JPS5944779B2 - Automatic die bonder push-up collect - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a push-up collet for an automatic die bonder used for assembling semiconductor devices.

In recent years, there has been remarkable progress in automation in the assembly process of semiconductor devices, and among these, automatic die bonders that connect semiconductor chips to semiconductor device frames are one of the most important devices.

Conventionally, an apparatus of this type as shown in FIG. 1 has been used. In the figure, a head 2 mounted on an arm 1 is capable of horizontal reciprocation and vertical movement, and is equipped with a suction collet 3 on its lower surface. The suction collet 3 has pores for suction, and is connected to a vacuum evacuation device (not shown) through a vacuum hose 4. A light receiver 5 is provided on the lower surface of the head 2 alongside the suction collet 3. A push-up collet 6 is located below the horizontal movement path of the head 2.
is installed. This push-up collet 6 has a built-in light projector, and its light is thrown upward from the tip of the push-up collet 6. When performing die bonding using such an automatic die bonder, as shown in FIG. 2, a platen 8 with a built-in heater T is placed below the horizontal path of the head 2, and a semiconductor device frame 9 is placed on top of the platen 8. do.

On the other hand, above the push-up collet 6, a semiconductor chip 11 attached to an adhesive sheet 10 is arranged. The adhesive sheet 10 to which the semiconductor chip 11 is attached is free to move in a horizontal plane, and a good semiconductor chip 11 selected based on the detection result by a surveillance camera (not shown) is pushed up and positioned on the collet 6. do. head 2 here
moves horizontally and reaches above the semiconductor chip 11,
As shown in FIG. 3, the push-up collet 6 rises from below to push up the semiconductor chip 11 and peel it off from the adhesive tape 10. At the same time, the head 2 descends and the suction collet 3 suctions and holds the semiconductor chip 11. semiconductor chip 11
The head 2 holding the head 2 moves in the opposite direction along the previous path and presses the semiconductor chip 11 onto the gold-plated connection point of the semiconductor device frame 9, as shown in FIG. Since the frame 9 is heated by the heater T, the semiconductor chip 11 is welded to the frame 9, and bonding is completed. In the bonding process described above, the head 2
On the outward journey toward suctioning the semiconductor chip 11, the photoreceiver 5 passes above the semiconductor chip 11 in advance of the suction collet 3, but at this time, the target semiconductor chip 11 is pushed up and positioned above the collet 6. If so, the light from the light projector 12 will not be blocked by the semiconductor chip 12 and will not reach the light receiver 5. However, as shown in Figure 3, the semiconductor chip 1
When the head 2 that has attracted the semiconductor chip 1 returns to the semiconductor device frame 9 while holding the semiconductor chip 11, the photodetector 5 follows the suction collet 3. When the semiconductor chip 11 is properly attracted and picked up, the light from the light projector 12 is caught by the light receiver 5 when it passes above the push-up collet 6. In this way, attach the projector 1 to the uplift collet 6.
2, and when the light does not enter the light receiver 5 on the outward path of the head 2 and enters the light receiver 5 on the return path, it is determined that the semiconductor chip 11 has been picked up normally. There is. As shown in FIG. 5, this push-up collet 6 is composed of a cylindrical holding base 6a with a tapered tip and a push-up portion 6b fitted into the tip. This raised portion 6b has translucency,
Its diameter becomes smaller toward the tip, and a small-area raised surface 6c is provided at the tip. Here, this raised portion 6
Of the parts b, only the flat raised surface 6c actually allows light to pass through, and the tapered part has a severely uneven surface due to processing and practically does not allow light to pass through. Therefore, in order to pass sufficient light to be detected by the light receiver 5, the diameter of the raised plane 6c is required to be at least 0.3 to 0.411 mm. However, if the dimensions of this thrusting surface 6c are large, the sixth
As shown in the figure, when the push-up collet 6 pushes up the semiconductor chip 11 through the adhesive tape 10, it comes into contact with the semiconductor chip 11 over a wide area, so that the semiconductor chip 11 is difficult to peel off from the adhesive tape 10. As a result, the semiconductor element 11 may fail to be picked up by the suction collet, or may be picked up in a state where it is deviated from its normal position or tilted. To provide a push-up collet for an automatic die bonder that eliminates deviations, angle deviations, etc.

In order to achieve this object, the push-up collet of the automatic die bonder according to the present invention has a part that serves as a light path for detecting the presence or absence of a chip, which is separate from a part that pushes up the semiconductor chip. The area of the thrusting surface is made sufficiently small to enhance the thrusting effect while ensuring a sufficient amount of light to be detected by the user.

The push-up collet of the automatic die bonder according to the present invention will be explained in detail below with reference to the drawings. FIG. 7 is a sectional view showing one embodiment of the push-up collet of the automatic die bonder according to the present invention.

In the figure, the push-up collet 13 is composed of a cylindrical member 13a and a push-up member 13b projecting from the tip thereof, and has a projector 12 in the interior space of the cylindrical member 13a. This push-up collet 13 is used as a part of an automatic die bonder as shown in FIG. 1, similarly to the push-up collet 6 shown in FIG. The above-mentioned push-up member 13b is tapered toward its tip, and its most extreme surface constitutes a minute push-up surface 13c with a diameter of 0.1 m1. A pore 14 extends along the thrusting direction from the tapered surface near the thrusting surface 13c to the internal space of the cylindrical member 13a, passing through the thrusting member 13b. Hereinafter, a case in which die bonding is performed using the push-up collet of the automatic die bonder having the above configuration will be described in detail. First, a semiconductor device frame 9 and a semiconductor chip 11 to be bonded are placed in the same manner as shown in FIG.

When the head 2 moves horizontally to the target semiconductor chip 11, the push-up collet 13 rises from below to push up the semiconductor chip 11 and attach it from the adhesive tape 10, as shown in FIG. At this time, the head 2 descends in the same way as shown in FIG. 3, and the semiconductor chip 11 is sucked onto the lower end of the suction collet 3. Next, the head 2 moves back toward the semiconductor device frame 9 while holding the semiconductor chip 11 by suction, and welds the carried semiconductor chip 11 to a desired location on the semiconductor device frame 9. At this time as well, it is possible to judge whether the semiconductor chip 11 has been reliably attracted and conveyed because the light emitted by the light projector 12 is not received by the light receiver 5 on the outward path of the head 2, but is received on the return path. It is carried out with In this case, the light emitted from the projector 13 is projected upward through the pore 14 penetrating the thrusting member 13b. Therefore, the diameter of the raised surface 13c is set to 0.0 mm because it is not necessary to make the raised surface large in order to obtain a sufficient amount of light, unlike the conventional case where this light was obtained from the raised surface.
It is formed very small at 1mm. As a result, when the push-up collet 13 pushes up the semiconductor chip 11,
The push-up collet 13 and the adhesive sheet 10 to which the semiconductor chip 11 is attached come into contact with each other over a very small area. Therefore, since the contact area between the semiconductor chip 11 and the adhesive sheet 10 is also small, when it is sucked by the suction collet 3, it is easily peeled off and adsorbed by the suction collet 3. In this way, push up and collect. As a result, the chances of pick-up errors, chip positional deviations, angular deviations, etc. are reduced. As explained above, according to the automatic die bonder push-up collect according to the present invention, as a path for projecting light for detecting the presence or absence of chips necessary for determining whether a semiconductor chip has been normally picked up by the suction collect, By providing a pore at a position offset from the tip of the semiconductor chip, the size of the thrust surface, which conventionally required 0.3 to 0.4 mm, can be reduced to 0 without reducing the amount of light for detection. It can be made as small as .1 mm or less.

Therefore, when a semiconductor chip attached to an adhesive tape is pushed up through the adhesive tape, the contact area becomes smaller, so that the effect of pushing up the semiconductor chip and peeling it off from the adhesive tape increases. As a result, the suction collet easily adsorbs semiconductor chips and has the effect of reducing problems such as pick-up errors, chip position deviations, and angle deviations.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing an example of a conventional automatic die bonder, Figs. 2 to 4 are front views showing main parts of Fig. 1, and Figs. 5 and 6 are projections of a conventional automatic die bonder. FIGS. 7 and 8 are cross-sectional views showing an example of a lifting collet and a partial sectional view showing its lifting operation; FIGS. FIG. 11... Semiconductor chip, 12... Floodlight, 13... Push-up collector, 13a...
... Cylindrical member, 13b... Push-up member, 13c
... Thrust-up surface, 14... Pore.

Claims (1)

[Scope of Claims] 1. A hollow member that accommodates a floodlight in an internal space, a projecting member protruding from the hollow member to the outside, a small-area projecting surface located at the tip of the projecting member, and a projecting surface located at the tip of the projecting member. and a pore extending from the vicinity of the raised surface to the internal space of the hollow member, and the pore is characterized in that the pore extends substantially parallel to the direction in which the raised surface pushes up the semiconductor chip. Push-up collet for automatic die bonder. 2. The push-up collet for an automatic die bonder according to claim 1, wherein the push-up surface has a dimension of 0.1 mm or less.