JPS5942066B2 - Rhenium-cobalt alloy contacts - Google Patents
Rhenium-cobalt alloy contactsInfo
- Publication number
- JPS5942066B2 JPS5942066B2 JP50128725A JP12872575A JPS5942066B2 JP S5942066 B2 JPS5942066 B2 JP S5942066B2 JP 50128725 A JP50128725 A JP 50128725A JP 12872575 A JP12872575 A JP 12872575A JP S5942066 B2 JPS5942066 B2 JP S5942066B2
- Authority
- JP
- Japan
- Prior art keywords
- rhenium
- contact
- contacts
- cobalt alloy
- rhodium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Contacts (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】
本発明は主として小型リード継電器のリードスイッチ、
小型継電器およびスイッチ等の比較的接触力の小さい接
点を有する各1種スイッチをもって大型継電器、ランプ
、モーター等の電力を制御する場合に用いられる接点に
関し、特にレニウム−コバルト合金接点に関する。[Detailed Description of the Invention] The present invention mainly relates to a reed switch for a small reed relay,
The present invention relates to contacts used when controlling the power of large relays, lamps, motors, etc. using one type of switch each having contacts with relatively small contact force such as small relays and switches, and particularly relates to rhenium-cobalt alloy contacts.
一般に小型化されたリードスイッチ等においては接触圧
力が小さく、また、厚い接点層を設けることも困難であ
り、接点材料としてタングステンモリブデン等の高融点
金属を用いたとき、接触抵抗の増大を防止することは出
来ない。In general, miniaturized reed switches, etc. have low contact pressure, and it is difficult to provide a thick contact layer, so when a high melting point metal such as tungsten molybdenum is used as the contact material, it is necessary to prevent an increase in contact resistance. I can't do that.
そこで、従来はロジウム等の貴金属のメッキ接点が広く
用いられている。Therefore, conventionally, contacts plated with noble metals such as rhodium have been widely used.
しかるにロジウム接点は雰囲気中に含まれる有機ガスや
表面にあらかじめ吸着されている有機ガスによって接触
抵抗が増大する欠点を有する。However, rhodium contacts have the disadvantage that contact resistance increases due to organic gases contained in the atmosphere or organic gases adsorbed on the surface in advance.
また、鉄、ニッケル等の酸化し易い接点弾条またはリー
ド片上に直接メッキを施すことができず、金、銀、銅等
のメッキ層を一層弁してメッキする必要があり、そのた
め有効なメッキ厚さが減少するとともに、製造上その工
程が複雑となり、接点の加工価格を大きくする欠点を有
する。In addition, it is not possible to directly plate contact strips or lead pieces made of iron, nickel, etc., which are easily oxidized, and it is necessary to apply a plating layer of gold, silver, copper, etc. As the thickness decreases, the manufacturing process becomes complicated and the processing cost of the contact increases.
本発明は上記のような制限された接点加工技術における
欠点を除去し、且つ性能を改善した接点を提供するもの
で、レニウムの成分比が重量比で50〜70%を含むレ
ニウム−コバルト合金接点である。The present invention eliminates the drawbacks of the limited contact processing technology as described above and provides a contact with improved performance, and is a rhenium-cobalt alloy contact containing rhenium in an amount of 50 to 70% by weight. It is.
前述したように、ロジウム接点は有機ガスによって、そ
の接触抵抗が増大し、接点としての機能を大巾に削減さ
れる。As mentioned above, the contact resistance of rhodium contacts increases due to organic gas, and the function as a contact is greatly reduced.
これは白金属金属等遷移金属に共有する特性で、接点面
が不活性雰囲気中で動作する場合を除いて、アーク等に
よって表面の破膜が除去された場合に生ずる現象である
。This is a characteristic shared by transition metals such as platinum metals, and is a phenomenon that occurs when a ruptured film on the surface is removed by an arc or the like, except when the contact surface is operated in an inert atmosphere.
しかるに、レニウム−コバルト合金の場合、レニウムと
コバルトは遷移金属ではないので有機ガスによって接触
抵抗が増大することはない。However, in the case of a rhenium-cobalt alloy, since rhenium and cobalt are not transition metals, the organic gas does not increase the contact resistance.
また、ロジウムの融点は1,966°Cであるのに対し
、レニウムを50〜70%含むコバルト合金の融点は約
2.100〜2,300℃と極めて高い、従って、アー
クによる消耗が少ない。Furthermore, the melting point of rhodium is 1,966°C, whereas the melting point of a cobalt alloy containing 50 to 70% rhenium is extremely high at about 2.100 to 2,300°C, so there is little wear due to arcing.
そこで、上記のレニウム−コバルト合金の接点はロジウ
ム接点と比較し、接点開閉時にアークを発生するような
条件で使用されるときは合金属のアークによる性質の変
化も作用してその寿命が長い。Therefore, compared to rhodium contacts, the rhenium-cobalt alloy contacts have a longer lifespan when used under conditions where arcs are generated when the contacts are opened and closed, due to changes in the properties of the alloy due to the arc.
一般に、金、銀、銅およびタングステン上にレニウムメ
ッキを施した接点は接触抵抗が低く安定し、電流の切断
能力も向上することは知られているが酸化し易い鉄、ニ
ッケル等の合金である接点弾条上に直接メッキすること
は工業的に困難であり、またレニウム単体のメッキはメ
ッキ技術上より極めて薄い層以下は割れあるいは剥離を
生じ易く、アーク電圧より十分高く、最小アーク電流よ
り大きい電流を断続するような場合に、レニウムの単層
の接点では薄すぎ不適当である。In general, contacts made of gold, silver, copper, and tungsten plated with rhenium are known to have low contact resistance and stability, and have improved current cutting ability, but alloys such as iron and nickel are easily oxidized. It is industrially difficult to directly plate the contact bullets, and due to plating technology, plating of rhenium alone is prone to cracking or peeling if it is less than an extremely thin layer, which is sufficiently higher than the arc voltage and higher than the minimum arc current. A single-layer rhenium contact is too thin and unsuitable for applications where current is to be interrupted.
しかるに、レニウムが重量比で70%以下のレニウム−
コバルト合金接点は鉄、ニッケル等の酸化し易い金属面
にも、電着し易いコバルトを含んでいるので、ロジウム
、ルテニウムと異なり、直接メッキすることが出来る。However, rhenium containing less than 70% rhenium by weight
Cobalt alloy contacts contain cobalt, which is easily electrodeposited even on easily oxidized metal surfaces such as iron and nickel, so unlike rhodium and ruthenium, they can be directly plated.
サラに、コバルトは勿論レニウムも卑金属であり、ロジ
ウムと比較して材料としても低価格であり、貴重な全資
源を用いることなく、製造工程も、簡易化されて極めて
高性能で安価なスイッチを提供することが出来る。In fact, rhenium, as well as cobalt, is a base metal and is a cheaper material than rhodium, making it possible to simplify the manufacturing process and create extremely high-performance, inexpensive switches without using all precious resources. can be provided.
また、メッキ技術よりみて鉄、ニッケル等酸化し易い金
属面にも電着し易いコバルトを含んでいるので、ロジウ
ムまたはレニウムでは工業的に不可能な鉄、ニッケル等
を含む接点弾条やリード上に電解メッキ法により直接厚
くレニウム−コバルト合金層を作ることができる。In addition, because it contains cobalt, which is easy to electrodeposit on metal surfaces that are easily oxidized, such as iron and nickel due to plating technology, it can be used on contact strips and leads that are industrially impossible to use with rhodium or rhenium. A thick rhenium-cobalt alloy layer can be created directly by electrolytic plating.
次に本発明の実施例について図面を参照して説明する。Next, embodiments of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例として接触抵抗の安定性をロ
ジウム接点と比較したものである。FIG. 1 compares the stability of contact resistance with that of a rhodium contact as an example of the present invention.
第2図は測定用の回路図で、21は試験に供されるレニ
ウム−コバルト合金接点を備えたリードスイッチ、また
はロジウム(下地金メッキ層)接点を備えたリードスイ
ッチである。FIG. 2 is a circuit diagram for measurement, and 21 is a reed switch equipped with a rhenium-cobalt alloy contact or a reed switch equipped with a rhodium (base gold plating layer) contact to be subjected to the test.
22はリードスイッチの接点21が閉じているとき、該
回路に電流を流す接点で、23は電源で電圧DC48V
、24は負荷抵抗である。22 is a contact that allows current to flow through the circuit when the reed switch contact 21 is closed, and 23 is a power source with a voltage of 48V DC.
, 24 is a load resistance.
このような回路において、リードスイッチ21を50H
zで開閉したときの動作回数と接触抵抗の関係を第1図
に示しである。In such a circuit, the reed switch 21 is set to 50H.
FIG. 1 shows the relationship between the number of operations and contact resistance when opening and closing at z.
第1図aはロジウム接点の場合、bはレニウム−コバル
ト(60%レニウム)の場合を示す。FIG. 1a shows the case of a rhodium contact, and FIG. 1b shows the case of rhenium-cobalt (60% rhenium).
aおよびbを比較するとレニウム−コバルト合金接点は
ロジウムと比較し動作回数が進んでも、接触抵抗の変動
は少なく、極めて安定であることがわかる。Comparing a and b, it can be seen that the rhenium-cobalt alloy contact exhibits less fluctuation in contact resistance and is extremely stable compared to the rhodium contact even if the number of operations increases.
第3図は本発明の一実施例として接点の電流切断能力を
従来のロジウム接点および本発明のレニウム−コバルト
合金接点と比較したものであり、第4図はその測定回路
図である。FIG. 3 compares the current cutting ability of a contact according to an embodiment of the present invention with a conventional rhodium contact and a rhenium-cobalt alloy contact of the present invention, and FIG. 4 is a measurement circuit diagram thereof.
第4図において41は試験に供されるレニウム−コバル
ト合金接点を備えたリードスイッチ、ロジウムおよびレ
ニウム接点を備えたリードスイッチで、42は接点の負
荷抵抗100Ωであり、43は電源DC100■である
。In Fig. 4, 41 is a reed switch with rhenium-cobalt alloy contacts to be tested, a reed switch with rhodium and rhenium contacts, 42 is a contact load resistance of 100 Ω, and 43 is a power source of DC 100 Ω. .
このリードスイッチ41を10Hzで開閉せしめたとき
の動作回数と寿命との関係を第3図に示す。FIG. 3 shows the relationship between the number of operations and the lifespan when the reed switch 41 is opened and closed at 10 Hz.
ここでイの直線はレニウム−コバルト接点の開離不能故
障の累積発生率を示し、口およびハの直線はロジウムお
よびレニウム接点の開離不能故障の累積発生率を示す。Here, the straight line A indicates the cumulative incidence of non-separable failures of rhenium-cobalt contacts, and the straight lines A and C indicate the cumulative incidence of non-separable failures of rhodium and rhenium contacts.
図より明らかなようにレニウム−コバルト接点はロジウ
ム、レニウム接点と比較して、その故障が発生し難いこ
とがわかる。As is clear from the figure, rhenium-cobalt contacts are less likely to fail than rhodium and rhenium contacts.
このレニウム−コバルト合金の層と金、銀、銅などの層
と交互に積み重ねた多層接点としても一層の効果がある
ことおよび一方の電極をレニウム−コバルト合金とし他
方の電極も金、銀、銅等の低融点金属とした場合も効果
がある。It is even more effective as a multilayer contact in which layers of this rhenium-cobalt alloy are stacked alternately with layers of gold, silver, copper, etc., and that one electrode is made of rhenium-cobalt alloy and the other electrode is also made of gold, silver, or copper. It is also effective when using low melting point metals such as.
なお、本発明による合金接点を構成するレニウム−コバ
ルト合金は溶融法などの周知の合金形成技術により製造
するこさができる。It should be noted that the rhenium-cobalt alloy constituting the alloy contact according to the present invention can be manufactured by well-known alloy forming techniques such as the melting method.
例えば、上述した実施例のように、レニウムを重量比で
60%含む合金を製造の場合、約2,100℃でレニウ
ムおよびコバルトを加熱溶融すれば全域固溶形の合金を
得ることができる。For example, in the case of manufacturing an alloy containing 60% rhenium by weight as in the above embodiment, by heating and melting rhenium and cobalt at about 2,100° C., a solid solution alloy can be obtained throughout the entire region.
本発明は以上説明したように、レニウムの成分比を50
〜70%のレニウム−コバルト合金で接点層を構成させ
ることにより低い接触力において、有機ガスを含む雰囲
気においても、接触抵抗が低、く安定で、大きな電力を
開閉するときの寿命を長く、且つ安価な接点を提供出来
る。As explained above, the present invention has a rhenium component ratio of 50
By configuring the contact layer with ~70% rhenium-cobalt alloy, the contact resistance is low and stable even in an atmosphere containing organic gas at low contact force, and the service life is long when switching large amounts of power. We can provide inexpensive contacts.
第1図aはロジウム接点の、且つ第1図すはレニウム−
コバルト接点の動作回数と接触抵抗の関係を示す図、第
2図は接触抵抗と動作回数の関係を測定するに用いた試
験回路図。
第3図は動作回数と接点開離不能累積故障率の関係を示
す図。
第4図は動作回数と接点開離不能累積故障率を測定する
に用いた試験回路図である。
21.41・・・・・・リードスイッチ、22・・・・
・・ゲート接点、23 、43・・・・・・電源、24
,42・・・・・・負荷抵抗。
:3Figure 1a shows a rhodium contact, and Figure 1a shows a rhenium contact.
A diagram showing the relationship between the number of operations and contact resistance of a cobalt contact. FIG. 2 is a test circuit diagram used to measure the relationship between the contact resistance and the number of operations. FIG. 3 is a diagram showing the relationship between the number of operations and the cumulative failure rate of contact failure. FIG. 4 is a test circuit diagram used to measure the number of operations and the cumulative failure rate of non-openable contacts. 21.41...Reed switch, 22...
...Gate contact, 23, 43...Power supply, 24
, 42...Load resistance. :3
Claims (1)
で50〜70%含むことを特徴とするレニウム−コバル
ト合金接点。1. A rhenium-cobalt alloy contact characterized by containing a rhenium component ratio of 50 to 70% by weight of the rhenium-cobalt alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50128725A JPS5942066B2 (en) | 1975-10-24 | 1975-10-24 | Rhenium-cobalt alloy contacts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50128725A JPS5942066B2 (en) | 1975-10-24 | 1975-10-24 | Rhenium-cobalt alloy contacts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5252106A JPS5252106A (en) | 1977-04-26 |
| JPS5942066B2 true JPS5942066B2 (en) | 1984-10-12 |
Family
ID=14991890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50128725A Expired JPS5942066B2 (en) | 1975-10-24 | 1975-10-24 | Rhenium-cobalt alloy contacts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5942066B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61145004A (en) * | 1984-12-18 | 1986-07-02 | Hitachi Electronics Eng Co Ltd | Transfer apparatus for thin ic |
| JPS63178219U (en) * | 1987-05-11 | 1988-11-18 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6039920A (en) * | 1997-05-12 | 2000-03-21 | W. C. Heraeus Gmbh & Co. Kg | Process for making rhenium-containing alloys |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1771763A1 (en) * | 1967-07-03 |
-
1975
- 1975-10-24 JP JP50128725A patent/JPS5942066B2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61145004A (en) * | 1984-12-18 | 1986-07-02 | Hitachi Electronics Eng Co Ltd | Transfer apparatus for thin ic |
| JPS63178219U (en) * | 1987-05-11 | 1988-11-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5252106A (en) | 1977-04-26 |
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