JPS5929430B2 - Manufacturing method of thermosetting resin products - Google Patents
Manufacturing method of thermosetting resin productsInfo
- Publication number
- JPS5929430B2 JPS5929430B2 JP3232275A JP3232275A JPS5929430B2 JP S5929430 B2 JPS5929430 B2 JP S5929430B2 JP 3232275 A JP3232275 A JP 3232275A JP 3232275 A JP3232275 A JP 3232275A JP S5929430 B2 JPS5929430 B2 JP S5929430B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- parts
- phenol
- laminate
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 title claims description 39
- 239000011347 resin Substances 0.000 title claims description 39
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 45
- 150000001875 compounds Chemical class 0.000 claims description 20
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 12
- 229920001568 phenolic resin Polymers 0.000 claims description 12
- 239000003063 flame retardant Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 10
- 229910052736 halogen Inorganic materials 0.000 claims description 10
- 150000002367 halogens Chemical class 0.000 claims description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 229910052698 phosphorus Inorganic materials 0.000 claims description 9
- 239000011574 phosphorus Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 7
- 239000011342 resin composition Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 239000002585 base Substances 0.000 description 7
- 150000002989 phenols Chemical class 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- FVKGRHSPCZORQC-UHFFFAOYSA-N formaldehyde;toluene Chemical compound O=C.CC1=CC=CC=C1 FVKGRHSPCZORQC-UHFFFAOYSA-N 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920003987 resole Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 2
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920000388 Polyphosphate Chemical class 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- ZSTLPJLUQNQBDQ-UHFFFAOYSA-N azanylidyne(dihydroxy)-$l^{5}-phosphane Chemical class OP(O)#N ZSTLPJLUQNQBDQ-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- UJSSNDKVUQJEGE-UHFFFAOYSA-N dichloro propyl phosphate Chemical compound CCCOP(=O)(OCl)OCl UJSSNDKVUQJEGE-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- -1 methylol group Chemical group 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000001205 polyphosphate Chemical class 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】
本発明はフェノール傾度性芳香族炭化水素ホルムアルデ
ヒド樹脂、フェノールホルムアルデヒド樹脂及びエポキ
シ樹脂からなる熱硬化性樹脂組成物に有機含リン化合物
と有機含ハロゲン化合物を配合してなる樹脂混合物を積
層品基材に含浸せしめ、積層成形することを特徴とする
難燃性熱硬化性樹脂積層品の製造方法に関するもので、
通常の積層板、銅箔を張りつけた積層板、積層棒、積層
管に適用され、優れた耐燃性と高い電気特性、機械強度
、寸法安定性、耐薬品性、耐熱性を合わせもつ熱硬化性
樹脂積層品を提供することにある。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a resin obtained by blending an organic phosphorus-containing compound and an organic halogen-containing compound with a thermosetting resin composition consisting of a phenol-gradient aromatic hydrocarbon formaldehyde resin, a phenol formaldehyde resin, and an epoxy resin. This invention relates to a method for producing a flame-retardant thermosetting resin laminate, which comprises impregnating a laminate base material with a mixture and performing laminate molding.
A thermosetting material that is applicable to ordinary laminates, copper foil-covered laminates, laminate bars, and laminate tubes, and has excellent flame resistance, high electrical properties, mechanical strength, dimensional stability, chemical resistance, and heat resistance. Our goal is to provide resin laminate products.
従来より熱硬化性樹脂積層品は電子機器を中心に絶縁板
、印刷配線基板として多く用いられ、その重要性は著る
しく増大する方向にあるが、近年これらの材料は燃焼性
について種々の規制が設けられ、それに伴い難燃性を付
与させることは今や一般的に行なわれているところであ
り、適用される難燃剤も数多く知られている。そしてこ
れら難燃剤は必要な難燃性を付与させる目的は達せられ
るものの、電気特性、機械強度、耐熱性、寸法安定性、
耐薬品性等のいずれかに多かれ少かれ悪影響を及ぼし、
その結果として非難燃積層品と比較するとき、実用上明
らかに制約を受けることは避けられない。本発明はこれ
らの点に鑑みてなされたものであり、上記特性を損なう
ことなく、難燃性を付与せしめんとして種々研究した結
果、熱硬化性樹脂の中のある特定の組成をもつものに、
有機含リン化合物及び有機含ハロゲン化合物を配合させ
た組成物が極めて有効で、満足すべき結果をもたらすこ
とを発見した。Traditionally, thermosetting resin laminates have been widely used as insulating boards and printed wiring boards, mainly in electronic devices, and their importance is increasing significantly, but in recent years these materials have come under various regulations regarding flammability. It is now common practice to provide flame retardance, and many flame retardants that can be used are also known. Although these flame retardants can achieve the purpose of imparting the necessary flame retardancy, they have poor electrical properties, mechanical strength, heat resistance, dimensional stability,
It has a more or less negative effect on chemical resistance, etc.
As a result, when compared with flame-retardant laminates, it is inevitable that they will be subject to obvious practical limitations. The present invention has been made in view of these points, and as a result of various studies aimed at imparting flame retardance without impairing the above properties, we have developed a thermosetting resin with a specific composition. ,
It has been discovered that a composition containing an organic phosphorus-containing compound and an organic halogen-containing compound is extremely effective and gives satisfactory results.
即ち、本発明方法はフェノール傾度性芳香族炭化水素ホ
ルムアルデヒド樹脂、フェノールホルムアルデヒド樹脂
及びエポキシ樹脂からなる熱硬化性樹脂組成物100部
に対し、有機含リン化合物5〜50部、及び有機含ハロ
ゲン化合物5〜60部を配合してなる樹脂混合物を積層
品基材に塗布含浸せしめ、これを所要枚数重ね、加熱加
圧することを特徴とする難燃性熱硬化性積層品の製造に
関する。That is, in the method of the present invention, 5 to 50 parts of an organic phosphorus-containing compound and 5 parts of an organic halogen-containing compound are added to 100 parts of a thermosetting resin composition comprising a phenol-gradient aromatic hydrocarbon formaldehyde resin, a phenol formaldehyde resin, and an epoxy resin. The present invention relates to the production of a flame-retardant thermosetting laminate, characterized in that a resin mixture containing up to 60 parts of the resin mixture is coated and impregnated onto a laminate base material, and the required number of sheets are stacked and heated and pressurized.
本発明でいうフエノール類とはフエノール自体、クレゾ
ール、キシレノール、置換フエノール化合物、多核フエ
ノール等を指す。Phenols as used in the present invention refer to phenols themselves, cresols, xylenol, substituted phenol compounds, polynuclear phenols, and the like.
本発明に於けるフエノール類変性芳香族炭化水素ホルム
アルデヒド樹脂とはベンゼン、トルエン、キシレン、メ
シチレン、ナフタリン等の芳香族炭化水素とホルムアル
デヒドとを硫酸の如き強酸触媒下で縮合せしめた含酸素
芳香族炭化水素ホルムアルデヒド樹脂に酸性触媒下で前
記フエノール類を後縮合させたフエノール類変性芳香族
炭化水素樹脂に、アルカリ触媒下でホルムアルデヒドを
縮合させたレゾール型フエノール類変性芳香族炭化水素
ホルムアルデヒド樹脂を指し、構造式中にメチロール基
(−CH2OH)を有する熱硬化性のものである。The phenol-modified aromatic hydrocarbon formaldehyde resin in the present invention is an oxygen-containing aromatic carbonized resin obtained by condensing an aromatic hydrocarbon such as benzene, toluene, xylene, mesitylene, or naphthalene with formaldehyde under a strong acid catalyst such as sulfuric acid. Refers to a resol-type phenol-modified aromatic hydrocarbon formaldehyde resin in which formaldehyde is condensed under an alkali catalyst to a phenol-modified aromatic hydrocarbon resin obtained by post-condensing the above phenols to a hydrogen formaldehyde resin under an acidic catalyst. It is a thermosetting compound having a methylol group (-CH2OH) in the formula.
またフエノール類変性芳香族炭化水素樹脂とは、フエノ
ール類変性芳香族炭化水素ホルムアルデヒド樹脂の製造
過程において、最終のホルムアルデヒドを反応させる前
の樹脂を指す。本発明でいうフエノールホルムアルデヒ
ド樹脂とは前記フエノール類とホルムアルデヒドをアル
カリ下で反応させて得られるレゾール型樹脂または各種
変性剤で変性されたレゾール型樹脂をいう。本発明でい
うエポキシ樹脂とは多価フエノール、多価の多核フエノ
ール、あるいは脂肪族多価アルコールをエピハロヒドリ
ンまたはジハロヒドリンと公知の方法でアルカリ触媒中
で反応させて得られる化合物、さらにジエンを保有する
脂環式化合物あるいは脂肪族化合物を過酸酸化によりエ
ポキシ化して得られる公知の化合物を意味する。Further, the phenol-modified aromatic hydrocarbon resin refers to the resin before reacting with the final formaldehyde in the production process of the phenol-modified aromatic hydrocarbon formaldehyde resin. The phenol formaldehyde resin as used in the present invention refers to a resol type resin obtained by reacting the phenols and formaldehyde in an alkaline environment, or a resol type resin modified with various modifiers. The epoxy resin used in the present invention is a compound obtained by reacting a polyvalent phenol, a polyvalent polynuclear phenol, or an aliphatic polyhydric alcohol with an epihalohydrin or a dihalohydrin in an alkaline catalyst by a known method, and a resin containing a diene. It means a known compound obtained by epoxidizing a cyclic compound or an aliphatic compound by peracid oxidation.
例えば次の分子式に相当するエポキシ樹脂等が使用でき
る。For example, epoxy resins having the following molecular formula can be used.
これらエポキシ樹脂は硬化剤、促進剤なしで使用できる
が、硬化剤、促進剤を用いることもできる。These epoxy resins can be used without a curing agent or accelerator, but a curing agent or an accelerator can also be used.
好ましい例として脂肪族、芳香族のポリアミン、酸無水
物、ポリアミド、BF3−アミンコンプレツクス、ジシ
アンジアミド、ベンジルジメチルアミン等がある。以上
熱硬化性樹脂成分としてフエノール類変性芳香族炭化水
素ホルムアルデヒド樹脂、フエノールホルムアルデヒド
樹脂及びエポキシ樹脂を構成させることにより、熱硬化
性樹脂組成物を得るのであるが、好ましい方法として3
つの成分を混合して得る方法が挙げられる。Preferred examples include aliphatic and aromatic polyamines, acid anhydrides, polyamides, BF3-amine complexes, dicyandiamide, and benzyldimethylamine. A thermosetting resin composition is obtained by composing a phenol-modified aromatic hydrocarbon formaldehyde resin, a phenol formaldehyde resin, and an epoxy resin as the thermosetting resin components.
An example of this method is to mix two components.
本発明に有用な難燃剤はリンを含有する有機化合物、も
しくはハロゲンを含有する有機化合物であるが、それぞ
れ単独で使用することは充分な難燃性付与には好ましく
なく、併用が好ましい結果を与える。The flame retardants useful in the present invention are phosphorus-containing organic compounds or halogen-containing organic compounds, but using each alone is not preferable for imparting sufficient flame retardancy, and using them in combination gives preferable results. .
有機含リン化合物を例示すればトリフエニルホスフエー
ト、トリクレジルホスフエート、トリスクロロエチルホ
スフエート、トリフエニルホスフアイト、置換ホスホネ
ート、ポリホスフエート、ポリホスホネート、トリスジ
クロルプロピルホスフエート、ホスホニトリル化合物等
である。Examples of organic phosphorus-containing compounds include triphenyl phosphate, tricresyl phosphate, trischloroethyl phosphate, triphenyl phosphite, substituted phosphonates, polyphosphates, polyphosphonates, tris dichloropropyl phosphate, and phosphonitrile compounds. be.
また有機含ハロゲン化合物の例としては塩素化パラフイ
ン、ハロゲン化エポキシ化合物、ハロゲン化フエノール
、ハロゲン化ビスフエノールA1ヘッド酸等がある。但
し有機含リン化合物、有機含ハロゲン化合物ともに例示
した化合物に限定するものではない。本発明で用いる積
層品基材とは紙、ガラス不織布、ガラス布、リンタ一と
ガラスの混抄不織布、アスベスト紙、綿布、合成繊維布
及び不織布があり、また酸化アンチモン抄込紙、フエノ
ール樹脂、メラミン樹脂等で処理した紙も好適に用いら
れる。Examples of organic halogen-containing compounds include chlorinated paraffins, halogenated epoxy compounds, halogenated phenols, and halogenated bisphenol A1 head acids. However, both the organic phosphorus-containing compound and the organic halogen-containing compound are not limited to the exemplified compounds. The laminate base materials used in the present invention include paper, glass nonwoven fabric, glass cloth, mixed nonwoven fabric of linter and glass, asbestos paper, cotton fabric, synthetic fiber fabric, and nonwoven fabric, as well as paper containing antimony oxide, phenolic resin, and melamine. Paper treated with resin or the like is also suitably used.
本発明において使用される熱硬化性樹脂に配合する難燃
剤量は積層品基材によつて異なるが、紙基材の場合、熱
硬化性樹脂組成物100部に対し、有機含リン化合物1
0部〜50部、有機含ハロゲン化合物10部〜60部が
適している。ガラス系基材では有機含リン化合物、有機
含ハロゲン化合物ともに紙基材の%以下でよい。以上述
べた如く本発明の方法において熱硬化性樹脂積層品を製
造する場合、優れた耐燃性と高い電気特性、機械強度、
寸法安定性、耐薬品性、耐熱性が得られる理由は明らか
でないが、フエノ一ル類変性芳香族炭化水素ホルムアル
デヒド樹脂成分、フエノールホルムアルデヒド樹脂、及
びエポキシ樹脂成分がそれぞれの欠点を相補ない、且つ
それぞれ単独では到達し得ない硬化性の向上をもたらす
結果、難燃剤の添加によつて損われる諸特性の低下を防
ぎ、非難燃化積層品と同等以上の良好な品質を保一つも
のと推察される。The amount of flame retardant added to the thermosetting resin used in the present invention varies depending on the base material of the laminate, but in the case of paper base material, 1 part of the organic phosphorus compound is added to 100 parts of the thermosetting resin composition.
0 parts to 50 parts and 10 parts to 60 parts of the organic halogen-containing compound are suitable. In the case of a glass base material, both the organic phosphorus-containing compound and the organic halogen-containing compound may be contained in an amount of % or less of the paper base material. As described above, when producing a thermosetting resin laminate using the method of the present invention, it has excellent flame resistance, high electrical properties, mechanical strength,
The reason why dimensional stability, chemical resistance, and heat resistance are obtained is not clear, but the reason is that the phenol-modified aromatic hydrocarbon formaldehyde resin component, the phenol formaldehyde resin, and the epoxy resin component do not compensate for their respective drawbacks, and As a result of improving hardenability, which cannot be achieved alone, it is thought to prevent the deterioration of various properties that are damaged by the addition of flame retardants, and maintain good quality equivalent to or better than flame-retardant laminates. Ru.
尚、本発明においてフエノール類変性芳香族炭化水素ホ
ルムアルデヒド樹脂またはフエノールホルムアルデヒド
樹脂は例えば可撓性を付与させるために乾性油、カシユ
ーナツツシエル油等の変性剤で随時変性することもでき
る。In the present invention, the phenol-modified aromatic hydrocarbon formaldehyde resin or the phenol formaldehyde resin can be optionally modified with a modifier such as drying oil or coconut oil in order to impart flexibility, for example.
また、メラミン樹脂変性、グアナミン樹脂変性も行なう
ことができる。また難燃成分としてリン、ハロゲンに加
えるにアンチモン化合物、その他無機難燃助剤を併用す
ることもできる。Furthermore, melamine resin modification and guanamine resin modification can also be performed. In addition to phosphorus and halogen as flame retardant components, antimony compounds and other inorganic flame retardant aids can also be used in combination.
以下実施例により銅箔をはりつけた積層板の詳細につい
て説明する。The details of a laminate to which copper foil is bonded will be described below in accordance with an example.
実施例 1
トルエン400部、ホルムアルデヒド源としてα−ポリ
オキシメチレン120部、98%硫酸80部の混合物を
冷却管付き反応器中で激しく攪拌しつ\100〜110
℃で8時間反応させ、反応終了後反応混合物を多量の水
中に投入して水洗をくり返し、酸を充分に洗い去り、6
0m7!LHgの減圧下で加熱しながら脱水して440
部のトルエンホルムアルデヒド樹脂を得た。Example 1 A mixture of 400 parts of toluene, 120 parts of α-polyoxymethylene as a formaldehyde source, and 80 parts of 98% sulfuric acid was vigorously stirred in a reactor equipped with a cooling tube, and the mixture was heated to \100-110.
℃ for 8 hours, and after the reaction was completed, the reaction mixture was poured into a large amount of water and washed repeatedly to thoroughly wash away the acid.
0m7! Dehydrated while heating under reduced pressure of LHg to 440
of toluene formaldehyde resin was obtained.
この樹脂は茶色の粘稠な液伏樹脂で炭素79.750!
)、水素7.34%、酸素12.91%の元素分析値で
あり、酸価は0,14であつた。こ\に得られたトルエ
ンホルムアルデヒド樹脂にフエノール418部、トルエ
ン88部、パラトルエンスルホン酸190部を冷却管付
き反応器中で攪拌しつ\還流下90〜100℃で2時間
反応せしめ、次いで減圧下で反応混合物の温度が140
℃になるまで脱水して反応を完結させた。次いでこれに
トルエン308部を加えてアンモニアで中和し、これに
さらにパラホルムアルデヒド110部、28%のアンモ
ニア22部を加えて85〜900Cで2.5時間反応せ
しめ、次に減圧下で縮合により発生した水とトルエンを
除去し、トルエンで希釈して得られたフエノール変性ト
ルエンホルムアルデヒド樹脂溶液とレゾール型フエノー
ルホルムアルデヒド樹脂溶液(固形分50%)150得
られた積層品の特性を第2表に示す。実施例 5,6
実施例1の方法に於いて芳香族炭化水素樹脂の種類をト
ルエン樹脂以外のものとしてキシレン樹脂メシチレン樹
脂を用意して、それぞれ実施例5,6とし、実施例1と
同様の条件で積層品を得た。This resin is a brown viscous liquid resin with a carbon content of 79.750!
), the elemental analysis values were 7.34% hydrogen and 12.91% oxygen, and the acid value was 0.14. The toluene-formaldehyde resin thus obtained was reacted with 418 parts of phenol, 88 parts of toluene, and 190 parts of para-toluenesulfonic acid in a reactor equipped with a cooling tube while stirring at 90 to 100°C under reflux for 2 hours, and then under reduced pressure. When the temperature of the reaction mixture is 140
The reaction was completed by dehydration until the temperature reached ℃. Next, 308 parts of toluene was added to this and neutralized with ammonia. To this, 110 parts of paraformaldehyde and 22 parts of 28% ammonia were further added and reacted at 85 to 900C for 2.5 hours, and then by condensation under reduced pressure. Table 2 shows the properties of the phenol-modified toluene-formaldehyde resin solution obtained by removing generated water and toluene and diluting with toluene, and the resol-type phenol-formaldehyde resin solution (solid content 50%). . Examples 5 and 6 In the method of Example 1, xylene resin and mesitylene resin were prepared using the aromatic hydrocarbon resin other than toluene resin to prepare Examples 5 and 6, respectively, and the same method as Example 1 was carried out. A laminate was obtained under the conditions.
特性を第2表に示す。実施例 7
実施例1に於てリンタ一紙としてあらかじめフエノール
樹脂で処理しないものを用いた以外は実施例1と同様の
方法にて積層品を得た。The characteristics are shown in Table 2. Example 7 A laminate was obtained in the same manner as in Example 1, except that the linter paper was not previously treated with phenolic resin.
特性を第2表に示す。実施例 8
実施例1に於てリンタ一紙の代りにガラス不織布を用い
、基材1に対し1,6の割合で樹脂を付着させた以外は
実施例1と同様の方法にて積層品を得た。The characteristics are shown in Table 2. Example 8 A laminate product was produced in the same manner as in Example 1, except that a glass nonwoven fabric was used instead of the linter paper in Example 1, and the resin was attached at a ratio of 1.6 parts to 1 part of the base material. Obtained.
特性を第2表に示す。比較例
通常の方法により得られたアンモニア触媒によるレゾー
ル型フエノールホルムアルデヒド樹脂(固形分50%)
1000部にトリフエニルホスフエート150部と臭素
化ビフエニル150部を添加混合したものを、あらかじ
めフエノール樹脂で処理した厚さ0.25m7!tのリ
ンタ一紙に含浸せしめ、実施例1と同様の方法にて積層
品を得た。The characteristics are shown in Table 2. Comparative Example Ammonia-catalyzed resol type phenol formaldehyde resin (solid content 50%) obtained by a conventional method
A mixture of 1000 parts and 150 parts of triphenyl phosphate and 150 parts of brominated biphenyl was pre-treated with phenolic resin to a thickness of 0.25 m7! A laminated product was obtained in the same manner as in Example 1 by impregnating a piece of linter paper of t.
Claims (1)
ムアルデヒド樹脂、フェノールホルムアルデヒド樹脂及
びエポキシ樹脂からなる熱硬化性樹脂組成物100部に
対し、有機含リン化合物5〜50部及び有機含ハロゲン
化合物5〜60部を配合してなる樹脂混合物を積層品基
材に塗布含浸せしめ、これを所要枚数重ね、加熱加圧す
ることを特徴とする難燃性熱硬化性樹脂積層品の製造方
法。1 5 to 50 parts of an organic phosphorus-containing compound and 5 to 60 parts of an organic halogen-containing compound to 100 parts of a thermosetting resin composition consisting of a resol-type phenol-modified aromatic hydrocarbon formaldehyde resin, a phenol formaldehyde resin, and an epoxy resin. 1. A method for producing a flame-retardant thermosetting resin laminate, which comprises coating and impregnating a laminate base material with a resin mixture prepared by blending the above, stacking the required number of sheets, and heating and pressurizing them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3232275A JPS5929430B2 (en) | 1975-03-19 | 1975-03-19 | Manufacturing method of thermosetting resin products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3232275A JPS5929430B2 (en) | 1975-03-19 | 1975-03-19 | Manufacturing method of thermosetting resin products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51107372A JPS51107372A (en) | 1976-09-22 |
| JPS5929430B2 true JPS5929430B2 (en) | 1984-07-20 |
Family
ID=12355691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3232275A Expired JPS5929430B2 (en) | 1975-03-19 | 1975-03-19 | Manufacturing method of thermosetting resin products |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5929430B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6079063A (en) * | 1983-10-07 | 1985-05-04 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and production thereof |
-
1975
- 1975-03-19 JP JP3232275A patent/JPS5929430B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51107372A (en) | 1976-09-22 |
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