JPS6012181B2 - Substrate polishing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for removing or removing material from a substrate, such as a semiconductor wafer, when a different or similar material that has grown or adhered to one side of the substrate scatters or wraps around the other side and becomes an unnecessary deposit. The present invention relates to a substrate polishing device for removing only deposits.

FIG. 1 shows a cross section when a different material is grown on one side of a semiconductor wafer 1 such as silicon.

A deposited layer 2 of a different material is grown or deposited on the surface of the semiconductor wafer 1 . There is no problem if this deposited layer 2 is formed only on the surface of the semiconductor wafer 1, but
During manufacturing, there has been a problem in that foreign materials wrap around the back surface of the semiconductor wafer 1, forming deposits 3 on the periphery, and are also scattered to form deposits 4 at the center of the back surface. The need to remove these deposits 3 and 4 is
It is common for the deposited layer 2 to have irregularities of more than Am and the thickness of the deposited layer 2 itself is not uniform, resulting in uneven thickness around loAm.
This is because when polishing is performed parallel and flat with reference to , it is important to remove only the deposits 3 and 4 on the back surface A without damaging the shape of the semiconductor wafer turtle, and regenerate it as the virgin surface of the semiconductor wafer. Conventionally, methods for removing the deposits 3 and crabs include a hand-wrapping method or a method of covering the surface B of the deposited layer 2 and etching it.
These methods not only take a long time, but also have complicated processes and low reproducibility because they are performed manually, and even if the back side A of the semiconductor layer is processed unevenly, it is difficult to reprocess it as a reference surface. Met.

As a technique that has been proposed in the past to suitably carry out this reprocessing process, there is a polishing method in which an elastic thin thin magnet is rotated and pressed against a semiconductor wafer furnace (hereinafter referred to as a substrate) having a deposited layer 2. This polishing process has not yet been developed to the extent of continuous processing of substrates, and automatic polishing and continuous processing using equipment has not been realized, which poses a practical problem.

Therefore, in view of the above-mentioned drawbacks, the present invention aims to eliminate the need for manual reprocessing, as well as to automate the polishing process in a continuous manner, from the substrate storage cassette before processing to the substrate heat absorption cassette after processing. The object of the present invention is to provide a substrate polishing device that can realize automatic polishing of so-called cassettes, which can be automated in a continuous process.

In order to achieve such an object, the present invention includes a mounting/detachment mechanism for attaching/detaching a substrate before polishing stored in a cassette, and a centering mechanism for positioning and centering the substrate transferred by the mounting/detachment mechanism. A holding and rotating mechanism that holds and rotates the substrate in this centering mechanism, a tool drive mechanism that drives an elastic thin grindstone tool that polishes the substrate in this holding and rotating mechanism, and a tool drive mechanism that drives an elastic thin grindstone tool that polishes the substrate in the holding and rotating mechanism. The present invention is characterized in that it has the above-mentioned attachment/detachment mechanism for attaching/detaching the substrate and transferring it into another cassette.

An embodiment of the substrate polishing layer of the present invention will now be described with reference to FIG.

Is each carrier 5 a cassette for storing the substrate 6a before polishing? and a cassette S for storing the substrate 6b after polishing are juxtaposed, and this single carrier 5 moves by a fixed distance corresponding to the pitch of the substrate 6a or 6b. A centering mechanism section 9 exists at a position where the substrate 63 can be moved in parallel.

This centering mechanism section 9 is composed of at least three (for example, six) cams, and the rotation of these cams uniformly sandwiches the outer periphery of the substrate 6a for positioning and centering. The transfer part turtle D is located on the same axis as the centering mechanism part g and so that the weaving part can be located between the centering mechanism parts 9. It has a function of holding the sandwiched substrate 6a by vacuum suction and transferring the substrate 6a forward.There is a cape 1 on the same track facing the centering mechanism part g and the transfer part 8. The work head winged turtle that can move forward and backward is mounted in a box.
The work head 1 is integrated with a holding rotation mechanism member 2 which holds the substrate by vacuum suction and can rotate at a stepless speed in the range of 50 to 30 pm during polishing.

An arm base 4 is attached to the bed gear 3 so as to be movable in the same direction as the board transfer direction.The arm base 4 is equipped with a motor 5 and an elastic flexible book-shaped grindstone tool driven by the motor turtle 5. A tool drive mechanism part turtle 7 for a deposit processing tool mat fin (hereinafter referred to as tool turtle 6) and a detachment mechanism part turtle 8 for attaching and detaching the substrate are attached.

In this case as well, the inclination 8L of the tool blade 6 can be variably adjusted in the push-in amount 8 from 1900 to 90Q, respectively, in the range of 0 to IQ, so that it can correspond to the amount of deposits. In addition, the attachment/detachment mechanism unit 81 has a function that allows it to simultaneously transfer the substrate 6a before polishing from the cassette to the centering mechanism g, and simultaneously transfer the substrate 6b after polishing from the work head 11 to the cassette 8. The board of the attachment/detachment mechanism 18 is held by vacuum suction.
Although not shown in FIG. 2, a nozzle for supplying machining fluid is provided near the tool blade 6 on the arm turtle 4', and the machining fluid is supplied by a fluid pump.

All operations such as the rough drive system, vacuum system, and machining fluid supply are executed based on commands from the control panel 19. Each part of this embodiment has been described above, and will now be described in more detail along with its operation.

While the work head 11 is retracted, the arm 14 moves over the head 13 toward the carry stand 5 and stops between the cassettes 7 and 8, and at the same time, the carry stand 5 moves by the pitch between the substrates 6a in the cassette 7. Moving attachment/detachment mechanism section 18
vacuum adsorbs the substrate 6a before polishing. Thereafter, the attachment/detachment mechanism section 18 is transferred to the centering mechanism section 9 while holding the substrate 6a, and the work head 11 moves forward at the center of the attachment mechanism section 18 and pushes the attachment/detachment mechanism section 18 so that its end, that is, the substrate 6a, is centered. As soon as the substrate 6a enters the mechanism section 9, it becomes temporarily free, but the six cams immediately sandwich the outer periphery and position and center the substrate 6a. The substrate 6a after centering is then vacuum-adsorbed and held from the transfer section 1, and transferred to the work head 11 of the holding and rotating mechanism section 12 located on the same axis. At this time, the work head 11 is also moving forward, and when the substrate 6a arrives, the work head 11 moves forward.
The substrate 6a is attracted to the substrate 1. Thereafter, the transfer section 10 returns to its original position and the work head 11 also retreats. Subsequently, after the substrate 6a is removed from the attachment/detachment mechanism 18 to the centering mechanism 9, the arm 14 in its original position moves toward the work head 11 and reaches a predetermined inclination of 0 and pushing amount. When the tip of the tool 16 by 6 reaches the outer periphery of the substrate 6a, the arm 14 stops. Then, the work head 11 moves forward and the tool 16 comes into contact with the substrate 6a. At this time, the work head 11 starts rotating at a predetermined rotational speed and polishing begins. If there is a lot of deposits on the outer periphery of the substrate, remove the deposits on the outer periphery of the substrate by letting the arm 14 thicken for several seconds to several minutes.
The tool 1 is moved over the board by retracting at a speed of
6 scans to the center and removes the deposits in the center. Simultaneously with the completion of machining, the work head 11 retreats to separate the tool 16 from the substrate, and the arm 14 moves forward so that the attachment/detachment mechanism 18 reaches near the center of the work head 11. Then, as the work head 11 moves forward, the processed substrate 6b is vacuum-suctioned by the attachment/detachment mechanism 18, and air is blown out to ensure that the substrate 6b is separated from the suction cup of the work head 11. In this way, after the substrate 6b is held by the attachment/detachment mechanism 18, the work head 11 is moved backward, and the arm 14 is attached to the bed 13.
The polished substrate 6b is stored in the cassette 8. At this time, one carrier 5 moves by the substrate pitch of the cassettes 8 and 7, and the substrate 6a to be processed next is held by the attachment/detachment mechanism section 18, and the above-described operation is repeated. In this way, the substrate is processed continuously. During this process, commands are transmitted for each operation based on data set in advance by the control section 19. As explained above, according to the present invention, the operation of each mechanical part can be automatically controlled along with the movement of the substrate, and continuous processing can be performed without manual work as in the conventional method. By installing the machine, it is possible to automatically remove only the deposits and regenerate the reference surface, improving efficiency and yield, and making unattended polishing possible.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a substrate, and FIG. 2 is a configuration diagram of an embodiment of a substrate polishing apparatus according to the present invention. In the drawings, 6a and 6b are substrates, 7 and 8 are cassettes, 9 is a centering mechanism section, 12 is a holding rotation mechanism section, 16 is a tool, 1
7 is a tool drive mechanism section, and 18 is an attachment/detachment mechanism section. Figure 1 Figure 2

Claims (1)

[Claims] 1. Mounting/detachment of the substrate before polishing stored in the cassette.
The above-mentioned board transferred by the transferring attachment/detachment mechanism is positioned and
a centering mechanism for centering; a holding and rotating mechanism for holding and rotating the substrate in this centering mechanism; a tool driving mechanism for driving an elastic thin grindstone tool for polishing the substrate in this holding and rotating mechanism; A substrate polishing apparatus comprising the above-mentioned attachment/detachment mechanism for loading and unloading the polished substrate in the holding/rotating mechanism and transferring it into another cassette. 2. A cassette for storing substrates before polishing and another cassette for storing substrates after polishing are placed side by side and moved by a fixed distance by the pitch between the substrates, and the attachment/detachment mechanism allows the attachment/detachment mechanism to attach/detach the substrates and transfer the two cassettes. A substrate polishing apparatus according to claim 1, which performs the polishing within the same operation. 3. The substrate according to claim 1, wherein a centering mechanism and a holding/rotating mechanism are arranged opposite to each other and aligned on the same axis, and the substrate after centering is transferred to and held by the holding/rotating mechanism. Polishing equipment. 4. The substrate polishing apparatus according to claim 1, wherein the attachment/detachment mechanism, the centering mechanism, the holding/rotating mechanism, and the tool drive mechanism are each operated continuously under control from a control panel. 5. The substrate polishing apparatus according to claim 1, wherein the substrate in the holding rotary tool is polished by pressing an elastic flexible thin grindstone tool at an arbitrary angle and an arbitrary pushing amount.