JPS5944205B2 - How to remove mold deposits - Google Patents
How to remove mold depositsInfo
- Publication number
- JPS5944205B2 JPS5944205B2 JP7606177A JP7606177A JPS5944205B2 JP S5944205 B2 JPS5944205 B2 JP S5944205B2 JP 7606177 A JP7606177 A JP 7606177A JP 7606177 A JP7606177 A JP 7606177A JP S5944205 B2 JPS5944205 B2 JP S5944205B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- deposits
- molding
- benzyl alcohol
- mold deposits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明は、ポリオキシメチレン組成物の成形において、
金型表面へ付着する金型への析出物（いわゆるモールド
デポジット）を除去する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides the following steps in molding a polyoxymethylene composition:
The present invention relates to a method for removing mold deposits (so-called mold deposits) that adhere to the mold surface.
ポリオキシメチレンはそのすぐれた強度特性、疲労特性
、電気特性などの故に、近年、電気部品、事務機器部品
、建材部品、その他に広く使用され、その使用量も年々
増大している。Due to its excellent strength properties, fatigue properties, electrical properties, etc., polyoxymethylene has recently been widely used in electrical parts, office equipment parts, building material parts, and other parts, and its usage is increasing year by year.
ポリオキシメチレン組成物は通常、射出成形あるいは押
出成形により所望の形状に成形されているが、その成形
において、金型表面へいわゆるモールドデポジットが付
着し、それが製品表面へ転写され、製品の外観が著しく
損われたり、歯車など寸法精度の要求される部品の場合
には、モールドデポジットにより寸法精度が損われるな
どの問題が生じることが多い。Polyoxymethylene compositions are usually molded into a desired shape by injection molding or extrusion molding, but during molding, a so-called mold deposit adheres to the surface of the mold and is transferred to the product surface, resulting in a change in the appearance of the product. In the case of parts that require dimensional accuracy such as gears, problems such as dimensional accuracy being impaired due to mold deposits often occur.
そのため、ポリオキシメチレン組成物の成形加工メーカ
ーは、金型の分掃に多大の時間を費している場合があり
、生産性の向上に対し大きな障害となつている。このよ
うな問題に対し、樹脂製造の立場から、モールドデポジ
ットの少ない組成物を提供するように種々の提案がなさ
れているが、未だ完全に問題を解決するには到つていな
い。Therefore, manufacturers of molding and processing polyoxymethylene compositions sometimes spend a large amount of time cleaning the molds, which is a major hindrance to improving productivity. To address this problem, various proposals have been made from the standpoint of resin production to provide compositions with less mold deposits, but the problem has not yet been completely solved.
また、モールドデポジットの除去方法に関しても有効な
手段が見出されていないのが現状である。本発明者らは
、モールドデポジットの除去方法に関し種々検討を加え
た結果、極めて有効な手段を見出すに到つた。Furthermore, at present, no effective method for removing mold deposits has been found. The inventors of the present invention have conducted various studies regarding methods for removing mold deposits, and as a result, have found a very effective means.
すなわち、本発明者らは、モールドデポジットの内容を
詳細に検討した結果、金型の構造（ガス抜けなど）およ
び金型温度、樹脂温度などの成形条件によつてモールド
デポジットの内容は異なり、ある場合には、発生する僅
少のガスが固化して付着したものであり、また、ある場
合にιＬポリオキシメチレン組成物中に含まれる含窒素
化合物が析出したものであることを見出し、そのいずれ
の析出物に対しても有効な除去方法の開発に努め、本発
明に到達した。That is, as a result of a detailed study of the contents of the mold deposit, the present inventors found that the contents of the mold deposit vary depending on the structure of the mold (gas release, etc.) and molding conditions such as mold temperature and resin temperature. In some cases, it has been found that a small amount of gas generated has solidified and adhered, and in some cases, it has been found that nitrogen-containing compounds contained in the ιL polyoxymethylene composition have precipitated. The present invention was achieved through efforts to develop a removal method that is also effective for precipitates.
本発明は、ポリオキシメチレン組成物の成形において金
型表面への付着物を除去するに際し、ベンジルアルコー
ルにアルコール性水酸基を少なくとも１つ有する溶媒を
加えてなる洗浄液を用いることを特徴とする金型付着物
除去方法に関するものである。The present invention provides a mold characterized in that when removing deposits on the surface of the mold in molding a polyoxymethylene composition, a cleaning liquid made by adding a solvent having at least one alcoholic hydroxyl group to benzyl alcohol is used. The present invention relates to a method for removing deposits.
上記ベンジルアルコールを含む洗浄液とは、ベンジルア
ルコールにアルコール性水酸基を少なくとも１つ有する
他の溶媒を加えたものをいう。The above-mentioned cleaning liquid containing benzyl alcohol refers to one obtained by adding another solvent having at least one alcoholic hydroxyl group to benzyl alcohol.
他の溶媒としては、エチルアルコール、インプロビルア
ルコール、エチレングリコール、ジエチレングリコール
、トリエチレングリコール、１，４−ブタンジオール、
グリセリン−エチレンオキサイド付加物、グリセリンー
プロピレンオキサイド付加物等がある。除去剤中のベン
ジルアルコールの量は特に制限はないが、通常、ベンジ
ルアルコールの量が５〜４０重量％で使用される。Other solvents include ethyl alcohol, Improvil alcohol, ethylene glycol, diethylene glycol, triethylene glycol, 1,4-butanediol,
Examples include glycerin-ethylene oxide adducts, glycerin-propylene oxide adducts, and the like. The amount of benzyl alcohol in the remover is not particularly limited, but is usually used in an amount of 5 to 40% by weight.
他の溶媒との組合せについては、エチレングリコール／
ベンジルアルコール、イソプロビルアルコール／ベンジ
ルアルコール、１，４−ブタンジオール／ベンジルアル
コールなどが特に除去効果が大きい。For combinations with other solvents, ethylene glycol/
Benzyl alcohol, isopropyl alcohol/benzyl alcohol, 1,4-butanediol/benzyl alcohol, etc. have a particularly great removal effect.
実際に付着物の除去を行う方法としては、成形 ト機に
金型を装着したま＼金型表面に洗浄液を塗布した後、数
シヨツト成形して付着物を成形品に転着させるか、また
は、金型を分解し、上記洗浄液を用いて洗浄するなどの
方法がとられる。The actual method for removing deposits is to apply a cleaning liquid to the surface of the mold while the mold is attached to the molding machine, and then mold several shots to transfer the deposits to the molded product. , the mold is disassembled and cleaned using the cleaning solution described above.
次に本発明の実施例を示す。Next, examples of the present invention will be shown.
なお、実施例中、％および部はすべて重量基準である。
実施例 １
ポリオキシメチレン組成物〔ホモポリオキシメチレンジ
アセテート（ＭＩ（１９０℃）″１４ｔ／１０分）１０
０部に対して、２，２′−メチレン−ビス−（４−メチ
ル−６−Ｔｅｒｔ−ブチルフエノール）０．３部、ポリ
ヘキサメチレンアジパミド（３５％）／ポリヘキサメチ
レンセバカミド（２７％）／ポリカプロラクタム（３８
％）よりなる共重合ポリアミド０．７５部を添加してな
る組成物〕を用いて、射出成形機でシリンダー温度２０
『Ｃ，金型温度８０℃にて、１００Ｘ５０Ｘ２藺の平板
を成形し、約４０００シヨツト成形後、金型表面にモー
ルドデポジツトが多量に付着したのを確かめた上で、金
型表面にベンジルアルコール２０％、イソプロビルアル
コール８０％よりなる洗浄液を塗布し、１分間放置後、
５シヨツト成形を行つたところ、金型の付着物は殆んど
全部除去されているのを確認した。In addition, in the examples, all percentages and parts are based on weight.
Example 1 Polyoxymethylene composition [homopolyoxymethylene diacetate (MI (190°C)'' 14t/10 min) 10
0 parts, 0.3 parts of 2,2'-methylene-bis-(4-methyl-6-tert-butylphenol), polyhexamethylene adipamide (35%)/polyhexamethylene sebamide ( 27%)/polycaprolactam (38%)
%) was used in an injection molding machine at a cylinder temperature of 20%.
``C. Molding a 100x50x2 flat plate at a mold temperature of 80°C, and after molding about 4000 shots, after confirming that a large amount of mold deposit has adhered to the mold surface, add benzyl alcohol to the mold surface. After applying a cleaning solution consisting of 20% and 80% isopropyl alcohol and leaving it for 1 minute,
When 5-shot molding was performed, it was confirmed that almost all the deposits on the mold had been removed.
実施例 ２〜４
実施例１に用いたと同じ組成物、同一の成形条件で４０
００シヨツト成形後、各種洗浄液を用いて金型付着物の
除去効果を検討した。Examples 2 to 4 The same composition used in Example 1 and the same molding conditions
After 00 shot molding, the effectiveness of removing mold deposits was investigated using various cleaning solutions.
その結果を次表に示す。実施例 ５
トリオキサンとエチレンオキサイド（２％）のコポリマ
ー（Ｍｌ（１９０℃）ご１０ｆ／１０分）１００部に対
して、ジシアンジアミド０．１部、メラミン０．０５部
、２，２／−メチレン−ビス−（４一メチル一６−Ｔｅ
ｒｔ−ブチルフエノール）０．３部を添加してなる組成
物の成形を実施例１と同様の条件（ｉ−マ１，全型温度
は４０℃）で行い、約４０００シヨツト成形後、金型表
面にモールドデポジツトが多量に付着したのを確かめた
上で、金型表面にベンジルアルコールを塗布し、１分間
放置後、５シヨツト成形を行い、付着物が除去されてい
るのを確認した。The results are shown in the table below. Example 5 0.1 part of dicyandiamide, 0.05 part of melamine, 2,2/-methylene- to 100 parts of copolymer of trioxane and ethylene oxide (2%) (10 f/10 min at 190° C.) bis-(4-methyl-6-Te
The composition containing 0.3 part of rt-butylphenol was molded under the same conditions as in Example 1 (i-ma 1, whole mold temperature 40°C), and after molding about 4000 shots, the mold After confirming that a large amount of mold deposit had adhered to the surface, benzyl alcohol was applied to the mold surface, and after being left for 1 minute, 5 shot molding was performed and it was confirmed that the deposit had been removed.
Claims (1)
面への付着物を除去するに際し、ベンジルアルコールに
アルコール性水酸基を少なくとも１つ有する溶媒を加え
てなる洗浄液を用いることを特徴とする金型付着物の除
去方法。1. Mold deposits, characterized in that in molding a polyoxymethylene composition, when removing deposits on the mold surface, a cleaning solution made by adding a solvent having at least one alcoholic hydroxyl group to benzyl alcohol is used. How to remove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7606177A JPS5944205B2 (en) | 1977-06-28 | 1977-06-28 | How to remove mold deposits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7606177A JPS5944205B2 (en) | 1977-06-28 | 1977-06-28 | How to remove mold deposits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5411163A JPS5411163A (en) | 1979-01-27 |
| JPS5944205B2 true JPS5944205B2 (en) | 1984-10-27 |
Family
ID=13594245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7606177A Expired JPS5944205B2 (en) | 1977-06-28 | 1977-06-28 | How to remove mold deposits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5944205B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH043504U (en) * | 1990-04-24 | 1992-01-13 | ||
| USD516742S1 (en) | 2004-12-01 | 2006-03-07 | Physicians Formula Cosmetics, Inc. | Cosmetic block |
| USD518230S1 (en) | 2004-12-01 | 2006-03-28 | Physicians Formula Cosmetics, Inc. | Cosmetic block |
| USD522174S1 (en) | 2004-12-01 | 2006-05-30 | Physicians Formula Cosmetics, Inc. | Cosmetic block |
| US7144847B2 (en) | 2000-12-13 | 2006-12-05 | Asahi Kasei Chemicals Corporation | Detergent |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6277040U (en) * | 1985-11-05 | 1987-05-16 |
-
1977
- 1977-06-28 JP JP7606177A patent/JPS5944205B2/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH043504U (en) * | 1990-04-24 | 1992-01-13 | ||
| US7144847B2 (en) | 2000-12-13 | 2006-12-05 | Asahi Kasei Chemicals Corporation | Detergent |
| USD516742S1 (en) | 2004-12-01 | 2006-03-07 | Physicians Formula Cosmetics, Inc. | Cosmetic block |
| USD518230S1 (en) | 2004-12-01 | 2006-03-28 | Physicians Formula Cosmetics, Inc. | Cosmetic block |
| USD522174S1 (en) | 2004-12-01 | 2006-05-30 | Physicians Formula Cosmetics, Inc. | Cosmetic block |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5411163A (en) | 1979-01-27 |
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