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JPS5931128B2 - floating magnetic head - Google Patents
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JPS5931128B2 - floating magnetic head - Google Patents

floating magnetic head

Info

Publication number
JPS5931128B2
JPS5931128B2 JP8538175A JP8538175A JPS5931128B2 JP S5931128 B2 JPS5931128 B2 JP S5931128B2 JP 8538175 A JP8538175 A JP 8538175A JP 8538175 A JP8538175 A JP 8538175A JP S5931128 B2 JPS5931128 B2 JP S5931128B2
Authority
JP
Japan
Prior art keywords
magnetic head
floating
slider
conductor
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8538175A
Other languages
Japanese (ja)
Other versions
JPS529417A (en
Inventor
洋 土屋
吉雄 郷原
亘 早川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8538175A priority Critical patent/JPS5931128B2/en
Publication of JPS529417A publication Critical patent/JPS529417A/en
Publication of JPS5931128B2 publication Critical patent/JPS5931128B2/en
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/31Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3103Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Magnetic Heads (AREA)

Description

【発明の詳細な説明】 電子計算機の外部記憶装置に用いられる磁気ディスク装
置、磁気ドラム装置などが大容量化高速化、低価格化の
方向に向かうにつれ、これらに用いられる磁気ヘッドも
高密度化、低価格化の方向に進んできている。
[Detailed Description of the Invention] As magnetic disk devices, magnetic drum devices, etc. used in external storage devices for computers move toward larger capacities, faster speeds, and lower prices, the magnetic heads used in these devices also become denser. , and are moving in the direction of lower prices.

そこで最近、メッキ、蒸着、エッチングなど薄膜集積技
術を応用した多素子形磁気ヘッドが発表され、そのいく
つかの形状が提案され公知となつている。これらの集積
形磁気ヘッドは磁気ヘッドの浮動スライダーの端面に多
数個の磁気ヘッド素子を一括して形成でき、巻線などの
手作業も不要であり、微小トラック幅、微小トラックピ
ッチで素子間の特性偏差の少ない安定した低価格の高密
度磁気ヘッドを供給することができる。これらの磁気ヘ
ッド素子と外部記録、再生回路間の信号授受方法として
は、多素子形磁気ヘッドの浮動スライダー上の接続端子
部でリード線を1本ずつ半田付けするか或いは超音波ボ
ンディングして取り出す方法がある。しかし、一つの素
子あたり通常2〜3本のリード線をとり出す必要がある
ため素子数が9〜40と多くなるとリード線の本数が約
20本〜120本と極めて多くなり、接続端子部におけ
る接続工数と、接続後のリード線を錯綜させずに所定の
回路端子に接続させることは極めて困難であり、かつ作
業取扱中での断線不良が多い。そこで、ポリイミド、ポ
リアミド、テフロンなどの可撓性絶縁フィルム上に銅な
どの導電箔をはりつけ所要のリード線本数が得られるよ
うにエッチングによつてパターン形成した可撓性導体を
用いて、磁気ヘッドの接続端子部および回路接続部でそ
れぞれ赤外線光源を相対的に移動しながら加熱して一括
半田付する赤外線リフロー接続法が提案されている。こ
の方法によれば短時間で安定に多数の接続を行うことが
可能になる。ところで、一般に接続端子部と多素子磁気
ヘッド部はメッキ蒸着エッチングなどによつて形成され
るため、製造プロセス上同一平面に形成される。この平
面は通常スライダー浮動面に大略垂直なスライダー端面
が用いられ、従つて可撓性導体はこの端面に平行な方向
に接続されることになる。この可撓性導体を浮動スライ
ダーと平行方向に位置する回路端子に接続するには可撓
性導体を接続端子部と回路端子部の間の適当な位置で大
略900曲げを行なう必要がある。こうした場合浮動ス
ライダーの追従動作巾に曲げ部に繰直し応力が加わつて
疲労断線を発生したり、浮動スライダーの接続部分にモ
ーメントが生じてスライダー姿勢角が大きくずれていま
い浮動不能の状態に陥らしめたりする。従つて安定な浮
動性能を有し、かつ信頼性ある磁気ヘツド構造を得るた
めには多素子磁気ヘツド部の形成されている端面に対し
て大略垂直で、スライダー浮動面に平行な方向に可撓性
導体が接続される接続構造にする必要がある。本発明は
このような薄膜集積技術を応用した多素子磁気ヘツドに
対して安定な浮動性能を有する可撓性導体と接続端子間
の安価で製造容易な3次元接続構造を提供するものであ
る。
Recently, multi-element magnetic heads that utilize thin film integration techniques such as plating, vapor deposition, and etching have been announced, and several shapes have been proposed and are now publicly known. These integrated magnetic heads can form a large number of magnetic head elements at once on the end face of the floating slider of the magnetic head, and do not require manual work such as winding. It is possible to supply a stable, low-cost, high-density magnetic head with little characteristic deviation. The method of transmitting and receiving signals between these magnetic head elements and external recording and reproducing circuits is to solder the lead wires one by one at the connection terminals on the floating slider of the multi-element magnetic head or to take them out by ultrasonic bonding. There is a way. However, since it is usually necessary to take out 2 to 3 lead wires per element, when the number of elements increases from 9 to 40, the number of lead wires becomes extremely large, approximately 20 to 120. It is extremely difficult to connect the lead wires to a predetermined circuit terminal without complicating the connection process, and there are many disconnections during handling. Therefore, a flexible conductor made of conductive foil such as copper is pasted on a flexible insulating film made of polyimide, polyamide, Teflon, etc. and patterned by etching to obtain the required number of lead wires. An infrared reflow connection method has been proposed in which an infrared light source is heated and soldered all at once while moving the infrared light source relative to the connection terminal portion and the circuit connection portion. This method allows a large number of connections to be made stably in a short period of time. Incidentally, since the connecting terminal portion and the multi-element magnetic head portion are generally formed by plating vapor deposition etching or the like, they are formed on the same plane due to the manufacturing process. This plane usually uses a slider end surface that is approximately perpendicular to the slider floating surface, and therefore the flexible conductor is connected in a direction parallel to this end surface. To connect this flexible conductor to a circuit terminal located parallel to the floating slider, it is necessary to bend the flexible conductor approximately 900 degrees at an appropriate position between the connecting terminal portion and the circuit terminal portion. In such cases, repeated stress is applied to the bending part of the floating slider during its follow-up motion, resulting in fatigue breakage, or a moment is generated at the connecting part of the floating slider, causing the slider attitude angle to deviate greatly, making it impossible to float. or Therefore, in order to obtain a magnetic head structure that has stable floating performance and is reliable, it is necessary to flex the slider in a direction that is approximately perpendicular to the end surface where the multi-element magnetic head portion is formed and parallel to the slider floating surface. It is necessary to create a connection structure in which the conductors are connected. The present invention provides an inexpensive, easy-to-manufacture three-dimensional connection structure between a flexible conductor and a connecting terminal that has stable floating performance for a multi-element magnetic head that applies such thin film integration technology.

以下図を用いて詳細に説明する。This will be explained in detail below using the figures.

第1図と第2図に従来の多素子集積形浮動磁気ヘツドの
構造の代表例を示す。磁気ヘツドは浮動スライダー1の
端面2に形成され、記録媒体面3が第1図Uの方向に相
対運動を行なつて情報の記録再生が行なわれる。浮動ス
ライダーはヘツド支持板6に対してジンバルバネや負荷
バネから成る支持バネ5によつて支持固定されており、
支持バネから与えられる負荷荷重とスライダーの浮上刃
の平衡点で決まる浮動空隙が与えられ、又支持バネによ
つて記録媒体面に対する追従性が確保される。第2図は
磁気ヘツド形成端面2の拡大図である。浮動スライダー
がフエライト材から成る例においては、フエライト材上
に導体7および接続端子9が形成され、この導体上に磁
性体8が形成される。このときTがトラツク幅となり、
又、導体7の厚みが磁気ヘツドギヤツプ長となることは
明きらかである。この図からメツキ、蒸着、エツチング
などによつてトラツク幅、トラツクピツチ、ギヤツプ長
の微小な高密度記録に適した磁気ヘツドが多数個同時に
容易に形成されることがわかるであろう。今このような
浮動スライダーの接続端子と外部の回路端子間を可撓性
導体4を通じて接続することを考える。可撓性導体は例
えば厚さ0.02〜0.17!T7!lの可撓性絶縁フ
イルム10上に、厚さ0.02〜0.1m711の導電
箔11を形成したものであり、第1図に示すように支持
バネに沿つてヘツド支持板6の方向に引き出さねばなら
ないため屈曲部12を設けなければならず、相対運動U
に対して浮動スライダーがローリングする方向にはねじ
り剛性が大になり屈曲し難い物となつたり、前述のよう
にこの部分で疲労断線する原因になつたり、モーメント
が働らいて浮動スライダーの磁気デイスク移動に関する
迎角を負にして浮動不能の状態に陥らせたりして信頼性
上大きな問題になる。今、多素子磁気ヘツド部の形成さ
れている端面に対して大略垂直で、スライダー浮動面に
ほぼ平行な方向に可撓性導体が接続される構造が実現で
きれば、屈曲部12をなくすことができ上述の不都合が
さけられる。
FIGS. 1 and 2 show typical examples of the structure of a conventional multi-element integrated floating magnetic head. The magnetic head is formed on the end surface 2 of the floating slider 1, and information is recorded and reproduced by relative movement of the recording medium surface 3 in the direction U in FIG. The floating slider is supported and fixed to the head support plate 6 by a support spring 5 consisting of a gimbal spring or a load spring.
A floating gap is provided which is determined by the load applied by the support spring and the equilibrium point of the floating blade of the slider, and the support spring also ensures followability to the surface of the recording medium. FIG. 2 is an enlarged view of the end face 2 forming the magnetic head. In an example in which the floating slider is made of ferrite material, the conductor 7 and the connecting terminal 9 are formed on the ferrite material, and the magnetic body 8 is formed on this conductor. At this time, T is the track width,
It is also clear that the thickness of the conductor 7 corresponds to the magnetic headgap length. It will be seen from this figure that a large number of magnetic heads suitable for high-density recording with minute track widths, track pitches, and gap lengths can be easily formed simultaneously by plating, vapor deposition, etching, etc. Now, let us consider connecting the connection terminal of such a floating slider and an external circuit terminal through the flexible conductor 4. The thickness of the flexible conductor is, for example, 0.02 to 0.17! T7! A conductive foil 11 with a thickness of 0.02 to 0.1 m 711 is formed on a flexible insulating film 10 of 1.0 m, and is applied along the support spring in the direction of the head support plate 6, as shown in FIG. Since it has to be pulled out, a bent part 12 must be provided, and the relative movement U
In the direction in which the floating slider rolls, the torsional rigidity increases, making it difficult to bend, or as mentioned above, this may cause fatigue breakage at this part, or the moment acts on the magnetic disk of the floating slider. If the angle of attack associated with movement becomes negative, the aircraft may become unable to float, which poses a major problem in terms of reliability. If a structure in which the flexible conductor is connected in a direction approximately perpendicular to the end surface where the multi-element magnetic head is formed and approximately parallel to the slider floating surface can be realized, the bent portion 12 can be eliminated. The above-mentioned disadvantages are avoided.

この実現の方法として、浮動スライダーの一つの端面2
と他の端面13の間を第3図に示すように薄膜集積技術
を応用した製造プロセスで接続し接続端子q上で可撓性
導体を接続する方法が考えられる。このような構造の実
用的な製造プロセスを考えると、フオトレジスト塗布、
パターン形成、蒸着、メツキエツチングの技術上の制約
から2面2,13上の導体を同時に形成することは一般
に困難であり、従つて先にいずれか一面を形成した後、
この面を完全にマスキングして第2の面を形成しなけれ
ばならず、不可能ではないとしても、マスキングの不完
全さから歩留が大幅に下がり、加工時間も上がつて低原
価の多素子磁気ヘツドを形成することが難かしく実用的
でない。そこで本発明による製造容易で低原価の接続構
造を第4図に示す。
As a way to achieve this, one end face 2 of the floating slider
A conceivable method is to connect the end face 13 and the other end face 13 by a manufacturing process applying thin film integration technology as shown in FIG. 3, and connect a flexible conductor on the connecting terminal q. Considering the practical manufacturing process of such a structure, photoresist coating,
It is generally difficult to form conductors on two surfaces 2 and 13 at the same time due to technical limitations in pattern formation, vapor deposition, and metal etching. Therefore, after forming one of the surfaces first,
This surface must be completely masked to form the second surface, and if not impossible, incomplete masking can significantly reduce yield and increase machining time, resulting in lower cost and higher production costs. It is difficult and impractical to form an element magnetic head. FIG. 4 shows an easy-to-manufacture and low-cost connection structure according to the present invention.

多素子磁気ヘツドが端面2に形成され、この磁気ヘツド
の導体群7が浮動スライダーの端面2と背面13の境界
の稜部14まで延ばされる。可撓性導体4の導電箔群1
1も導体群7と同じピツチで、かつほぼ等しい幅に形成
される。この可撓性導体を端面2から幅dだけ突出させ
かつ導体7と導電箔11とが各群のピツチ中心がそれぞ
れ重なるように位置決めする。これらの間を接続するに
は稜部14に沿つて平行に棒状半田15を置き、赤外線
照射しながら半田を溶融した半田は、半田ぬれ性が良い
導体部分に凝集しようとするので、棒状半田の直径を適
当に選ぶことにより、隣接の導体接続部とブリツジする
ことなく、第4図の斜線で示す部分16で接続すること
ができる。ここでdは棒状半田の直径と同等以上の大き
さであることが望ましい。別の方法としては棒状半田を
用いず、予め導体7と導電箔11のいずれか一方、又は
両者の半田接続部付近に蒸着又はメツキなどの方法によ
り半田膜を形成しておいて、第4図と同様にしてピツチ
をそろえた後赤外線等照射を行なつてもよい。又赤外線
照射でなくとも半田が充分熔融加能な温度に加熱できる
ならその他の加熱方法を用いてよいのは勿論である。こ
れらの方法により与えられる磁気ヘツドの構造を第5図
に示す。
A multi-element magnetic head is formed on the end face 2, the conductors 7 of which extend to the ridge 14 at the boundary between the end face 2 and the back surface 13 of the floating slider. Conductive foil group 1 of flexible conductor 4
1 is also formed to have the same pitch as the conductor group 7 and approximately the same width. This flexible conductor is made to protrude from the end face 2 by a width d, and the conductor 7 and the conductive foil 11 are positioned so that the pitch centers of each group overlap with each other. To connect these, a solder bar 15 is placed parallel to the ridge 14, and the solder melted while irradiating infrared rays tends to aggregate on the conductor part with good solder wettability. By appropriately selecting the diameter, the connection can be made at the shaded area 16 in FIG. 4 without bridging with adjacent conductor connections. Here, it is desirable that d be equal to or larger than the diameter of the bar-shaped solder. Another method is to form a solder film in advance on either the conductor 7 or the conductive foil 11, or in the vicinity of the solder joint between the two by a method such as vapor deposition or plating, without using bar-shaped solder, as shown in FIG. After aligning the pitches in the same manner as above, infrared rays or the like may be irradiated. Of course, other heating methods other than infrared irradiation may be used as long as the solder can be heated to a temperature sufficient to melt the solder. The structure of a magnetic head produced by these methods is shown in FIG.

この図かられかるように可撓性導体4は第1回と異つて
極端な屈曲部12をもたず、ゆるい角度でヘツド支持板
の適当な位置に固定されるので導体部分によるねじり剛
性は非常に少なくなり信頼性のある安定な動作が与えら
れるのである。尚、可撓性導体のスライダー背面上の支
持バネ5が作用する部分付近は必要に応じて導電箔ピツ
チを狭くしたり全体の幅を広げたりして干渉する部分を
逃げる構造にすることは任意である。又可撓性導体4を
緊張させた状態でヘツド支持板にとりつけるよりもいく
ぶんたるみをもたせた方が追従動作土更に望ましい。以
上に述べた構造により、磁気ヘツド素子数が9〜40ト
ラツク、これに対する接続端子が20〜120本と極め
て多数の接続も極めて容易かつ短時間で低原価で実現で
き、信頼性ある安定な動作が与えられる。尚、ここに述
べた方法は薄膜集積技術を応用した記録再生ヘツドのみ
ならず、ホール素子ヘツドや磁気抵抗効果素子ヘツドな
どの多トラツクのヘツド実装構造においても適用するこ
とができるものであり、又可撓性導体だけでなく磁気ヘ
ツド素子部も金属箔で作られる多素子形磁気ヘツドやそ
の他、一般に異なる面間に3次元配線接続を必要とする
構造にも適用できるものである。
As can be seen from this figure, unlike the first example, the flexible conductor 4 does not have an extreme bend 12 and is fixed at a suitable position on the head support plate at a gentle angle, so the torsional rigidity due to the conductor portion is As a result, reliable and stable operation can be achieved. In addition, it is optional to narrow the conductive foil pitch or widen the overall width of the flexible conductor near the part on the back surface of the slider where the support spring 5 acts, as necessary, to create a structure in which the interfering part can escape. It is. Also, it is more desirable for the flexible conductor 4 to have some slack than to attach it to the head support plate under tension. With the structure described above, an extremely large number of connections such as 9 to 40 magnetic head elements and 20 to 120 connection terminals can be realized easily, in a short period of time, and at low cost, resulting in reliable and stable operation. is given. The method described here can be applied not only to recording/reproducing heads that apply thin film integration technology, but also to multi-track head mounting structures such as Hall element heads and magnetoresistive element heads. The present invention can be applied to multi-element magnetic heads in which not only the flexible conductor but also the magnetic head element portion is made of metal foil, and other structures that generally require three-dimensional wiring connections between different surfaces.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来提案されていた薄膜磁気ヘツドの導体接続
法による磁気ヘツド構造図、第2図は第1図の接続部の
拡大説明図、第3図は隣接する2つの面に薄膜導体を形
成した磁気ヘツドの接続部説明図、第4図は本発明によ
る接続構造説明図、第5図は第4図による磁気ヘツド構
造図、第6図は第4図による磁気ヘツド導体接続部分の
斜視図である。 1・・・・・・浮動スライダー、2・・・・・・磁気ヘ
ツド形成端面、3・・・・・・磁気デイスク、4・・・
・・・可撓性導体、5・・・・・・支持バネ、6・・・
・・・ヘツド支持板、7・・・・・・導体、8・・・・
・・磁性体、9,9・・・・・・接続端子、10・・・
・・・可撓性絶縁フイルム、11・・・・・・導電箔、
12・・・・・・屈曲部、13・・・・・・スライダー
背面、14・・・・・・スライダー陵部、15・・・・
・・棒状半田、16・・・・・・導体接続部。
Figure 1 is a diagram of the structure of a magnetic head using the previously proposed conductor connection method for thin-film magnetic heads, Figure 2 is an enlarged explanatory diagram of the connecting part in Figure 1, and Figure 3 is a diagram of a thin-film magnetic head with thin-film conductors on two adjacent surfaces. 4 is an explanatory diagram of the connection structure of the formed magnetic head, FIG. 5 is a diagram of the structure of the magnetic head according to FIG. 4, and FIG. 6 is a perspective view of the magnetic head conductor connection portion according to FIG. 4. It is a diagram. DESCRIPTION OF SYMBOLS 1...Floating slider, 2...Magnetic head forming end face, 3...Magnetic disk, 4...
...Flexible conductor, 5...Support spring, 6...
...Head support plate, 7...Conductor, 8...
...Magnetic material, 9,9... Connection terminal, 10...
... Flexible insulating film, 11 ... Conductive foil,
12...Bending portion, 13...Slider back, 14...Slider crest, 15...
...rod-shaped solder, 16...conductor connection part.

Claims (1)

【特許請求の範囲】[Claims] 1 可撓性不導体の帯上に導体列を形成した接続帯と浮
動スライダーの媒体対向面とほゞ垂直の壁面に稜線に沿
つて配置された磁気ヘッドの巻線の接続パッドをもつ浮
動形磁気ヘッドに於て、その壁面にほゞ直角なスライダ
ー背面に沿つて上記接続パッドの近接稜線にのり出して
配置した接続帯を有し、その接続帯の導体列とほゞ直角
にまじわつた壁面の接続パッドをハンダでもつて橋絡す
ることにより電気接続をすることを特徴とする浮動形磁
気ヘッド。
1. A floating type having a connection band in which conductor rows are formed on a flexible nonconductor band, and connection pads for magnetic head windings arranged along a ridge line on a wall surface substantially perpendicular to the medium facing surface of a floating slider. The magnetic head has a connecting band extending from the adjacent ridgeline of the connecting pad along the back surface of the slider that is substantially perpendicular to the wall surface of the magnetic head, and that the connecting band merges with the conductor row at substantially right angles to the connecting band. A floating magnetic head characterized in that electrical connections are made by bridging connection pads on a wall surface with solder.
JP8538175A 1975-07-14 1975-07-14 floating magnetic head Expired JPS5931128B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8538175A JPS5931128B2 (en) 1975-07-14 1975-07-14 floating magnetic head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8538175A JPS5931128B2 (en) 1975-07-14 1975-07-14 floating magnetic head

Publications (2)

Publication Number Publication Date
JPS529417A JPS529417A (en) 1977-01-25
JPS5931128B2 true JPS5931128B2 (en) 1984-07-31

Family

ID=13857146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8538175A Expired JPS5931128B2 (en) 1975-07-14 1975-07-14 floating magnetic head

Country Status (1)

Country Link
JP (1) JPS5931128B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4645280A (en) * 1985-08-08 1987-02-24 Rogers Corporation Solderless connection technique between data/servo flex circuits and magnetic disc heads
US4789914A (en) * 1986-10-28 1988-12-06 International Business Machines Corporation Thin film magnetic read-write head/arm assemblies
US4761699A (en) * 1986-10-28 1988-08-02 International Business Machines Corporation Slider-suspension assembly and method for attaching a slider to a suspension in a data recording disk file
JPH0718007Y2 (en) * 1989-07-07 1995-04-26 アルプス電気株式会社 Magnetic head
US5293288A (en) * 1990-05-17 1994-03-08 Sony Corporation Dual thin-film magnetic head with side surface terminals
US6021022A (en) * 1997-10-27 2000-02-01 Seagate Technology, Inc. Flexure displacement limiter-flex circuit interconnect
WO2009096014A1 (en) * 2008-01-30 2009-08-06 Fujitsu Limited Method of manufacturing head slider

Also Published As

Publication number Publication date
JPS529417A (en) 1977-01-25

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