JPS6010410B2 - Composite plated contacts - Google Patents
Composite plated contactsInfo
- Publication number
- JPS6010410B2 JPS6010410B2 JP51151139A JP15113976A JPS6010410B2 JP S6010410 B2 JPS6010410 B2 JP S6010410B2 JP 51151139 A JP51151139 A JP 51151139A JP 15113976 A JP15113976 A JP 15113976A JP S6010410 B2 JPS6010410 B2 JP S6010410B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- particles
- platinum group
- composite
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002131 composite material Substances 0.000 title claims description 11
- 239000002245 particle Substances 0.000 claims description 28
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 20
- 239000000956 alloy Substances 0.000 claims description 13
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 238000007747 plating Methods 0.000 description 10
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011246 composite particle Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000000573 anti-seizure effect Effects 0.000 description 1
- 235000021028 berry Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/027—Composite material containing carbon particles or fibres
Landscapes
- Contacts (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】 この発明は複合めつき接点に関するものである。[Detailed description of the invention] This invention relates to composite plated contacts.
/ 弱電用のスイッチング接点材料として従来から銀系
材料、白金系材料および金を主成分とする合金が用いら
れている。/ Silver-based materials, platinum-based materials, and alloys mainly composed of gold have been used as switching contact materials for light current applications.
しかしながら、銀系材料を用いた接点は、大気中におい
て絶縁性皮膜を生じ耐食性に欠け、、かつ接触特性も悪
かった。白金族系材料を用いた接点は、軽負荷(例えば
0.1V,lmA)開閉において、接触面に絶縁性の有
機物(ブラウンパウダ)を生じ接触不良を起すという問
題があった。However, contacts using silver-based materials formed an insulating film in the atmosphere, lacked corrosion resistance, and had poor contact characteristics. Contacts made of platinum group materials have a problem in that insulating organic matter (brown powder) is generated on the contact surface when switching at light loads (for example, 0.1 V, lmA), resulting in poor contact.
金または金を主成分とする合金を用いた接点を有さず耐
食性および接触特性が優れているが、融点が低く軟質な
ため耐摩耗性に欠けるという問題があった。したがって
、この発明の目的は、耐食性および接触特性がよく、し
かも耐摩耗性に富む大気中で使用する気中開閉用の複合
めつき接点を提供することである。It does not have contacts made of gold or gold-based alloys and has excellent corrosion resistance and contact characteristics, but has a problem of lacking wear resistance due to its low melting point and softness. Accordingly, an object of the present invention is to provide a composite plated contact for use in the air for use in the atmosphere, which has good corrosion resistance and contact characteristics, and is highly wear resistant.
要約すれば、この発明のめつき接点は、白金族元素また
は白金族元素を主成分とする合金中に、WC粒子を分散
するものである。In summary, the plated contact of the present invention has WC particles dispersed in a platinum group element or an alloy containing a platinum group element as a main component.
このように、白金族元素または白金族元素を主成分とす
る合金を材料として用いるので、銀系材料を用いた従来
の接点の欠点である大気中における絶縁性皮膜の生成が
なく、耐食性にすぐれたものになる。また、白金族元素
からなる接点の欠点である大気中におけるブラウンパウ
ダの発生が抑制され、耐食性および接触特性が向上し、
耐摩耗性も向上する。つぎに、この発明を詳しく説明す
る。白金族元素または白金族元素を主成分とする合金中
に分散されるWC粒子は、高硬度、高融点、耐腐食性、
耐酸化性、導電性の各特性を有する。In this way, since a platinum group element or an alloy containing platinum group elements as a main component is used as a material, there is no formation of an insulating film in the atmosphere, which is a disadvantage of conventional contacts using silver-based materials, and it has excellent corrosion resistance. become something. In addition, the generation of brown powder in the atmosphere, which is a disadvantage of contacts made of platinum group elements, is suppressed, and corrosion resistance and contact characteristics are improved.
Abrasion resistance is also improved. Next, this invention will be explained in detail. WC particles dispersed in platinum group elements or alloys mainly composed of platinum group elements have high hardness, high melting point, corrosion resistance,
It has oxidation resistance and conductivity properties.
また、WC粒子は、その粒子中にフリーカーボンが接点
をさらに高寿命化する。すなわち、カーボンは放電を生
じ易い物質であるから、放電を生じた部分のカーボンが
燃焼してしまい次の放電が他の部分で起こるようになる
。そのため、放電が分散し結局接点面は平滑に消耗する
。さらに、WC粒子は比較的入手が容易であり量産性と
低価格を具備している。このWC粒子を用いた接点層を
第1図および第2図に示す。In addition, free carbon in the WC particles further extends the life of the contacts. That is, since carbon is a substance that tends to cause electrical discharge, the carbon in the area where the electrical discharge occurred will burn, and the next electrical discharge will occur in another area. Therefore, the discharge is dispersed and the contact surface is worn out smoothly. Furthermore, WC particles are relatively easy to obtain, can be mass-produced, and are inexpensive. A contact layer using these WC particles is shown in FIGS. 1 and 2.
これらの図において、1は白金族元素または白金族元素
を主成分とする合金、2はそこへ分散されたWC粒子で
ある。この場合、接点層の厚みは1〜15山mが好まし
い。また、WC粒子2の直径は10山m以下であること
が好ましく、その量は20〜8舷容量%が好ましい。こ
のように、白金族元素または白金族元素を主成分とする
合金1中に、それよりも硬度が高く優れた特性をもつW
C粒子2を分散するため、これを用いた接点は耐落着性
および耐摩耗性が向上し、接触特性が安定化する。特に
第2図のように、接点層表面にWC粒子2を密に分散さ
せてWC粒子2の皮膜をつくり白金族元素または白金族
元素を主成分とする合金1の露呈を防ぐと、ブラウンパ
ウダの発生が一層少なくなる。そのため、軽負荷(例え
ば0.1V,lmA)における使用において、接触不良
を起すことがなくなる。もちろん、この接点構造で、比
較的大容量負荷(例えば20V,IA)で使用してもさ
しつかえない。また、WC粒子を接点層に均一にあるい
は第2図に示すように表面に密に分散させるうえで、め
つき法を用いるのが好ましく、従来の暁結法によって得
られた接点ではWC粒子の分散性に劣り、安定した品質
の穣点を得ることができない。このようにして得られた
複合めつき接点は、ブラウンパゥダの発生が防がれ耐食
性が優れているため、比較的低接触圧で設計されるスイ
ッチング接点において、軽負荷(0.1V,lmA)に
おける開閉で接触信頼度の向上に優れた効果を発揮する
。In these figures, 1 is a platinum group element or an alloy mainly composed of a platinum group element, and 2 is WC particles dispersed therein. In this case, the thickness of the contact layer is preferably 1 to 15 m. Further, the diameter of the WC particles 2 is preferably 10 m or less, and the amount thereof is preferably 20 to 8% by vessel volume. In this way, W, which has higher hardness and superior properties, is added to platinum group elements or alloy 1 whose main component is platinum group elements.
Since the C particles 2 are dispersed, a contact using the C particles has improved anti-seizure properties and wear resistance, and stable contact characteristics. In particular, as shown in Figure 2, if WC particles 2 are densely dispersed on the contact layer surface to form a film of WC particles 2 to prevent exposure of platinum group elements or alloy 1 whose main component is platinum group elements, brown powder The occurrence of this will be further reduced. Therefore, when used under light loads (for example, 0.1 V, lmA), contact failures will not occur. Of course, this contact structure can be used with a relatively large capacity load (for example, 20V, IA). In addition, it is preferable to use the plating method to disperse the WC particles uniformly in the contact layer or densely on the surface as shown in Figure 2. It has poor dispersibility and cannot obtain a stable quality of berries. The composite plated contacts obtained in this way prevent the generation of brown powder and have excellent corrosion resistance, so they can be used at light loads (0.1V, lmA) in switching contacts designed with relatively low contact pressure. It has an excellent effect on improving contact reliability when opening and closing.
また、比較的大きい負荷(例えば20V,IA)におい
ても溶着がなく、かつ接触信頼度が高い。すなわち、こ
の複合めつき接点の使用により広に範囲で開閉可能なス
イッチング接点を得ることができる。また、硬度が高い
WC粒子を分散しているため、耐摩耗性も向上する。つ
ぎに、好ましい実施例について説明する。Moreover, there is no welding even under relatively large loads (for example, 20 V, IA), and contact reliability is high. That is, by using this composite plated contact, a switching contact that can be opened and closed over a wide range can be obtained. Furthermore, since WC particles with high hardness are dispersed, wear resistance is also improved. Next, preferred embodiments will be described.
実施例 1:Pd−Nj合金めつき裕中にWC粒子を混
入し、Cu層の上にNi層を施した下地の上にに、Pd
−Ni合金と共にWC粒子をめつき法によって共析させ
接点層を形成し複合めつき接点を得た。Example 1: WC particles were mixed into a Pd-Nj alloy plating layer, and Pd
A contact layer was formed by eutectoidizing WC particles together with the -Ni alloy by a plating method, and a composite plated contact was obtained.
この場合、Pb−Ni合金めつき格の組成をPd8の重
量%,Ni2の重量%とした。WC粒子は、粒子径がl
rmであった。そして、WC粒子の共析量を聡%に設定
した。この場合の複合めつき方法および条件はつぎの通
りである。‘1’めつき液(パラジウムーニッケル合金
めつき液PNP80 日進化成社製)‘2)複合粒子混
入量: 25夕/そ■ 液 温:
30qo‘41 電流密度:
IA/d〆{5} 蝿洋方法:
機械的蝿梓この場合、共析量は電流密度
を調節することにより制御することができ、これを制御
することによに接点層表面に複合粒子を密な状態で共折
させた。In this case, the composition of the Pb-Ni alloy plating case was set to be Pd8 weight % and Ni 2 weight %. WC particles have a particle diameter of l
It was rm. Then, the eutectoid amount of WC particles was set to %. The composite plating method and conditions in this case are as follows. '1' Plating liquid (palladium-nickel alloy plating liquid PNP80 manufactured by Nisshinsha Co., Ltd.) '2) Amount of composite particles mixed: 25 minutes/day ■ Liquid temperature:
30qo'41 Current density:
IA/d〆{5} Fly method:
In this case, the amount of eutectoid can be controlled by adjusting the current density, and by controlling this, the composite particles were co-deposited in a dense state on the surface of the contact layer.
比較例 1:
複合粒子の混入を止め、Pd80重量%、Ni20重量
%のみからなるPd−Nj合金めつき浴を用いた。Comparative Example 1: Mixing of composite particles was stopped, and a Pd-Nj alloy plating bath consisting of only 80% by weight of Pd and 20% by weight of Ni was used.
そのほかは実施例1と同様にして接点層を形成し接点を
得た。比較例 2:
金で接点を構成した。Otherwise, a contact layer was formed and a contact was obtained in the same manner as in Example 1. Comparative Example 2: Contacts were made of gold.
以上の実施例1、比較例1,2で得た薮点の開聞寿命試
験の結果を次表に示した。The results of the open life test of the bush points obtained in Example 1 and Comparative Examples 1 and 2 are shown in the following table.
第1表
なお、20V,IN巽閉試験において、寿命の判定は、
接触抵抗40の時点で寿命とした。Table 1 In addition, in the 20V, IN Tatsumi closed test, the lifespan was determined as follows:
When the contact resistance reached 40, the life was reached.
また、フラウンパウダ発生による接触障害の有無を調べ
る0−IV,lmA開閉試験では、初期ミスの発生した
時点で寿命とした。実施例 2:前記と同じPd−Ni
合金めつき液(PNP80)にWC粒子を混入して下地
上にPd−Ni合金と共にWC粒子をめつき法によって
共析させ、複合接点Aを得た。In addition, in the 0-IV, lmA opening/closing test to examine the presence or absence of contact failure due to the generation of flounce powder, the end of life was defined as the point at which an initial error occurred. Example 2: Same Pd-Ni as above
Composite contact A was obtained by mixing WC particles into an alloy plating solution (PNP80) and eutectoiding the WC particles together with the Pd-Ni alloy on the substrate by a plating method.
一方、WC粒子に代えてTIC粒子を用いたほかは前記
と同機にして複合接点Bを得た。On the other hand, composite contact B was obtained using the same machine as above except that TIC particles were used instead of WC particles.
これらWC粒子およびTIC粒子でそれぞれ複合化した
接点を用いて、20V,IAでの接点の開閉寿命(p9
5)および初期接触抵抗を調べた。その結果を次表に示
す。第2表
この結果から、WC粒子を混入した接点AはTIC粒子
を混入した接点Bに比して開閉寿命が高く、しかも初期
懐鮫抵抗が低いことがわかる。Using a contact composited with these WC particles and TIC particles, the switching life of the contact at 20V and IA (p9
5) and the initial contact resistance was investigated. The results are shown in the table below. Table 2 From the results, it can be seen that contact A containing WC particles has a longer switching life and lower initial resistance than contact B containing TIC particles.
第1図および第2図はそれぞれこの発明の複合めつき接
点からなる接点層の構成図である。
1…白金族元素または白金族元素を主成分とする合金、
2・・・WC粒子。
第1図
第2図FIGS. 1 and 2 are diagrams showing the structure of a contact layer comprising a composite plated contact of the present invention, respectively. 1...Platinum group element or alloy mainly composed of platinum group element,
2...WC particles. Figure 1 Figure 2
Claims (1)
にWC粒子を分散した気中開閉用の複合めつき接点。1. A composite plated contact for aerial switching in which WC particles are dispersed in a platinum group element or an alloy containing platinum group elements as a main component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51151139A JPS6010410B2 (en) | 1976-12-15 | 1976-12-15 | Composite plated contacts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51151139A JPS6010410B2 (en) | 1976-12-15 | 1976-12-15 | Composite plated contacts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5374274A JPS5374274A (en) | 1978-07-01 |
| JPS6010410B2 true JPS6010410B2 (en) | 1985-03-16 |
Family
ID=15512209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51151139A Expired JPS6010410B2 (en) | 1976-12-15 | 1976-12-15 | Composite plated contacts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6010410B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0640458B2 (en) * | 1984-06-25 | 1994-05-25 | 古河電気工業株式会社 | Switching contacts for low power and its manufacturing method |
| JPS6144141A (en) * | 1985-07-26 | 1986-03-03 | Ngk Spark Plug Co Ltd | Material for electrode for ignition plug |
-
1976
- 1976-12-15 JP JP51151139A patent/JPS6010410B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5374274A (en) | 1978-07-01 |
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