JPS594503B2 - Plating processing equipment - Google Patents
Plating processing equipmentInfo
- Publication number
- JPS594503B2 JPS594503B2 JP15144180A JP15144180A JPS594503B2 JP S594503 B2 JPS594503 B2 JP S594503B2 JP 15144180 A JP15144180 A JP 15144180A JP 15144180 A JP15144180 A JP 15144180A JP S594503 B2 JPS594503 B2 JP S594503B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tank
- processing equipment
- plating solution
- plating processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Description
【発明の詳細な説明】
本発明は印刷配線板を無電解銅メッキ処理槽内に浸漬し
導電パターン及びスルーホールを得るた −めのメッキ
処理装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plating apparatus for immersing a printed wiring board in an electroless copper plating bath to obtain conductive patterns and through holes.
最近、印刷配線板の製法は、絶縁板に銅箔が接着された
メタルクラド品を用い、この基板をエッチング法により
導体パターンを形成するエツチドフオイル法に対し、省
資源の見地から、触媒入り 、の樹脂を表面にコートし
た絶縁基板を用い、これにエポキシ樹脂の逆パターンマ
スク印刷を行つた後、この基板を無電解銅メッキ浴に浸
漬して、導体パターンを析出させるアデデイブ法が多く
採用されつつある。Recently, the manufacturing method for printed wiring boards has changed from the etched oil method in which a metal clad product in which copper foil is bonded to an insulating board and a conductive pattern is formed on this board by etching. The AdeDave method is increasingly being adopted, in which a reverse pattern mask of epoxy resin is printed on an insulating substrate coated on the surface, and then the substrate is immersed in an electroless copper plating bath to deposit a conductor pattern. .
アデデイブ法では無電解銅メッキ処理槽内のメッキ浴液
の液組成の濃度やｐＨ値等を規定値の範囲内で制御する
ことがポイントであり、メッキ浴液が化学反応によつて
消費され、変化していく状況をメッキ処理槽内に設けた
センサーがとらえその信号を自動制御盤に送り、不足と
なつたメッキ液５ は補充用タンクから電磁弁の操作に
より補充されるようになつている。In the Ade Dave method, the key is to control the concentration and pH value of the plating bath solution in the electroless copper plating treatment tank within the specified value range, and the plating bath solution is consumed by chemical reactions. A sensor installed in the plating tank detects changing conditions and sends a signal to the automatic control panel, and the insufficient plating solution 5 is replenished from the replenishment tank by operating a solenoid valve. .
この補充液が混合槽に供給され循環しているメッキ液に
注入合流し、さらに熱交換機で所定温度に調整されてメ
ッキ処理槽内にフィードバックするメッキ液の循環方式
が採用１０されている。メッキ処理槽内においては、メ
ッキ溶液に浸漬された絶縁基板がメッキ処理され時間経
過と共に化学反応が進行するにつれて水素が発生してい
る。A plating solution circulation method 10 is adopted in which this replenisher is supplied to a mixing tank, is injected into the circulating plating solution, is further adjusted to a predetermined temperature by a heat exchanger, and is fed back into the plating tank. In the plating bath, an insulating substrate immersed in a plating solution is plated, and hydrogen is generated as a chemical reaction progresses over time.
この水素の影響により、基板上に析出された銅メー５
ツキは脆弱なものを形成してしまうことがあつた。本発
明はこの水素ガスをメッキ溶液から脱気させることを目
的とするメッキ処理装置を提供する。本発明の実施例を
図面に基づき説明すると、１は化学メッキ処理槽であり
、印刷配線板Ｗがメツ”ｏ キ溶液２内に浸漬されてい
る。メッキ溶液２は循環パイプ３により循環している。
４は混合槽であり、補充タンクから補充される補充液５
が混合槽４内で攪拌混合され貯槽６へポンプＴで送液さ
れる。Due to the influence of this hydrogen, copper matrix 5 is deposited on the substrate.
Tsuki sometimes formed something fragile. The present invention provides a plating processing apparatus whose purpose is to degas this hydrogen gas from a plating solution. An embodiment of the present invention will be described based on the drawings. Reference numeral 1 denotes a chemical plating treatment tank, in which a printed wiring board W is immersed in a metal plating solution 2. The plating solution 2 is circulated through a circulation pipe 3. There is.
4 is a mixing tank, and replenisher 5 is replenished from a replenishment tank.
are stirred and mixed in the mixing tank 4 and sent to the storage tank 6 by the pump T.
貯槽６内のメッキ溶液２はポンプ８で熱交換；５ 機９
を経由してメッキ処理槽１にフィードバックされている
。貯槽６にはメッキ溶液２に含まれた水素ガス１０を外
気へ放出するための減圧ポンプ１１が接続されている。Plating solution 2 in storage tank 6 undergoes heat exchange with pump 8; 5 Machine 9
It is fed back to the plating treatment tank 1 via. A vacuum pump 11 is connected to the storage tank 6 for discharging hydrogen gas 10 contained in the plating solution 2 to the outside air.
さらに積極的に水素ガス１０を放１０出させ、また、メ
ッキ溶液の混合を促進するため貯槽内に攪拌装置１２を
備える等の手段を付加することはかまわない。本発明の
メッキ処理装置は、メッキ溶液が化学反応により発生す
る水素ガスを貯槽を設け、貯槽３ ′− 内でガスを排
出するので、印刷配線板への銅メッキは展性及び可撓性
が優れた銅を連続的に析出することができるようになり
、品質が一定になつた。Further, it is possible to add means such as providing a stirring device 12 in the storage tank to actively release hydrogen gas 10 and to promote mixing of the plating solution. The plating processing apparatus of the present invention is provided with a storage tank for hydrogen gas generated by a chemical reaction of the plating solution, and the gas is discharged in the storage tank 3'-, so that copper plating on printed wiring boards is malleable and flexible. It became possible to continuously deposit superior copper, and the quality became constant.
図は本発明の装置のレイアウトを示す正面図。 The figure is a front view showing the layout of the device of the present invention.
Claims (1)
キ処理槽と、このメッキ処理槽内のメッキ溶液を循環さ
せる循環パイプと、この循環パイプの途中に接続した貯
槽とを有し、この貯槽内の水素ガスを脱気するための脱
気手段を設けたことを特徴とするメッキ処理装置。1. It has a plating tank in which printed wiring boards are immersed and subjected to electroless copper plating, a circulation pipe that circulates the plating solution in this plating tank, and a storage tank connected to the middle of this circulation pipe. A plating processing apparatus characterized by being provided with a degassing means for degassing hydrogen gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15144180A JPS594503B2 (en) | 1980-10-30 | 1980-10-30 | Plating processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15144180A JPS594503B2 (en) | 1980-10-30 | 1980-10-30 | Plating processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5775491A JPS5775491A (en) | 1982-05-12 |
| JPS594503B2 true JPS594503B2 (en) | 1984-01-30 |
Family
ID=15518667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15144180A Expired JPS594503B2 (en) | 1980-10-30 | 1980-10-30 | Plating processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS594503B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002298999A (en) * | 2001-03-30 | 2002-10-11 | Molex Inc | Socket for semiconductor package, and sliding method to semiconductor package |
| JP2012153934A (en) * | 2011-01-25 | 2012-08-16 | Tokyo Electron Ltd | Plating processing apparatus, plating processing method, and recording medium |
| JP2012153936A (en) * | 2011-01-25 | 2012-08-16 | Tokyo Electron Ltd | Plating processing apparatus, plating processing method, and storage medium |
-
1980
- 1980-10-30 JP JP15144180A patent/JPS594503B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5775491A (en) | 1982-05-12 |
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