JPS5929429B2 - Manufacturing method of thermosetting resin products - Google Patents
Manufacturing method of thermosetting resin productsInfo
- Publication number
- JPS5929429B2 JPS5929429B2 JP3232175A JP3232175A JPS5929429B2 JP S5929429 B2 JPS5929429 B2 JP S5929429B2 JP 3232175 A JP3232175 A JP 3232175A JP 3232175 A JP3232175 A JP 3232175A JP S5929429 B2 JPS5929429 B2 JP S5929429B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- parts
- formaldehyde
- compound
- phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 title claims description 41
- 239000011347 resin Substances 0.000 title claims description 41
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 24
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 71
- 150000001875 compounds Chemical class 0.000 claims description 28
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 239000011342 resin composition Substances 0.000 claims description 11
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 10
- 239000003063 flame retardant Substances 0.000 claims description 10
- 229910052736 halogen Inorganic materials 0.000 claims description 10
- 150000002367 halogens Chemical class 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052698 phosphorus Inorganic materials 0.000 claims description 9
- 239000011574 phosphorus Substances 0.000 claims description 9
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical group C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 claims description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 7
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 239000000123 paper Substances 0.000 description 9
- 229920000877 Melamine resin Polymers 0.000 description 7
- 239000002585 base Substances 0.000 description 7
- 150000002989 phenols Chemical class 0.000 description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 4
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- 150000007974 melamines Chemical class 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000004312 hexamethylene tetramine Substances 0.000 description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 2
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- FIDRAVVQGKNYQK-UHFFFAOYSA-N 1,2,3,4-tetrahydrotriazine Chemical group C1NNNC=C1 FIDRAVVQGKNYQK-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical class NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920000388 Polyphosphate Chemical class 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- NJYZCEFQAIUHSD-UHFFFAOYSA-N acetoguanamine Chemical class CC1=NC(N)=NC(N)=N1 NJYZCEFQAIUHSD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- ZSTLPJLUQNQBDQ-UHFFFAOYSA-N azanylidyne(dihydroxy)-$l^{5}-phosphane Chemical class OP(O)#N ZSTLPJLUQNQBDQ-UHFFFAOYSA-N 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- UJSSNDKVUQJEGE-UHFFFAOYSA-N dichloro propyl phosphate Chemical compound CCCOP(=O)(OCl)OCl UJSSNDKVUQJEGE-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- CBOIHMRHGLHBPB-UHFFFAOYSA-N hydroxymethyl Chemical compound O[CH2] CBOIHMRHGLHBPB-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- NIQQIJXGUZVEBB-UHFFFAOYSA-N methanol;propan-2-one Chemical compound OC.CC(C)=O NIQQIJXGUZVEBB-UHFFFAOYSA-N 0.000 description 1
- -1 methylol group Chemical group 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical class [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000001205 polyphosphate Chemical class 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 150000003613 toluenes Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Description
【発明の詳細な説明】
フェノール傾度性芳香族炭化水素ホルムアルデヒド樹脂
、5−トリアジン環を有する化合物−ホルムアルデヒド
樹脂及びエポキシ樹脂からなる熱硬化性樹脂組成物、ま
たはフェノール傾度性芳香族炭化水素樹脂と5−トリア
ジン環を有する化合物とホルムアルデヒドを反応せしめ
得られる熱硬化性樹脂及びエポキシ樹脂からなる熱硬化
性樹脂組成物に有機含リン化合物と有機含ハロゲン化合
物を配合してなる樹脂混合物を積層品基材に含浸せしめ
、積層成形することを特徴とする難燃性熱硬化性樹脂積
層品の製造方法に関するもので、通常の積層板、銅箔を
張りつけた積層板、積層棒、積層管に適用され、その目
的とするところは優れた耐燃性と高い電気特性、機械強
度、寸法安定性、耐薬品性、耐熱性を合せもつ熱硬化性
樹脂積層品を提供することにある。Detailed Description of the Invention A thermosetting resin composition comprising a phenol-gradient aromatic hydrocarbon formaldehyde resin, a compound having a 5-triazine ring-formaldehyde resin, and an epoxy resin, or a phenol-gradient aromatic hydrocarbon resin and 5 - A resin mixture made by blending an organic phosphorus-containing compound and an organic halogen-containing compound with a thermosetting resin composition made of a thermosetting resin and an epoxy resin obtained by reacting a compound having a triazine ring with formaldehyde is used as a laminate product base material. This relates to a method for manufacturing flame-retardant thermosetting resin laminates, which is characterized by impregnating the product with a flame-retardant thermosetting resin and laminating it.It is applicable to ordinary laminates, laminates with copper foil, laminate bars, and laminate pipes. The objective is to provide a thermosetting resin laminate that has excellent flame resistance, high electrical properties, mechanical strength, dimensional stability, chemical resistance, and heat resistance.
従来より熱硬化性樹脂積層品は電子機器を中心に絶縁板
、印刷配線基板として多く用いられ、その重要性は著し
く増大する方向にあるが、近年これらの材料は燃焼性に
ついて種々の規制が設けられ、それに伴い難燃性を付与
させることは今や一般的に行われているところであり、
適用される難燃剤も数多く知られている。Traditionally, thermosetting resin laminates have been widely used as insulating boards and printed wiring boards, mainly in electronic devices, and their importance is increasing significantly. However, in recent years, various regulations have been put in place regarding the flammability of these materials. As a result, it is now common practice to impart flame retardancy.
Many applicable flame retardants are also known.
そしてこれら難燃剤は必要な難燃性を付与させる目的は
達せられるものの、電気特性、機械強度、耐熱性、寸法
安定性、耐薬品性等のいずれかに多かれ少なかれ悪影響
を及ぼし、その結果として非難燃積層品と比較するとき
、実用上明らかに制約を受けることは避けられない。本
発明はこれらの点に鑑みてなされたものであ゛ り、上
記特性を損なうことなく難燃性を付与せしめんとして種
々研究した結果、熱硬化性樹脂の中のある特定の組成を
もつものに有機含リン化合物及び有機含ハロゲン化合物
を配合させた組成物が極めて有効で満足すべき結果をも
たらすことを見い出した。Although these flame retardants achieve the purpose of imparting the necessary flame retardancy, they have a more or less negative effect on electrical properties, mechanical strength, heat resistance, dimensional stability, chemical resistance, etc., and as a result, they have been criticized. When compared with fuel laminated products, it is inevitable that they will be subject to obvious practical limitations. The present invention has been made in view of these points, and as a result of various studies aimed at imparting flame retardance without impairing the above properties, we have developed a thermosetting resin with a specific composition. It has been found that a composition containing an organic phosphorus-containing compound and an organic halogen-containing compound is extremely effective and produces satisfactory results.
即ち本発明の方法はフエノール類変性芳香族炭化水素ホ
ルムアルデヒド樹脂、S−トリアジン環を有する化合物
−ホルムアルデヒド樹脂及びエポキシ樹脂からなる熱硬
化性樹脂組成物、またはフエノール類変性芳香族炭化水
素樹脂とS−トリアジン環を有する化合物とホルムアル
デヒドを反応させて得られる熱硬化性樹脂組成物及びエ
ポキシ樹脂からなる熱硬化性樹脂組成物100部に対し
、有機含リン化合物5〜50部及び有機含ハロゲン化合
物5〜60部を配合してなる樹脂混合物を積 ,層品基
材に塗布含浸せしめ、これを所要枚数重ね、加熱加圧す
ることを特徴とする難燃性熱硬化性樹脂積層品の製造に
関する。That is, the method of the present invention uses a thermosetting resin composition consisting of a phenol-modified aromatic hydrocarbon formaldehyde resin, a compound-formaldehyde resin having an S-triazine ring, and an epoxy resin, or a phenol-modified aromatic hydrocarbon resin and an S-triazine ring-containing compound-formaldehyde resin. 5 to 50 parts of an organic phosphorus-containing compound and 5 to 50 parts of an organic halogen-containing compound to 100 parts of a thermosetting resin composition made of an epoxy resin and a thermosetting resin composition obtained by reacting a compound having a triazine ring with formaldehyde. The present invention relates to the production of a flame-retardant thermosetting resin laminate, characterized in that a resin mixture containing 60 parts of the resin mixture is laminated, coated and impregnated onto a layer base material, stacked in a required number of layers, and heated and pressurized.
本発明でいうフエノール類とはフエノール自体、クレゾ
ール、キシレノール、置換フエノール化合物、多核フエ
ノール等を指す。Phenols as used in the present invention refer to phenols themselves, cresols, xylenol, substituted phenol compounds, polynuclear phenols, and the like.
本発明に於けるフエノール類変性芳香族炭化水素ホルム
アルデヒド樹脂とはベンゼン、トルエン、キシレン、メ
シチレン、ナフタリン等の芳香族炭化水素とホルムアル
デヒドとを硫酸の如き強酸触媒下で縮合せしめた含酸素
芳香族炭化水素ホルムアルデヒド樹脂に、酸性触媒下で
前記フエノール類を後縮合させたフエノール類変性芳香
族炭化水素樹脂にアルカリ触媒下でホルムアルデヒドを
縮合させたレゾール型フエノール類変性芳香族炭化水素
ホルムアルデヒド樹脂を指し、構造式中にメチロール基
+CH2OH)を有する熱硬化性のものである。The phenol-modified aromatic hydrocarbon formaldehyde resin in the present invention is an oxygen-containing aromatic carbonized resin obtained by condensing an aromatic hydrocarbon such as benzene, toluene, xylene, mesitylene, or naphthalene with formaldehyde under a strong acid catalyst such as sulfuric acid. Refers to a resol-type phenol-modified aromatic hydrocarbon formaldehyde resin in which formaldehyde is condensed under an alkaline catalyst to a phenol-modified aromatic hydrocarbon resin in which the above-mentioned phenols are post-condensed to a hydrogen formaldehyde resin under an acidic catalyst. It is a thermosetting material having a methylol group + CH2OH in the formula.
またフエノール類変性芳香族炭化水素樹脂とはフエノー
ル類変性芳香族炭化水素ホルムアルデヒド樹脂の製造過
程において最終のホルムアルデヒドを反応させる前の樹
脂を指す。本発明でいうS−トリアジン環を有する化合
物はメラミン類、グアナミン類であり、メラミン、置換
メラミン、アセトグアナミン、ベンゾグアナミン等が好
適に使用できる。Further, the phenol-modified aromatic hydrocarbon resin refers to the resin before reacting with the final formaldehyde in the production process of the phenol-modified aromatic hydrocarbon formaldehyde resin. The compounds having an S-triazine ring in the present invention are melamines and guanamines, and melamine, substituted melamine, acetoguanamine, benzoguanamine, etc. can be preferably used.
S−トリアジン環を有する化合物−ホルムアルデヒド樹
脂はメラミン類、グアナミン類を中性またはアルカリ下
でホルムアルデヒドと反応させて得られるものである。The compound-formaldehyde resin having an S-triazine ring is obtained by reacting melamines and guanamines with formaldehyde under neutral or alkaline conditions.
本発明でいうエポキシ樹脂とは多価フエノール、多価の
多核フエノールあるいは脂肪族多価アルコールをエピハ
ロヒドリンまたはジハロヒドリンと公知の方法でアルカ
リ触媒中で反応させて得られる化合物、さらにジエンを
保有す伺〒責式化合物あるいは脂肪族化合物を過酸酸化
によりエポキシ化して得られる公知の化合物を意味する
。The epoxy resin as used in the present invention is a compound obtained by reacting a polyvalent phenol, a polyvalent polynuclear phenol, or an aliphatic polyhydric alcohol with an epihalohydrin or a dihalohydrin in an alkaline catalyst by a known method, and also contains a diene. It means a known compound obtained by epoxidizing a compound or an aliphatic compound by oxidation with a peracid.
例えば次の分子式に相当するエポキシ樹脂等が使用でき
る。For example, epoxy resins having the following molecular formula can be used.
これらエポキシ樹脂は硬化剤、促進剤なしで使用できる
が硬化剤、促進剤を用いることもできる。These epoxy resins can be used without a curing agent or accelerator, but a curing agent or accelerator can also be used.
好ましい例として脂肪族、芳香族のポリアミン、酸無水
物、ポリアミド、BF3−アミンコンプレツクス、ジシ
アンジアミド、ベンジルジメチルアミン等がある。以上
熱硬化性樹脂成分としてフエノール類変性芳香族炭化水
素ホルムアルデヒド樹脂、S−トリアジン環を有する化
合物−ホルムアルデヒド樹脂及びエポキシ樹脂を構成さ
せることにより熱硬化性樹脂組成物を得るのであるが、
好ましい方法として(1)3つの成分を混合して得る方
法、(2)フエノール類変性芳香族炭化水素樹脂、S−
トリアジン環を有する化合物及びホルムアルデヒドを反
応主成分としてこれらの混合物をアルカリの存在下に加
熱縮合せしめて得られる熱硬化性共縮合樹脂組成物とエ
ポキシ樹脂を混合して得る方法が挙げられる。Preferred examples include aliphatic and aromatic polyamines, acid anhydrides, polyamides, BF3-amine complexes, dicyandiamide, and benzyldimethylamine. As described above, a thermosetting resin composition is obtained by composing a phenol-modified aromatic hydrocarbon formaldehyde resin, a compound-formaldehyde resin having an S-triazine ring, and an epoxy resin as the thermosetting resin components.
Preferred methods include (1) a method of mixing three components, (2) a method of obtaining a phenol-modified aromatic hydrocarbon resin, S-
Examples include a method in which a thermosetting co-condensed resin composition obtained by heating and condensing a mixture of a compound having a triazine ring and formaldehyde as main reaction components in the presence of an alkali and an epoxy resin is obtained.
本発明に有用な難燃剤はリンを含有すれ有機化合物もし
くはハロゲンを含有する有機化合物であるが、それぞれ
単独で使用することは充分な難燃性付与には好ましくな
く、併用が好ましい結果を与える。The flame retardants useful in the present invention are phosphorus-containing organic compounds or halogen-containing organic compounds, but it is not preferable to use each alone to impart sufficient flame retardancy, and a combination thereof gives preferable results.
有機含リン化合物を例示すれば、トリフエニルホスフエ
ート、トリクレジルホスフエート、トリスクロロエチル
ホスフエート、トリフエニルホスフアイト、置換ホスホ
ネート、ポリホスフエート、ポリホスホネート、トリス
ジクロルプロピルホスフエート、ホスホニトリル化合物
等である。Examples of organic phosphorus-containing compounds include triphenyl phosphate, tricresyl phosphate, trischloroethyl phosphate, triphenyl phosphite, substituted phosphonate, polyphosphate, polyphosphonate, tris dichloropropyl phosphate, phosphonitrile compounds, etc. It is.
また有機含ハロゲン化合物の例としては、塩素化パラフ
イン、ハロゲン化エポキシ化合物、ハロゲン化フエノー
ル、ハロゲン化ビスフエノールA1ヘッド酸等がある。
但し有機含リン化合物、有機含ハロゲン化合物ともに例
示した化合物に限定するものではない。本発明で用いる
積層品基材とは、紙、ガラス不織布、ガラス布、リンタ
一とガラスの混抄不織布、アスベスト紙、綿布、合成繊
維布及び不織布があり、また酸化アンチモン抄込紙、フ
エノール樹脂、メラミン樹脂等で処理した紙も好適に用
いられる。Examples of organic halogen-containing compounds include chlorinated paraffins, halogenated epoxy compounds, halogenated phenols, and halogenated bisphenol A1 head acids.
However, both the organic phosphorus-containing compound and the organic halogen-containing compound are not limited to the exemplified compounds. The laminate base materials used in the present invention include paper, glass nonwoven fabric, glass cloth, mixed nonwoven fabric of linter and glass, asbestos paper, cotton fabric, synthetic fiber fabric, and nonwoven fabric, as well as paper containing antimony oxide, phenolic resin, Paper treated with melamine resin or the like is also suitably used.
本発明において使用される熱硬化性樹脂に配合する難燃
剤量は積層品基材によつて異なるが、紙基材の場合熱硬
化性樹脂組成物100部に対し、有機含リン化合物10
部〜50部、有機含ハロゲン化合物10部〜60部が適
している。ガラス系基材では有機含リン化合物、有機含
ハロゲン化合物ともに紙基材の1/2以下でよい。以上
述べた如く本発明の方法において熱硬化性樹脂積層品を
製造する場合、優れた耐燃性と高い電気特性、機械強度
、寸法安定性、耐薬品性、耐熱性が得られる理由は明ら
かでないが、フエノール類変性芳香族炭化水素ホルムア
ルデヒド樹脂成分、S−トリアジン環化合物一ホルムア
ルデヒド樹脂成分及びエポキシ樹脂成分がそれぞれの欠
点を相補ない、且つそれぞれ単独では到達し得ない硬化
性の向上をもたらす結果、難燃剤の添加によつて損われ
る諸特性の低下を防ぎ非難燃化積層品と同等以上の良好
な品質を保つものと推察される。The amount of flame retardant added to the thermosetting resin used in the present invention varies depending on the base material of the laminate, but in the case of paper base material, 10 parts of the organic phosphorus compound is added to 100 parts of the thermosetting resin composition.
Parts to 50 parts and organic halogen-containing compounds 10 to 60 parts are suitable. In the case of a glass base material, both the organic phosphorus-containing compound and the organic halogen-containing compound may be 1/2 or less of that of the paper base material. As mentioned above, it is not clear why excellent flame resistance, high electrical properties, mechanical strength, dimensional stability, chemical resistance, and heat resistance are obtained when thermosetting resin laminates are produced using the method of the present invention. , the phenol-modified aromatic hydrocarbon formaldehyde resin component, the S-triazine ring compound-formaldehyde resin component, and the epoxy resin component do not compensate for their respective drawbacks, and as a result, they each bring about improvements in curability that cannot be achieved alone. It is inferred that this prevents the deterioration of various properties that would be impaired by the addition of refractory agents, and maintains quality that is equal to or better than non-combustible laminates.
尚本発明においてフエノール類変性芳香族炭化水素ホル
ムアルデヒド樹脂またはフエノールホルムアルデヒド樹
脂は例えば可撓性を付与させるために乾性油、カシユー
ナツツシエル油等の変性剤で随時変性することもできる
。また難燃成分としてリン、ハロゲンに加えるにアンチ
モン化合物その他無機難燃助剤を併用することもできる
。In the present invention, the phenol-modified aromatic hydrocarbon formaldehyde resin or the phenol formaldehyde resin can be optionally modified with a modifier such as drying oil or coconut oil in order to impart flexibility. In addition to phosphorus and halogen as flame retardant components, antimony compounds and other inorganic flame retardant aids can also be used in combination.
以下実施例により銅箔をはりつけた積層板の詳細につい
て説明する。The details of a laminate to which copper foil is bonded will be described below in accordance with an example.
実施例 1
トルエン400部、ホルムアルデヒド源としてα−ポリ
オキシメチレン120部、98%硫酸ール変性トルエン
樹脂溶液にメラミン200部、ホルマリン(37%水溶
液)660音臥ヘキサメチレンテトラミン22部を加え
て80〜86℃で3時間反応せしめ、次に減圧下で縮合
により発生した水とトルエンを除去し、アセトン−メタ
ノール混合溶媒で希釈して樹脂溶液を得た。Example 1 400 parts of toluene, 120 parts of α-polyoxymethylene as a formaldehyde source, 200 parts of melamine, 22 parts of formalin (37% aqueous solution) and 660% hexamethylenetetramine were added to a 98% sulfate-modified toluene resin solution to give 80 parts of hexamethylenetetramine. The reaction was carried out at ~86°C for 3 hours, and then water and toluene generated by condensation were removed under reduced pressure, and diluted with an acetone-methanol mixed solvent to obtain a resin solution.
この液にビスフエノールA型エポキシ樹脂(エポキシ当
量500)270部、ベンジルジメチルアミン1,5部
、トリフエニルホスフエート178部と臭素化ビフエニ
ル178部を添加混合したものを、あらかじめメラミン
樹脂で処理した厚さ0.25mmのクラフト紙に含浸せ
しめ、実施例1と同様の方法により積層品を得た。その
特性を第2表に示す。実施例 3,4,5実施例1の方
法に於いてトリクレジルホスフエート、臭素化ビフエニ
ルの組合わせ以外の難燃剤組合わせとして、第1表@的
化合物を用意した。A mixture of 270 parts of bisphenol A type epoxy resin (epoxy equivalent: 500), 1.5 parts of benzyldimethylamine, 178 parts of triphenyl phosphate, and 178 parts of brominated biphenyl was added and mixed to this solution, and the mixture was treated with melamine resin in advance. A laminate was obtained in the same manner as in Example 1 by impregnating kraft paper with a thickness of 0.25 mm. Its properties are shown in Table 2. Examples 3, 4, 5 In the method of Example 1, compounds listed in Table 1 were prepared as flame retardant combinations other than the combination of tricresyl phosphate and brominated biphenyl.
その他の条件は全て実施例1と同様にして積層品を得た
。得られた積層品の特性を第2表に示す。実施例 6,
7
実施例1の方法に於いて芳香族炭化水素樹脂の種類をト
ルエン樹脂以外のものとしてキシレン樹脂、メシチレン
樹脂を用意してそれぞれ実施例6,7とし、実施例1と
同様の条件で積層品を得た。All other conditions were the same as in Example 1 to obtain a laminate. Table 2 shows the properties of the obtained laminate. Example 6,
7 In the method of Example 1, xylene resin and mesitylene resin were prepared as the aromatic hydrocarbon resin other than toluene resin and used as Examples 6 and 7, respectively, and laminated products were produced under the same conditions as Example 1. I got it.
特性を第2表に示す。実施例 8
実施例1に於てリンタ一紙としてあらかじめフエノール
樹脂で処理しないものを用いた以外は実施例1と同様の
方法にて積層品を得た。The characteristics are shown in Table 2. Example 8 A laminate was obtained in the same manner as in Example 1, except that the linter paper was not previously treated with phenolic resin.
特性を第2表に示す。実施例 9
実施例1に於てリンタ一紙の代りにガラス不織布を用い
、基材1に対し1.6の割合で樹脂を付着させた以外は
実施例1と同様の方法にて積層品を得た。The characteristics are shown in Table 2. Example 9 A laminate was produced in the same manner as in Example 1, except that a glass nonwoven fabric was used instead of the linter paper, and the resin was attached at a ratio of 1.6 to 1 of the base material. Obtained.
特性を第2表に示す。比較例
通常の方法により得られたアンモニア触媒によるレゾー
ル型フエノールホルムアルデヒド樹脂(固形分50%)
1000部にトリフエニルホスフエート150部と臭素
化ビフエニル150部を添加混合したものを、あらかじ
めフエノール樹脂で処理した厚さ0.25能のリンタ一
紙に含浸せしめ実施例1と同様の方法にて積層品を得た
。The characteristics are shown in Table 2. Comparative Example Ammonia-catalyzed resol type phenol formaldehyde resin (solid content 50%) obtained by a conventional method
A mixture of 1000 parts and 150 parts of triphenyl phosphate and 150 parts of brominated biphenyl was impregnated into a piece of linter paper with a thickness of 0.25 that had been previously treated with phenolic resin, and the same method as in Example 1 was carried out. A laminate was obtained.
Claims (1)
樹脂、S−トリアジン環を有する化合物−ホルムアルデ
ヒド樹脂及びエポキシ樹脂からなる熱硬化性樹脂組成物
、またはフェノール類変性芳香族炭化水素樹脂とS−ト
リアジン環を有する化合物とホルムアルデヒドを反応さ
せて得られる熱硬化性共縮合樹脂組成物及びエポキシ樹
脂からなる熱硬化性樹脂組成物100部に対し、有機含
リン化合物5〜50部及び有機含ハロゲン化合物5〜6
0部を配合してなる樹脂混合物を積層品基材に塗布含浸
せしめ、これを所要枚数重ね、加熱加圧することを特徴
とする難燃性熱硬化性樹脂積層品の製造方法。1. A phenol-modified aromatic hydrocarbon formaldehyde resin, a compound having an S-triazine ring - a thermosetting resin composition consisting of a formaldehyde resin and an epoxy resin, or a phenol-modified aromatic hydrocarbon resin and a compound having an S-triazine ring 5 to 50 parts of an organic phosphorus-containing compound and 5 to 6 parts of an organic halogen-containing compound per 100 parts of a thermosetting resin composition consisting of an epoxy resin and a thermosetting cocondensation resin composition obtained by reacting formaldehyde with formaldehyde.
1. A method for producing a flame-retardant thermosetting resin laminate, which comprises coating and impregnating a laminate base material with a resin mixture containing 0 parts of 0 parts, piling up a required number of sheets, and heating and pressurizing them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3232175A JPS5929429B2 (en) | 1975-03-19 | 1975-03-19 | Manufacturing method of thermosetting resin products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3232175A JPS5929429B2 (en) | 1975-03-19 | 1975-03-19 | Manufacturing method of thermosetting resin products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51107371A JPS51107371A (en) | 1976-09-22 |
| JPS5929429B2 true JPS5929429B2 (en) | 1984-07-20 |
Family
ID=12355662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3232175A Expired JPS5929429B2 (en) | 1975-03-19 | 1975-03-19 | Manufacturing method of thermosetting resin products |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5929429B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6079063A (en) * | 1983-10-07 | 1985-05-04 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and production thereof |
-
1975
- 1975-03-19 JP JP3232175A patent/JPS5929429B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51107371A (en) | 1976-09-22 |
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