JPS5941573B2 - laminated material - Google Patents
laminated materialInfo
- Publication number
- JPS5941573B2 JPS5941573B2 JP7368076A JP7368076A JPS5941573B2 JP S5941573 B2 JPS5941573 B2 JP S5941573B2 JP 7368076 A JP7368076 A JP 7368076A JP 7368076 A JP7368076 A JP 7368076A JP S5941573 B2 JPS5941573 B2 JP S5941573B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- acrylate
- coating
- protective layer
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002648 laminated material Substances 0.000 title description 5
- 239000010410 layer Substances 0.000 claims description 45
- 239000011241 protective layer Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 150000002736 metal compounds Chemical class 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 229920001577 copolymer Polymers 0.000 claims description 7
- 238000000576 coating method Methods 0.000 description 25
- 238000000034 method Methods 0.000 description 22
- 239000011248 coating agent Substances 0.000 description 20
- -1 tributyl phosphate) Chemical class 0.000 description 12
- 239000010408 film Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000001035 drying Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 239000000839 emulsion Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 238000004898 kneading Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- 239000008199 coating composition Substances 0.000 description 4
- 239000004816 latex Substances 0.000 description 4
- 229920000126 latex Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 150000003440 styrenes Chemical class 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 150000001253 acrylic acids Chemical class 0.000 description 2
- 150000008360 acrylonitriles Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005661 hydrophobic surface Effects 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 239000010887 waste solvent Substances 0.000 description 2
- POTYORUTRLSAGZ-UHFFFAOYSA-N (3-chloro-2-hydroxypropyl) prop-2-enoate Chemical compound ClCC(O)COC(=O)C=C POTYORUTRLSAGZ-UHFFFAOYSA-N 0.000 description 1
- MRIKSZXJKCQQFT-UHFFFAOYSA-N (3-hydroxy-2,2-dimethylpropyl) prop-2-enoate Chemical compound OCC(C)(C)COC(=O)C=C MRIKSZXJKCQQFT-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- SYENVBKSVVOOPS-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butyl prop-2-enoate Chemical compound CCC(CO)(CO)COC(=O)C=C SYENVBKSVVOOPS-UHFFFAOYSA-N 0.000 description 1
- BUZAXYQQRMDUTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yl prop-2-enoate Chemical compound CC(C)(C)CC(C)(C)OC(=O)C=C BUZAXYQQRMDUTM-UHFFFAOYSA-N 0.000 description 1
- RWXMAAYKJDQVTF-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl prop-2-enoate Chemical compound OCCOCCOC(=O)C=C RWXMAAYKJDQVTF-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- WTBIHKZYDZQMQA-UHFFFAOYSA-N 2-(n-ethylanilino)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCN(CC)C1=CC=CC=C1 WTBIHKZYDZQMQA-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- WHBAYNMEIXUTJV-UHFFFAOYSA-N 2-chloroethyl prop-2-enoate Chemical compound ClCCOC(=O)C=C WHBAYNMEIXUTJV-UHFFFAOYSA-N 0.000 description 1
- AEPWOCLBLLCOGZ-UHFFFAOYSA-N 2-cyanoethyl prop-2-enoate Chemical compound C=CC(=O)OCCC#N AEPWOCLBLLCOGZ-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- CTHJQRHPNQEPAB-UHFFFAOYSA-N 2-methoxyethenylbenzene Chemical compound COC=CC1=CC=CC=C1 CTHJQRHPNQEPAB-UHFFFAOYSA-N 0.000 description 1
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 1
- BTOVVHWKPVSLBI-UHFFFAOYSA-N 2-methylprop-1-enylbenzene Chemical compound CC(C)=CC1=CC=CC=C1 BTOVVHWKPVSLBI-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- CUTWSDAQYCQTGD-UHFFFAOYSA-N 2-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)C(C)OC(=O)C=C CUTWSDAQYCQTGD-UHFFFAOYSA-N 0.000 description 1
- KFNGWPXYNSJXOP-UHFFFAOYSA-N 3-(2-methylprop-2-enoyloxy)propane-1-sulfonic acid Chemical compound CC(=C)C(=O)OCCCS(O)(=O)=O KFNGWPXYNSJXOP-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- INRQKLGGIVSJRR-UHFFFAOYSA-N 5-hydroxypentyl prop-2-enoate Chemical compound OCCCCCOC(=O)C=C INRQKLGGIVSJRR-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002567 K2S2O8 Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000002597 Solanum melongena Nutrition 0.000 description 1
- 244000061458 Solanum melongena Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- ZCZFEIZSYJAXKS-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] prop-2-enoate Chemical compound OCC(CO)(CO)COC(=O)C=C ZCZFEIZSYJAXKS-UHFFFAOYSA-N 0.000 description 1
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 description 1
- CXSXCWXUCMJUGI-UHFFFAOYSA-N [methoxy(phenyl)methyl] prop-2-enoate Chemical compound C=CC(=O)OC(OC)C1=CC=CC=C1 CXSXCWXUCMJUGI-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 150000001536 azelaic acids Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- FCSHDIVRCWTZOX-DVTGEIKXSA-N clobetasol Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@H](C)[C@@](C(=O)CCl)(O)[C@@]1(C)C[C@@H]2O FCSHDIVRCWTZOX-DVTGEIKXSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- XWNVSPGTJSGNPU-UHFFFAOYSA-N ethyl 4-chloro-1h-indole-2-carboxylate Chemical compound C1=CC=C2NC(C(=O)OCC)=CC2=C1Cl XWNVSPGTJSGNPU-UHFFFAOYSA-N 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 239000011817 metal compound particle Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical class CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 150000002826 nitrites Chemical class 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 235000019394 potassium persulphate Nutrition 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910021487 silica fume Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 229910001935 vanadium oxide Inorganic materials 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C1/00—Photosensitive materials
- G03C1/76—Photosensitive materials characterised by the base or auxiliary layers
- G03C1/7614—Cover layers; Backing layers; Base or auxiliary layers characterised by means for lubricating, for rendering anti-abrasive or for preventing adhesion
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
本発明は積層材料に関するもので、更に詳しくは元系溶
媒により保護層を設けた金属又は金属化合物層を有し、
支持体の表面に感光性記録層を設けた事を特徴とする積
層材料に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laminated material, more specifically, it has a metal or metal compound layer provided with a protective layer using a base solvent,
The present invention relates to a laminated material characterized in that a photosensitive recording layer is provided on the surface of a support.
感光材料に用いられる高分子支持体は殆んど全て常温常
湿下で1013Ω以上の表面抵抗率を有している。とこ
ろが常温常湿下で10”3Ω以上の表面抵抗率を有する
様な支持体では、それの製造工程加工工程において、あ
るいは写真フィルムとしての使用時において種々のトラ
ブルが生じる。例えば従来接触摩耗によつて生じた蓄積
静電荷即ち、塵埃の付着、火花放電による引火性物質へ
の引火、スタチツクマーク(写真フィルムでは蓄積され
た電荷が放電するとフィルム面は感光し現像した際、点
状ないしは樹枝板状の線班が生じる。これをスタチツク
マークと呼称している。)等の様々なトラブルせ避けら
れなかつた。これら種々の常置をもたらす高分子物質の
帯電防止法としては、例えば従来(1)高分子物質にあ
らかじめ帯電防止剤を混入する練込み型のもの(2)高
分子物質上に帯電防止剤を塗布する塗布型のもの、の2
つの方法がある。Almost all polymer supports used in photosensitive materials have a surface resistivity of 10 13 Ω or more at room temperature and humidity. However, with a support that has a surface resistivity of 10"3Ω or more at room temperature and humidity, various problems occur during the manufacturing process or when using it as a photographic film. For example, in the past, contact wear caused Accumulated static charges that occur, such as adhesion of dust, ignition of flammable materials due to spark discharge, and static marks (in photographic film, when the accumulated charges are discharged, the film surface is exposed to light, and when developed, it becomes dotted or dendritic). Various troubles such as static marks (which are called static marks) cannot be avoided.As methods for preventing static electricity on polymeric materials that cause these various permanent marks, for example, conventional methods (1) ) A kneading type in which an antistatic agent is mixed into the polymeric substance in advance (2) A coating type in which the antistatic agent is applied onto the polymeric substance, (2)
There are two ways.
所がこれらの方法にはそれぞれいくつかの欠点がある。
例えば練込み方法では混入する帯電防止剤の量が多量で
ないと効果がないか又は少なくて、又塗布型の方法では
支持体を溶解もしくは膨潤させる有機溶剤を使用するこ
とが不可欠である為、塗布後、高温での乾燥により支持
体の平面性を害したり、排溶剤、排ガス等の処理上、公
害を発生する原因となるという問題があつた。又、用い
る帯電防止剤についてもアルキルスルホン酸塩や、4級
アンモニウム塩等の様な有機の帯電防止剤を用いた場合
は表面抵抗率の湿度依存性が大きく、湿度が低くなると
乾燥により吸着水の放出が起きて極端に表面抵抗率が大
きくなり、帯電防止機能を失なつてしまう、という欠点
があつた。However, each of these methods has some drawbacks.
For example, in the kneading method, the antistatic agent must be mixed in a large amount to be ineffective or ineffective, and in the coating method, it is essential to use an organic solvent that dissolves or swells the support. Thereafter, there were problems in that drying at high temperatures impairs the flatness of the support and caused pollution in the treatment of waste solvents, exhaust gases, and the like. In addition, when using an organic antistatic agent such as an alkyl sulfonate or a quaternary ammonium salt, the surface resistivity is highly dependent on humidity, and when the humidity is low, adsorption of water increases due to drying. The drawback was that the surface resistivity was extremely high due to the release of ions, and the antistatic function was lost.
金属化合物を用いたものについては、塗布又は練込時に
有機溶剤を使用する為、上記の様な排溶剤による公害上
の問題がつねにつきまとつている。又これらは、いずれ
も金属化合物の粒子が分散した形をとつて層を形成して
いる為、塗布又は練込量を多くしないと導電性が悪く、
帯電防止効果がおちる。かつ又、粒子が分散している為
、透明性は良好でない等の難点があつた。Products using metal compounds use organic solvents during coating or kneading, so they always pose the above-mentioned pollution problem due to waste solvents. In addition, since all of these have a layer formed by dispersing metal compound particles, they have poor conductivity unless the amount of coating or kneading is increased.
The antistatic effect deteriorates. In addition, since the particles were dispersed, there were problems such as poor transparency.
この様に塗布方法を用いるもの、練込み方法を用いるも
のはいずれも種種の欠点を有していた。ところでこれら
の欠点を有しない方法として分野は異るが、最近、金属
や金属化合物を溶剤を用いないで薄く一様な連続相とし
て、形成させる方法とくに金属、金属化合物たとえば金
属酸化物、合金などを真空下で支持体上に沈着させる所
謂真空蒸着法がある。真空蒸着法によつて形成させた蒸
着層からなる帯電防止法としては、例えば、電子ビーム
記録材料の帯電防止に金属を蒸着したものがある。Both those using the coating method and those using the kneading method have various drawbacks. By the way, methods that do not have these drawbacks have recently been developed, although in different fields, methods of forming metals and metal compounds as a thin, uniform continuous phase without using solvents, especially methods for forming metals and metal compounds such as metal oxides and alloys. There is a so-called vacuum evaporation method in which the material is deposited on a support under vacuum. As an antistatic method using a deposited layer formed by a vacuum deposition method, for example, there is a method in which a metal is deposited to prevent charging of an electron beam recording material.
(必要ならば、英国特許第1340403号、米国特許
第3336596号など参照。)最近になり、この様な
蒸着法を写真記録用材料の帯電防止法として用いる試み
もなされはじめた。これらの蒸着法により写真記録用材
料として用いる方法の一つとしては写真乳剤層と支持体
の間に金属又は金属化合物蒸着層を設ける方法が行なわ
れていた。(例えば特開昭49−51930号)しかし
これらは金属又は金属化合物蒸着層と写真乳剤層の密着
性が充分でない。即ち一般に写真処理として行なわれる
現像、定着、水洗等のウエツト処理の際に乳剤層が剥離
してしまうという欠点を有していた。そこでこれらの欠
点を改良する為に支持体の片方に無機物からなる保護層
をもつた導電層を設け、その反対側に下塗り層と乳剤層
を設けくという方法があつた。しかしここで用いられて
いる導電層の保護層は金属ハロゲン化物を用いて真空蒸
着法により得られるものである。(If necessary, refer to British Patent No. 1,340,403, US Pat. No. 3,336,596, etc.) Recently, attempts have been made to use such a vapor deposition method as an antistatic method for photographic recording materials. One method of using these vapor deposition methods as a photographic recording material is to provide a metal or metal compound vapor deposited layer between the photographic emulsion layer and the support. (For example, JP-A-49-51930) However, in these methods, the adhesion between the metal or metal compound vapor-deposited layer and the photographic emulsion layer is not sufficient. That is, it has the disadvantage that the emulsion layer peels off during wet processing such as development, fixing, and water washing, which are generally carried out as photographic processing. In order to overcome these drawbacks, a method has been developed in which a conductive layer with a protective layer made of an inorganic material is provided on one side of the support, and an undercoat layer and an emulsion layer are provided on the opposite side. However, the protective layer of the conductive layer used here is obtained by vacuum evaporation using a metal halide.
従つてコスト的にはさらに高価なものとなる。又現像処
理をする前迄は導電層の経時による酸化の為、表面抵抗
率の増加を防止する働らきをもつているが、現像処理後
は導電層は酸化されて、表面抵抗は増大するという欠点
を有していた。又この保護層は金属ハロゲン化物である
為に蒸着膜を厚くすると不透明になる。従つて実際には
500λ以下の膜厚になつている。しかしこの様な薄膜
では化学的及び物理的強度が充分でない。即ち化学的に
は、非常に酸、アルカリ等に対して浸透性が著るしく蒸
着層を劣化させる。物理的には摩擦等により保護層がと
れ易く、蒸着層の保護の働らきをしない等の為に表面抵
抗率の増大をきたす等の欠点を有していた。本発明者は
上述した様な事情を考慮し、蒸着層に保護層を設ける場
合の、特に蒸着法でなくコーテイングによる方法につい
て研究をした結果、新規且つ有効な保護層組成物を見出
し本発明をなすに致つたものである。Therefore, the cost becomes even more expensive. In addition, before development, the conductive layer is oxidized over time and has the function of preventing an increase in surface resistivity, but after development, the conductive layer is oxidized and the surface resistance increases. It had drawbacks. Moreover, since this protective layer is a metal halide, it becomes opaque when the thickness of the deposited film is increased. Therefore, the actual film thickness is 500λ or less. However, such thin films do not have sufficient chemical and physical strength. That is, chemically, it is extremely permeable to acids, alkalis, etc. and deteriorates the deposited layer. Physically, the protective layer tends to come off due to friction, etc., and since it does not protect the deposited layer, it has the disadvantage of increasing surface resistivity. Taking into consideration the above-mentioned circumstances, the present inventor conducted research on a method of providing a protective layer on a vapor-deposited layer, particularly by coating rather than vapor deposition, and as a result, discovered a new and effective protective layer composition and developed the present invention. It was perfect for eggplant.
即ち本発明の目的は第一にコーテイング法による有機層
からなる保護層を設けることによりコスト的に非常に安
価である積層材料を提供することである。本発明の第2
はコーテイング法による為蒸着法に比して高速塗布が可
能である積層材料の製造法を提供するものである。第3
は非常に透明度の高い保護層組成物を提供するものであ
る。第4は耐摩耗性が非常に秀れた保護層組成物を提供
するものである。第5は金属又は金属化合物層の酸化を
防止する保護層組成物を提供するものである。第6は金
属又は金属化合物蒸着層の導電性を僅かしか低下させな
い保護層組成物を提供するものである。第7は化学的(
酸やアルカリに対して)、物理的に安定な保護層組成物
を提供するものである。That is, the object of the present invention is first to provide a laminated material that is extremely inexpensive in terms of cost by providing a protective layer consisting of an organic layer by a coating method. Second aspect of the present invention
provides a method for manufacturing a laminated material that uses a coating method and can therefore be applied at a higher speed than the vapor deposition method. Third
provides a highly transparent protective layer composition. The fourth objective is to provide a protective layer composition that has excellent abrasion resistance. A fifth object is to provide a protective layer composition that prevents oxidation of a metal or metal compound layer. A sixth object is to provide a protective layer composition that only slightly reduces the conductivity of the metal or metal compound deposited layer. The seventh is chemical (
This provides a physically stable protective layer composition (with respect to acids and alkalis).
第8は蒸着層との密着が非常に秀れた保護層組成物を提
供するものである。第9は水系コーテイングが可能で、
溶剤排気による公害の問題がない。本発明の上記の目的
は、カルボキシル基を含有するアクリレート系ラテック
スを金属又は金属化合物層の上に直接塗設することによ
り、蒸着層の酸化防止、耐摩耗性、及び現像、定着、水
洗等の写真処理によつても前述の金属を含む蒸着層を保
護し、且つ導電性を低下させない保護層を与えることが
見出された。本発明に於いて特に強調したいのは、前記
組成物を、厚み100λ〜1μ好ましくは1000λ〜
7000λの範囲において設けることである。The eighth object is to provide a protective layer composition that has excellent adhesion to the vapor deposited layer. No. 9, water-based coating is possible.
There is no problem of pollution caused by solvent exhaust. The above object of the present invention is to prevent oxidation, wear resistance, and improve development, fixing, water washing, etc. of the vapor deposited layer by directly coating the acrylate latex containing a carboxyl group on the metal or metal compound layer. It has been found that photographic processing can also provide a protective layer that protects the metal-containing deposited layer and does not reduce conductivity. What is particularly important to emphasize in the present invention is that the composition has a thickness of 100λ to 1μ, preferably 1000λ to
It is to be provided within a range of 7000λ.
又蒸着層の表面抵抗率が102〜104Ωの範囲にある
場合その保護層の上からの見かけの表面抵抗率は、温湿
度に関係なく103〜106Ωの範囲に入るもので、そ
の値は写真処理における摩擦、空気酸化等によつて変化
するものでない。従つて上記保護層は写真記録材料の帯
電防止層の保護層として充分に適用されうるものである
。本発明に用いられるカルボキシル基含有アクリレート
系共重合体、とはカルボキシル基を有する単位を約15
重量%以下を含有するアクリレート系共重合体をいう。In addition, when the surface resistivity of the vapor deposited layer is in the range of 102 to 104 Ω, the apparent surface resistivity from above the protective layer is in the range of 103 to 106 Ω, regardless of temperature and humidity, and its value is determined by photographic processing. It does not change due to friction, air oxidation, etc. Therefore, the above-mentioned protective layer can be satisfactorily applied as a protective layer for an antistatic layer of a photographic recording material. The carboxyl group-containing acrylate copolymer used in the present invention has about 15 carboxyl group-containing units.
An acrylate copolymer containing % by weight or less.
特に取扱い易さの点からラテツクスの形のものが好まし
い。例えばカルボキシル基を有する単量体とはアクリル
酸、メタクリル酸、イタコン酸、アクリロキシプロピオ
ン酸、あるいは無水マレイン酸の如き、単量体と付加重
合性単量体の一種以上とを共重合させたものである。Particularly preferred is a latex form from the viewpoint of ease of handling. For example, a monomer having a carboxyl group is a monomer copolymerized with one or more addition-polymerizable monomers such as acrylic acid, methacrylic acid, itaconic acid, acryloxypropionic acid, or maleic anhydride. It is something.
共重合に用いられる単量体としては、例えばアクリル酸
エステル、メタクリル酸エステル、アクリル酸アミド、
メタクリル酸アミド、ビニルエーテル類(例えばメチル
ビニルエーテル、ビニルブチルエーテル)ビニルエステ
ル(例えば酢酸ビニル、プロピオン酸ビニル)スチレン
類、α−β不胞和二トリル、N−ビニル化合物(例えば
ビニルカルバゾール)等、通常の単量体が用いられる。Examples of monomers used in copolymerization include acrylic esters, methacrylic esters, acrylic amide,
Methacrylic acid amide, vinyl ethers (e.g. methyl vinyl ether, vinyl butyl ether) vinyl esters (e.g. vinyl acetate, vinyl propionate) styrenes, α-β unsulfated nitrile, N-vinyl compounds (e.g. vinyl carbazole), etc. Monomers are used.
例えばアクリル酸エステルとしてはアクリル酸エチル、
アクリル酸プロピル、アクリル酸ブチル、アクリル酸ア
ミル、アクリル酸エチルヘキシル、アクリル酸オクチル
、アクリル酸−t−オクチル、2−メトキシエチルアク
リレート、2−ブトキシエチルアクリレート、2−フエ
ノキシエチルアクリレート、クロルエチルアクリレート
、ヒドロキシエチルアクリレート、シアノエチルアクリ
レート、ヒドロキシプロピルアクリレート、ジメチルア
ミノエチルアクリレート、2・2−ジメチルヒドロキシ
プロピルアクリレート、5−ヒドロキシペンチルアクリ
レート、ジエチレングリコールモノアクリレート、トリ
メチロールプロパンモノアクリレート、ペンタエリスリ
トールモノアクリレート、グリシジルアクリレート、2
−ヒドロキシー3−クロロプロピルアクリレート、ベン
ジルアクリレート、メトキシベンジルアクリレート、フ
ルフリルアクリレート、テトラヒドロフルフリルアクリ
レート、フエニルアクリレート等。メタクリル酸エステ
ルとしては(例えばメチルメタアクリレート、エチルメ
タアクリレート、プロピルメタクリレート、イソプロピ
ルメタクリレート、アミルメタクリレート、ヘキシルメ
タクリレート、シクロヘキシルメタクリレート、オクチ
ルメタクリレート、スルホプロピルメタクリレート、N
−エチル−N−フエニルアミノエチルメタクリレート、
エチレングリコールモノメタクリレート、2−ヒドロキ
シエチルメタクリレート、その他)、スチレン類として
は、、スチレン、メチルスチレン、クロルスチレン、メ
トキシスチレン、ジメチルスチレンなど。α・β−不飽
和二トリルとしてはアクリロユトリル、メタクリロニト
リルなど、の中から選ぶことができる。For example, acrylic esters include ethyl acrylate,
Propyl acrylate, butyl acrylate, amyl acrylate, ethylhexyl acrylate, octyl acrylate, t-octyl acrylate, 2-methoxyethyl acrylate, 2-butoxyethyl acrylate, 2-phenoxyethyl acrylate, chloroethyl acrylate , hydroxyethyl acrylate, cyanoethyl acrylate, hydroxypropyl acrylate, dimethylaminoethyl acrylate, 2,2-dimethylhydroxypropyl acrylate, 5-hydroxypentyl acrylate, diethylene glycol monoacrylate, trimethylolpropane monoacrylate, pentaerythritol monoacrylate, glycidyl acrylate, 2
-Hydroxy-3-chloropropyl acrylate, benzyl acrylate, methoxybenzyl acrylate, furfuryl acrylate, tetrahydrofurfuryl acrylate, phenyl acrylate, etc. Examples of methacrylic acid esters include methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, amyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, octyl methacrylate, sulfopropyl methacrylate, N
-ethyl-N-phenylaminoethyl methacrylate,
ethylene glycol monomethacrylate, 2-hydroxyethyl methacrylate, etc.), styrenes include styrene, methylstyrene, chlorostyrene, methoxystyrene, dimethylstyrene, etc. The α/β-unsaturated nitrile can be selected from acryloytrile, methacrylonitrile, and the like.
これらの中から、目的に応じて種々の組合せが選ばれる
か、たとえば重量で、カルボキシルを含有する単量体が
0.8ないし約15%、とくに2ないし8%のもの、ア
クリル酸エステル又はメタクリル酸エステルが約40な
いし95%、スチレン類0〜約50%、不飽和二トリル
がO〜約50%の範囲のものを選ぶと好都合である。Among these, various combinations are selected depending on the purpose, for example, those containing 0.8 to about 15%, especially 2 to 8%, by weight of carboxyl-containing monomers, acrylic esters or methacrylates. Conveniently, the selection ranges from about 40 to 95% acid esters, from 0 to about 50% styrenes, and from O to about 50% unsaturated nitrites.
アクリレートの中でもメチルアクリレートが70%以上
のものは皮膜硬度が大で、その結果、耐摩耗性、耐スリ
傷性、耐薬品性(酸、アルカリ)、透明性も特に秀れて
いる。しかし95%以上になると、蒸着層との密着力が
低下し、その結果、上記耐性は低下する傾向にある。Among acrylates, those containing 70% or more of methyl acrylate have high film hardness, and as a result, have particularly excellent abrasion resistance, scratch resistance, chemical resistance (acid, alkali), and transparency. However, when it exceeds 95%, the adhesion with the vapor deposited layer decreases, and as a result, the above-mentioned resistance tends to decrease.
その他共重合体を形成する場合に、架橋性付与剤として
アクリルアミド、N−メチロールアクリルアミド、グリ
シジルメタアクリレート、ヒドロキシメチル化ジアセト
ンアクリルアミド等を10%程度迄含ませることもでき
る。これらの共重合体の合成にあたつては良く知られて
いる乳化重合法が特に好都合に用いられる。又その他に
架橋性ポリマーとしてメラミン−ホルムアルデヒド樹脂
等を用いてもよい。その添加量は例えばメタクリル酸メ
チルに対し10%以内が好ましい。In addition, when forming a copolymer, up to about 10% of acrylamide, N-methylolacrylamide, glycidyl methacrylate, hydroxymethylated diacetone acrylamide, etc. can be included as a crosslinking agent. In the synthesis of these copolymers, the well-known emulsion polymerization method is particularly advantageously used. In addition, melamine-formaldehyde resin or the like may be used as a crosslinkable polymer. The amount added is preferably within 10% relative to methyl methacrylate, for example.
それ以上用いると蒸着膜に対する密着性が低下するばか
りでなく長い反応時間が必要な為に塗布乾燥速度が低下
する傾向にある。If it is used in excess of this amount, not only does the adhesion to the deposited film deteriorate, but also the coating drying rate tends to decrease because a long reaction time is required.
本発明に用いられる溶媒としては水が用いられる。Water is used as a solvent in the present invention.
本発明の塗液にはその他、所望により各種の添加剤を加
える事ができる。この様な添加剤としては可塑剤例えば
リン酸エステル(リン酸トリブチル等)、フタル酸エス
テル(例えばフタル酸ジブチル)、塗布助剤例えば少量
のアルコール類(例えばメチルアルコール、エチルアル
コール等)、その他塗液はマイクロシリカ、アルミニウ
ムステアレート、有機ベントナイト、オルベンタルクの
如き増粘剤を含むことが出来る。これらの添加剤が通常
当業界で知られた技術手都により添加されることはいう
までもない。In addition, various additives can be added to the coating liquid of the present invention as desired. Such additives include plasticizers such as phosphate esters (such as tributyl phosphate), phthalates (such as dibutyl phthalate), coating aids such as small amounts of alcohols (such as methyl alcohol, ethyl alcohol, etc.), and other coating agents. The liquid may contain thickening agents such as microsilica, aluminum stearate, organic bentonite, orbentalc. It goes without saying that these additives are generally added by technical means known in the art.
一般にこれら本発明の塗液の製造法は特に制限をうけず
通常当業界で知られたいかなる製造方法でも行なうこと
が出来る。該塗布液の塗布方法としては、一般の塗布機
、グラビア印刷機等が塗布精度の点から好ましい。本発
明に用いられる写真感光材料としては、銀塩乳剤、ジア
ゾ、感光性ポリマー等があるが、これらの塗布量、用い
方、処理法等については、菊地 写真化学 共立出版1
973K0sar1LightSensitiveSy
stems゛JOhnWiley&SOnsl965、
NewYOrk等に詳しく述べてある。又本発明に用い
られる支持体とはセルロースエステル類、例えばセルロ
ースナイトレート及びセルロースアセテート;ポリ(ビ
ニルアセタール)重合体、ポリカーボナート類、ポリエ
ステル類、例えばポリオキシアルコールの様な2官能性
ポリオキシ有機化合物と縮合した2官能性の、飽和及び
不飽和の、脂肪族及び芳香族ジカルボン酸の線状ポリエ
ステル重合体、例えばアルキレングリコール及び(又は
)グリセロールとテレフタル酸、イソフタル酸、アジピ
ン酸、マレイン酸、フマル酸及び(又は)アゼライン酸
のポリエステルリポリハイハイドロカーボン類、例えば
ポリビニルクロリド:及びハイドロカーボン重合体、例
えばポリスチレン及びポリオレフイン、特に炭素原子2
〜20個を有するオレフインの重合体が含まれる。上記
の重合体は、フレキシブルなフイルムあるいはその他の
単一な絶縁性支持体の形で利用してもよく、あるいはガ
ラス、紙及び重合体絶縁性支持体上の被膜として利用し
てもよい。被覆された支持体のうちで好ましいものは、
α−オレフイン樹脂を被覆した紙の支持体、例えばポリ
エチレン、ポリプロピレ 】ン、エチレン−ブテン共重
合体等を被覆した紙の支持体である。親水性コロイド(
例えば写真乳剤)を被覆すべき支持体の表面が疎水性を
具えている場合にはその疎水性表面に対する親水性コロ
イド皮膜の粘着力を改良する為に、通常、活性化処理
5されるか又は下塗り層を被覆する。例えば、ポリエチ
レンテレフタレート支持体の様なポリエステルフイルム
支持体は、通常、アクリラート低級(C4以下)アルキ
ルエステル、ビニリデンハライド、アクリル酸及びアク
リルニトリルなどから選ばれたターポリマ一例えばビニ
リデンクロリド、アクリル酸及びアクリルニトリル又は
メチルアクリレート、のターポリマ一から構成されてな
る下塗り層を具えている。ところで金属を含む層は、上
記の様な下塗り層上に沈着せしめることが出来、.ある
いは重合体フイルムの疎水性表面に直接沈着せしめるこ
とができる。それというのも、導電性層を形成する為に
利用し得る金属、金属化合物は上記の様な支持体の表面
に強固に付着するからである。上述の層は当業者によく
理解されている技 4術手段を用いて支持体上に沈着せ
しめてもよい。本発明における真空蒸着層に用いられる
具体的物質としては、例えばアルミニウム、アンチモン
、ヒ素、ホウ素、カドミウム、クロム、ゲルマニウム、
鉄、マグネシウム、ケイ素、チタン、コバルト、銅、金
、インジウム、イリジウム、鉛、マンガン、モルブデン
、ニツケル、パラジウム、白金、ロジウム、セレン、銀
、タリウム、テルル、スズ、タングステン、バナジウム
、亜鉛、ジルコニウム等及びこれらの合金、あるいは酸
化物、窒化物、ホウ化物、ヨウ化物、炭素化物、硫化物
、塩類、金属どうしの化合物等があげられるがこれらの
中でも本発明に於いて特に好ましいのは金、パラジウム
、酸化チタン、酸化インジウム、酸化錫、酸化バナジウ
ム、酸化ジルコニウムからなる層等であるが、勿論これ
らに限定されるものではない。上記金属又は金属化合物
の層の厚さは30λ〜2000λになされる。又真空蒸
着法としては公知の各種の方法が用いられる。本発明の
塗液組成物は水分散性である為に、排気による公害問題
、爆発の危険性は全くない。In general, the method of manufacturing the coating liquid of the present invention is not particularly limited, and any manufacturing method commonly known in the art can be used. As a method for applying the coating liquid, a general coating machine, a gravure printing machine, etc. are preferable from the viewpoint of coating accuracy. Photographic light-sensitive materials used in the present invention include silver salt emulsions, diazo, photosensitive polymers, etc. For details on coating amounts, usage, processing methods, etc., please refer to Kikuchi Photo Chemistry, Kyoritsu Shuppan 1.
973K0sar1LightSensitiveSy
stems゛JOhnWiley&SOnsl965,
It is described in detail in NewYOrk etc. Supports used in the present invention include cellulose esters such as cellulose nitrate and cellulose acetate; poly(vinyl acetal) polymers, polycarbonates, polyesters, and difunctional polyoxy organic compounds such as polyoxyalcohols. Linear polyester polymers of difunctional, saturated and unsaturated, aliphatic and aromatic dicarboxylic acids condensed with, for example alkylene glycols and/or glycerol with terephthalic acid, isophthalic acid, adipic acid, maleic acid, fumaric acid. polyesters of acids and/or azelaic acids; polyhydrocarbons, such as polyvinyl chloride; and hydrocarbon polymers, such as polystyrene and polyolefins, especially 2 carbon atoms.
Included are polymers of olefins having ~20 olefins. The above polymers may be utilized in the form of flexible films or other single insulating supports, or as coatings on glass, paper, and polymeric insulating supports. Preferred among the coated supports are:
A paper support coated with an α-olefin resin, such as a paper support coated with polyethylene, polypropylene, ethylene-butene copolymer, or the like. Hydrophilic colloid (
When the surface of the support to be coated (e.g. with a photographic emulsion) is hydrophobic, an activation treatment is usually used to improve the adhesion of the hydrophilic colloid film to the hydrophobic surface.
5 or coat with a subbing layer. Polyester film supports, such as polyethylene terephthalate supports, are typically made from terpolymers selected from acrylate lower (C4 or less) alkyl esters, vinylidene halides, acrylic acids, and acrylonitriles, such as vinylidene chloride, acrylic acids, and acrylonitriles. or a terpolymer of methyl acrylate. However, a metal-containing layer can be deposited on the undercoat layer as described above. Alternatively, it can be deposited directly onto the hydrophobic surface of the polymer film. This is because the metals and metal compounds that can be used to form the conductive layer firmly adhere to the surface of the support as described above. The layers described above may be deposited on the support using techniques well understood by those skilled in the art. Specific substances used in the vacuum-deposited layer in the present invention include, for example, aluminum, antimony, arsenic, boron, cadmium, chromium, germanium,
Iron, magnesium, silicon, titanium, cobalt, copper, gold, indium, iridium, lead, manganese, molybdenum, nickel, palladium, platinum, rhodium, selenium, silver, thallium, tellurium, tin, tungsten, vanadium, zinc, zirconium, etc. and alloys thereof, oxides, nitrides, borides, iodides, carbonides, sulfides, salts, compounds of metals, etc. Among these, particularly preferred in the present invention are gold and palladium. , titanium oxide, indium oxide, tin oxide, vanadium oxide, zirconium oxide, etc., but of course the layer is not limited to these. The thickness of the metal or metal compound layer is between 30λ and 2000λ. Furthermore, various known methods can be used as the vacuum deposition method. Since the coating composition of the present invention is water-dispersible, there is no problem of pollution caused by exhaust gas and no risk of explosion.
又作業環境が良好で設備的にも簡単で安価である。本発
明の塗液組成物は人体皮層への刺激が全くなく、エツチ
ング剤を用いないでも蒸着層と充分な接着強度を与える
。又本発明の塗液を用いた塗布工程は、その乾燥温度に
対して、巾広いラチチユードをもつ、それは工業上、特
に高温塗布操作上、非常に大きな利点でもある。本発明
の塗布組成物により得られた保護層は非常に硬度が大で
あり、1000λ〜7000λ程度の薄い層でもベース
搬送中や、工程中での機械的摩擦に対しても傷がつかず
、蒸着層の導電性を保持する働らきを持つている。さら
に空気等による酸化防止、あるいは現像、水洗、定着等
の一般写真処理等を行なつても保護層は剥離せずに化学
的安定性と蒸着層に対する秀れた定着性を有している為
に蒸着層の導電性を低下させない保護層を提供するもの
である。Moreover, the working environment is good, and the equipment is simple and inexpensive. The coating composition of the present invention causes no irritation to the human skin layer and provides sufficient adhesive strength to the vapor deposited layer without using an etching agent. Furthermore, the coating process using the coating liquid of the present invention has a wide latitude with respect to its drying temperature, which is a very great advantage in industry, especially in high-temperature coating operations. The protective layer obtained using the coating composition of the present invention has extremely high hardness, and even a thin layer of about 1000λ to 7000λ will not be damaged by mechanical friction during base transportation or during the process. It has the function of maintaining the conductivity of the deposited layer. Furthermore, the protective layer does not peel off even when subjected to oxidation prevention using air, etc., or general photographic processing such as development, washing, fixing, etc., and has excellent chemical stability and adhesion to the vapor deposited layer. The present invention provides a protective layer that does not reduce the conductivity of the deposited layer.
又、本発明の塗布組成物はその同存性、経時安定性が秀
れている。Furthermore, the coating composition of the present invention has excellent coexistence and stability over time.
本発明の塗布液組成物は一般に次の如く使用される。つ
まり支持体の裏面に設けた金属又は金属化合物層の上に
直接塗布して、バ一、スクイズロール、又はエアーナイ
フにて必要塗布量に調節し乾燥部にて乾燥され巻取られ
る。この時の乾燥温度は80℃〜160℃、好ましくは
10『C〜140℃で乾燥時間は30秒〜10分である
。性能及びコストの面から好ましくは2分〜5分位であ
る。以下の実施例において行なわれた評価項目と評価方
法は下記の通りである。The coating liquid composition of the present invention is generally used as follows. That is, it is applied directly onto the metal or metal compound layer provided on the back side of the support, adjusted to the required amount using a roll, squeeze roll, or air knife, dried in a drying section, and wound up. The drying temperature at this time is 80°C to 160°C, preferably 10°C to 140°C, and the drying time is 30 seconds to 10 minutes. From the viewpoint of performance and cost, it is preferably about 2 to 5 minutes. The evaluation items and evaluation methods performed in the following examples are as follows.
1.塗膜の引掻硬度試験法(ダイヤ針)
クレメンス型引掻硬度試験器(東洋精機製)を用い、ダ
イヤ針(直径0.05〜)に負荷を加え、試料品を一定
速度で移動させて、試1験面である被覆層を引掻き、そ
の痕跡のつきはじめる点を観察してその時の負荷荷重を
もつて、塗膜の引掻硬度の評価とする。1. Scratch hardness test method for paint film (diamond needle) Using a Clemens type scratch hardness tester (manufactured by Toyo Seiki), a load was applied to the diamond needle (diameter 0.05~) and the sample was moved at a constant speed. The coating layer, which is the test surface, is scratched, and the point at which scratches begin to be observed is observed, and the applied load at that time is used to evaluate the scratch hardness of the coating film.
次に本発明の共重合体の合成例をあげる。Next, a synthesis example of the copolymer of the present invention will be given.
合成例
2.57のソジウムラウリルサルフエートを800CC
の水に希釈し、撹拌器をとりつけたフラスコ80℃に加
熱する。800 CC of sodium lauryl sulfate of Synthesis Example 2.57
of water and heated to 80°C in a flask equipped with a stirrer.
それに1.277のK2S2O8を加え、これにエチル
アクリレート5部、メチルメタアクリレート90部、ア
クリル酸5部を約30分間かかつて加え、混合する。そ
の時、同時に2.57のソジウムラウリルサルフエート
を200CCの水に希釈したものを加える。添加後、更
に80〜82℃で15分間反応させる。その後室温に冷
却し微量の凝固物のみを含む水のゾルを口過する。この
時液のPHは2.9である。ついでこのゾルを希アンモ
ニア水でPH6.Oに調整し、さらに凝固物を沢別する
と良好なラテツクスが得られた。以下に実施例をいくつ
か示すが、以下の具体例における量的関係は全て重量部
を表わすものであ実施例 164μのポリエステルフイ
ルムに酸化インジウム層を600Aの厚みに蒸着した。Add 1.277 parts of K2S2O8 to it, add 5 parts of ethyl acrylate, 90 parts of methyl methacrylate, and 5 parts of acrylic acid for about 30 minutes and mix. At the same time, 2.57 ml of sodium lauryl sulfate diluted in 200 cc of water is added. After the addition, the mixture is further reacted at 80 to 82°C for 15 minutes. Thereafter, it is cooled to room temperature and the water sol containing only a small amount of coagulated material is passed through the mouth. At this time, the pH of the liquid is 2.9. Next, this sol was adjusted to pH 6 with diluted ammonia water. A good latex was obtained by adjusting the amount of O and further removing the coagulated material. Several examples are shown below, but all quantitative relationships in the following specific examples represent parts by weight.Example An indium oxide layer was vapor-deposited to a thickness of 600A on a 164μ polyester film.
その時の表面抵抗率は6.0×102Ωであつた。次に
メチルメタアクリレート/エチルアクリレート/アクリ
ル酸(モル比 90/5/5)からなる組成のラテツク
ス(固形分 40%)10部に水を100部加えて調製
した塗布液をワイヤーバ一方式で塗布し120℃で3分
間乾燥させた。The surface resistivity at that time was 6.0×10 2 Ω. Next, a coating solution prepared by adding 100 parts of water to 10 parts of latex (solid content 40%) consisting of methyl methacrylate/ethyl acrylate/acrylic acid (molar ratio 90/5/5) was applied using a wire bar. and dried at 120°C for 3 minutes.
Claims (1)
ート系共重合体からなる保護層を設けた金属又は金属化
合物層を有し、支持体の表面に感光性記録層を設けたこ
とを特徴とする積層材料。1. A laminate characterized by having a metal or metal compound layer provided with a protective layer made of an acrylate copolymer containing a carpoxyl group on the surface of the support, and a photosensitive recording layer provided on the surface of the support. material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7368076A JPS5941573B2 (en) | 1976-06-22 | 1976-06-22 | laminated material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7368076A JPS5941573B2 (en) | 1976-06-22 | 1976-06-22 | laminated material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52156613A JPS52156613A (en) | 1977-12-27 |
| JPS5941573B2 true JPS5941573B2 (en) | 1984-10-08 |
Family
ID=13525165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7368076A Expired JPS5941573B2 (en) | 1976-06-22 | 1976-06-22 | laminated material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5941573B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2838433B2 (en) * | 1990-08-16 | 1998-12-16 | コニカ株式会社 | Silver halide photographic material |
-
1976
- 1976-06-22 JP JP7368076A patent/JPS5941573B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52156613A (en) | 1977-12-27 |
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