JPS592443B2 - resin composition - Google Patents
resin compositionInfo
- Publication number
- JPS592443B2 JPS592443B2 JP17354579A JP17354579A JPS592443B2 JP S592443 B2 JPS592443 B2 JP S592443B2 JP 17354579 A JP17354579 A JP 17354579A JP 17354579 A JP17354579 A JP 17354579A JP S592443 B2 JPS592443 B2 JP S592443B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- resin composition
- acid
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011342 resin composition Substances 0.000 title claims description 17
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 15
- 239000000194 fatty acid Substances 0.000 claims description 15
- 229930195729 fatty acid Natural products 0.000 claims description 15
- 150000004665 fatty acids Chemical class 0.000 claims description 15
- 229920000180 alkyd Polymers 0.000 claims description 11
- 150000005846 sugar alcohols Polymers 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- 229920006395 saturated elastomer Polymers 0.000 claims description 3
- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 description 17
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 13
- 238000001723 curing Methods 0.000 description 13
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 11
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 10
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 8
- 239000011256 inorganic filler Substances 0.000 description 8
- 229910003475 inorganic filler Inorganic materials 0.000 description 8
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 8
- 239000011976 maleic acid Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 7
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000003549 soybean oil Substances 0.000 description 6
- 235000012424 soybean oil Nutrition 0.000 description 6
- 229920006337 unsaturated polyester resin Polymers 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 5
- NBICYCZLCAMSBG-UHFFFAOYSA-L [Co+2].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O Chemical compound [Co+2].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O NBICYCZLCAMSBG-UHFFFAOYSA-L 0.000 description 5
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000006482 condensation reaction Methods 0.000 description 5
- 230000018044 dehydration Effects 0.000 description 5
- 238000006297 dehydration reaction Methods 0.000 description 5
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 5
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000013016 damping Methods 0.000 description 4
- 239000000944 linseed oil Substances 0.000 description 4
- 235000021388 linseed oil Nutrition 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 2
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002383 tung oil Substances 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 241000283973 Oryctolagus cuniculus Species 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- -1 and agarite Substances 0.000 description 1
- OGBUMNBNEWYMNJ-UHFFFAOYSA-N batilol Chemical class CCCCCCCCCCCCCCCCCCOCC(O)CO OGBUMNBNEWYMNJ-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- LRCFXGAMWKDGLA-UHFFFAOYSA-N dioxosilane;hydrate Chemical compound O.O=[Si]=O LRCFXGAMWKDGLA-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005609 naphthenate group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Organic Insulating Materials (AREA)
- Polyesters Or Polycarbonates (AREA)
Description
【発明の詳細な説明】
本発明は通電時に振動及び熱を発生する放電灯安定器、
小形電源トランスなどの電気機器に充てん使用する樹脂
組成物に関するものであり、密着性及び防振効果のすぐ
れた樹脂組成物を提供するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a discharge lamp ballast that generates vibration and heat when energized;
This invention relates to a resin composition used to fill electrical equipment such as small power transformers, and provides a resin composition with excellent adhesion and vibration-proofing effects.
一般にトランス、チョーク等を内蔵する放電灯用安定器
、小形電源トランスなどの電気機器においては内部のコ
イル、抵抗などの固定、防湿、かつ通電時に発生する熱
の放散、磁歪や磁気力による鉄心の振動及び電磁力によ
るコイルの振動に起因して発生する振動を防止するため
に、電気機器のケース内部に樹脂または樹脂と無機質充
てん剤を含むコンパウンドを充てんしている。In general, electrical equipment such as discharge lamp ballasts and small power transformers that have built-in transformers, chokes, etc. are used to fix internal coils, resistors, etc., to prevent moisture, and to dissipate heat generated when energizing, and to prevent iron cores due to magnetostriction and magnetic force. In order to prevent vibrations caused by vibrations of coils caused by vibration and electromagnetic force, the inside of the case of electrical equipment is filled with resin or a compound containing resin and an inorganic filler.
この種のコンパウンドには、(1)ケースとの密着性が
良好で、クラックの発生のないこと、(2)電気絶縁性
が良好なこと、
(3)熱放散性が良好なこと、
(4)弾性に富み、電気振動による騒音を吸収できるこ
と、(5)コンパウンドの充てん作業性が良好なこと、
とくに熱放散性のすぐれた無機質充てん剤を多量に配合
でき、しかも適度な流動性を有し、かつ、常温で硬化し
ても適度な硬化速度を有すること、(6)各種絶縁材料
との相性が良好なことなどの諸特性が要求される。This type of compound has (1) good adhesion to the case and no cracking, (2) good electrical insulation, (3) good heat dissipation, (4) ) It is highly elastic and can absorb noise caused by electric vibration, (5) It has good compound filling workability,
In particular, it must be able to contain a large amount of an inorganic filler with excellent heat dissipation properties, have appropriate fluidity, and have an appropriate curing speed even when cured at room temperature; (6) Compatibility with various insulating materials. Various properties are required, such as good properties.
従来、この種のコンパウンドとしては価格、特性面でバ
ランスのとれている不飽和ポリエステル樹脂に無機質充
てん剤を配合したコンパウンドが用いられている。Conventionally, as this type of compound, a compound in which an inorganic filler is blended with an unsaturated polyester resin, which is well-balanced in terms of price and properties, has been used.
しかし、通常の不飽和ポリエステル樹脂は、ケースに注
入し、硬化させると硬化時の収縮によるケースとの密着
性が劣り、安定器の騒音が大きく、またクラックが発生
し易く、耐湿性に欠ける欠点があつた。また、とくに安
定器の騒音については、充てん硬化物が硬いため磁気力
による鉄心の振動を吸収できないので、騒音防止できな
い。However, when ordinary unsaturated polyester resin is injected into the case and cured, it shrinks during curing, resulting in poor adhesion to the case, making the ballast noise louder, cracking easily, and lacking moisture resistance. It was hot. In addition, noise from the ballast cannot be prevented because the hardened filling material is hard and cannot absorb the vibrations of the core caused by the magnetic force.
このような現状に鑑み、本発明者らは前述のような樹脂
の欠点を是正すべく鋭意検討した結果、従来の不飽和ポ
リエステル樹脂の特長をそこなうことなく、ケースとの
密着性がすぐれ、柔軟で弾性に富んだすぐれた防振効果
をもち、かつ常温硬化しても十分その特性を発揮できる
樹脂組成物を完成するにいたつた。In view of this current situation, the inventors of the present invention have made extensive studies to correct the drawbacks of resins mentioned above. As a result, they have developed a resin that has excellent adhesion to the case and is flexible, without sacrificing the features of conventional unsaturated polyester resin. We have completed a resin composition that is highly elastic and has an excellent vibration-damping effect, and that can sufficiently exhibit its characteristics even when cured at room temperature.
すなわち、本発明はシンクロペンタンエニルモノマレエ
ート10〜20当量%、飽和二塩基酸20〜30当量%
、少なくとも一個の二重結合を有する脂肪酸10〜20
当量%および多価アルコール50〜60当量%を反応さ
せて得られる不飽和アルキド40〜80重量%(.A)
と重合性ビニル系単量体20〜60重量%(B)を含有
してなる樹脂組成物に関するものである。That is, the present invention uses 10 to 20 equivalent % of synchropentanenyl monomaleate and 20 to 30 equivalent % of saturated dibasic acid.
, 10-20 fatty acids having at least one double bond
40-80% by weight of unsaturated alkyd obtained by reacting % by weight and 50-60% by weight of polyhydric alcohol (.A)
The present invention relates to a resin composition containing 20 to 60% by weight (B) of a polymerizable vinyl monomer.
シンクロペンタンエニルモノマレエートは、シンクロペ
ンタジエン、無水マレイン酸及び水またはシンクロペン
タジエン及びマレイン酸を反応させて得られる。Syncropentanenyl monomaleate can be obtained by reacting syncropentadiene, maleic anhydride, and water or syncropentadiene and maleic acid.
反応温度は150℃以下とされる。反応温度が150℃
を越える場合はシンクロペンタジエンがシクロペンタジ
エンに熱分解され、マレイン酸の二重結合に付加するた
め、ポリエステルの不飽和度が減少し、硬化性、電気特
性に悪影響を及ぼす。シンクロペンタジエン、無水マレ
イン酸及び水はほぼ等モルで反応され、シンクロペンタ
ジエン及びマレイン酸の反応の場合もほぼ等モルで反応
される。The reaction temperature is 150°C or lower. Reaction temperature is 150℃
If it exceeds 100%, synchlopentadiene is thermally decomposed into cyclopentadiene and added to the double bond of maleic acid, resulting in a decrease in the degree of unsaturation of the polyester, which adversely affects the curability and electrical properties. Synchropentadiene, maleic anhydride, and water are reacted in approximately equimolar amounts, and in the case of reaction of synclopentadiene and maleic acid, they are also reacted in approximately equimolar amounts.
マレイン酸の第一カルボン酸の強い解離性によつて無触
媒下でシンクロペンタジエンとマレイン酸の第一カルボ
キシル基との付加反応が起こり、シンクロペンタンエニ
ルモノマレエートが得られる。Due to the strong dissociative nature of the primary carboxylic acid of maleic acid, an addition reaction between synchropentadiene and the primary carboxyl group of maleic acid takes place in the absence of a catalyst, yielding synclopentanenyl monomaleate.
水及び無水マレイン酸を用いる場合には、まずマレイン
酸が生成し上記の反応が起こる。When water and maleic anhydride are used, maleic acid is first produced and the above reaction occurs.
また、マレイン酸は融点以上では一部フマル酸に転移し
、フマル酸は無触媒中ではシンクロペンタジエンとの付
加反応が起こりにくいために、フマル化を防ぐためには
反応温度を140℃以下で行なうことが望ましい。In addition, maleic acid partially transfers to fumaric acid above its melting point, and fumaric acid is difficult to undergo an addition reaction with synchropentadiene in the absence of a catalyst, so to prevent fumarization, the reaction temperature should be 140°C or lower. is desirable.
本発明においてすぐれた密着性を与えるのは、このシン
クロペンタンエニルモノマレエートの使用によるところ
が大である。シンクロペンタンエニルモノマレエートの
量は、不飽和アルキドに対して10〜20当量%であれ
ば実用可能であり、10〜15当量%が好ましい。10
当量%未満では、硬化性及び密着性が悪くなり、20当
量%を越えると得られるコンパウンドが硬すぎ、柔軟性
を失い防振効果が悪くなる。The excellent adhesion in the present invention is largely due to the use of synchropentanenyl monomaleate. The amount of synchropentanenyl monomaleate can be practically used if it is 10 to 20 equivalent % based on the unsaturated alkyd, and preferably 10 to 15 equivalent %. 10
If it is less than 20 equivalent %, the curability and adhesion will be poor, and if it exceeds 20 equivalent %, the resulting compound will be too hard, lose its flexibility, and have a poor vibration damping effect.
本発明における飽和二塩基酸としては無水フタル酸、フ
タル酸、アジピン酸、これらの混合物等が使用でき、そ
の量は硬化性、密着性及び硬さの点から不飽和アルキド
に対して20〜30当量%とされる。20当量%未満で
は得られる硬化物の防振性が十分ではなく、30当量%
を越える場合には、電気絶縁性に劣る。As the saturated dibasic acid in the present invention, phthalic anhydride, phthalic acid, adipic acid, a mixture thereof, etc. can be used, and the amount thereof is 20 to 30% relative to the unsaturated alkyd in terms of curability, adhesion, and hardness. Equivalent %. If it is less than 20 equivalent%, the resulting cured product will not have sufficient vibration damping properties;
If it exceeds , the electrical insulation properties will be poor.
また、少なくとも一個の二重結合を有する脂肪酸として
は大豆油脂肪酸、アマニ油脂肪酸、脱水ヒマシ油脂肪酸
、桐油脂肪酸およびこれらの混合物等が用いられる。Further, as the fatty acid having at least one double bond, soybean oil fatty acid, linseed oil fatty acid, dehydrated castor oil fatty acid, tung oil fatty acid, and mixtures thereof are used.
大豆油、アマニ油、脱水ヒマシ油、桐油等のモノグリセ
リドおよびこれらの混合物を前記脂肪酸と混合して、用
いてもよい。この脂肪酸の量は、硬化物の防振効果、電
気絶縁性、組成物の硬化性の点から、不飽和アルキドに
対して10〜20当量%とされる。本発明における不飽
和アルキドに用いられる多価アルコールとしては、エチ
レングリコール、プロピレングリコール、ジエチレング
リコール、ジプロピレングリコール、ネオペンチルグリ
コール、1,6−ヘキサンジオールなどの多価アルコー
ル、これらの混合物等が用いられる。Monoglycerides such as soybean oil, linseed oil, dehydrated castor oil, tung oil, and mixtures thereof may be used in combination with the fatty acids. The amount of this fatty acid is set to 10 to 20 equivalent % based on the unsaturated alkyd from the viewpoint of the vibration-proofing effect of the cured product, the electrical insulation properties, and the curability of the composition. As the polyhydric alcohol used in the unsaturated alkyd in the present invention, polyhydric alcohols such as ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, neopentyl glycol, 1,6-hexanediol, mixtures thereof, etc. are used. .
多価アルコールを不飽和アルキドに対して50〜60当
量%とするのは不飽和アルキドのにごり、低分子量化を
さけるためである。The reason why the polyhydric alcohol is contained in an amount of 50 to 60 equivalent % based on the unsaturated alkyd is to prevent the unsaturated alkyd from becoming cloudy and having a low molecular weight.
多価アルコールの量は酸成分に対してO〜30当量%の
範囲で過剰に用いられる。The amount of polyhydric alcohol used is in excess of 0 to 30 equivalent % based on the acid component.
好ましくは5〜20当量%である〇なお、不飽和アルキ
ド(.A)は通常の不飽和ポリエステル樹脂を合成する
方法と同様に溶融法、溶剤法(キシレン、トルエンなど
)で酸価、粘度を管理することにより得ることができ、
必要に応じて公知の触媒を用いてもよい。Preferably 5 to 20 equivalent %〇In addition, the unsaturated alkyd (.A) can be prepared by adjusting the acid value and viscosity using a melting method or a solvent method (xylene, toluene, etc.) in the same way as the method for synthesizing ordinary unsaturated polyester resins. can be obtained by managing
A known catalyst may be used if necessary.
このようにして得られた不飽和アルキド40〜80重量
%をスチレン、ビニルトルエンなどの重合性ビニル系単
量体20〜60重量%に溶解して樹脂組成物を得る。A resin composition is obtained by dissolving 40 to 80% by weight of the unsaturated alkyd thus obtained in 20 to 60% by weight of a polymerizable vinyl monomer such as styrene or vinyltoluene.
重合性ビニル系単量体が20重量%未満では不飽和ポリ
エステル樹脂の粘度が高くなり、無機質充てん剤を多量
に配合できなくなるため、放熱性が低下する。If the content of the polymerizable vinyl monomer is less than 20% by weight, the viscosity of the unsaturated polyester resin will increase, making it impossible to incorporate a large amount of inorganic filler, resulting in a decrease in heat dissipation.
重合性ビニル系単量体が60重量%を越えると不飽和ア
ルキドとの共重合性が低下し、耐クラツク性のすぐれた
樹脂組成物を得ることができない。本発明になる樹脂組
成物には必要に応じて通常使用される量で硬化触媒、硬
化促進剤、重合禁止剤、無機質充てん剤などを加えても
よい。If the content of the polymerizable vinyl monomer exceeds 60% by weight, copolymerizability with unsaturated alkyds decreases, making it impossible to obtain a resin composition with excellent crack resistance. If necessary, a curing catalyst, a curing accelerator, a polymerization inhibitor, an inorganic filler, etc. may be added to the resin composition of the present invention in commonly used amounts.
硬化触媒としては、メチルエチルケトンパーオキサイド
、ベンゾイルパーオキサイド、シクロヘキサノンパーオ
キサイド、クメンハイドロパーオキサイド、ジクミルパ
ーオキサイド、ターシヤリーブチルパーオキサイドなど
が適用できる。As the curing catalyst, methyl ethyl ketone peroxide, benzoyl peroxide, cyclohexanone peroxide, cumene hydroperoxide, dicumyl peroxide, tert-butyl peroxide, etc. can be used.
硬化促進剤としては、過酸化物をレドツクス反応などで
分解し、活性ラジカルの発生を容易にする作用のある物
質ならよく、例えば、コバルト、マンガン、鉛などのナ
フテン酸塩などの有機金属塩、ジメチルアニリンなどが
ある。硬化方法としては、上述の硬化触媒と硬化促進剤
を併用して常温または加熱硬化の方法が適用される。The curing accelerator may be any substance that decomposes peroxide by redox reaction and facilitates generation of active radicals, such as organic metal salts such as naphthenates of cobalt, manganese, lead, etc. Examples include dimethylaniline. As a curing method, a method of curing at room temperature or by heating using the above-mentioned curing catalyst and curing accelerator is applied.
重合禁止剤としてはハイドロキノン、p−ベンゾキノン
、ピロガロール、カテコールなどのキノン類などの一般
に使用されているものが用いられる。As the polymerization inhibitor, commonly used ones such as quinones such as hydroquinone, p-benzoquinone, pyrogallol, and catechol are used.
無機質充てん剤としては、珪砂、炭酸カルシウム、シリ
カ、水和アルミナ、川砂、寒水石などがあげられ、,さ
らにタルクなどを沈降防止剤として添加してもよい。Examples of the inorganic filler include silica sand, calcium carbonate, silica, hydrated alumina, river sand, and agarite, and talc and the like may be added as an anti-settling agent.
これらの無機質充てん剤の粒子径は任意に選べ、粒径の
異なるものの組合せや、異種の充てん剤を組合せてもよ
い。これらの充てん剤の含有水分は電気機器のコイルに
使用されているエナメル銅線の絶縁皮膜を劣化させるの
で、できるだけ少ない方がよく、0.15重量%以下に
管理することが好ましい。コンパウンドの硬化温度は常
温〜120℃の範囲で柔軟性に富んだ密着性、防振効果
のすぐれた硬化物が得られる。The particle size of these inorganic fillers can be arbitrarily selected, and fillers with different particle sizes or different types of fillers may be combined. Since the moisture content of these fillers deteriorates the insulation coating of enamelled copper wires used in coils of electrical equipment, it is better to keep it as low as possible, and it is preferably controlled to 0.15% by weight or less. When the curing temperature of the compound is in the range of room temperature to 120°C, a cured product with excellent flexibility, adhesion, and vibration-proofing effect can be obtained.
本発明になる樹脂組成物は主として注型用に適している
。The resin composition of the present invention is mainly suitable for casting.
つぎに本発明を実施例、比較例によつて説明する。Next, the present invention will be explained using Examples and Comparative Examples.
部または%とあるのは重量部または重量%を意味する。Parts or percentages refer to parts or percentages by weight.
実施例 1
シンクロペンタジエン277部、無水マレイン酸206
部、水41部を窒素ガス気流中で140℃で2時間反応
させ、シンクロペンタンエニルモノマレエートを合成し
、これに無水フタル酸207部、大豆油脂肪酸392部
及びプロピレングリコール266部を添加し、窒素ガス
気流中150〜210℃で常法に従い脱水縮合反応を行
ない、得られた樹脂1000部をハイドロキノン0.0
2%を含むスチレンモノマ540部に溶解し、全体の組
成に対して6%オクテン酸コバルト0.7%、ジメチル
アニリン0.03%を添加した。Example 1 277 parts of synchropentadiene, 206 parts of maleic anhydride
1 part and 41 parts of water were reacted at 140°C for 2 hours in a nitrogen gas stream to synthesize synchropentanenyl monomaleate, to which 207 parts of phthalic anhydride, 392 parts of soybean oil fatty acid and 266 parts of propylene glycol were added. A dehydration condensation reaction is carried out according to a conventional method at 150 to 210°C in a nitrogen gas stream, and 1000 parts of the resulting resin is mixed with 0.0 parts of hydroquinone.
It was dissolved in 540 parts of styrene monomer containing 2%, and 0.7% of 6% cobalt octenoate and 0.03% of dimethylaniline were added to the total composition.
得られた組成物を樹脂組成物aとした。実施例 2
シンクロペンタジエン227部とマレイン酸244部を
窒素ガス気流中で140℃で2時間反応させ、シンクロ
ペンタンエニルモノマレエートを合成し、これにジエチ
レングリコール468部、大豆油脂肪酸343部、アマ
ニ油脂肪酸147部、アジピン酸153部、無水フタル
酸155部を加え窒素ガス気流中150〜210℃で常
法に従い脱水縮合反応を行なう。The resulting composition was designated as resin composition a. Example 2 227 parts of synchropentadiene and 244 parts of maleic acid were reacted in a nitrogen gas stream at 140°C for 2 hours to synthesize synchropentanenyl monomaleate, which was then mixed with 468 parts of diethylene glycol, 343 parts of soybean oil fatty acid, and linseed oil. 147 parts of fatty acid, 153 parts of adipic acid, and 155 parts of phthalic anhydride are added, and a dehydration condensation reaction is carried out in a nitrogen gas stream at 150 to 210°C according to a conventional method.
得られた樹脂1500部をハイドロキノン0.02%を
含むスチレンモノマ910部に溶解し、全体の組成に対
し6%オクテン酸コバルト0.7%、ジメチルアニリン
0.03%を添加した。得られた組成物を樹脂組成物b
とした。実施例 3
実施例1と同じ方法で合成したシンクロペンタンエニル
モノマレエート558部、プロピレングリコール188
部、ジエチレングリコール239部、アジピン酸274
部、無水フタル酸56部、大豆油脂肪酸420部、アマ
ニ油脂肪酸105部を窒素気流中150〜210℃で常
法に従い脱水縮合反応を行ない、得られた樹脂1600
部をハイドロキノン0.02(f)を含むスチレンモノ
マJモV0部に溶解し、全体の組成に対し6%オクテン酸
コバルト0.7Cf1)、ジメチルアニリン0.07%
を添加した。1,500 parts of the obtained resin was dissolved in 910 parts of styrene monomer containing 0.02% of hydroquinone, and 0.7% of 6% cobalt octenoate and 0.03% of dimethylaniline were added to the total composition. The resulting composition was used as resin composition b.
And so. Example 3 558 parts of synchropentanenyl monomaleate synthesized in the same manner as in Example 1, 188 parts of propylene glycol
parts, diethylene glycol 239 parts, adipic acid 274 parts
56 parts of phthalic anhydride, 420 parts of soybean oil fatty acid, and 105 parts of linseed oil fatty acid were subjected to a dehydration condensation reaction in a nitrogen stream at 150 to 210°C according to a conventional method to obtain a resin of 1600 parts.
0.02(f) of styrene monomer JMoV0 containing 0.02(f) of hydroquinone, 6% cobalt octenoate (0.7Cf1), 0.07% dimethylaniline based on the total composition.
was added.
得られた組成物を樹脂組成物cとした。比較例 1プロ
ピレングリコール609部、ジロピレングリコール40
2部、無水マレイン酸392部、無水フタル酸888部
を窒素ガス気流中、150〜210℃で脱水縮合反応を
行ない得られた樹脂2000部をハイドロキノン0.0
1%を含むスチレンモノマ2000部に溶解し全体の
組成に対し6%オクテン酸コバルト0.5%を添加した
。The resulting composition was designated as resin composition c. Comparative example 1 609 parts of propylene glycol, 40 parts of dilopylene glycol
2 parts, 392 parts of maleic anhydride, and 888 parts of phthalic anhydride were subjected to a dehydration condensation reaction at 150 to 210°C in a nitrogen gas stream, and 2000 parts of the resulting resin was mixed with 0.0 parts of hydroquinone.
0.5% of 6% cobalt octenoate was added to the total composition by dissolving it in 2000 parts of styrene monomer containing 1%.
得られた組成物を樹脂組成物dとした。比較例 2
ジシクロペンタジエニルモノマレエ一卜660部、プロ
ピレングリコール9 1.3部、トリメチロールプロパ
ン5 8.3部、大豆油脂肪酸18 2.7部を窒素ガ
ス気流中150〜210℃で脱水縮合反応を行ない、得
られた樹脂800Vをハイドロキノン0.0 2%を含
むスチレンモノマ430部に溶・解し、全体の組成に対
し6%オクテン酸コバルトを0.5%添加した。The resulting composition was designated as resin composition d. Comparative Example 2 660 parts of dicyclopentadienyl monomale, 1.3 parts of propylene glycol 9, 8.3 parts of trimethylolpropane 5, and 2.7 parts of soybean oil fatty acid 18 were heated at 150 to 210°C in a nitrogen gas stream. A dehydration condensation reaction was carried out, and the obtained resin 800V was dissolved in 430 parts of styrene monomer containing 0.02% of hydroquinone, and 0.5% of 6% cobalt octenoate was added to the total composition.
得られた組成物を樹脂組成物eとした。以上の実施例1
〜3、比較例1〜2で得た樹脂組成物a−e100重量
部に常温硬化の場合はメチルエチルケトンパーオキサイ
ド、加熱硬化の場合はシクロヘキサノンパーオキサイド
をそれぞれ1重量部添加し、ついでけい砂を主成分とす
る無機質充てん剤(H−122、瓢産業株式会社製商品
名)350部を添加し、均一に混合したコンパウンドを
ラビツトスタ一卜型の40W2灯用螢光灯安定器に注入
し、所定条件で硬化させた。The resulting composition was designated as resin composition e. Example 1 above
~3. To 100 parts by weight of the resin compositions a-e obtained in Comparative Examples 1 and 2, 1 part by weight each of methyl ethyl ketone peroxide was added in the case of room temperature curing, and 1 part by weight of cyclohexanone peroxide was added in the case of heat curing, and then silica sand was added as the main component. 350 parts of an inorganic filler (H-122, trade name manufactured by Hyōsangyo Co., Ltd.) was added and the uniformly mixed compound was injected into a 40W two-lamp fluorescent lamp ballast of the Rabbit Star type, and the mixture was heated under specified conditions. hardened with.
硬化後、安定器のコンパウンドとケースの密着状態及び
涌音試験を行なつた結果を第1表に示す。器具組込み時
の騒音は、上記の安定器を40W2灯用の器具にセツト
とし、これを厚12薦Iのべニヤ板に取りつけ、点灯し
螢光灯から10−の距離に騒音計のマイクロフオンをセ
ツトし騒音を測定した。コンパウンドの硬さは、シヨア
硬度計で測定した。After curing, Table 1 shows the adhesion between the ballast compound and the case and the results of a popping sound test. To measure the noise when installing the fixture, set the above ballast to a fixture for two 40W lights, attach it to a plywood board with a thickness of 12 mm, turn it on, and place the microphone of a sound level meter at a distance of 10 mm from the fluorescent light. was set and the noise was measured. The hardness of the compound was measured using a Shore hardness meter.
本発明になる樹脂組成物は、従来の不飽和ポリエステル
樹脂組成物の欠点とされていたケースとの密着性を改良
し、かつコンパウンドを軟質化し弾性を持たせることに
より防振効果を向上させるので、放電灯安定器、小形電
源トランスなどを低騒音化できる。The resin composition of the present invention improves the adhesion to the case, which has been considered a drawback of conventional unsaturated polyester resin compositions, and also improves the vibration damping effect by softening the compound and giving it elasticity. , discharge lamp ballasts, small power transformers, etc. can be made to have lower noise levels.
Claims (1)
当量%、飽和二塩基酸20〜30当量%、少なくとも一
個の二重結合を有する脂肪酸10〜20当量%および多
価アルコール50〜60当量%を反応させて得られる不
飽和アルキド40〜80重量%(A)と重合性ビニル系
単量体20〜60重量%(B)を含有してなる樹脂組成
物。1 Dicyclopentadienyl monomaleate 10-20
40-80% by weight of an unsaturated alkyd obtained by reacting 20-30% by weight of a saturated dibasic acid, 10-20% by weight of a fatty acid having at least one double bond, and 50-60% by weight of a polyhydric alcohol. A resin composition containing (A) and 20 to 60% by weight of a polymerizable vinyl monomer (B).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17354579A JPS592443B2 (en) | 1979-12-28 | 1979-12-28 | resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17354579A JPS592443B2 (en) | 1979-12-28 | 1979-12-28 | resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5695916A JPS5695916A (en) | 1981-08-03 |
| JPS592443B2 true JPS592443B2 (en) | 1984-01-18 |
Family
ID=15962511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17354579A Expired JPS592443B2 (en) | 1979-12-28 | 1979-12-28 | resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS592443B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61143651U (en) * | 1985-02-27 | 1986-09-04 |
-
1979
- 1979-12-28 JP JP17354579A patent/JPS592443B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61143651U (en) * | 1985-02-27 | 1986-09-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5695916A (en) | 1981-08-03 |
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