JPS5932261B2 - Injection deburring method and device that reduce compressed air consumption - Google Patents
Injection deburring method and device that reduce compressed air consumptionInfo
- Publication number
- JPS5932261B2 JPS5932261B2 JP16138080A JP16138080A JPS5932261B2 JP S5932261 B2 JPS5932261 B2 JP S5932261B2 JP 16138080 A JP16138080 A JP 16138080A JP 16138080 A JP16138080 A JP 16138080A JP S5932261 B2 JPS5932261 B2 JP S5932261B2
- Authority
- JP
- Japan
- Prior art keywords
- injection
- compressed air
- deburring
- molded product
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 30
- 238000002347 injection Methods 0.000 title claims description 16
- 239000007924 injection Substances 0.000 title claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 12
- 239000008151 electrolyte solution Substances 0.000 claims description 7
- 239000003792 electrolyte Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Landscapes
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Description
【発明の詳細な説明】
この発明は圧縮空気の消費量を逓減させる噴射パリ取り
方法及び装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an injection deburring method and apparatus that reduce compressed air consumption.
金属との接触部にパリの出ているモールド品、例えば、
第1図に示す未仕上げの半導体容器Cは、第2図に示す
ように、両脚a、bとなるべき部分を残してスリットC
を打抜いたリードフレームAの前記両脚apb間に電子
素子を内蔵させた、例えば合成樹月國のパッケージBを
モールドし、後1個づつに切断し、両脚atbを曲げ、
第1図に示すような製品、半導体容器Cとするが、第2
図に示すようにパッケージBをモールドすると、パッケ
ージBとリードフレームAとの接する部分に不可避的に
パッケージBの材料の合成樹脂のパリ又はフラッシュd
を生じ、これらは後工程のノ・ンダ又は電気メッキの耐
着を阻害するので除去しなげればならない。Molded products that have sharp edges in contact with metal, e.g.
As shown in FIG. 2, the unfinished semiconductor container C shown in FIG.
For example, mold a package B of synthetic Shugekuni, in which an electronic element is built in between the legs apb of the lead frame A punched out, cut it into pieces one by one, bend both legs atb,
The product shown in Fig. 1 is semiconductor container C, but the second
When package B is molded as shown in the figure, the contact area between package B and lead frame A is unavoidably exposed to flash or flash d of synthetic resin, which is the material of package B.
These must be removed because they interfere with the adhesion of solder or electroplating in subsequent steps.
このパリ等を除去する方法としては、プラッタ法、ブラ
スト法等があるが、パッケージBの材料の合成樹脂の密
着度が高いため、ブラック法ではフラッシュは完全に除
去出来ず、ブラスト法で行うと完全に除去出来るが、多
量の圧縮空気を必要とし、圧縮機の設備費、動力費が嵩
む欠点があった。There are methods to remove this flash, such as the platter method and the blast method, but due to the high degree of adhesion of the synthetic resin of package B, the flash cannot be completely removed by the black method, and the blast method is Although it can be completely removed, it requires a large amount of compressed air and has the drawback of increasing equipment and power costs for the compressor.
出願人は上記圧縮空気の量を低減させる方途として、種
々の清浄法との組合わせの実験を行ったところ、事前に
電解剥離法を施すと、圧縮空気の量を、液体ホーニング
加工による単独パリ取りの場合よりも著しく低減できる
ばかりでなく、合成樹脂のパッケージが、従来、多量の
圧縮空気による耐層のため、白色化してしまう欠点も殆
んど起らず、半導体容器Cの仕上り状態も向上させるこ
とができることを発見した。The applicant conducted experiments in combination with various cleaning methods as a way to reduce the amount of compressed air, and found that if electrolytic stripping was applied in advance, the amount of compressed air could be reduced by liquid honing alone. Not only can this be significantly reduced compared to the case where the semiconductor container C is finished, but also because synthetic resin packages are resistant to a large amount of compressed air. I discovered that it can be improved.
この発明はそのような金属との接触部にパリの出ている
モールド品のパリ取りに適するような、圧縮空気の消費
量を逓減させる噴射パリ取ら方法及び装置も提供するの
をその目的とする。It is an object of the present invention to also provide an injection deburring method and apparatus which reduce the amount of compressed air consumed and are suitable for deburring molded products that have deburring in the contact area with metal. .
この発明方法は、金属との接触部にパリの出ているモー
ルド品を、液体ホーニング加工で連続的にパリ取りを行
う工程の前に、該モールド品を一方の極とした電解剥離
法を施す工程を通すことを特徴とする圧縮空気の消費量
を逓減させる噴射パリ取り方法である。The method of this invention involves applying an electrolytic stripping method using the molded product as one pole before the process of continuously deburring the molded product where the contact area with the metal is exposed by liquid honing. This is an injection deburring method that reduces the amount of compressed air consumed.
上記方法を実施する装置の一例を示すと、第4図に示す
ように、一双の無端チェーン1,1′の相対する内側の
リンク2.zに、リードフレームAの各端が挿嵌できる
挾持部3,3′を設けこの挾持部3,3′に、パッケー
ジBとして例えば合成樹脂をモールドしたリードフレー
ムAを挿嵌したものを、連続回転する原動チェーホイル
4及び従動チェーンホイール5,6,7,8.9により
連続的に送られるようにし、先づ、電解液として苛性ソ
ーダの水溶液(30〜45%]が70℃に加温されてい
る電解液槽■に、該リードフレームAが陰極になって通
過するようにした。An example of a device for carrying out the above method is shown in FIG. 4, as shown in FIG. 4, opposing inner links 2. z, there are clamping parts 3, 3' into which each end of the lead frame A can be inserted, and a lead frame A molded with synthetic resin, for example, as a package B, is inserted into the clamping parts 3, 3', and is continuously It is continuously fed by the rotating driving chain wheel 4 and driven chain wheels 5, 6, 7, 8.9, and first, an aqueous solution of caustic soda (30 to 45%) is heated to 70°C as an electrolyte. The lead frame A was passed through the electrolytic solution tank (2) as a cathode.
なお該槽■中、10は陰極シュー、11は陽極、12は
電源を夫々示し、電圧はり、C2〜12V、採用したも
のは6V、電流密度は2〜12 A/ 100 ctr
t、採用したもの5 A/ 100 crtt、電解時
間60秒にした。In the tank 1, 10 is a cathode shoe, 11 is an anode, and 12 is a power source.The voltage beam is C2 to 12V, the one used is 6V, and the current density is 2 to 12 A/100 ctr.
t, the adopted one was 5 A/100 crtt, and the electrolysis time was 60 seconds.
このような条件で電解剥離を受けたリードフレームAを
次に液体ホーニング装置■で液体ホーニングによるパリ
取りを行わせるようにし、その結果、液体ホーニングの
条件は、研削粉はガラスピーズの#180、噴射圧力1
.5贅、ノズル#4が2ケ、距離100mrn、送り速
度10 m /m i n で、パリ取りは完全に行わ
れ、パッケージの白色化も起こらなかった。The lead frame A that has undergone electrolytic peeling under these conditions is then deburred by liquid honing using a liquid honing device (2).As a result, the liquid honing conditions are as follows: Injection pressure 1
.. 5, with two #4 nozzles, a distance of 100 mrn, and a feed rate of 10 m/min, deburring was completed completely and no whitening of the package occurred.
なおこの時の消費圧縮空気量は0.7m37m1nであ
った。The amount of compressed air consumed at this time was 0.7 m37 m1n.
なお第3図中■の部分は被加工リートフレームを一双の
チェーンの挾持部3,3′に供給し、加工済のリードフ
レームを一双のチェーンより9fflす場所を示す。In addition, the part marked ■ in FIG. 3 shows the place where the lead frame to be processed is supplied to the clamping parts 3, 3' of a pair of chains, and the processed lead frame is lifted 9ffl from the pair of chains.
その方法は種々考えられるが、この実施例では、第5図
に示すように一双のチェーン1,1′を受台13上に設
けた、間隔が次第に拡がり又次第に狭くなる一双の案内
溝14.14’にて案内し、間隔を次第に太き(し、挾
持部3,3′より加工済のリードフレームA1 を受台
13に放出するようにし、新しい被加工リートフレーム
A2を間隔が次第に狭くなって行く挾持部3,3′に挿
入するようにしたものである。Various methods can be considered, but in this embodiment, as shown in FIG. 5, a pair of chains 1, 1' are provided on a pedestal 13, and a pair of guide grooves 14 whose spacing gradually widens and gradually narrows. 14', the gap becomes gradually thicker (the processed lead frame A1 is discharged from the clamping parts 3, 3' to the pedestal 13, and the new processed lead frame A2 is placed in the gap gradually narrower). It is designed to be inserted into the holding portions 3, 3' that move forward.
上述の液体ホーニング加工の諸条件を単独液体ホーニン
グ加工の場合の加工条件である。The conditions for the liquid honing process described above are the processing conditions for a single liquid honing process.
研削粉#180、噴射圧力2驚、消費圧縮空気量3.4
4m3/min 1ノズル#4×8ケ、噴射加工距離1
00叫、送り速度2.5m/min と比較して見ると
、噴射空気圧は1.5驚72驚二〇、75.75%、送
り速度は10m/min /2.5m/m1n=4倍、
噴射空気量は0.7 m”/ mi n / 3−44
m3/min 二0.2.20係で圧縮空気の消費量
は電解用の消費電力を差引いても電力量で約10KWH
程で172に低減でき、リードフレームの加工能率は4
倍となり、リードフレーム−個あたりの空なお電解剥離
法には陽極法と陰極法とがあるが、リードフレームのよ
うな場合は陰極法の方が発生ガスはH2の量が多く、金
属の溶出もなく有利であるがフレームが鉄製でない場合
、例えばアルミニュームの場合は陽極法の方がよい。Grinding powder #180, injection pressure 2, compressed air consumption 3.4
4m3/min 1 nozzle #4 x 8 pieces, injection processing distance 1
00, the feed speed is 2.5 m/min, the injection air pressure is 1.5 x 72 x 20, 75.75%, the feed speed is 10 m/min /2.5 m/m1n = 4 times,
Injection air volume is 0.7 m”/min/3-44
m3/min 20.2.20 The compressed air consumption is about 10KWH even after subtracting the power consumption for electrolysis.
It can be reduced to 172 in about 20 minutes, and the lead frame processing efficiency is 4.
There are two types of electrolytic stripping methods: an anode method and a cathode method, but in cases such as lead frames, the cathode method generates a larger amount of H2 gas and is less likely to elute metal. However, if the frame is not made of iron, for example aluminum, the anodic method is better.
なお、パッケージをモールドしたリードフレームのパリ
取り方法を実施する装置の他の一実施例を示すと、第6
図に示すように、一双の無端チェーン15.15’を連
続回転する原動チェーンホイール16、及び従動チェー
ンホイール17,18゜19.20,21、従動チェー
ンホイール18゜19を電解液面22に近く設置して無
端チェーンが電解液面22に近づくようにし、無端チェ
ーンの下側に平行して一定間隔mを有する1付の案内杵
23.24を設け、一部は電解液中に浸るように設け、
一双の無端チェーン15.15’の相対する内側のリン
クの一定ピッチ毎に連結杵26を無端チェーンと直交し
て固定し、電解液槽■の次には液体ホーニング装置■を
設置し、パッケージをモールドしたリードフレームAは
長方形の金属製枠27の縦側28,28に短い金属線3
0を介して例えば溶接により数段に固定し、該金属製枠
27の横側3L 31には該長方形の金属製枠27を含
む平面内にあるように釣部32,32を設け、該釣部3
2の一方は前記連結杵26に引掛け、他方は前記1対の
案内杵23,24の間隔m内に挿入するようにし、電解
液面22上を通過する連結杵26は電池25の陰極端子
33に触れるようにしたもので、第6図中34は陽極、
35は噴射ノズルを夫々示す。In addition, another embodiment of the apparatus for carrying out the deburring method of a lead frame in which a package is molded is shown in the sixth embodiment.
As shown in the figure, a driving chainwheel 16 that continuously rotates a pair of endless chains 15, 15', driven chainwheels 17, 18° 19, 20, 21, and driven chainwheels 18° 19 are placed close to the electrolyte level 22. The endless chain is installed so that it approaches the electrolyte surface 22, and one guide punch 23, 24 with a constant interval m is provided parallel to the bottom of the endless chain, so that a part of the endless chain is immersed in the electrolyte solution. established,
Connecting punches 26 are fixed perpendicularly to the endless chains at regular pitches between the opposing inner links of a pair of endless chains 15 and 15', and a liquid honing device ■ is installed next to the electrolyte tank ■, and the package is The molded lead frame A has short metal wires 3 on the vertical sides 28, 28 of a rectangular metal frame 27.
For example, the metal frame 27 is fixed in several stages by welding, and fishing portions 32, 32 are provided on the side 3L 31 of the metal frame 27 so as to be within a plane that includes the rectangular metal frame 27. Part 3
2 is hooked on the connecting punch 26, and the other is inserted within the interval m between the pair of guide punches 23, 24, and the connecting punch 26 passing above the electrolyte surface 22 is connected to the cathode terminal of the battery 25. 33, 34 in Figure 6 is the anode,
Reference numeral 35 indicates an injection nozzle.
この実施例は斜上のような構成を有するから、電解液槽
■の前方で前記金属製枠27の上方の釣部32を無端チ
ェーン15.15’の連結杵26に引掛け、下方の釣部
32を1対の案内杵23゜24間に入れて供給すると、
金属製枠27に固定されていりリードフレームAは電解
液槽内にては陰極となり電解剥離作用が行われてパリ又
はフラッシュ等は刺離し、或は剥離し易くなり、次いで
液体ホーニング装置■に送られ噴射ノズル35より研削
用スラリーが噴射され、上記パリ又はフラッシュ等が完
全に取去られる。Since this embodiment has a diagonally upward configuration, the upper fishing part 32 of the metal frame 27 is hooked to the connecting punch 26 of the endless chain 15, 15' in front of the electrolyte tank When the part 32 is inserted between a pair of guide punches 23° and 24 and fed,
The lead frame A, which is fixed to the metal frame 27, becomes a cathode in the electrolytic solution tank and performs an electrolytic stripping action, making it easy to puncture or peel off the flash or other particles. Grinding slurry is injected from the injection nozzle 35, and the above-mentioned flash or flash is completely removed.
この発明に係る方法及び装置によると、金属との接触部
にパリの出ているモールド品、例えばパッケージをモー
ルドしたリードフレームのパリ或はフラッシュは最初の
工程の電解剥離法により非常にもろく除去し易い状態と
なるので次工程の液体ホーニング加工の圧縮空気圧は高
圧を用いる必要なく、単独液体ホーニング加工の場合の
75東噴射空気量は175単位リードフレームのパリ取
り用圧縮空気量は5係に低減できるため空気圧縮機の設
備費、動力費が低減でき、延いては上記モールド製品例
えば半導体溶器Cのコストダウンに大いに貢献できる顕
著な効果を有する。According to the method and apparatus according to the present invention, the molded product that has pars in contact with metal, for example, the pars or flash of a lead frame in which a package is molded, can be removed by the electrolytic stripping method in the first step. Since the condition becomes easy, there is no need to use high pressure compressed air pressure for the next process of liquid honing, and the amount of air injected into the east of 75 in the case of single liquid honing is 175 units.The amount of compressed air for deburring the lead frame is reduced to 5 units. As a result, the equipment cost and power cost of the air compressor can be reduced, and this has a remarkable effect that can greatly contribute to cost reduction of the above-mentioned molded product, for example, the semiconductor melter C.
第1図は半導体の斜視図、第2図はパッケージをモール
ドしたリードフレームの一部の斜視図、第3図はこの発
明に係る圧縮空気の消費量を逓減させる噴射パリ取り方
法に使用する装置の一例の正面図、第4図は一双の無端
チェーンにリードフレームが保持される状態を示す斜視
図、第5図は装置中加工済みリードフレームが一双のチ
ェーンより放出され、新しい被力旺リードフレームが一
双のチェーンに装填される受台の部分の平面図、第6図
は他の実施例の正面図、第1図はリードフレームの取付
枠の斜視図、第8図は第6図中■−■線に沿って見た縦
断側面図を夫々示す。Fig. 1 is a perspective view of a semiconductor, Fig. 2 is a perspective view of a part of a lead frame in which a package is molded, and Fig. 3 is a device used in the injection deburring method for reducing compressed air consumption according to the present invention. A front view of an example, FIG. 4 is a perspective view showing a state in which a lead frame is held by a pair of endless chains, and FIG. FIG. 6 is a front view of another embodiment, FIG. 1 is a perspective view of the lead frame mounting frame, and FIG. 8 is in FIG. 6. A longitudinal side view taken along the line ■-■ is shown, respectively.
Claims (1)
ホーニング加工で連続的にパリ取りを行う工程の前に、
該モールド品を一方の極とした電解剥離法を施す工程を
通すことを特徴とする、圧縮空気の消費量を逓減させる
噴射パリ取り方法。 2 電解液槽■とホーニング加工装置■とを並設し、該
電解液槽■の上方より該ホーニング加工装置■中を貫い
て、互に平行して連続回転する1双の無端チェーンを設
け、該チェーン間にて、金属との接触部にパリの出てい
るモールド品Aを保持するようにし、該無端チェーンに
より、モールド品Aは電解液槽I中において、一方の極
となって電解液に浸って通過するように設け、次いで液
体ホーニング加工装置■の噴射ノズルの前を通過するよ
うにしたことを特徴とする、圧縮空気の消費量を逓減さ
せる噴射パリ取り装置。[Claims] 1. Before the process of continuously deburring a molded product that has deburrs in the contact area with metal by liquid honing,
An injection deburring method for gradually reducing compressed air consumption, characterized by passing through a step of applying an electrolytic stripping method using the molded product as one pole. 2. An electrolytic solution tank (■) and a honing device (■) are installed side by side, and a pair of endless chains that continuously rotate in parallel to each other are provided, passing through the honing device (■) from above the electrolytic solution tank (■), Between the chains, the molded product A, which has a sharp edge in contact with the metal, is held, and the endless chain allows the molded product A to serve as one pole in the electrolytic solution tank I, and to absorb the electrolytic solution. An injection deburring device for gradually reducing consumption of compressed air, characterized in that the injection deburring device is provided so as to be immersed in and passed through, and then passed in front of an injection nozzle of a liquid honing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16138080A JPS5932261B2 (en) | 1980-11-18 | 1980-11-18 | Injection deburring method and device that reduce compressed air consumption |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16138080A JPS5932261B2 (en) | 1980-11-18 | 1980-11-18 | Injection deburring method and device that reduce compressed air consumption |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5789562A JPS5789562A (en) | 1982-06-03 |
| JPS5932261B2 true JPS5932261B2 (en) | 1984-08-07 |
Family
ID=15733984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16138080A Expired JPS5932261B2 (en) | 1980-11-18 | 1980-11-18 | Injection deburring method and device that reduce compressed air consumption |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5932261B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61181978U (en) * | 1985-04-24 | 1986-11-13 |
-
1980
- 1980-11-18 JP JP16138080A patent/JPS5932261B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61181978U (en) * | 1985-04-24 | 1986-11-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5789562A (en) | 1982-06-03 |
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