JPS60211B2 - Thermosetting resin casting equipment - Google Patents
Thermosetting resin casting equipmentInfo
- Publication number
- JPS60211B2 JPS60211B2 JP13655275A JP13655275A JPS60211B2 JP S60211 B2 JPS60211 B2 JP S60211B2 JP 13655275 A JP13655275 A JP 13655275A JP 13655275 A JP13655275 A JP 13655275A JP S60211 B2 JPS60211 B2 JP S60211B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- raw material
- resin
- cavity
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 3
- 238000010125 resin casting Methods 0.000 title claims 2
- 239000002994 raw material Substances 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 238000007872 degassing Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- UKUVVAMSXXBMRX-UHFFFAOYSA-N 2,4,5-trithia-1,3-diarsabicyclo[1.1.1]pentane Chemical compound S1[As]2S[As]1S2 UKUVVAMSXXBMRX-UHFFFAOYSA-N 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明は熱硬化性樹脂等の溶融状あるいは液状の原料(
以下原料樹脂という)を金型内へ注入し、金型内へイン
サートされている物へ含浸させる注型装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for processing molten or liquid raw materials such as thermosetting resins (
This invention relates to a casting device that injects raw material resin (hereinafter referred to as raw material resin) into a mold and impregnates an object inserted into the mold.
従来コイル等に前記原料樹脂を含浸させて絶縁体等にす
る注型方法は第1図のようにインサートとなるべきコイ
ル等(図略)を挿入した金型1を真空タンク2内へ入れ
、原料樹脂がコイルの間に良〈浸込むように金型1内を
図示してない真空ポンプ等により矢印aから脱気するよ
うにするとともに前記真空タンク2を原料樹脂の硬化促
進のため図示してない加熱器により加熱するようになっ
ており、金型1内の温度と真空度が所定値に達したとき
、原料タンク3内の原料樹脂4を弁5を開いて金型1内
が原料樹脂で充満されるまで注入した後、同金型1を真
空タンク2より取出し、図示してない硬化炉に移して硬
化させるようになっていた。In the conventional casting method, a coil or the like is impregnated with the raw material resin to form an insulator or the like, as shown in Fig. 1, a mold 1 into which a coil or the like (not shown) to be an insert is inserted is placed into a vacuum tank 2. The interior of the mold 1 is evacuated in the direction of arrow a using a vacuum pump (not shown) so that the raw material resin penetrates well between the coils, and the vacuum tank 2 (not shown) is used to promote hardening of the raw resin. When the temperature and degree of vacuum inside the mold 1 reach a predetermined value, the raw material resin 4 in the raw material tank 3 is heated by a heater that does not contain the raw material. After injecting resin until it is filled with resin, the mold 1 is taken out from the vacuum tank 2 and transferred to a curing furnace (not shown) for curing.
しかし、金型1内の原料樹脂の硬化にあたっては硬化に
よる収縮のために起きるポィドや残留応力が発生するた
め低温度で長時間のうちに除々に硬化させるのが普通で
あった。However, when curing the raw material resin in the mold 1, pods and residual stress are generated due to shrinkage due to curing, so it is common to harden gradually at low temperatures over a long period of time.
そのため成形サイクルが長いうえ、原料樹脂の硬化のた
め長時間にわたり金型を置いておくためのスペースを多
く必要とし、生産性が悪いという欠点があった。本発明
は上記の欠点を取除き、成形サイクルの短い生産性の良
い含浸洋型装置を提供することであり、さらに詳しく本
発明について説明すると、従来より比較的生産性の良い
方法として用いられている加圧ゲル化法、即ち高反応性
の原料樹脂を使用し「金型を加熱して硬化を早くさせる
とともに急激な硬化による収縮分を補うため新に未硬化
の樹脂を金型内に注入する装置で、コイル等の間に原料
樹脂が良く浸込むように金型内を真空にする真空装置を
設けた装置である。本発明の実施例を第2図により説明
すると、11は原料タンク12に入れられた原料樹脂で
樹脂通路13を介して金型14へ原料樹脂を注入するノ
ズル15へ蓬通している。As a result, the molding cycle is long, and a large amount of space is required to leave the mold for a long time in order to harden the raw material resin, resulting in poor productivity. The purpose of the present invention is to eliminate the above-mentioned drawbacks and provide a highly productive impregnating machine with a short molding cycle. The pressure gelation method uses a highly reactive raw material resin, heats the mold to speed up curing, and injects new uncured resin into the mold to compensate for the shrinkage caused by rapid curing. This device is equipped with a vacuum device that evacuates the inside of the mold so that the raw material resin penetrates well between the coils, etc. An embodiment of the present invention will be explained with reference to FIG. 2, where 11 is a raw material tank. The raw resin contained in the mold 12 is passed through a resin passage 13 to a nozzle 15 for injecting the raw resin into the mold 14.
前記ノズル15には空気圧により前記ノズル15の先端
部にあるノズル孔16を開閉するように作動する弁体1
7が設けられていて、前記原料樹脂11の金型14への
注入を制御するようになっている。そして金型14はヒ
ータ等の加熱装置18により加熱が可能であり、ノズル
15および後述する固定板および移動板とは断熱板19
を設けるとともに金型キャビティ20より空気等を抜く
吸引孔21が設けられている。22は真空チャンバで固
定板23に取付られ同移動板23を底とし、移動板24
側が閉口しており、固定板23および移動板に取付られ
た金型が閉じて一体に係合したとき、前記移動板24と
真空チャンバ22の閉口縁がパッキン25を介して当援
するようになっている。The nozzle 15 has a valve body 1 that operates to open and close a nozzle hole 16 at the tip of the nozzle 15 using air pressure.
7 is provided to control the injection of the raw material resin 11 into the mold 14. The mold 14 can be heated by a heating device 18 such as a heater, and the nozzle 15 and the fixed plate and moving plate described later are connected to a heat insulating plate 19.
At the same time, a suction hole 21 for removing air etc. from the mold cavity 20 is provided. A vacuum chamber 22 is attached to a fixed plate 23, with the movable plate 23 as the bottom, and a movable plate 24.
The side is closed, and when the molds attached to the fixed plate 23 and the movable plate are closed and engaged together, the movable plate 24 and the closed edge of the vacuum chamber 22 are supported through the packing 25. It has become.
前記真空チャンバ22には内部の空隙部26および金型
キャビティ20内の空気等を脱気するために脱気孔35
が設けてあり電磁切換弁27を介して真空ポンプ28に
より脱気が可能となっている。29は前記金型キャビテ
ィ20内から脱気を行うための吸引孔21の開閉を行う
栓で空気シリンダ3川こより作動し、金型キャビティ2
0内が所定の真空度となり原料樹脂11が注入される直
前に前記吸引孔21を閉鎖するようになっている。The vacuum chamber 22 is provided with a degassing hole 35 for degassing the air inside the internal cavity 26 and the mold cavity 20.
is provided, and degassing is possible with a vacuum pump 28 via an electromagnetic switching valve 27. Reference numeral 29 denotes a plug that opens and closes the suction hole 21 for deaerating the inside of the mold cavity 20, and is operated from the air cylinder 3, and the mold cavity 2
The suction hole 21 is closed immediately before the inside of the chamber reaches a predetermined degree of vacuum and the raw resin 11 is injected.
31は電磁切襖弁で前記原料タンク12内の脱気を制御
するものである。Reference numeral 31 is an electromagnetic gate valve for controlling degassing in the raw material tank 12.
32は前記原料タンク12内に空気を送り込み加圧する
ための空気供給回路を開閉するための電磁切換弁である
。32 is an electromagnetic switching valve for opening and closing an air supply circuit for feeding and pressurizing air into the raw material tank 12.
以上のように構成されており、次に本発明による装置の
作用動作について説明すると、注型にあたり栓26を後
退(図中左向)させ電磁切換弁2T,31をB位置とし
て真空回路を閉鎖しておき、金型キャビテイ20内にイ
ンサートとなるコイル(図路)を所定位置に入れる。The operation of the apparatus according to the present invention, which is constructed as described above, will be explained next. During pouring, the stopper 26 is moved back (toward the left in the figure), and the electromagnetic switching valves 2T and 31 are set to the B position to close the vacuum circuit. Then, a coil (diagram) serving as an insert is placed in the mold cavity 20 at a predetermined position.
次いで移動板24が前進(図中上向)し、金型14が閉
じると〜ノズル15の弁体17がノズル孔16を塞ぎ、
電磁切換弁27,31をA位置にすると、真空チヤンバ
22、キヤビテイ20および原料タンク12内が所定の
真空度になると空気シリンダ30‘こより栓29が金型
14の吸引孔21を閉じ〜ノズル孔16が開かれて原料
タンク内の原料樹脂11は自重により樹脂通路13を経
てノズル15よりキヤビティ20内へ注入される。この
際「原料タンク12内およびキヤビティ20内は脱気状
態にあり、空気等は入っていないので注型時に気泡等が
出来ることがない。Then, when the moving plate 24 moves forward (upward in the figure) and the mold 14 closes, the valve body 17 of the nozzle 15 closes the nozzle hole 16,
When the electromagnetic switching valves 27 and 31 are set to the A position, when the vacuum chamber 22, cavity 20, and raw material tank 12 reach a predetermined degree of vacuum, the air cylinder 30' causes the plug 29 to close the suction hole 21 of the mold 14 to the nozzle hole. 16 is opened, and the raw material resin 11 in the raw material tank is injected into the cavity 20 from the nozzle 15 via the resin passage 13 due to its own weight. At this time, the inside of the raw material tank 12 and the inside of the cavity 20 are in a deaerated state and no air or the like is present, so that no air bubbles are formed during casting.
また原料樹脂11は自重で降下してキャビティ20内に
入るが真空吸引を断ち、即ち電磁切換弁31をB位置と
して大気圧に通じるリーク弁33を絞り弁34を介して
開くと原料タンク12内とキャビティ20内は差圧が生
じるので原料樹脂11はキャビティ20内に入りやすく
することも出来る。Further, the raw material resin 11 descends under its own weight and enters the cavity 20, but when the vacuum suction is cut off, that is, the electromagnetic switching valve 31 is set to the B position and the leak valve 33 communicating with atmospheric pressure is opened via the throttle valve 34. Since a pressure difference occurs inside the cavity 20, the raw resin 11 can easily enter the cavity 20.
再び前述の作用動作に戻り説明を続けると、キャビティ
20内に樹脂が充満し、真空状態を解いても気泡等を巻
き込む心配がなくなった時点で電磁切換弁27および3
1をB位置として真空回路を閉じ電磁切換弁32をA位
置とすると原料タンク12内は加圧状態となりキャビテ
ィ20内に注入されている原料樹脂は加圧され、金型1
4に設けられた加熱装置18の加熱による作用で硬化が
促進されるとともに、キャビティ20内の収縮には未硬
化の原料樹脂1 1が原料タンク12内を加圧すること
によりキャビティ20内に補充されるので、従来のよう
なボィドや硬化収縮による亀裂や残留応力等の影響が生
じない。Returning again to the above-mentioned operation and continuing the explanation, when the cavity 20 is filled with resin and there is no need to worry about air bubbles being drawn in even if the vacuum state is released, the electromagnetic switching valves 27 and 3 are closed.
When the vacuum circuit is closed and the electromagnetic switching valve 32 is set to A position, the inside of the raw material tank 12 becomes pressurized, and the raw material resin injected into the cavity 20 is pressurized, and the mold 1
Curing is accelerated by the heating action of the heating device 18 provided at 4, and when the cavity 20 contracts, uncured raw material resin 11 is replenished into the cavity 20 by pressurizing the raw material tank 12. This eliminates the effects of voids, cracks due to curing shrinkage, residual stress, etc. that occur in the past.
本実施例は長いリード線を有するコイル等の成形の例で
あり、リード線が金型キャビティ外へ出る場合を仮定し
て説明したが、リード線等がない物、あるいは有っても
短かくて金型内に収納する空所を設けられるときは金型
外周の真空チャンバは不要である。This example is an example of molding a coil etc. with a long lead wire, and the explanation was given assuming that the lead wire comes out of the mold cavity. When a cavity is provided in the mold for storage, a vacuum chamber around the mold is unnecessary.
第1図は従来例を示す図。
第2図は本発明による実施例を示す図。11……原料樹
脂、12・…・・原料タンク「 15・…・・ノズル、
17・・・・・・弁体、18・・・・・・加熱装置、2
0・・・・・・金型キヤビテイ、21・・・・・・吸引
孔、22…・・・真空チャンバト28…・・・真空ポン
プ、29…・・・栓。
汐′函
次2図FIG. 1 is a diagram showing a conventional example. FIG. 2 is a diagram showing an embodiment according to the present invention. 11... Raw material resin, 12... Raw material tank 15... Nozzle,
17... Valve body, 18... Heating device, 2
0... Mold cavity, 21... Suction hole, 22... Vacuum chamber 28... Vacuum pump, 29... Plug. Shio'kanji figure 2
Claims (1)
状で他端が開口しており、移動板に取付た移動金型が前
記固定金型と係合したとき前記他端の開口縁がパツキン
を介して移動板に接し、前記枠内を気密状態に保つよう
にされた真空ダクト、b 固定金型と移動金型が係合し
、一体となってキヤビテイを形成したとき前記真空ダク
トで外側を抱囲されるとともに、前記キヤビテイより真
空ダクト内へ連通する吸引孔が開閉可能に形成されてい
る金型、c 内部にノズル孔を開閉する弁体を有する原
料樹脂を注入するバルブノズル、d 内部に原料樹脂を
貯え、加圧、減圧が可能とされた前記バルブノズルへ原
料樹脂を供給する原料タンク、e 前記真空ダクト内お
よびキヤビテイ内から空気等を脱気するとともに、前記
原料タンクの減圧するよう配管された真空配管装置、f
前記バルブノズルの弁体および金型の吸引孔の開閉を
制御し、かつ原料タンク内に貯えられた原料を加圧する
ための空気配管装置、g 前記金型を加熱し、キヤビテ
イ内に注入された原料樹脂の硬化を促進させる加熱ヒー
タより成る熱硬化性樹脂の注型装置。1 a One end is frame-shaped with a fixed plate for attaching a fixed mold as the bottom, and the other end is open, and when the movable mold attached to the movable plate engages with the fixed mold, the opening edge of the other end a vacuum duct which is in contact with the movable plate through a gasket to keep the inside of the frame airtight; b) the vacuum duct when the fixed mold and the movable mold are engaged and integrally form a cavity; a mold that is surrounded on the outside by a mold and has a suction hole that can be opened and closed and that communicates from the cavity to the inside of the vacuum duct; (c) a valve nozzle for injecting raw resin that has a valve body that opens and closes the nozzle hole inside; , d a raw material tank that stores raw resin therein and supplies the raw resin to the valve nozzle that can be pressurized and depressurized; e a raw material tank that deaerates air etc. from the vacuum duct and cavity a vacuum piping device piped to reduce the pressure of f
an air piping device for controlling the opening and closing of the valve body of the valve nozzle and the suction hole of the mold, and pressurizing the raw material stored in the raw material tank; A thermosetting resin casting device consisting of a heater that accelerates the curing of raw resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13655275A JPS60211B2 (en) | 1975-11-13 | 1975-11-13 | Thermosetting resin casting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13655275A JPS60211B2 (en) | 1975-11-13 | 1975-11-13 | Thermosetting resin casting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5260855A JPS5260855A (en) | 1977-05-19 |
| JPS60211B2 true JPS60211B2 (en) | 1985-01-07 |
Family
ID=15177877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13655275A Expired JPS60211B2 (en) | 1975-11-13 | 1975-11-13 | Thermosetting resin casting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60211B2 (en) |
-
1975
- 1975-11-13 JP JP13655275A patent/JPS60211B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5260855A (en) | 1977-05-19 |
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