JPH0654725B2 - Flexible resistor - Google Patents
Flexible resistorInfo
- Publication number
- JPH0654725B2 JPH0654725B2 JP60206871A JP20687185A JPH0654725B2 JP H0654725 B2 JPH0654725 B2 JP H0654725B2 JP 60206871 A JP60206871 A JP 60206871A JP 20687185 A JP20687185 A JP 20687185A JP H0654725 B2 JPH0654725 B2 JP H0654725B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resistor
- phenol
- bisphenol
- binder resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 38
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 13
- 239000005062 Polybutadiene Substances 0.000 claims description 13
- 229920002857 polybutadiene Polymers 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 12
- 229930185605 Bisphenol Natural products 0.000 claims description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 9
- 229920003987 resole Polymers 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 5
- 239000003973 paint Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000007792 addition Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 230000001846 repelling effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は各種電子機器に使用される導電性粉末とバイン
ダ樹脂を主体とした可撓性抵抗体に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible resistor mainly composed of a conductive powder and a binder resin used in various electronic devices.
従来の技術 従来より、導電性粉末、主として炭素粉末とバインダ樹
脂を主体とする、いわゆるカーボンレンジ系の抵抗体
は、体型あるいは皮膜型として広く使用されてきた。こ
れらの中で、皮膜型の抵抗体は、セラシックス、金属ホ
ーロー板、あるいは紙フェノール積層板のような樹脂積
層板といった固い基板上に塗布して使用されてきたた
め、抵抗体自体の可撓性に対する要求は皆無であった。
しかしながら、近年可撓性印刷配線板等可撓性を有する
基材の需要が高まりこれにともなって可撓性抵抗体の必
要性も高まってきた。2. Description of the Related Art Conventionally, a so-called carbon range type resistor, which is mainly composed of conductive powder, mainly carbon powder and binder resin, has been widely used as a body type or a film type. Among these, the film-type resistor has been used by coating it on a hard substrate such as Ceraix, a metal enamel plate, or a resin laminated plate such as a paper phenol laminated plate, and thus the flexibility of the resistor itself. There was no request for.
However, in recent years, the demand for flexible base materials such as flexible printed wiring boards has increased, and the need for flexible resistors has increased accordingly.
可撓性抵抗体としては従来特開昭５４−136694号公報に
開示されるように、従来抵抗体用バインダ樹脂として広
く使用されてきたフェノール変性キシレン樹脂に液状ポ
リブタジエンを添加したものが知られている。As a flexible resistor, as disclosed in Japanese Patent Laid-Open No. 54-136694, a phenol-modified xylene resin which has been widely used as a binder resin for resistors has been added with liquid polybutadiene. There is.
発明が解決しようとする問題点 しかしながら、一般に抵抗体は要求される抵抗変化特性
を満たすため数回の重ね印刷が必要であるが、フェノー
ル変成キシレン樹脂と液状ポリブタジエンの相溶性が悪
いため、可撓性は付与されるものの塗膜の高温焼付の際
に液状ポリブタジエンが塗膜表層にブリードしてしま
い、数回の重ね印刷を行なう場合、塗料がはじかれた
り、焼付後、簡単に剥れてしまう欠点を有していた。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in general, a resistor needs to be overprinted several times in order to satisfy the required resistance change characteristics, but the compatibility between the phenol-modified xylene resin and the liquid polybutadiene is poor, so that it is flexible The liquid polybutadiene bleeds to the surface layer of the coating film when the coating film is baked at a high temperature, but the paint is repelled when it is printed several times, or it easily peels off after baking. It had drawbacks.
本発明はこのような欠点を解消するもので、数回の重ね
印刷により形成する場合に、塗料のはじきや剥離のない
抵抗体を得ることを目的とするものである。The present invention solves such a drawback, and an object of the present invention is to obtain a resistor which does not repel paint or peel off when it is formed by several times of overprinting.
問題点を解決するための手段 抵抗体用バインダ樹脂は、耐摺動摩耗特性，耐熱特性，
耐湿特性等通常の樹脂材料とは異なる特性が要求され
る。Means for Solving Problems The binder resin for resistors has sliding wear resistance, heat resistance,
Properties different from ordinary resin materials such as moisture resistance are required.
発明者らは、重ね塗りによるはじきや剥れがなく可撓性
を有し、前記抵抗体用バインダ樹脂としての各種特性を
満足し得る材料を見出すべく研究の結果、ビスフェノー
ル系レゾール樹脂とフェノール変性キシレン樹脂の混合
物に液状ポリブタジエンを添加することにより、可撓性
を有しつつ重ね塗りによるはじきや剥れのない抵抗体の
得られることを見出した。The inventors of the present invention have conducted research to find out a material which has flexibility and has no repellency or peeling due to overcoating, and which can satisfy various properties as the binder resin for the resistor. It has been found that by adding liquid polybutadiene to a mixture of xylene resins, it is possible to obtain a resistor which is flexible and does not repel or peel off due to repeated coating.
作 用 本発明の組成にかかる抵抗体を使用した場合の第一の効
果は、数回の重ね塗りの際にはじきや剥れが発生しない
ことである。すなわち、実施例にも述べるように、重ね
塗りの際のクロスカットテーピング試験でも全く剥れが
生じない。Operation The first effect of using the resistor according to the composition of the present invention is that repellency or peeling does not occur during repeated coating several times. That is, as described in Examples, no peeling occurs at all even in the cross-cut taping test during overcoating.
また、可撓性をもそこなうことなく、可撓性基体上に積
層した抵抗体は１８0゜の折り曲げにも耐えることがで
きる。さらに８５℃の高温雰囲気中や、６０℃９０〜９
５％ＲＨの高湿度雰囲気中に長時間放置した場合の抵抗
値の変化巾も向上する。Further, the resistor laminated on the flexible substrate can withstand 180 ° bending without losing flexibility. Furthermore, in a high temperature atmosphere of 85 ° C. or 60 ° C. 90 to 9
The width of change in resistance value when left for a long time in a high humidity atmosphere of 5% RH is also improved.
本発明に述べるフェノール変性キシレンとは、メタキシ
レンとフェノールとをホルムアルデヒドと縮合し、ある
いはキシレン樹脂とフェノールを反応させて得られる樹
脂である。The phenol-modified xylene described in the present invention is a resin obtained by condensing meta-xylene and phenol with formaldehyde, or by reacting a xylene resin and phenol.
ビスフェノール系レゾール樹脂とは、その一例を工業化
学雑誌、６１巻、４３９頁（１９５８年）にも記載され
ているようにビスフェノール類とホルムアルデヒドとを
縮合させて得られるレゾール型樹脂である。The bisphenol-based resol resin is a resol-type resin obtained by condensing bisphenols and formaldehyde as described in, for example, Industrial Chemistry, Vol. 61, p. 439 (1958).
液状ポリブタジエンとは、室温にて液状のブタジエン重
合体あるいは他モノマとの共重合体であって、通常３０
０〜６０００の分子量を有する樹脂である。Liquid polybutadiene is a butadiene polymer which is liquid at room temperature or a copolymer with other monomers, and is usually 30
It is a resin having a molecular weight of 0 to 6000.
液状ポリブタジエンの添加割合は、バインダ樹脂全量に
対して５〜５０重量％が望ましい。５重量％より少ない
添加では充分な可撓性を得ることはできない。また５０
重量％より多く添加した場合は抵抗体の表面硬度が低下
し、耐摺動摩耗性が悪化する。また、ビスフェノール系
レゾール樹脂とフェノール変性キシレン樹脂の重量比率
は９５：５〜１０〜９０が望ましい。ビスフェノール系
レゾールの重量比率が９５部を越えると、１８0゜折り
曲げにより塗膜にクラックが発生し易くなり、１０部よ
り少ない場合ははじきや剥れが生ずる。The addition ratio of liquid polybutadiene is preferably 5 to 50% by weight based on the total amount of binder resin. Sufficient flexibility cannot be obtained with additions less than 5% by weight. Again 50
If it is added in excess of wt%, the surface hardness of the resistor will decrease and the sliding wear resistance will deteriorate. The weight ratio of the bisphenol-based resole resin to the phenol-modified xylene resin is preferably 95: 5 to 10-90. If the weight ratio of the bisphenol-based resole exceeds 95 parts, the coating film is likely to be cracked by bending by 180 °, and if it is less than 10 parts, cissing or peeling occurs.
実施例 （実施例１） １・−ビス（Ｐ・オキシフェニル）オクタンとホルムア
ルデヒドより成るレゾール型樹脂２０ｇ、フェノール変
性キシレン樹脂２０ｇ，ポリブタジエン５ｇ，炭素粉末
１７ｇ，ベンジンアルコール１２ｇを混合し、三本ロー
ルで十分に混練して均一な抵抗塗料を製造した。この塗
料５０μのポリイミドフィルムに印刷し１８０℃１時間
硬化して、さらにその塗膜上に同一塗料を重ね印刷して
同一条件の硬化を行ない皮膜抵抗器を作製した。この抵
抗器は、１８0゜の折り曲げに対してもクラックが発生
しなかった。また重ね印刷部分を１mm角のクロスカット
テーピング剥離試験をしても塗膜層が剥離してしまうこ
とはなかった。Example (Example 1) 20 g of a resole-type resin composed of 1-bis (P.oxyphenyl) octane and formaldehyde, 20 g of a phenol-modified xylene resin, 5 g of polybutadiene, 17 g of carbon powder, 12 g of benzine alcohol were mixed to form a triple roll. Was thoroughly kneaded to prepare a uniform resistance paint. This coating material was printed on a polyimide film having a thickness of 50 μm, cured at 180 ° C. for 1 hour, and the same coating material was overprinted on the coating film to perform curing under the same conditions to produce a film resistor. This resistor did not crack even when bent by 180 °. Further, the coating layer was not peeled off even when a 1 mm square cross-cut taping peeling test was performed on the overprinted portion.
比較のため前記ビスフェノール系レゾール型樹脂をフェ
ノール変性キシレン樹脂に置替えて、バインダ樹脂をフ
ェノール変性キシレン樹脂と液状ポリブタジエンのみで
作製した抵抗体は重ね印刷時塗料がはじかれ、はじかれ
ずに残留した部分もクロスカットテーピング剥離試験で
完全に剥離した。For comparison, the bisphenol-based resol type resin was replaced with a phenol-modified xylene resin, and the binder resin was made only of phenol-modified xylene resin and liquid polybutadiene.The resistor was repelled during overprinting and remained without being repelled. Was also completely peeled in the cross-cut taping peel test.
また、前記実施例および比較例の一層印刷のみの抵抗体
について８５℃の耐熱試験および６０℃９０〜９５％Ｒ
Ｈの耐湿試験を実施したところ、図に示すように、実施
例（実線）は比較例（点線）に比較して抵抗値の変化巾
が少なかった。Further, the heat resistance test at 85 ° C. and the resistance of only 90 ° to 95% R at 60 ° C. for the resistors of the above-mentioned examples and comparative examples, which are printed only in one layer
When a humidity resistance test of H was carried out, as shown in the figure, the variation range of the resistance value was smaller in the example (solid line) than in the comparative example (dotted line).
（実施例２） 実施例１においてポリブタジエンの代りにカルボキシタ
ーミネーテッドブタジエン−アクリルニトル共重合体
（商品名：CTBN）を使用して作製した抵抗体は、重ね印
刷に対してもはじきや剥がれはなく、１８0゜折り曲げ
に対してもクラックを発生することがなかった。(Example 2) A resistor produced by using a carboxy-terminated butadiene-acrylonitrile copolymer (trade name: CTBN) in place of polybutadiene in Example 1 does not cause repellency or peeling even after overprinting. No crack was generated even when bent by 180 °.
（実施例３） 実施例１および実施例２による抵抗体の表面硬度を測定
したところ４〜５Ｈの鉛筆硬度であった。また、可変抵
抗器を作製して塗膜の耐摺動摩耗試験を行なったとこ
ろ、いずれも３７５００回摺動しても塗膜が削れて断線
することはなかった。(Example 3) When the surface hardness of the resistor according to Example 1 and Example 2 was measured, it was a pencil hardness of 4 to 5H. Further, when a variable resistor was prepared and a coating film was subjected to a sliding wear resistance test, the coating film was not scraped and broken even after sliding 37500 times.
発明の効果 以上のように本発明によれば、抵抗体用バインダ樹脂と
して、ビスフェノール系レゾール樹脂とフェノール変性
キシレン樹脂の混合樹脂に液状ポリブタジエンを添加す
ることにより、数回の重ね印刷による塗料のはじきや剥
離がなく、合せて抵抗体の耐熱．耐湿特性を改善し得る
可撓性抵抗体を得ることができる。As described above, according to the present invention, as a binder resin for resistors, by adding liquid polybutadiene to a mixed resin of a bisphenol-based resole resin and a phenol-modified xylene resin, repelling of a paint by several overprinting There is no peeling or peeling, and the resistance of the resistor is heat resistant. It is possible to obtain a flexible resistor that can improve moisture resistance characteristics.
また本発明においては、液状ポリブタジエンの添加割合
を、バインダ樹脂全量に対して５〜５０重量％としてお
り、５重量％より少ない添加では充分な可撓性を得るこ
とはできず、また５０重量％より多く添加した場合は抵
抗体の表面硬度が低下し、耐摺動磨耗性が悪化する。さ
らに、ビスフェノール系レゾール樹脂とフェノール変性
キシレン樹脂の重量比率を９５：５〜１０：９０として
おり、ビスフェノール系レゾールの重量比率が９５部を
越えると、１８０゜折り曲げにより塗膜にクラックが発
生し易くなり、１０部より少ない場合ははじきや剥れが
生じる。Further, in the present invention, the addition ratio of the liquid polybutadiene is set to 5 to 50% by weight based on the total amount of the binder resin, and if it is less than 5% by weight, sufficient flexibility cannot be obtained. When added in a larger amount, the surface hardness of the resistor is lowered and the sliding wear resistance is deteriorated. Furthermore, the weight ratio of the bisphenol-based resole resin and the phenol-modified xylene resin is 95: 5 to 10:90. If the weight ratio of the bisphenol-based resole exceeds 95 parts, the coating film is likely to crack due to bending by 180 °. When less than 10 parts, repelling and peeling occur.
図は本発明にかかる抵抗体および比較例の耐熱試験およ
び耐湿試験における抵抗値変化を示す曲線図である。The figure is a curve diagram showing the resistance value change in the heat resistance test and the humidity resistance test of the resistor according to the present invention and the comparative example.
Claims (1)
つ前記バインダ樹脂はビスフェノール系レゾール樹脂
と、フェノール変性キシレン樹脂と、液状ポリブタジエ
ンとの混合物からなり、前記ビスフェノール系レゾール
樹脂と前記フェノール変性キシレン樹脂はその相対の重
量比率を９５：５〜１０：９０とし、かつ前記液状ポリ
ブタジエン重量比率を前記バインダ樹脂の５〜５０重量
％とした可撓性抵抗体。1. A conductive powder and a binder resin as a main component, said binder resin comprising a mixture of bisphenol-based resole resin, phenol-modified xylene resin and liquid polybutadiene, said bisphenol-based resole resin and said phenol-modified xylene. A flexible resistor in which the resin has a relative weight ratio of 95: 5 to 10:90 and the liquid polybutadiene weight ratio is 5 to 50% by weight of the binder resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60206871A JPH0654725B2 (en) | 1985-09-19 | 1985-09-19 | Flexible resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60206871A JPH0654725B2 (en) | 1985-09-19 | 1985-09-19 | Flexible resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6266601A JPS6266601A (en) | 1987-03-26 |
| JPH0654725B2 true JPH0654725B2 (en) | 1994-07-20 |
Family
ID=16530417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60206871A Expired - Fee Related JPH0654725B2 (en) | 1985-09-19 | 1985-09-19 | Flexible resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0654725B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52154097A (en) * | 1976-06-16 | 1977-12-21 | Matsushita Electric Ind Co Ltd | Paint for resistor |
| JPS5923441B2 (en) * | 1978-04-13 | 1984-06-02 | 松下電器産業株式会社 | flexible resistor |
-
1985
- 1985-09-19 JP JP60206871A patent/JPH0654725B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6266601A (en) | 1987-03-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |