characterized in that the binder resin is a mixture of phenol-modified xylene resin and liquid polybutadiene containing 5 to 30 weight percent polybutadiene. Flexible resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53043976A JPS5923441B2 (en) | 1978-04-13 | 1978-04-13 | flexible resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53043976A JPS5923441B2 (en) | 1978-04-13 | 1978-04-13 | flexible resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54136694A JPS54136694A (en) | 1979-10-23 |
| JPS5923441B2 true JPS5923441B2 (en) | 1984-06-02 |
Family
ID=12678738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53043976A Expired JPS5923441B2 (en) | 1978-04-13 | 1978-04-13 | flexible resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5923441B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0654725B2 (en) * | 1985-09-19 | 1994-07-20 | 松下電器産業株式会社 | Flexible resistor |
| US6083426A (en) * | 1998-06-12 | 2000-07-04 | Matsushita Electric Industrial Co., Ltd. | Conductive paste |
-
1978
- 1978-04-13 JP JP53043976A patent/JPS5923441B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54136694A (en) | 1979-10-23 |
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