JPS5947951B2 - Converter configuration unit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides at least two semiconductor valves for each alternating current phase;
The present invention relates to a converter component with a cooling body common to all semiconductor valves.

Such an exchanger construction unit is known from German Patent No. 1 514 463 for a rectifier arrangement with controllable valves, in which at least two valves for each phase are connected in antiparallel; In each case, only the forward direction valve is always open.

In typical converter components, each semiconductor valve is provided with its own cooling body. Several such units are assembled in sufficient separation together with other functional elements inside a housing (which can be a housing of a support of an electronics device or a component device). The three-phase conductor must then be provided with, for example, a current transformer, the current actual value detection circuit, the control component with the amplifier and the protection circuit component and the current conductor being accommodated as separate functional elements in the housing, Finally, a blower must be provided to ensure that the heat-generating components or component arrangements are sufficiently cooled. The electronic component arrangement and the transducer component must finally be wired in order to function properly.

Furthermore, mechanical support and guidance systems are provided for the transducer component and the necessary functional elements. The present invention provides a transducer construction unit of the type mentioned at the outset, while having a compact construction style and ease of manufacture and assembly.
The purpose is to bring together all functionally related elements.

This object, according to the invention, is such that the semiconductor valve has a thermally conductive and electrically insulating contact surface, the terminals of the semiconductor valve are located opposite this contact surface, and all The semiconductor valve rests with its contact surface on a flat cooling surface of the cooling body, and the terminals of the semiconductor valve are connected to rigid, elongated conductor elements, which conductor elements are electrically connected in one or more parallel assembly planes. This is achieved by using it as a support for functional elements. The functionally necessary functional elements of semiconductor valves, heat sinks and transducers are thus combined into one self-supporting, stable unit with a high packing density, by means of which all kinds of transducers, e.g. controllable rectifiers, can be connected. can also be realized. By arranging the electrical functional elements in one or more planes, these functional elements are clearly visible and easily accessible. This contributes to ease of manufacture, assembly and maintenance. The use of semiconductor valves in which the cooling surface and the terminal surface are diametrically opposed to each other makes it possible to clearly separate the cooling function and the electrical function in space. A removable, mechanically stable connection between the terminals of the semiconductor valve and a rigid, elongated conductor element opposite the cooling body and the conductor element provide a kind of frame. The associated electrical functional elements can be mounted on the frame. This frame is integrated with electrical conductors at the same time, so that direct electrical connections to functional elements arranged in the assembly plane can always be made wherever necessary in the different assembly planes. Therefore, the guide. The body element has a dual function, on the one hand mechanical support and on the other hand guidance of the main current. The purposeful use of these dual functions significantly improves the use of space and contributes to increased functional reliability. This is because a very large portion of cumbersome and error-prone wiring can be eliminated and the danger of stray effects of undefined conductors can be avoided. The prefabricated and factory-tested converter assembly can be easily installed at the installation site, for example as a module unit for constructing a power supply for a DC motor, with just a few plug connections and current conductor terminals. Can be combined into one large device. It is advantageous if the assembly plane extends approximately perpendicular to the conductor element. This ensures a simple yet robust construction. In an advantageous embodiment, the electrically functional element on one of the assembly planes is provided on a printed circuit board through which the conductor element passes.

In this case, mechanically loadable electrical contacts can be created between the printed circuit board and the conductor element at the penetration points. Such functional elements are, for example, for controllable converters, protective component arrangements for protecting semiconductor valves from overcurrents and overvoltages, and control component arrangements for transmitting control pulses to semiconductor valves. . A printed circuit board provided with such functional elements can be prefabricated and tested before being installed in the converter component. In order to obtain a structural form that is easy to handle and sufficiently safe against mechanical damage, the dimensions of the printed circuit board should be matched to the dimensions of the heat sink, so that the printed circuit board does not protrude to the sides of the heat sink very much. do. By creating a contact between the printed circuit board and the conductive elements, the printed circuit board is held mechanically securely, and at the same time the electrically functional elements provided on the printed circuit board are connected via the terminals of the semiconductor valve and the conductive elements. connected to ensure proper contact. The connection between the printed circuit board and the conductor element can be made in such a way that the printed circuit board has ring-shaped conductor tracks at the penetration points. The conductor elements can be soldered immediately at this point in the Schwall process that is actually necessary after the printed circuit board has been installed. It is advantageous if current conductors and current transformers, which functionally connect the conductor elements, are arranged on one of the assembly surfaces as functional elements.

The electrical connection of the semiconductor valve terminals and the current detection are therefore clearly and easily accessible on this side. In this aspect, the supply of electricity and the withdrawal of a current modulated by the action of the converter takes place. The conductor element can be formed as a metal tube which is pressed onto the electrical terminal of the semiconductor valve by means of a screw connection.

Metal tubes that are firmly connected to one or more printed circuit boards can be connected to the semiconductor valve by a simple mechanical method by means of bolts passing through the individual metal tubes, if the terminals of the semiconductor valve have internal threads. Can be pressed onto the terminal.

By means of this bolt, a current conductor arranged in one plane at the end of the metal tube remote from the cooling body can at the same time be easily releasably connected to the metal tube. In an advantageous embodiment, a component is used as the semiconductor valve, each having two semiconductor valves connected in series, the connection between the two terminals belonging to the input and output of the value sequence circuit and the semiconductor valves being connected in series. A third terminal belonging to the conductor is arranged in series with the component.

These components can be secured to the heat sink with little assembly, and the precise dimensioning of the component terminals eliminates tolerance problems when mounting multiple printed elements mounted within a printed circuit board. Decrease. In the case of converter components for three-phase systems, it is advantageous if three such components are arranged in parallel with one another.

This results in a simple construction and clear straight current conductor paths. In an advantageous embodiment, the outer surface of the heat sink is used as the cooling surface, the cooling fins on the side opposite the outer surface of the heat sink are covered by a baffle wall to form a rectangular channel, and the cooling fins are formed on the end surface. Forced ventilation is provided by an axial blower installed in the

The compact blower/cooler unit provides effective cooling of the high heat generating semiconductor valve and provides a preferred fixing surface for the semiconductor valve with an easily accessible flat exterior surface. Depending on the intended use, the converter component is suitable both for the installation of controllable semiconductor valves and for the installation of non-controllable semiconductor valves. Thyristors can therefore also be used as semiconductor valves. In this case, the printed circuit board can have as functional elements a pulse transmitter, a carrier accumulation effect protection circuit and components for detecting the actual current value, as well as contact units for the terminals of the external connection conductors. A highly space-efficient design of the converter component is advantageous, especially if the number of protection circuits for the controllable semiconductor valve is considerable.

By integrating all functionally important elements, by spatially arranging these elements, and by combining mechanical and electrical connections in the form of conductive elements, conventional, i.e. separate, functions can be eliminated. The volume is reduced by 90% and the weight reduced by 80% compared to a converter component unit of the same capacity consisting of a single unit. Embodiments of the present invention will be described below with reference to the drawings.

The block connection diagram shown in FIG. 1 schematically shows the construction of a converter component with associated electrical functional elements.

In the center of the connection diagram, the semiconductor valve unit 1 of the converter is shown. It has six three-phase bridge-connected thyristors T1 to T6 with a pulse number of six. The three-phase voltage supply takes place at the input E via a current transformer 2. The output terminals of the converter component are designated A1 and A2. Furthermore, the converter component unit includes a thyristor T1
a pulse transmitter 3 (possibly followed by a pulse amplifier) for supplying control pulses to the ignition electrodes of T6 and T6; a carrier accumulation effect protection circuit 4; and a current actual value as electrical functional elements. It has a detection circuit 5 and a blower 6 that cools the thyristors T1 to T6 that generate high heat. As already mentioned at the outset, in the past the semiconductor valve unit and the associated electrical functional elements were constructed and arranged separately.

This method is no longer used with integrated structures in the present invention.

FIG. 2 shows a perspective view of an embodiment of the transducer component according to the invention. Reference numeral 7 denotes a cooling body formed into a rectangular parallelepiped by a wind guide wall, one end face of which is provided with an axial flow blower 6, and the opposite end face is open.

The tube-like shape of the cooling body 7 leads to a perfect and uniform cooling gas flow to the cooling fins 8 located inside the tube. The internal structure of the cooling body 7 is clearly shown in FIG.

FIG. 3 shows a cross section taken along the - line in FIG. The cooling fins 8 facing inside the rectangular parallelepiped cooling body 7 are
The heat absorbed from the semiconductor valves T1 to T6 to be cooled in the cooling surface 9 is released into a laminar cooling air stream. In use, the transducer component is rotated nine degrees relative to the position shown in FIG. 2 and is therefore assembled in a columnar manner.

The axial blower 6 is placed above the inlet of the cooling body 7 and assists the convection of the cooling gas by a suction action. In place of each individual semiconductor valve T1 to T6, a component 10 of identical construction is inserted, in each case two series-connected semiconductor valves assembled in an elongated case.

These components are shown in FIGS. 2 and 3. The heat dissipation from the semiconductor valves of these components 10 takes place via the electrically insulating and thermally conductive oxide ceramics to the metallic contact surfaces 11 of the components 10. The electrical terminals of these components 10 face the contact surface 11 and are arranged one after the other in series. In this case, the terminals 12, 13 belonging to the input and output of the series circuit are adjacent. These terminals include terminal 1, which belongs to the connecting conductor between semiconductor valves.
4 is connected as the third terminal. Terminals 12, 13
and 14 each have one internal thread. The circuit connection of the thyristors, e.g. T1 and T2, and the contact mechanisms belonging thereto in such a component 10 are
As shown in the figure. The components 10 each have a cutout 15 at their end, into which a mounting hole 16 passes through the contact surface. Such component 1
0 is, for example, Federal Republic of Germany Utility Model No. 7512573
It is disclosed in the specification of No. To realize the three-phase bridge circuit with six thyristors T1 to T6 shown in FIG.
are arranged in parallel with each other on the cooling surfaces 9 of the cooling surfaces 9 and are pressed against these cooling surfaces 9 by bolts 25.

In this case a component 10 is provided for each of the three phases,
For example, thyristors T1 and T2, thyristors T3 and T2, or thyristors T5 and T6 are each included in one component 10. In the terminals 12, 13 and 14 of the component 10, a longitudinally extending conductor element in the form of a metal tube 17 is inserted through which a bolt 23 is inserted from above in each case to connect the terminal 1.
It is pressed by being screwed together with the internal threads 2, 13 and 14.

Metal tube 17 is attached to printed circuit board 18;
This printed circuit board 18 is arranged perpendicularly to the axis of the metal tube 17 and is sized such that it does not exceed the basic dimensions predetermined by the combination of the cooling body T and the axial blower 6. On the printed circuit board 18, functional elements such as a pulse transmitter, a carrier accumulation effect protection circuit, and a current actual value detection circuit 5 are provided. These circuits only include some electronic components 19 in FIG.
It is shown in the form of A component 19 surrounded by a dashed rectangle on the printed circuit board 18 shows the current actual value detection circuit 5 by way of example. Furthermore, the printed circuit board 18 has contact units 20 for the terminals of peripheral units of the control device, for example.
have. Of course, in contrast to this embodiment, the control device can also be arranged on a separate assembly plane and mounted on one printed circuit board. The printed circuit board may also be supported by a metal chip, via which it may be connected to the control terminals of the thyristor to suit the desired function. Semiconductor valves T1, T2, T3, T4 provided in component 10
, T5, T6, the metal tubes 17 in contact with the terminals 12, 13, 14 serve not only as a support for the printed circuit board 18, but also as elongated terminals of the semiconductor valves T1 to T6, from which the printed circuit can be connected. The limits, current and voltage values necessary for the functional elements provided on the printed circuit board 18 are extracted within the enclosure of the board 18 . Contact is thus also made simultaneously with the attachment of the printed circuit board 18 to the metal tube 17. For this purpose, the printed circuit board 18 is provided in each case with a ring-shaped conductor track that surrounds the metal tube 17 at its penetration points 24 . In the manufacturing process of the printed circuit board 18, after installation, the electronic components are soldered to the conductor tracks of the printed circuit board 18 in a Schwall bath. In this case, the metal chip IT inserted into the printed circuit board 18 is at the same time electrically and mechanically reliably connected to the ring-shaped conductor track.
The printed circuit board 18 thus becomes the first assembly surface E1.
A current conductor 2 is placed on another assembly surface E2 on this first assembly surface E1.
1 and 22 and a current transformer 2 are arranged.

Current conductor 21 connects the anodes of thyristors T1, T3 and T5, current conductor 22 connects the anodes of thyristors T2, T4 and T
Connect the cathodes of 6. The metal tube IT in this case serves on the one hand as a support and spacer, and on the other hand as itself an electrically conductive element. The fixing of the current conductors 21 and 22 to the metal tube IT takes place by bolts 23 that connect the metal tube itself to the terminals 12, 13, 14 of the component 10. The current conductors 21 and 22 are provided at their ends with terminal holes A1 and A2 as outputs of a converter component, to which a load can be connected. The metal tubes 17 at the rear in FIG. 2, which belong in each case to the three-phase terminal E on the one hand and to the two thyristors, for example T1 and T2, connected in series on the other hand, are arranged slightly higher relative to the current conductor plane E2. It serves as a support element for the bushing type current transformer 2.

According to the invention, it is possible to use a compact transducer construction unit in which all major electrical and mechanical functional elements are assembled in a self-supporting manner.

Such converter construction units can be completely prefabricated and inserted at the installation site with little expense to form a complete converter, for example as a power supply unit of an electric drive. This converter component is easy to assemble and maintain while maintaining its compactness. As a result of the compact construction, the electrical wiring is shorter and significantly simpler than in conventional separate arrangements, and is much less prone to breakdowns. Due to the spatial arrangement and self-supporting structure, the weight and volume of the transducer component according to the invention is reduced by 80 to 90 times compared to conventional devices.

[Brief explanation of the drawing]

1 is a block connection diagram of a thyristor component unit, FIG. 2 is a perspective view of a converter component unit constructed according to the present invention, and FIG. 3 is a cross-section of the converter component unit taken along the line - in FIG. 2. It is a diagram.

Claims (1)

[Claims] 1 At least two semiconductor valves for each alternating current phase,
A plurality of components, wherein the semiconductor valve has a thermally conductive and electrically insulating contact surface, and on the opposite side of the contact surface an electrical terminal of the semiconductor valve is provided with an internal thread. ,
The plurality of components are arranged in parallel so that common electric terminals of the plurality of components are aligned, a common cooling body is connected to the contact surfaces of the plurality of components, and a metal tube is connected to the penetration point of the printed circuit board. electrically and mechanically connecting the components, a printed circuit board is arranged on top of said component, and furthermore current conductors and current transformers are arranged on top of the printed circuit board to suitably connect the metal tubes. . A transducer configuration unit, characterized in that the metal tube is pressed against an electrical terminal of a semiconductor valve by screw connection.