JPS6312332B2 - - Google Patents
Info
- Publication number
- JPS6312332B2 JPS6312332B2 JP11962781A JP11962781A JPS6312332B2 JP S6312332 B2 JPS6312332 B2 JP S6312332B2 JP 11962781 A JP11962781 A JP 11962781A JP 11962781 A JP11962781 A JP 11962781A JP S6312332 B2 JPS6312332 B2 JP S6312332B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- reed switch
- plating layer
- gold
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Contacts (AREA)
Description
【発明の詳細な説明】
本発明は測定器、試験機、電子計算機および周
辺機器等の回路を閉成または接続するリードスイ
ツチの接点構成に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a contact configuration of a reed switch that closes or connects circuits of measuring instruments, testing machines, electronic computers, peripheral devices, etc.
通常、この種の電気接点の重要な現象の一つと
して接点消耗がある。接点消耗は主として接点金
属の転移、即ち接点が動作を繰返すうち次第に接
触面から接点金属が移行する現象であり、原因と
しては(1)接点の接続直前又は切断直後に発生する
シヨートアークによるもの、(2)接点への通電中、
接触部の接触抵抗によつて発生するジユール熱に
よる接点金属溶融によるもの、および(3)接点切断
時のブリツジ形成による接点金属の転移によるも
のなどがある。接点消耗が起るとどちらかの電極
に転移が集中する。例えば、陽極側接点には孔
が、且つ陰極側接点には突起が形成され、それら
が成長して突起と孔が接続したままとなり、接点
としての機能を果さなくなる。このような接点消
耗は電圧、電流密度及び負荷等の回路条件によつ
てその程度が異なる。また、同一の回路条件では
使用される接点金属の種類によつて接点消耗に差
が見られる。従つて、接点に用いる金属の選定は
接点の寿命を左右する極めて重要な問題である。
このため、従来より種々の金属からつくつた電気
接点が提案されている。例えば、金系金属材料、
即ち、ルテニウム、ロジウム、レニウム等の高融
点貴金属を用いた接点がある。 Normally, one of the important phenomena of this type of electrical contact is contact wear. Contact wear is mainly a phenomenon in which the contact metal transfers, that is, as the contact repeats its operation, the contact metal gradually transfers from the contact surface.The causes are (1) short arc that occurs just before the contact is connected or disconnected; 2) While the contacts are energized,
There are two causes: (1) melting of the contact metal due to Joule heat generated by the contact resistance of the contact portion; and (3) transfer of the contact metal due to bridge formation when the contact is broken. When contact wear occurs, the transfer will concentrate on one of the electrodes. For example, a hole is formed on the anode side contact and a protrusion is formed on the cathode side contact, and as these grow, the protrusion and the hole remain connected, and they no longer function as a contact. The degree of such contact wear differs depending on circuit conditions such as voltage, current density, and load. Furthermore, under the same circuit conditions, there are differences in contact wear depending on the type of contact metal used. Therefore, the selection of the metal used for the contact is an extremely important issue that affects the life of the contact.
For this reason, electrical contacts made from various metals have been proposed. For example, gold-based metal materials,
That is, there are contacts using high-melting point noble metals such as ruthenium, rhodium, and rhenium.
しかしながら、これらの接点においても高レベ
ル負荷条件(電圧50V前後、電流100mA以上)
の下では動作回数が増すと接点消耗を起こし、十
分満足しうる寿命を達し得ないのが実状である。
そこで、スズ、亜鉛、カドミウム、鉛及びインジ
ウム等の低融点金属上にロジウム、レニウム、ル
テニウム、イリジウム、タングステン及びモリブ
デン等の高融点金属を施した後、熱処理により低
融点金属と高融点金属を拡散することによつて高
レベル負荷条件での長寿命を達成する等のことが
考えられているが、熱処理条件、メツキ厚のバラ
ツキによる拡散度合の変動、および工数の増加等
の問題が存在する。 However, even at these contacts, high level load conditions (voltage around 50V, current over 100mA)
The reality is that as the number of operations increases, the contacts wear out and cannot reach a fully satisfactory lifespan.
Therefore, after applying high melting point metals such as rhodium, rhenium, ruthenium, iridium, tungsten and molybdenum on low melting point metals such as tin, zinc, cadmium, lead and indium, the low melting point metal and high melting point metal are diffused by heat treatment. Although it is thought that by doing so, a long life under high-level load conditions can be achieved, there are problems such as variations in the degree of diffusion due to variations in heat treatment conditions and plating thickness, and an increase in the number of man-hours.
本発明の目的は、高レベル負荷条件下において
も接点消耗を著しく防止でき、長期間の使用に耐
え得る接点部を有するリードスイツチを提供する
ことにある。 An object of the present invention is to provide a reed switch having a contact portion that can significantly prevent contact wear even under high-level load conditions and can withstand long-term use.
本発明は鉄およびニツケルを主成分とする合金
よりなるリード片を軟質ガラス管などの密閉容器
に密封したリードスイツチにおいて、リード片の
接点部に金−コバルト合金メツキを2μ以下の厚
さに施し、その上層にスズ、亜鉛、カドミウム、
鉛及びインジウム等の低融点金属のいずれかを
0.5μ以下の厚さに施したことを特徴とする。 The present invention is a reed switch in which a reed piece made of an alloy whose main components are iron and nickel is sealed in an airtight container such as a soft glass tube, in which a gold-cobalt alloy plating is applied to the contact portion of the reed piece to a thickness of 2μ or less. , the upper layer contains tin, zinc, cadmium,
Either low melting point metal such as lead or indium
It is characterized by being applied to a thickness of 0.5μ or less.
次に、本発明の実施例について図面を参照して
説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第1図は一般に使用されているリードスイツチ
の断面構成を示し、リード1及び1′と軟質ガラ
ス管2とから成る。 FIG. 1 shows a cross-sectional configuration of a commonly used reed switch, which consists of leads 1 and 1' and a soft glass tube 2.
第2図は本発明によるリードスイツチの接点部
の断面図であり、鉄−ニツケル合金よりなるリー
ド1の上に金−コバルト合金メツキ層3を施し、
更にその上に低融点金属メツキ層4を施してあ
る。この実施例の場合、低融点金属メツキ層4と
してスズをメツキして検討を行なつた。つまり、
第3図に示す高レベル負荷条件(DC50V−100m
A)の下で寿命試験を行ない、動作不能となるま
で接点をオン・オフ動作させ、動作回数と不良率
との相関を調べた。第4図は本発明の接点処理を
したリードスイツチ、従来のリードスイツチ、及
び本発明のメツキ厚の範囲外の接点処理を施した
リードスイツチの寿命特性を比較した図である。
第4図において、aは本発明の接点処理(金−コ
バルト合金メツキ)を施したリードスイツチの特
性を示し、厚さ1μの金−コバルト合金メツキ層
上に厚さ0.2〜0.5μのスズメツキ層を施した接点
を有するリードスイツチの寿命特性、bは厚さ
3μの金−コバルト合金メツキ層上に厚さ0.2〜
0.5μのスズメツキ層を施した接点を有するリード
スイツチの寿命特性、cはa,bのリードスイツ
チと同等の寸法を有し、接点処理のみ異なる従来
のリードスイツチの寿命特性、dはa,b,cよ
りやや小形の従来のリードスイツチの寿命特性例
を示す。この結果から明らかのように、従来の接
点処理を施したリードスイツチ又は金−コバルト
合金メツキ層が本発明のリードスイツチより厚い
リードスイツチ等は、高レベル負荷条件の下では
約50〜100万回程度の動作回数で開離不能が発生
するのに対し、本発明の接点処理を施したリード
スイツチは400〜500万回程度まで開離不能が発生
しない。 FIG. 2 is a sectional view of the contact portion of the reed switch according to the present invention, in which a gold-cobalt alloy plating layer 3 is applied on the lead 1 made of iron-nickel alloy,
Furthermore, a low melting point metal plating layer 4 is applied thereon. In the case of this example, the study was conducted by plating tin as the low melting point metal plating layer 4. In other words,
High-level load conditions shown in Figure 3 (DC50V-100m
A life test was conducted under A), the contacts were turned on and off until they became inoperable, and the correlation between the number of operations and defective rate was investigated. FIG. 4 is a diagram comparing the life characteristics of a reed switch with the contact treatment of the present invention, a conventional reed switch, and a reed switch with the contact treatment outside the plating thickness range of the present invention.
In Fig. 4, a shows the characteristics of a reed switch that has been subjected to the contact treatment (gold-cobalt alloy plating) of the present invention, and a tin plating layer with a thickness of 0.2 to 0.5 μm is formed on a gold-cobalt alloy plating layer with a thickness of 1 μm. The life characteristics of a reed switch with contacts treated with , b is the thickness
0.2~ thick on 3μ gold-cobalt alloy plating layer
Life characteristics of a reed switch with contacts coated with a 0.5μ tin plating layer; c is the life characteristics of a conventional reed switch that has the same dimensions as the reed switches a and b, but differs only in contact treatment; d is the life characteristics of a and b An example of the life characteristics of a conventional reed switch that is slightly smaller than , c is shown. As is clear from this result, reed switches with conventional contact treatment or reed switches with a thicker gold-cobalt alloy plating layer than the reed switch of the present invention can be operated approximately 50 to 1 million times under high-level load conditions. In contrast, the inability to open occurs after approximately 4 to 5 million operations, whereas the reed switch to which the contact treatment of the present invention has been applied does not occur until approximately 4 to 5 million operations.
従来の接点処理を施したリードスイツチが本発
明の接点処理を施したリードスイツチより寿命が
短いのは転移による突起及び孔の成長が接点の開
離不能をひき起すことによる。しかしながら、本
発明の接点処理を施したリードスイツチは接点表
面に低融点金属メツキ層が施されているため、従
来の接点処理を施したリードスイツチと異なり、
転移による突起と孔の成長が防げられて尖つた転
移でなく平滑な転移が生じるため突起と孔による
開離不能の発生を防止する効果があるため、接点
寿命が延びるものと考えられる。又、低融点金属
メツキ層の下層に金−コバルト合金メツキ層を施
すことにより、金−コバルト合金メツキ層中に含
有されている不純物による転移の平滑化の促進を
計る効果があるため、耐開離不能性の向上及び接
触抵抗の安定性が得られる。しかしながら、金−
コバルト合金メツキ層が厚すぎる(3μ以上)と、
低融点金属メツキ層の転移後に金−コバルト合金
メツキ層の転移が第2図に示す横方向aでなく縦
方向bに進む傾向があり、そのために金−コバル
ト合金メツキ層が薄い場合よりも転移による尖つ
た突起が起き易いと考えられる。したがつて、コ
バルト合金メツキ層の厚さは2μ以下が良好であ
る。 The reason why a reed switch with a conventional contact treatment has a shorter life than a reed switch with a contact treatment of the present invention is because the growth of protrusions and holes due to dislocation causes the contact to become inseparable. However, since the reed switch with the contact treatment of the present invention has a low melting point metal plating layer on the contact surface, it differs from the reed switch with the conventional contact treatment.
The growth of protrusions and holes due to transfer is prevented, and a smooth transition occurs instead of a sharp transition, which has the effect of preventing the inability to separate due to protrusions and holes, and is thought to extend the life of the contact. In addition, by applying a gold-cobalt alloy plating layer below the low-melting point metal plating layer, it has the effect of promoting smoothing of the transition caused by impurities contained in the gold-cobalt alloy plating layer, making it resistant to cracking. Improved inseparability and stability of contact resistance can be obtained. However, gold-
If the cobalt alloy plating layer is too thick (more than 3μ),
After the transition of the low melting point metal plating layer, the transition of the gold-cobalt alloy plating layer tends to proceed in the vertical direction b rather than the horizontal direction a shown in Fig. 2, so that the transition is faster than when the gold-cobalt alloy plating layer is thinner. It is thought that sharp protrusions are likely to occur. Therefore, the thickness of the cobalt alloy plating layer is preferably 2 μm or less.
なお、上記実施例においては、低融点金属メツ
キ層をスズにより構成したが、同じく低融点であ
る亜鉛、カドミウム、鉛およびインジウムなどで
あつても同様に実施できる。 In the above embodiments, the low melting point metal plating layer is made of tin, but it can also be made of zinc, cadmium, lead, indium, etc., which also have low melting points.
以上説明したように本発明によれば、金−コバ
ルト合金メツキ内層に低融点金属メツキ外層を施
すことにより、高レベル負荷条件での長寿命化及
び接触抵抗の安性化を図ることができる。 As explained above, according to the present invention, by applying a low melting point metal plating outer layer to the gold-cobalt alloy plating inner layer, it is possible to extend the life and stabilize the contact resistance under high-level load conditions.
第1図は一般に使用されているリードスイツチ
の断面図、第2図は本発明によるリードスイツチ
の一実施例の接点構成を示す断面図、第3図は本
発明によるリードスイツチの寿命を試験した回路
図、および第4図は従来の接点処理をしたリード
スイツチと本発明の接点処理をしたリードスイツ
チの寿命試験の結果を示す図である。
1,1′……リード片、2……軟質ガラス管、
3……金−コバルト合金メツキ層、4……低融点
金属メツキ層。
Fig. 1 is a cross-sectional view of a commonly used reed switch, Fig. 2 is a cross-sectional view showing the contact configuration of an embodiment of the reed switch according to the present invention, and Fig. 3 is a test of the life of the reed switch according to the present invention. The circuit diagram and FIG. 4 are diagrams showing the results of a life test of a reed switch with conventional contact treatment and a reed switch with contact treatment of the present invention. 1, 1'...Reed piece, 2...Soft glass tube,
3... Gold-cobalt alloy plating layer, 4... Low melting point metal plating layer.
Claims (1)
るリード片を密閉容器に封着したリードスイツチ
において、前記リード片の接点部を2μ以下の厚
さの金・コバルト合金メツキ内層と、スズ、亜
鉛、カドミウム、鉛およびインジウムのうちのい
づれかからなる0.5μ以下の厚さの低融点金属メツ
キ外層とより構成したことを特徴とするリードス
イツチ。1. In a reed switch in which a reed piece made of an alloy mainly composed of iron and nickel is sealed in a sealed container, the contact part of the reed piece is coated with an inner layer of gold/cobalt alloy plating with a thickness of 2μ or less, tin, zinc, A reed switch characterized by comprising an outer layer of low melting point metal plating with a thickness of 0.5μ or less and made of any one of cadmium, lead, and indium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11962781A JPS5819818A (en) | 1981-07-30 | 1981-07-30 | Lead switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11962781A JPS5819818A (en) | 1981-07-30 | 1981-07-30 | Lead switch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5819818A JPS5819818A (en) | 1983-02-05 |
| JPS6312332B2 true JPS6312332B2 (en) | 1988-03-18 |
Family
ID=14766118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11962781A Granted JPS5819818A (en) | 1981-07-30 | 1981-07-30 | Lead switch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5819818A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4731720B2 (en) * | 2001-05-17 | 2011-07-27 | 株式会社アドバンテスト | Contact life diagnosis method |
-
1981
- 1981-07-30 JP JP11962781A patent/JPS5819818A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5819818A (en) | 1983-02-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1293152A (en) | Improvements in or relating to semiconductor devices | |
| US4105828A (en) | Low-current contact construction | |
| US4088803A (en) | Electrical contact and process of manufacture | |
| US3663777A (en) | Reed switch | |
| JPS6312332B2 (en) | ||
| US2916810A (en) | Electric contacts | |
| US2988665A (en) | Coated contact members for electric discharge tubes | |
| US3036251A (en) | Spring contact element for semiconductor diodes | |
| JPS5942066B2 (en) | Rhenium-cobalt alloy contacts | |
| JP3310010B2 (en) | Positive characteristic thermistor device | |
| US2010398A (en) | Liquid switch | |
| JPH0411966B2 (en) | ||
| EP0017404B1 (en) | A rhodium electrical contact of a switch particularly a reed switch | |
| JPS58112210A (en) | Electric contact | |
| CA1308151C (en) | Electrical contact | |
| US1774108A (en) | Electric switch | |
| US2343653A (en) | Mercury switch | |
| SU1105950A1 (en) | Contact part for hermetically sealed ferreed contact | |
| US1905813A (en) | Mercury tube switch | |
| US1598875A (en) | Electrical apparatus | |
| US2133986A (en) | Electrode for mercury devices | |
| US889566A (en) | Electric switch. | |
| CA1226317A (en) | Fluorescent lamp circuit breaker with low contact resistor | |
| JPH0481287B2 (en) | ||
| JPH02265207A (en) | Chip resistor |