JPS6012808B2 - Manufacturing method of piezoelectric vibrator - Google Patents

Description

[Detailed description of the invention] The present invention relates to an improvement in a method for manufacturing a piezoelectric vibrator.

In the production of subordinate piezoelectric vibrators, each step is carried out by handwork, and the material is fed and removed one by one into the processing equipment, or multiple pieces are mounted on a jig using handwork, and the jig is fed to the processing equipment. The method used was to remove the piezoelectric vibrator from the jig by removing the piezoelectric vibrator from the jig by hand after processing.

The vibration frequency adjustment process and the secure packaging process, which are the most important manufacturing processes for piezoelectric vibrators, will be explained below using a crystal vibrator as an example. The vibration frequency adjustment process of the crystal resonator is mainly performed by laser processing and metal vapor deposition.The vibration frequency adjustment process by laser processing is performed by adjusting the crystal resonator piece support part 1 as shown in FIG. A plurality of crystal resonators 3 consisting of a crystal resonator piece 2 mounted on the crystal resonator piece support component 1 are attached to a jig 4 made of an insulating material, and the materials are fed to a vibration frequency adjustment device using laser processing. do. The vibration frequency adjustment device by laser processing includes a laser beam generator 5, a processing optical device 6, a vibration frequency measuring device 7 for the crystal oscillator 3, a feeding device 8 for pitch feeding the jig 4, and a control for controlling the whole. The laser beam emitted from the laser beam generating device 5 is irradiated onto the crystal resonator 3 by the processing optical device 6 to remove the metal coating attached to the crystal resonator 3. The vibration frequency of the crystal resonator 3 changes due to the removal of the metal coating, and this is measured by the vibration frequency measuring device 7, and the metal coating is removed while controlling the laser beam generator 5 and processing optical device 6 through the control device 9. The process continues until the predetermined vibration frequency is reached, and the process is stopped.
The jig is moved by the feeding device 8, and the vibration frequency of the unprocessed crystal resonator 3 is adjusted in the same manner. Next, the vibration frequency adjustment step by metal vapor deposition uses the apparatus and jig shown in FIGS. 2, 3, and 4.

A plurality of crystal oscillators 3 are attached to a jig 10 by hand and installed in the device. Next, the inside of the vacuum container 11 is exhausted from the exhaust port 12.
to create a high vacuum. Next, a current is applied from the electrode 13 to heat the boat 14 and melt and evaporate the metal 15 inside the boat 14. Initially, the evaporated metal is shielded by the evaporator shielding device 16 and does not reach the crystal oscillator 3, but when the evaporator shielding device 16 is activated and opened, the evaporated metal is deposited on a part of the crystal oscillator 3. The vibration frequency of the crystal resonator 3 can be changed. The vibration frequency of the crystal oscillator 3 can be constantly measured through the contacts 17 and terminals 18, and when the vibration frequency reaches a predetermined value, the evaporation shielding device 16 shields the evaporated metal again to reduce the vibration frequency. can be adjusted. Next, the one-pitch jig 10 is rotated from the rotating shaft 19 and the indexing device 20',
The vibration frequency of the unprocessed crystal resonator 3 is adjusted in the same manner.

The secret packaging process for crystal resonators generally uses a jig as shown in FIG. A crystal resonator 3 is attached to a jig 21 by hand, and a confidential cylindrical container 23 is attached to a jig 22. The confidential cylindrical container 23 is lightly fixed inside the jig 22 with a spring or the like so that it does not fall out even when the jig 22 is reversed. Next, the jig 22 is turned upside down and the guide hole 24 is attached to the guide pin 25 of the jig 21. Next, the combined jigs 21 and 22 are placed in a vacuum pressurizer, and the jigs 21 and 22 are pressurized in a vacuum.
The secret cylindrical container 23 is press-fitted into the crystal resonator 3 inside.
There are methods shown in FIGS. 6, 7, and 8 that can be carried out continuously in the secret packaging process for crystal resonators.

The crystal resonator 3 is attached to the jig 26 by hand, and the jig 27 is pushed into the guide with the guide pin 28 of the jig 26. Furthermore, the confidential cylindrical container 23 is pushed through the hole 29 of the jig 27.
In this state, it is fed to a device as shown in FIG. 30
, 31, 32, 33, 34, 35, and 36 are vacuum chambers that are more strongly evacuated from exhaust holes 37, 38, 39, 40, 41, 42, and 43, respectively.

Further, the gap between the entrance and exit of each vacuum chamber through which the jigs 26 and 27 pass is kept extremely small. As a result, the degree of vacuum in the central vacuum chamber 33 reaches the degree of vacuum required within the sealed package of the crystal resonator. jig 26,
27 is continuously pitch-fed, and a pressurizing device 44 disposed in the vacuum chamber 33 inserts the sealed cylindrical container 23 into the crystal resonator 3 which is pressurized from the upper part of the hole 29 of the jig 27. In this way, no matter which method is used, the vibration frequency adjustment process or the secret packaging process, it is necessary to attach the crystal resonator 3 to the jig and remove it again after processing, but this work may contaminate the crystal resonator 3. Doing so may adversely affect the long-term stability of the vibration frequency, and if the crystal resonator piece 2 is handled roughly or collides with other objects, the vibration frequency may change or even be damaged. It is difficult to automatically attach or detach the device using a machine or the like, so manual work by humans has been required.

If the jig for the vibration frequency adjustment process and the confidential packaging process are made common, the attachment and removal of the jig can be omitted once each. The vibrator 3 must not be electrically connected to the entire jig, and in the secret packaging process, there is a special condition that it must withstand pressure for press-fitting, making it difficult to standardize the vibrator 3. Furthermore, if the jig is forced to be made common, the number of pieces attached to one jig will be reduced, resulting in a reduction in the process capability of one or both of them. Moreover, the shape of the jig becomes complicated and the jig becomes more expensive. In either method, in order to effectively operate the apparatus, a considerable number of jigs are required, resulting in a large investment in jigs.

In addition, creating a mechanism that automatically supplies jigs to the device would make the device expensive, and even if the device is equipped with a jig supply mechanism, the number of jigs that can be placed in the jig supply system in advance is not very large. We need supplies, and we have no choice but to rely on people for this. Also, jigs are quite bulky, making them difficult to hold and store. In addition, in the vibration frequency adjustment device using metal vapor deposition, when processing of one jig is completed, air is introduced into the vacuum vessel 11 after cooling the boat 14, and after replacing the jig 10, the interior of the vacuum vessel 11 is raised again. It was necessary to create a vacuum and heat the boat 14, and the time required for this work could not be omitted.

The present invention has been made to eliminate such drawbacks.

A technique similar to the present invention that is used in a process other than the Shoden vibrator manufacturing process is a transistor manufacturing process as shown in FIG.

This manufacturing method involves continuously punching out a long thin plate made of, for example, nickel using a press or the like, separating them from each other and making them parallel to each other.
, 46, 47, and a connecting piece 48 connecting one end of the wires 46, 47 is formed. Next, the transistor element 53 and its electrode connecting wires 54, 55 are fixed to the free ends 50, 51, 52 of the lead wires, respectively, and hung up. Next, the transistor element 53 is made of, for example, epoxy resin.
A method is used in which after forming the external generator 56 by burying the vicinity thereof, the lead wires in the vicinity shown by chain lines 57 are cut to form individual transistors. However, as shown in FIG. 10, the supporting parts of the piezoelectric vibrator are made of glass 61 for insulating and sealing the lead wires 58, 59 and the cylindrical part 60, and the glass 61 is melted to connect the lead wires 58, 59 and the cylindrical part. Since there is a step of fixing the lead wires 60, as shown in FIG. 11, it is possible to connect the ends of the lead wires 58 and 59 with the connecting piece 62 in the case of short lengths, but it is difficult to make them long. In addition, in the vibration frequency adjustment process of the piezoelectric vibrator, in order to measure the vibration frequency, lead wires 58, 59
It is necessary to cut either one of the connecting pieces 62 from the connecting piece 62, which causes a strength problem. Another well-known process using a long tape is a tape carrier method for manufacturing semiconductor devices. However, in the case of piezoelectric vibrators, special processes such as a vibration frequency adjustment process and a confidential packaging process must be carried out, so a production line for piezoelectric vibrators using the longest tape has not been devised. However, in the present invention, by developing a series of devices that make this possible, a new method for manufacturing piezoelectric vibrators has been established. A twelfth embodiment of the present invention
Fig. 13, Fig. 14, Fig. 15, Fig. 16, Fig. 17
18, as shown in FIG. 12, a polyimide tape 65, which has a sprocket hole 63 used for tape feeding and a crystal resonator guide hole 64, has a crystal resonator piece 2 and a crystal vibrator. A plurality of connected crystal oscillators 68 each having a shape in which a quartz crystal oscillator 67 consisting of a child piece support part 66 is connected by a part of 20 to 3 solid crystal oscillator piece support parts 66 are attached with an adhesive tape 69.

Next, as shown in FIG. 13, it is wound onto a reel 71 together with the spacer tape 70. While sequentially feeding the crystal resonator attached to the long polyimide tape 65 in this way,
Perform vibration frequency adjustment process and secret packaging process. The vibration frequency adjustment step uses a device as shown in FIGS. 14 and 15.

A roll 71 for winding up a polyimide tape 65 equipped with a crystal resonator 67 and a baser tape 70 is arranged in a vacuum container 72, and the polyimide tape 65 is connected to tape sequential feeding mechanisms 73, 74 and a vibration frequency adjustment section 75 by vapor deposition. The end of the tape is secured to another take-up reel 76 through the tape. Subaser Tape 7 Kawama Bypass Roller 77
, 78 to secure the tape end to the take-up reel 76. The vibration frequency adjustment section 75 includes a boat 80 for melting the deposited metal 79, an electrode 81 for passing a current through the boat, an evaporation source cover 82, an evaporation material shielding device 83, a crystal oscillator guide section 84, and a vibration frequency measurement device 85. . After the tape and reel are arranged as shown in FIG. 14, the inside of the vacuum container 72 is evacuated to create a high vacuum of about 10-50 rr. Next, current is passed through the boat 801 to melt and evaporate the deposited metal 79 inside the boat 80. Next, the polyimide tape 65 is sequentially fed to position the crystal resonator 67 in the vibration frequency adjustment section 75. Next, while measuring the vibration frequency to 0 using the vibration frequency measuring device 85, the vapor shielding device 83 is opened to deposit the evaporated metal onto a part of the crystal resonator 67. When the vibration frequency reaches a predetermined value, the evaporated material shielding device 83 is activated to shield the evaporated metal from reaching the crystal oscillator 67. Next, the polyimide tape 65 is fed one pitch by tape sequential feeding mechanisms 73 and 74, and the next crystal oscillator 67 is placed in the vibration frequency adjustment section 75, and the vibration frequency is adjusted to a predetermined value in the same manner. .

0 The confidential packaging process is shown in Figure 16, Figure 17,
An apparatus as shown in FIG. 18 is used.

A roll 71 for winding up a polyimide tape 65 with a crystal oscillator 67 mounted thereon and a baser tape 70 is arranged in a vacuum container 86, and a tape sequential feeding mechanism 87, 88 and a tape bending mechanism 89, The end of the tape is fixed to another take-up reel 92 through the pressure-fitting mechanism 90 and the sealed cylindrical container 91 . Subaser tape 7
The tape is fixed to the take-up reel 92 through Kawama bypass rollers 93 and 94. As shown in FIGS. 17 and 18, the secret cylindrical container press-fitting mechanism 91 includes a cassette 96 filled with a secret cylindrical container 95, a secret cylindrical container supply slide mechanism 97, a pressurizing mechanism 98, and a press-fit guide mechanism 99,1.
00 and crystal resonator support component receiving parts 101 and 102. With the above configuration, first, the inside of the vacuum container 86 is evacuated.
Create a high vacuum of about 5 torr.

Next, the polyimide tape 65 is sequentially fed, and the crystal oscillator 6
7 is positioned in the secret cylindrical container press-fitting mechanism 91. At this time, since the polyimide tape 65 passes through the tape bending mechanisms 89 and 90, as shown in FIG. 17, about half of the polyimide tape 65 is bent at the pressure-fitting mechanism 91 of the secret cylindrical container. Further, the press-fitting guide mechanisms 99 and 100 slide in the directions of arrows 103 and 104, respectively, so that the crystal oscillator 67 can move as the tape moves. Next, the confidential cylindrical container supply slide mechanism 97 reciprocates once in the directions of arrows 105 and 106 to receive one confidential cylindrical container 95 from the cassette 96.

Next, the press-fitting guide mechanisms 99, 100 slide in the directions of arrows 107, 108 and are positioned as shown in FIGS. 17 and 18. Next, the pressurizing mechanism 98 moves in the direction of the arrow 109, press-fits into the sealed cylindrical container 95 and the crystal resonator support part 66, and returns to its original position. Next, after the press-fit guide mechanisms 99 and 100 slide in the directions of arrows 103 and 104, the 1-pitch polyimide tape 65 is fed by the tape sequential feed mechanisms 87 and 88, and the next crystal oscillator 67 is positioned in the press-fit mechanism 91 for the secret cylindrical container. In the same way, the sealed cylindrical container 95 is press-fitted. In the above description, the vibration frequency adjustment step was explained using a method using metal vapor deposition, but a method using laser processing may also be used.

The method may also include a step of inspecting each crystal oscillator by sequentially feeding the tape while attached to the long tape before or after the vibration frequency adjustment or after the step of press-fitting the sealed cylindrical container. Furthermore, although polyimide tape has been described, other insulating flexible tapes may be used. Moreover, although the description has been made using a crystal oscillator in which 20 to 3 crystals are connected by a part of the pressure crab oscillator piece support component, each crystal oscillator may have an independent shape. Furthermore, although the crystal resonator is of the cylindrical sealed packaging type, other shapes of crystal resonators may be used. Furthermore, although a crystal resonator has been described, a resonator using other piezoelectric materials may be used. According to this embodiment, once the piezoelectric vibrator is attached to the long tape before the vibration frequency adjustment process, it can be passed through the process as it is until the final process, and the attachment to the intermediate jig can be removed. This eliminates the need to perform this work.

Furthermore, since approximately 3,000 to 7,000 tapes can be attached to a long tape, it is possible to operate the apparatus completely unattended while processing the number of tapes to be attached. Furthermore, since the feeding mechanism of the piezoelectric vibrator requires only a tape sequential feeding mechanism and a tape winding mechanism, it is cheaper than a device that automatically feeds a jig, and stable operation is possible. Also, since the tape can be used repeatedly until it breaks, it is much cheaper than investing in jig production. Also, since it is wound onto a reel, it is not bulky and is easy to hold and store. In addition, when processing is performed in a vacuum container, such as a vibration frequency adjustment process using metal vapor deposition or a confidential packaging process, there is no need to open the vacuum container until all tapes have been processed, and the jig can be replaced. Compared to the conventional method of releasing the vacuum and evacuation each time, it became possible to reduce the number of times the vacuum was released and evacuated. In this way, if piezoelectric vibrators are attached to a long tape at the initial stage, continuous processing is possible by simply setting the reel on the device, and the supply quantity at one time is large, ranging from 3,000 to 7,000 pieces. Therefore, long-term unattended operation is possible, investment in jigs can be reduced, and an inexpensive piezoelectric vibrator can be obtained.

According to the present invention, a plurality of crystal resonators each having a crystal resonator piece fixed to the end of a lead wire passing through the plug are juxtaposed on a conveying tape, and the crystal resonators are connected to the plug and the crystal resonator. Place the piece facing the guide hole of the transport tape,
The first step is to fix the lead wire portion to the carrier tape using adhesive tape, and then the individual crystal units are transported into a vacuum container using the carrier tape and the vibration frequency is adjusted by laser processing or vapor deposition. In the second step, after that, the part of the transport tape on the crystal oscillator side is bent,
This method includes a third step of isolating the crystal resonator piece and the plug from the transport tape and press-fitting the airtight container into the plug, and brings about the following effects. a. When placing the crystal resonator with the crystal resonator piece fixed to the end of the lead wire that passes through the plug on the conveyor tape, place the crystal resonator piece and the plug into the guide hole provided in the conveyor tape. Insert oppositely,
The lead wire section is placed on the carrier tape, and the lead wire section is fixed to the carrier tape using adhesive tape, so the parallelism between the crystal resonator piece and the carrier tape is maintained, and it can be easily removed by laser processing or dusting in the post-process. It has the advantage of facilitating the vibration frequency adjustment work, and furthermore, when bending one side of the transducer of the transport tape and inserting the airtight container into the plug in the subsequent process, the guide hole of the transport tape reduces the rigidity of the transport tape. Since the tape can be bent easily, it has the advantage that press-fitting the airtight container can be easily performed. b. Since the lead wire of the crystal resonator is placed on the transport tape and only that part is fixed to the transport tape with adhesive tape, bend one side of the crystal resonator on the transport tape and connect the crystal resonator and plug. This enables a completely new method of inserting the airtight container by separating it from the conveyor tape and press-fitting it into an airtight container.It also enables the vibration frequency adjustment process and the press-fitting process of the airtight container to be performed in an integrated line, improving production efficiency. Above all, the benefits are enormous.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram for explaining a conventional vibration frequency adjustment method using laser processing. FIG. 2, FIG. 3, and FIG. 4 are a plan view of the device, a front view of the device, and a side view of the main parts for explaining a method of adjusting vibration frequency by metal vapor deposition of a slave. Figure 5 shows a jig for secret packaging used in the conventional method. FIGS. 6 and 7 are a front sectional view and a side sectional view of a jig in a conventional method for continuously performing confidential packaging. FIG. 8 is a schematic diagram of an apparatus for a conventional continuous secret packaging method. FIG. 9 is a schematic diagram for explaining a method of manufacturing a transistor. FIG. 10 is a diagram showing supporting parts of a piezoelectric vibrator. Figure 11 shows a support part for a piezoelectric vibrator connected by a lotus piece. FIG. 12 is an explanatory diagram of a long tape equipped with a piezoelectric vibrator of the present invention. FIG. 13 is an explanatory diagram of a method for winding up the longest tape of the present invention. FIG. 14 and FIG. 15 are a schematic diagram of an apparatus and a side view of a main part for explaining the vibration frequency adjustment method by metal vapor deposition of the present invention. 16, 17, and 18 are a schematic diagram of an apparatus, a schematic diagram of the outline of the apparatus, and a sectional view of the main parts of the apparatus for explaining the secure packaging method of the present invention.
65...Polyimide tape, 68...Crystal resonator having a shape in which 20 to 3N solids are connected, 70...Subacer tape, 71...Reel, 72, 86...Vacuum container,
73, 74, 87, 88...Tape top feed mechanism,
75... Vibration frequency adjustment section, 91...
Confidential cylindrical container press-fitting mechanism. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure F Figure 8 Figure 9 Figure 10 Figure 11. Figure '2 Hoko B Figure 14 Figure 15 Figure 16. Key 'Figure 7 - Figure 8

Claims (1)

[Claims] 1. A conveying tape with sprocket holes used for tape feeding at both ends and a guide hole in the center for receiving a vibrator in a direction perpendicular to the longitudinal direction of the tape, and a lead wire end passing through a plug. A crystal resonator with a crystal resonator fixed to the section is used, the plug of the resonator and the crystal resonator piece are opposed to each other in the guide hole of the conveying tape, and the lead wire section is placed on the tape. Along with juxtaposing crystal oscillators,
A first step is to fix all the lead wires to the carrier tape with adhesive tape, and the crystal resonator is transported into a vacuum container while being fixed to the carrier tape, and the vibration frequency is adjusted by laser processing or vapor deposition. a second step of adjusting, and then a third step of bending one side of the crystal oscillator on the transport tape to separate the crystal oscillator piece and the plug from the transport tape and press-fitting the confidential container into the plug; A method for manufacturing a piezoelectric vibrator, characterized in that the second and third steps are continuously and repeatedly carried out by conveying the conveying tape through a sprocket hole.