JPS5950433B2 - How to weld thin plates - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in the method of welding a resilient thin plate onto a substrate.

When manufacturing the contact part of a relay switch, the thickness is approximately 0.5
A thin plate having a thickness of about 0.1 mm and serving as a contact spring is welded onto a rectangular substrate of about 0.7 mm along one side edge of the substrate.

In this case, conventionally the spring plate is pressure-welded onto the board using electric resistance welding, but since the electrode rod is pressed along one side edge of the spring plate and welded, the free end of the spring plate rises after welding. When the desired adhesion cannot be obtained, and the contact resistance differs due to differences in the surface conditions of the thin plate and the substrate (formation of oxide film, adhesion of impurities, etc.), and the welding condition changes, making it impossible to achieve uniform welding. It was hot. The present invention has been made in view of the above points, and provides a uniform welding condition by improving the adhesion between the free end of the unwelded thin plate and the substrate when welding one edge of the thin plate to another substrate. The purpose of the present invention is to provide a thin plate welding method that yields.

For this reason, in the present invention, a gap is provided between the thin plate and the substrate by curving the thin plate or forming a recess covering almost the entire upper surface of the substrate, and the gap is sandwiched between the thin plate and the edge near the welding point and the opposite edge. The method is characterized in that welding is performed by irradiating the welding point with a laser beam as a heat source while pressing the thin plate onto the substrate along the welding point. FIG. 1 is a sectional view of a welding machine according to the present invention.

One of the substrates 3 to be welded fits into a receiving groove 2 of a predetermined shape provided at a predetermined position of the base 1. The other thin plate 4 having spring properties is mounted on this substrate 3 to be welded. The thin plate 4 is aligned by fitting a pin 6 provided on the base 1 into the hole 5 of the thin plate 4. This thin plate 4
is curved upward in a convex shape. A pressing block 8 placed on the thin plate 4 presses the thin plate 4 onto the substrate 3.
This pressing block 8 has pressing portions Ba and 8b on both sides of its lower part.
The thin plate 4 is pressed and fixed in the vicinity of the welding point A and in the vicinity of the free end on the opposite side. The pressing force F of this pressing block 8 is given by a spring plate 9. Action portion 9a of spring plate 9
is located approximately in the center between the pressing portions Ba and 8b of the pressing block 8, and applies approximately uniform force to both. Reference numeral 11 denotes a laser beam irradiation device, which irradiates the welding area A to heat and weld the thin plate 4 and the substrate 3.

In the welding method described above, a gap is formed between the thin plate and the substrate, so the influence of the surface condition is suppressed, the pressure block presses both edges of the thin plate with uniform force, and a laser beam is used as the welding heat source. Since this method is used, it is possible to obtain a stable and uniform welding condition that is not affected by variations in resistance distribution, has good adhesion, and does not cause the free end portion to lift up after welding.

Incidentally, in order to provide a gap between the thin plate and the substrate, a recess 10 may be formed over the entire upper surface of the substrate 3 as shown in FIG.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of an apparatus for carrying out the method of the present invention, and FIG. 2 is a cross-sectional view of another example of the substrate according to the present invention. 3...Substrate, 4...Thin plate, 8...
...Press block, 10...Recess, 11...
... Loser light irradiation device.

Claims (1)

[Claims] 1. A method of welding a thin springy plate that substantially covers a rectangular substrate along one side edge of the substrate, in which the thin plate is curved or a recess is formed that covers substantially the entire upper surface of the substrate, and the thin plate and A gap is provided between the substrates, and the thin plate is pressed onto the substrate along the vicinity of the welding point and the vicinity of the edge on the opposite side of the gap, and the welding is performed by irradiating the welding point with a laser beam. method for welding thin plates.