JPS6020896B2 - bonding tools - Google Patents
bonding toolsInfo
- Publication number
- JPS6020896B2 JPS6020896B2 JP10987977A JP10987977A JPS6020896B2 JP S6020896 B2 JPS6020896 B2 JP S6020896B2 JP 10987977 A JP10987977 A JP 10987977A JP 10987977 A JP10987977 A JP 10987977A JP S6020896 B2 JPS6020896 B2 JP S6020896B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding tool
- bonding
- pressing surface
- cylindrical
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
本発明はボンディングツール、特にテープアッセンブリ
方式を利用した半導体装置の素子とＩＪ−ドとのボンデ
ィング接続に使用するボンディングツールに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a bonding tool, and more particularly to a bonding tool used for bonding a semiconductor device element and an IJ-board using a tape assembly method.
ＩＣ（半導体集積回路）チップのアッセンブリ方式の一
つとして、テープアツセンブリ方式が知られている。A tape assembly method is known as one of the assembly methods for IC (semiconductor integrated circuit) chips.
この方式はチップ搭載用孔等を有する絶縁テープを用意
した後、この絶縁テープ面に鋼箔を貼り付け、その後こ
の銅箔を部分的にエッチングして除去し所望のリードパ
ターンを形成する。つぎに、第５図に示すように、リー
ドーと絶縁テープ２とからなるキャリャテープ３を回路
素子を形成した半導体チップ４上に臨ませる。このチッ
プ４の上面には突出電極（バンプ）５が形成され、これ
らの電極５上にはチップ搭載用孔６に突出するりード１
の内端が重なるように臨む。そして、リード１の上方か
らボンディングツール７が下降し、バンプ５にリード１
を押し付けるとともに加熱して両者の接合を図り、テー
プキャリャを製造する。ところで、前記ボンディングツ
ールにおけるリード‘こ接触する矩形の平坦な突出部か
らなるボンディングツール先端部の加熱は、パルス電流
をボンディングツール先端部に流すことによって加熱す
るパルスヒート構造やボンディングツール内に内蔵した
ヒータから発熱する熱を伝導によってボンディングツー
ル先端部に伝えるコンテイニュアス構造とが知られてい
る。In this method, after preparing an insulating tape having holes for chip mounting, etc., a steel foil is pasted on the surface of the insulating tape, and then the copper foil is partially etched and removed to form a desired lead pattern. Next, as shown in FIG. 5, a carrier tape 3 consisting of a lead and an insulating tape 2 is placed over the semiconductor chip 4 on which the circuit elements are formed. Projecting electrodes (bumps) 5 are formed on the upper surface of this chip 4, and leads 1 projecting into chip mounting holes 6 are formed on these electrodes 5.
Face it so that the inner edges of the two sides overlap. Then, the bonding tool 7 descends from above the lead 1 and attaches the lead 1 to the bump 5.
A tape carrier is manufactured by pressing and heating the two to bond them together. By the way, the tip of the bonding tool, which consists of a rectangular flat protrusion that contacts the lead, can be heated using a pulse heat structure that heats the tip of the bonding tool by passing a pulsed current through it, or a device built into the bonding tool. A continuous structure is known in which heat generated from a heater is transmitted to the tip of a bonding tool by conduction.
しかし、これらの構造にあっては、ボンディングツール
先端部の平坦な押圧面の温度分布は均一とはなりにくい
。However, in these structures, the temperature distribution on the flat pressing surface of the bonding tool tip is difficult to be uniform.
特に第６図に示すようにヒータ８を内蔵したコンティニ
ュアス構造のボンディングツール９では熱伝導によって
押圧面１０各部に熱が伝わる構造となっているため、ヒ
ータ８から遠い位瞳にあるボンディングツール先端の押
圧部１１の隅部は中央部に較べて温度が低くなる。この
差は、たとえば、第３図ａのグラフにおける×印を結ぶ
曲線によって示されるように最大約８０℃にまで達する
。なお、同グラフの縦軸は温度を示し、穣軸および斜軸
はチップの電極位置に対応するボンディングツールの押
圧面部分（図中電極位置と託す。）を示す。これら電極
位置は同図ｂで示すように、便宜的に番号を付けてある
。このように、押氏面１０各部に大きな温度差が生じる
と、温度の低い所ではボンディングが確実に行なわれず
に、剥離や接合強度不足が生じる。In particular, as shown in FIG. 6, in the bonding tool 9 of continuous structure with a built-in heater 8, heat is transmitted to each part of the pressing surface 10 by thermal conduction, so the bonding tool 9 is located far from the heater 8. The temperature of the corners of the pressing portion 11 at the tip is lower than that of the center. This difference reaches a maximum of about 80° C., for example, as shown by the curve connecting the x marks in the graph of FIG. 3a. The vertical axis of the graph indicates temperature, and the horizontal and oblique axes indicate the pressing surface portion of the bonding tool (referred to as electrode position in the figure) corresponding to the electrode position of the chip. These electrode positions are numbered for convenience, as shown in Figure b. As described above, if a large temperature difference occurs between the various parts of the pressing surface 10, bonding cannot be performed reliably at low temperature areas, resulting in peeling and insufficient bonding strength.
また、全体に温度を上げ、最低温度の向上を図ることに
よって最低温度部での接合を良好とすると、温度差が大
きいことから最高高温部では必要以上に温度が高くなり
、逆に突出電極部のニッケル、クロム等のバリアメタル
の破壊を生じさせ、特性の劣化を生じさせることになる
。したがって、本発明の目的は、ボンディング用押圧面
各部の温度差が少ないテープアツセンブリ方式半導体装
置の組立用ボンディングツールを提供することにある。In addition, if we try to improve the bonding at the lowest temperature part by increasing the temperature throughout the entire body and improving the lowest temperature, the temperature at the highest temperature part will become higher than necessary due to the large temperature difference, and conversely, the protruding electrode part will become hotter than necessary. This results in destruction of barrier metals such as nickel and chromium, resulting in deterioration of characteristics. SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a bonding tool for assembling a tape assembly type semiconductor device in which the temperature difference between various parts of the bonding press surface is small.
このような目的を達成するために本発明は、チップをキ
ャリャテープに接続するボンディングツールにおいて、
ボンディングツール先端のチップに対応する矩形突出部
からなる平坦なボンデイング押圧部に少なくともその中
央部に窪みを設けておくものであって「以下実施例によ
り本発明を具体的に説明する。In order to achieve such an object, the present invention provides a bonding tool for connecting a chip to a carrier tape.
The flat bonding press part, which is a rectangular protrusion corresponding to the tip at the tip of the bonding tool, is provided with a recess at least in its center.
第１図に本発明のボンディングツールの一実施例を示す
。FIG. 1 shows an embodiment of the bonding tool of the present invention.
このボンディングツール２０はヒータ２１を内蔵する本
体２２と、本体２２の上部に突出する取付用軸２３と、
本体２２の下部に突出する矩形突出部からなる押圧部２
４とからなっている。また、このボンディングツール２
０はたとえはべりリャによって一体的に作られている。
また、前記押圧部２４はチップとほぼ同一の大きさに形
成されるとともに、下端部は平坦な押圧面２５を形成し
ている。また、この押圧面２５の中央には、第２図に示
すように円形の窪み２６が形成され、押圧面中央部の温
度上昇を押さえるようになっている。また、前記窪み２
６の大きさは、たとえば、押圧部２４の一辺が約３〜４
側程度の場合、直径が２側ぐで深さが０．５帆である。
このような構造のボンディングツール２０‘こよれば、
押圧面２５の中央部には温度降下用の窪み２６が設けら
れていることから押圧面２５の周緑各部の温度差は従来
に較べて小さくなる。すなわち、第３図ａの○印を結ぶ
曲線に示すように、押圧部隅部と辺の中央部との温度差
は最大でも３５ｑ０程度となり、全域で確実なボンディ
ングができるようになった。また、このような実施例に
よれば、繰返して使用することによって押圧面に付着す
る金属や酸化物を除去する場合の研摩時において、押圧
面２５の中央部に窪み２６を設けてあることから、研摩
が短時間で済む。このため、押圧面周縁でのだれ量も従
来に較べて小さくなる。たとえば、従来ではだれ量が最
大６仏ｍであったのが、本実施例の場合には最大でも４
ｒｍ程度となる。この結果、ボンディングツールの寿命
も長くなった。たとえば、３雌の引張力をボンディング
後のりードとバンプとに加える場合、従来ではボンディ
ングを２０の副程度行なった頃には剥離が生じるが、こ
の実施例によるボンディングツールによれば、３５０回
程度のボンディング回数を経なければ、剥離は生じない
。なお、本発明は前記実施例に限定されない。This bonding tool 20 includes a main body 22 containing a heater 21, a mounting shaft 23 protruding from the upper part of the main body 22,
Pressing part 2 consisting of a rectangular protrusion protruding from the lower part of main body 22
It consists of 4. Also, this bonding tool 2
0 is made integrally by Berilla.
Further, the pressing portion 24 is formed to have approximately the same size as the chip, and a flat pressing surface 25 is formed at the lower end. Further, a circular depression 26 is formed in the center of the pressing surface 25, as shown in FIG. 2, so as to suppress a rise in temperature at the central portion of the pressing surface. In addition, the depression 2
6, for example, one side of the pressing part 24 is about 3 to 4.
In the case of side length, the diameter is 2 side lengths and the depth is 0.5 sails.
According to the bonding tool 20' having such a structure,
Since the depression 26 for temperature reduction is provided in the center of the pressing surface 25, the temperature difference between the surrounding green parts of the pressing surface 25 is smaller than that in the past. That is, as shown by the curve connecting the circles in FIG. 3a, the temperature difference between the corner of the pressing part and the center of the side was about 35q0 at maximum, making it possible to perform reliable bonding over the entire area. Furthermore, according to this embodiment, the depression 26 is provided in the center of the pressing surface 25 during polishing to remove metals and oxides that adhere to the pressing surface due to repeated use. , polishing can be done in a short time. Therefore, the amount of sag at the periphery of the pressing surface is also smaller than in the past. For example, in the conventional case, the maximum amount of droop was 6 m, but in this embodiment, the maximum amount of sag is 4 m.
It will be about rm. As a result, the life of the bonding tool has also been extended. For example, when applying a tensile force of 3 times to a lead and a bump after bonding, conventionally, peeling occurs after 20 times of bonding, but according to the bonding tool of this embodiment, peeling occurs after 350 times. Peeling does not occur unless bonding is repeated a certain number of times. Note that the present invention is not limited to the above embodiments.
たとえば、押圧面２５に設ける窪み２６は第４図ａ〜ｃ
で示すような矩形あるいは十字形の形状でもよい。また
、第４図ｄで示すように、チップにおけるパッドの配列
状態によっては、パッドのない部分に対応する押圧部は
部分的に除去し窪みとしてもよい。以上のように、本発
明のボンディングツールによれば、ボンディング時にリ
ードと接触する押圧面の温度差は従来に較べて遥かに小
さくなる。For example, the depressions 26 provided in the pressing surface 25 are as shown in FIGS.
It may be rectangular or cross-shaped as shown in . Furthermore, as shown in FIG. 4d, depending on the arrangement of pads on the chip, the pressing portions corresponding to areas without pads may be partially removed to form depressions. As described above, according to the bonding tool of the present invention, the temperature difference between the pressing surfaces that come into contact with the leads during bonding is much smaller than in the past.
この結果、全域に亘つて確実にボンディングが行なえ「
製品の歩留向上、品質向上を図ることができる。また、
本発明によれば、ボンディングツールの押圧面に付着し
た金属や酸化物を研摩して除去する際、押圧面の中央部
に窪みを有していることから研摩時間が短かくなり、周
縁にだれが生じにくくなる。As a result, bonding can be performed reliably over the entire area.
It is possible to improve product yield and quality. Also,
According to the present invention, when polishing and removing metals and oxides adhering to the pressing surface of a bonding tool, since the pressing surface has a depression in the center, the polishing time is shortened and there is no sag on the periphery. is less likely to occur.
この結果、ボンディングツールの寿命が長くなるほど多
くの効果を奏する。図面の簡単な税額第１図は本発明の
ボンディングツールの−実施例による斜視図、第２図は
同じくボンディングッール先端部の一部断面図、第３図
ａ，ｂは本発明のボンディングツールおよび従来のボン
ディングツールの温度分布を示すグラフおよびべレツト
の電極位置を示す平面図、第４図ａ〜ｄは本発明の他の
実施例を示すボンディングツール先端部の底面図、第５
図はテープキャリャの組立状態を示す説明図、第６図は
従来のテープキャリャ組立用のボンディングツールの斜
視図である。As a result, the longer the life of the bonding tool, the greater the effect. Figure 1 is a perspective view of an embodiment of the bonding tool of the present invention, Figure 2 is a partial sectional view of the tip of the bonding tool, and Figures 3 a and b are views of the bonding tool of the present invention. A graph showing the temperature distribution of the tool and a conventional bonding tool, and a plan view showing the electrode position of the beret; FIGS. 4a to d are bottom views of the tip of the bonding tool showing other embodiments of the present invention;
The figure is an explanatory view showing the assembled state of the tape carrier, and FIG. 6 is a perspective view of a conventional bonding tool for assembling the tape carrier.
１・・・・・・リード、２・・・・・・絶縁テープ、３
・・・・・・キャリャテープ、４……チップ、６……電
極（バンプ）、６・・・・・・チップ搭載用孔、７・・
・・・・ボンディングツール、８……ヒータ、９……ボ
ンディングツール、１０…・・・押圧面、１１・・・・
・・押圧面、２０・・・…ボンディングツール、２１…
…ヒータ、２２…・・・本体、２３・・・・・・取付用
軸、２４…・・・押圧部、２５・・・・・・押圧面、２
６・・・・・・窪み。1...Lead, 2...Insulating tape, 3
...Carrier tape, 4...Chip, 6...Electrode (bump), 6...Chip mounting hole, 7...
... Bonding tool, 8 ... Heater, 9 ... Bonding tool, 10 ... Pressing surface, 11 ...
... Pressing surface, 20 ... Bonding tool, 21 ...
... Heater, 22 ... Main body, 23 ... Mounting shaft, 24 ... Pressing part, 25 ... Pressing surface, 2
6... Depression.
力ｌ図矛２図 力５図 汐４図 劣５図 矛６図Power l Zuzu 2 force 5 diagram Shio 4 map 5th grade Spear 6
Claims (1)
で、その下端にほぼ円形で前記円柱より直径の小さい平
面部を有する本体と（ｃ） 上記本体の円柱状部を横に
貫通するように設けられたヒータ挿入孔と（ｄ） 上記
ヒータ挿入孔に取付けられた円柱状のヒータと（ｅ）
上記本体下部の円形平面の中央に設けられた４角形の突
出平面よりなる押圧部と（ｆ） 上記押圧部の中央に設
けられた窪みよりなることを特徴とするボンデイングツ
ール。[Scope of Claims] 1. (a) A cylindrical mounting shaft; and (b) a substantially cylindrical shape attached to the lower end of the mounting shaft, and a substantially circular flat portion having a smaller diameter than the cylindrical column at the lower end. (c) a heater insertion hole provided to laterally penetrate the cylindrical portion of the main body; (d) a cylindrical heater attached to the heater insertion hole; and (e)
A bonding tool comprising: (f) a pressing part made of a rectangular protruding plane provided at the center of the circular plane of the lower part of the main body; and (f) a depression provided at the center of the pressing part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10987977A JPS6020896B2 (en) | 1977-09-14 | 1977-09-14 | bonding tools |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10987977A JPS6020896B2 (en) | 1977-09-14 | 1977-09-14 | bonding tools |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5443677A JPS5443677A (en) | 1979-04-06 |
| JPS6020896B2 true JPS6020896B2 (en) | 1985-05-24 |
Family
ID=14521475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10987977A Expired JPS6020896B2 (en) | 1977-09-14 | 1977-09-14 | bonding tools |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6020896B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01156283U (en) * | 1988-04-15 | 1989-10-26 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04146636A (en) * | 1990-10-09 | 1992-05-20 | Matsushita Electric Ind Co Ltd | Film carrier tape |
-
1977
- 1977-09-14 JP JP10987977A patent/JPS6020896B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01156283U (en) * | 1988-04-15 | 1989-10-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5443677A (en) | 1979-04-06 |
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