JPS6018541B2 - marking device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a marking device that attaches a mark by aligning a component mark surface with a reference surface of a battle stage.

To apply the desired marking to the mark surface of conventional parts,
As shown in Fig. 1, place the part 2 so that the back surface 2b of the part 2 is aligned with the reference surface la of the lighthouse 1, lower the marking 3 from a direction perpendicular to the reference surface la, and press it against the mark surface 2a. There is. However, in such a device, if the component 2 is a semiconductor lead frame 4 having a large number of mold parts 4a as shown in FIG.
Since undulations occur in the lead frame due to contraction of the resin after molding, the back surface 4c does not match the reference surface la. In other words, since the mark surface 4b is not parallel to the reference surface la, the marking 3 does not strike the mark surface 4b at right angles. For this reason, mark unevenness occurred on the mark surface 4b, and uniform marking could not be achieved. It is also possible to mark by increasing the pressing force of the stamp 3 and extending the undulations of the lead frame 4, but in this case as well, the stamp 3
As a result of the misalignment between the marking surface 4b and the mark surface 4b, the mark may be crushed, making it impossible to make a clear marking, and also shortening the life of the stamp 3. The present invention is intended to eliminate the disadvantages of such conventional marking devices, and its purpose is to provide a marking device that can make uniform and clear marks on the marking surface of parts.

Another object of the present invention is to provide a marking device that can extend the life of the marking. The structure of the present invention to achieve such an object is to press the part from the back side with a tracing pressing means so that the mark surface of the part matches the reference plane of the Sendaidai table, and then push the part through a window raised to the reference plane. The present invention will be described below with reference to embodiments shown in the drawings.

FIG. 3 is a partially cutaway front view of a marking device according to an embodiment of the present invention, with some parts omitted.

In the same figure, this marking is flat and the reference plane l
It has a mounting table 1 having a diameter of 1.5 mm, which is wide enough to place a semiconductor lead frame 4 on it, and has a strip-shaped window lb extending in the length direction of the mounting table 1 at the center in the width direction. I'm giving. This window lb has an arc surface 4 as shown in FIG.
Considering that the main part of c is exposed to the evening mist, two holes lc for positioning the lead frame are provided near the main part at a certain distance. Further, the operating punch 6 is reciprocated with a certain width by the veloflam cylinder 5 to a position moved from the reference plane la in a direction approaching the top green of the paper shown in FIG.
, a part of which is freely supported by the support part 7, a compression spring 9 is provided to protrude from the tip member 8, and a presser pad 10 is placed at the tip so as to be parallel to the reference plane la. The mold parts 4a and the back surface 4b, especially the center part, can be held down in an independently suspended manner. Further, when the operating range of the operating punch 6 is set farthest from the reference plane la, the presser pad 10 does not touch the back surface 4b, and when it comes closest to the opposite side, the presser pad 10 completely contacts the back surface 4b. Compress the compression spring 9 to completely bring the mark surface 4c to the reference surface la.
It is set to a position that matches the . Further, two positioning pins 16 are provided near the green part in the width direction of the tip member 8 so that the tip can be inserted into the positioning hole lc, and these are inserted into the hole 4d of the frame 4.
The position relative to the reference plane la is determined. The length of this pin 16 is such that when the tip member 8 is farthest from the reference plane la, its tip is at a position further away (higher) than the position of the mark surface 4c. Further, on the lower green side of the paper showing FIG. 3, there is a stamp 1 corresponding to the window lb
1 is made so that it can be moved in a direction perpendicular to the reference surface la so that an arbitrary mark can be placed on the exposed part of the mark surface 4c through the window lb. This is accomplished by movably supported by the support member 12 and engaging the body portion 11a with one end of an arm 13 that swings by receiving power from a drive motor 19. Since the marking bag hawk of the above embodiment is constructed as described above, it is placed on the reference plane la, and the operating punch 6 is brought close to the reference plane la side, and the bottle 16 is inserted into the hole 4d of the lead frame 4. to determine the position of frame 4 and mark surface 4.
Let the main part of c protrude from window lb, and then mark surface 4c
The operating punch 6 is brought close so that the reference plane 1a and the reference plane 11 are completely aligned with each other until the presser pad 10 comes into contact with the back surface 4b and the elastic force of the spring 9 is fully exerted.

In this case, the force pushing the back surface 4b is large enough to extend the undulations of the lead frame 4. Therefore, since the mark surface 4c and the reference surface la are in close contact,
If the stamp 11 is brought close to and pressed against the mark surface 4c exposed from the window lb, the stamp 11 will be perpendicular to the mark surface 4c, and a mark in the shape engraved on the stamp 11 can be attached. Since the movements of the operation panel 6 and the markings are synchronized, the positioning of the lead frame 4, the pressing of the back surface 4b, and the marking operations on the mark surface 4c can be performed regularly. In the above embodiment, a mark is placed on the reference plane la.
In the above example, the mark surface 4c is placed with the mark surface 4c facing down and the back surface 4b is pressed with the presser pad 10 in order to match the reference surface la and the mark surface 4c.These structures are as shown in FIG. A stand 14 for teaching the frame 4 is provided below the reference surface la so that the mark surface 4c touches the reference surface la from below, and a presser pad 10 is further provided below the stand 14.
The base 14 is provided with a round hole or groove 15 through which the pad 10 can be passed, and a round hole or groove 17 through which the pin 16 can be passed, corresponding to the window lb. The structure may be such that the mark surface 4c is pressed against the mark surface 4c.

In this case, it is effective in that the operator can monitor the marking state in a natural posture. Furthermore, the compression spring 9 and presser pad 10 protruding from the tip member 8 of the embodiment shown in FIGS. 3 and 5 are attached instead of the rubber or elastic resin member 18 as shown in FIG. compression spring 9
It is also possible to have a similar function. In this case, there are advantages in that the number of parts can be reduced and installation can be simplified (by gluing, etc.).

As is clear from the above description, according to the present invention, 1. The mark surface 4c is aligned with the reference surface la, and the back surface 4b is pressed toward the reference surface la so that the mark surface 4c is brought into close contact with the reference surface la.
Since the structure is such that the mark surface 4c presses against the stamp 11 at right angles, the stamp 11 does not hit unevenly against the mark surface 4c, and a uniform mark can be made exactly as the mark engraved on the stamp 11. can be attached.

2. Since the stamp 11 is parallel to the mark surface 4c, the life of the stamp 11 can be extended without damaging the corners of the mark engraved on the stamp 11.

Effects such as this can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of a conventional marking device, FIG. 2 is an explanatory diagram showing the state of waviness of a lead frame, and FIG. FIG. 4 is a partially omitted plan view of only the loading table shown in FIG. 3 viewed from the direction of the reference plane, and FIG. FIG. 6 is a cross-sectional front view showing only essential parts, and is an explanatory view showing a state in which a rubber or elastic resin member is attached to the tip member. 1...Teaching stand, la...Reference plane, lb
...Window, LC...Positioning hole, 2...
...Parts, 2a...Mark surface, 2b...
・Back side, 3... Engraving, 4... Semiconductor lead frame, 4a... Mold part, 4b...
Mark side, 4c...back side, 4d...hole, 5
...Bello frame cylinder, 6...Easy to operate, 7...Support part, 8...Tip member, 9...
・Compression spring, 10... Presser pad, 11... Stamp, 11a... Body part, 12... Support member,
13... Arm, 14... Table for mounting parts, 15... Round hole or groove, 16...
...Positioning pin, 17...Round hole or groove, 18...Rubber or elastic resin member, 19...
...Drive motor. Figure 1 Figure 2/Figure 3 Figure 4 Figure 5 Figure 6

Claims (1)

[Scope of Claims] 1. A marking device for marking a semiconductor device, which includes a member having a window, a pressing means for applying a pressing force to the semiconductor device to press the semiconductor device against the member, and a mark on the semiconductor device through the window of the member. A marking device comprising: an inscription for marking a surface;・