JPS5952518B2 - Connector manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a novel connector that allows high density.

Recently, the density of electronic components has been increasing, and along with this, there is a demand for the development of fine connectors that can easily connect electronic components. The connector is made of alternating layers of rubber.
There are limits to high density.

As a result of intensive research to answer the above request, the inventors of the present invention have developed a highly reliable circuit by forming a fine-line conductor circuit on a peelable substrate, then peeling the substrates, stacking them, and cutting them into desired dimensions. The present inventors discovered that a fine connector with excellent properties can be obtained, and completed the present invention.

That is, the present invention involves forming a thin metal layer after applying a polymer layer on a peelable substrate, and forming a pattern by applying an amount of energy sufficient to generate a pattern in the thin metal layer. , then plating a conductive metal on the patterned metal thin layer to obtain a conductive circuit board, peeling the obtained conductive circuit board from the peelable substrate, laminating it, and then cutting it into desired dimensions. It is an object of the present invention to achieve the above object by providing a method for manufacturing a connector, which includes a step of cutting a laminate.

As the removable substrate used in the present invention, Teflon, silicone, or a film or sheet treated with a conventionally known release agent is preferably used, and these substrates have a somewhat weak adhesion to the polymer. is selected.

The polymer layer used in the present invention is preferably one that is resistant to thermal decomposition.

In addition, the adhesion to the thin metal layer used is excellent, but
Particularly suitable is one that has a somewhat weak adhesion to the substrate. The above-mentioned polymers can be either thermoplastic or thermosetting, but thermosetting ones are particularly preferred. Examples of polymers that can be suitably used in the present invention include epoxy resins, phenolic resins, polyurethanes, polycarbonates, polyamides, polyimides, polyesters, silicone rubbers, etc. In the case of thermosetting types, suitable initiators or It is advisable to add a hardening agent. These can be applied by dissolving them in a suitable solvent to obtain a desired film thickness. These may have a single layer or multilayer structure. However, a more preferable range of film thickness is 1 to 100 μm. Metal thin films that can be used in the present invention include nickel, copper, titanium, tin, indium, palladium, lead, zinc, bismuth, tellurium, iron, cobalt, antimony, germanium, gold,
Metals such as silver, aluminum, chromium, and alloys thereof, etc., can be formed by any convenient equipment, such as vacuum steaming, sputtering, ion blating, etc.; Moreover, it may have a multilayer structure of two or more layers, if necessary.

The film thickness is preferably in the range of 50 to 1μ, particularly 100 to 5000. Methods for forming a pattern on the thin metal layer used in the present invention include exposure using a mask and scanning with image-modulated energy, so that the thin metal layer in the exposed area is dispersed. A sufficient amount of energy is applied to remove the material.

Types of energy include radiant energy and particle energy, and pulse type is more preferable. Examples include flash lamps, infrared lamps, lasers, and electron beams. The conductive metal plating method used in the present invention includes an electroless plating method and an electroplating method, and these methods can be used alone or in combination.

Examples of conductive metals include copper, silver, gold, nickel, and tin, and plating is usually performed by a known method. As for the method of peeling the conductor circuit board used in the present invention from the substrate and laminating it, the peeled conductor circuit board may be laminated as is, but the polymer layer of the conductor circuit board is in a semi-cured state and then separated. A preferred method is to peel and transfer the conductive circuit board from the substrate (on which a polymer layer is applied), repeat the peeling and transfer to laminate, and then heat and press the board.

A conventionally known method can be used to cut the laminated conductive circuit board according to the present invention into desired dimensions.

In addition, in order to further improve reliability, each terminal of the terminal section may be plated with a conductive metal after cutting, and if necessary, heat treatment or other treatment may be applied after plating each terminal. Also good.

EXAMPLES In order to further clarify aspects of the present invention, examples will be described below, but the present invention is not limited to the following examples, and various modifications are possible.

Example: On a Teflon sheet, epoxy adhesive "XA-564-4" manufactured by Bostikku Mori was applied to a thickness of 50 μm after drying, heated at 180°C for 10 minutes, and then coated with 100 μm of copper.
Next, nickel was deposited to a thickness of 100 people.

Claims (1)

[Claims] 1. After applying a polymer layer on a peelable substrate, forming a thin metal layer and applying an amount of energy sufficient to cause a pattern to the thin metal layer to form a pattern; a step of plating a conductive metal on a thin metal layer to obtain a conductive circuit board; a laminate cutting step of peeling the obtained conductor circuit board from a peelable substrate, laminating it, and then cutting it into desired dimensions; A method for manufacturing a connector, characterized by having the following.