JPS5952517B2 - Connector manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a novel connector that allows high density.

Recently, the density of electronic components has been increasing, and along with this, there is a demand for the development of fine connectors that can easily connect electronic components. The connector is made of alternating layers of rubber.
There are limits to high density.

As a result of intensive research to meet the above requirements, the present inventors have discovered that a multilayer circuit can be created by forming a fine line conductor circuit on a substrate in a laminated manner with a polymer layer interposed therebetween, and then cutting it into desired dimensions. The inventors discovered that a highly reliable fine connector with densely laminated layers could be obtained and completed the present invention.

That is, the present invention forms a thin metal layer on a substrate or a substrate coated with a polymer layer, applies a sufficient amount of energy to the thin metal layer to form a pattern, and then forms a pattern. After plating a conductive metal on the patterned metal thin layer, a polymer is further applied (at this time, the coating is applied so that the protrusions of the conductor circuit pattern are eliminated and the coating surface is practically flat), and the metal thin layer is formed. By providing a method for manufacturing a connector, which comprises repeating the steps of forming a conductor circuit, forming an energy application pattern, and plating a conductive metal, and cutting the laminate into desired dimensions. This aims to achieve the above objectives. Substrates that can be used in the present invention can be found in a wide variety of ways.

The substrate may be a film of polyester, polyimide, polyamide, cellulose acetate, polystyrene, polyethylene, polypropylene, polyether sulfone, polyparapanic acid, etc., but natural rubber, styrene-butadiene rubber, polybutadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, Epichlorohydrin rubber, high styrene rubber, chlorosulfonated polyethylene, acrylic rubber, fluororubber, chlorinated polyethylene, urethane rubber, ethylene propylene rubber, polyisoprene rubber,
Particularly preferred are those having rubber elasticity such as alphine rubber and silicone rubber. The polymer layer used in the present invention is preferably one that is resistant to thermal decomposition.

Moreover, those having excellent adhesion to the substrate and thin metal layer used are particularly preferred. The above-mentioned polymers can be either thermoplastic or thermosetting, but thermosetting ones are particularly preferred. Examples of polymers that can be suitably used in the present invention include epoxy resins, phenolic resins, polyurethanes, polycarbonates, polyamides, polyimides, polyesters, silicone rubbers, etc. In the case of thermosetting types, suitable initiators or curing agents can be used. It is recommended to mix. These can be applied by dissolving them in a suitable solvent to obtain a desired film thickness. A more preferable range of film thickness is 1 to 100 μm. Metal thin films that can be used in the present invention include metals such as nickel, copper, titanium, tin, indium, palladium, lead, zinc, bismuth, tellurium, iron, cobalt, antimony, germanium, gold, silver, aluminum, and chromium; can be formed using any convenient equipment, such as by vacuum deposition, sputtering, ion plating, etc.
These may have a single layer structure, or may have a multilayer structure of two or more layers as necessary.
The preferred range is 00 to 5,000 people.

Methods for forming the thin metal layer pattern used in the present invention include a method of exposing using a mask, a method of scanning energy modulated into an image, etc.
A sufficient amount of energy is applied to disperse and remove the metal thin layer in the exposed area.

Types of energy include radiant energy and particle energy, and pulsed energy is more preferable.
Examples include flash lamps, infrared lamps, lasers, and electron beams. The conductive metal plating method used in the present invention includes an electroless plating method and an electroplating method, and these methods can be used alone or in combination.

Examples of conductive metals include copper, silver, gold, nickel, and tin, and plating is usually performed by a known method. After the conductor circuit is formed in a laminated manner on the substrate in this manner, a conventionally known method is used to cut the conductor circuit into desired dimensions.

Further, in order to further improve reliability, each terminal of the terminal portion may be plated with a conductive metal after cutting, and further may be subjected to heat treatment or other treatment as necessary.

EXAMPLES In order to further clarify aspects of the present invention, examples will be described below, but the present invention is not limited to the following examples, and various modifications are possible.

Example 3 On a 300μ silicone rubber sheet, epoxy adhesive “XA-564-4” manufactured by Bostik was applied to a thickness of 10μ after drying, and after heating at 150°C for 10 minutes, 100 people Next, titanium was deposited to a thickness of 100 mm.

Claims (1)

[Claims] 1 forming a thin metal layer on a substrate or a substrate coated with a polymer layer, applying a sufficient amount of energy to the thin metal layer to form a pattern, and then forming a pattern on the patterned metal. After plating a conductive metal on the thin layer, the process of forming a conductor circuit consisting of polymer application, metal thin layer formation, energy application pattern formation, and conductive metal plating is further repeated to laminate the laminate. A method for manufacturing a connector, which comprises cutting the connector into desired dimensions.