JPS6021420B2 - air bearing device - Google Patents
air bearing deviceInfo
- Publication number
- JPS6021420B2 JPS6021420B2 JP15523477A JP15523477A JPS6021420B2 JP S6021420 B2 JPS6021420 B2 JP S6021420B2 JP 15523477 A JP15523477 A JP 15523477A JP 15523477 A JP15523477 A JP 15523477A JP S6021420 B2 JPS6021420 B2 JP S6021420B2
- Authority
- JP
- Japan
- Prior art keywords
- holes
- air
- plating
- thin plate
- bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000007772 electroless plating Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 9
- 229910000906 Bronze Inorganic materials 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 239000010974 bronze Substances 0.000 description 7
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 7
- 238000005339 levitation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000005553 drilling Methods 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000006179 pH buffering agent Substances 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- -1 platinum metals Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Advancing Webs (AREA)
Description
【発明の詳細な説明】
本発明は微小孔から吹き出す空気によって磁気テープを
支持する空気ベアリング装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an air bearing device that supports a magnetic tape by air blown out from microholes.
本来、磁気テープ装置における空気ベアリングは内部に
加圧空気を有し、ベアリング面の微小孔から外部に空気
を吹き出すことによって磁気テープとベアリング面間に
厚さ40〜50ムwの空気険を形成し磁気テープを浮揚
させている。Originally, air bearings in magnetic tape devices have pressurized air inside, and by blowing the air out from micro holes in the bearing surface, an air gap of 40 to 50 mm thick is formed between the magnetic tape and the bearing surface. The magnetic tape is levitated.
一般に磁気テープの浮揚量はテープ張力と磁気テープ面
に附与される空気圧によって決められる。この磁気テー
プ面に附与される空気圧は空気ベアリング内の加圧空気
の圧力よりも低く、ベアリング面の微小孔の径と配列に
左右される。磁気テープ記録では磁気テープを正確な通
路上におくため空気ベアIJング上の磁気テープの浮揚
量の変動は許容出来る程小さくなければならないし、し
かも磁気テープの張力や加圧空気の圧力の変動に対して
小さい事が必要である。このような条件を満足する空気
ベアリングの微小孔は、実験によると磁気テ−プの浮揚
基が50山凧程度の場合、孔径が0.1豚から0.05
凧の微小であることが確認された。しかし、このような
微小孔を比較的板厚の厚いベアリング面に直俵ドリル等
の機械加工であげることは困難である。すなわち、ドリ
ルによる孔あげ加工能力は孔径の5倍の板厚に孔をあげ
るのが限度であり、また空気ベアリング面のように多数
孔をあげるような場合はドリルの磨耗、加工時間などの
問題があり、一般に微小径の孔あげの目安として孔径よ
り深く切り込めないと考えるのが普通である。従って、
孔径が0.1風や0.05岬の場合、ドリルで加工しう
る板厚は0.1凧や0.05肌と極めて薄くなってしま
う。しかし、板厚の薄いマンドルでは剛性がなく容易に
変形し精確なべアリング面が縛られないという相反する
問題がある。そこでこの問題を回避する為、従釆ベアリ
ング面として透過率の小さい多孔質材を用いてテープを
浮揚させていたが、これは加工性が極めて悪く表面の研
削や研磨時において孔を埋める、いわゆる目づまりを起
こしベアリング面に対し不均一な配列となって磁気テー
プの浮揚が不均一になってしまう欠点がある。Generally, the amount of levitation of a magnetic tape is determined by tape tension and air pressure applied to the surface of the magnetic tape. The air pressure applied to this magnetic tape surface is lower than the pressure of the pressurized air in the air bearing, and depends on the diameter and arrangement of the micropores in the bearing surface. In magnetic tape recording, in order to place the magnetic tape on a precise path, fluctuations in the amount of levitation of the magnetic tape on the air bearing IJ must be tolerably small, and also fluctuations in the tension of the magnetic tape and the pressure of pressurized air. It is necessary to do something small. Experiments have shown that the micropores of air bearings that satisfy these conditions have a hole diameter of 0.1 to 0.05 when the floating base of the magnetic tape is about 50 kites.
It was confirmed that the kite was tiny. However, it is difficult to create such minute holes in a relatively thick bearing surface by machining using a straight barrel drill or the like. In other words, the drilling ability with a drill is limited to drilling holes in a plate thickness that is five times the hole diameter, and when drilling multiple holes such as on an air bearing surface, there are problems such as drill wear and processing time. As a general rule of thumb for drilling micro-diameter holes, it is common to think that it is impossible to cut deeper than the hole diameter. Therefore,
If the hole diameter is 0.1 or 0.05, the thickness of the board that can be drilled with a drill will be extremely thin, such as 0.1 or 0.05. However, a thin mandle has contradictory problems in that it lacks rigidity and easily deforms, and the precise bearing surface is not constrained. Therefore, in order to avoid this problem, the tape was floated using a porous material with low transmittance as the secondary bearing surface, but this was extremely difficult to process and filled the holes when grinding or polishing the surface. There is a drawback that clogging occurs and the magnetic tape becomes non-uniformly arranged with respect to the bearing surface, resulting in non-uniform floating of the magnetic tape.
また他の空気ベアリング面として第1図及び第2図に示
すものがある。Other air bearing surfaces are shown in FIGS. 1 and 2.
第1図は空気ベアリングの構成図を示し、第2図は断面
図である。第1図及び第2図に示す空気ベアリングは、
側面の肉厚の厚い中空円柱状のベアリング支持体1の側
面に機械加工が容易な程度の比較的大きな孔2をあげ、
一方薄板3に0.1凧以下の微小孔4をあげ、ベアリン
グ支持体1と薄板3の微小孔の中心が合致するように両
者を婆合したものである。しかし、この構造では薄板の
厚さが孔径と同じかそれ以下の場合には機械加工又はエ
ッチング法などによって微4・孔をあげることが可能で
あるが、この場合(1)薄板であっても多数の微小孔を
ドリルであげることは極めて加工時間がかかり能率が思
い。FIG. 1 shows a configuration diagram of an air bearing, and FIG. 2 is a sectional view. The air bearing shown in Figures 1 and 2 is
A relatively large hole 2 that can be easily machined is formed in the side surface of a hollow cylindrical bearing support 1 with a thick side wall.
On the other hand, the thin plate 3 is provided with a minute hole 4 of 0.1 size or less, and the bearing support 1 and the thin plate 3 are fitted together so that the centers of the minute holes coincide with each other. However, in this structure, if the thickness of the thin plate is the same as or less than the hole diameter, it is possible to make micro holes by machining or etching, but in this case (1) even if it is a thin plate, Drilling a large number of small holes takes a lot of processing time and reduces efficiency.
(0)エッチング法では、孔径が薄板3の厚さ以下の孔
あげは可能であり、また孔あげは容易で加工時間も機械
加工よりも短縮できるという利点はあるが、孔径が0.
1肋以下になると孔の加工精度が悪くバラツキも大きく
なり、更にはベアリング面の一部に孔のあかないことも
起こり、ベアリング面上に均一な空気膜を形成し難い。(0) With the etching method, it is possible to make a hole with a hole diameter equal to or less than the thickness of the thin plate 3, and it has the advantage that it is easy to make the hole and the processing time can be shorter than with machining, but if the hole diameter is 0.
When the number of holes is less than one row, the accuracy of hole machining becomes poor and variations become large, and furthermore, some holes may not be formed on the bearing surface, making it difficult to form a uniform air film on the bearing surface.
皿)ベアリング支持体1は剛性があり変形しないが、薄
板3の厚さは微小孔4の孔径と同じかそれ以下のため薄
板3は剛性に乏しく空気ベアリング内の加圧空気の圧力
によって容易に変形し、空気ベアリングに必要な精確な
表面形状を維持し難い。などの欠点がある。Although the bearing support 1 is rigid and does not deform, the thickness of the thin plate 3 is the same as or smaller than the diameter of the microhole 4, so the thin plate 3 has poor rigidity and is easily deformed by the pressure of the pressurized air in the air bearing. deforms and is difficult to maintain the precise surface geometry required for air bearings. There are drawbacks such as.
本発明は上述のようなベアリング支持体に薄板を接合し
た空気ベアリングにおける欠点を解消し、磁気テープを
ベアリング面上に均一に浮揚し、しかも浮揚量の変動が
少ない空気ベアリング装置を提供するものである。The present invention eliminates the drawbacks of the air bearing in which a thin plate is bonded to the bearing support as described above, and provides an air bearing device that levitates the magnetic tape uniformly on the bearing surface and has less fluctuation in the amount of levitation. be.
本発明を図にもとづいて説明する。The present invention will be explained based on the drawings.
第3図は本発明の空気ベアリング装置の一実施例のベア
リング面を構成する薄板の微小孔部分の断面図である。
微小孔の形成はまずフオトェツチングによってリン青銅
板等の比較的板厚の小さい金属薄板6に孔8をあげる。
この場合エッチング法では板厚より小さな径の孔をあげ
ると孔の精度が悪くバラッキも大きくなるため板厚の2
倍以上の孔径にし、孔の加工精度の低下を回避する。次
にこの金属薄板6に無電解〆ッキを行なうと金属薄板の
両面にメッキ層7が形成され同時にエッチングによる孔
8の局縁にもメッキ層が形成される。FIG. 3 is a sectional view of a microhole portion of a thin plate forming a bearing surface of an embodiment of the air bearing device of the present invention.
To form the microholes, holes 8 are first formed in a relatively thin metal plate 6 such as a phosphor bronze plate by photoetching.
In this case, with the etching method, if the holes are made with a diameter smaller than the plate thickness, the precision of the holes will be poor and the variation will be large, so
Make the hole diameter more than double to avoid deterioration in hole machining accuracy. Next, when this thin metal plate 6 is subjected to electroless plating, a plating layer 7 is formed on both sides of the thin metal plate, and at the same time, a plating layer is also formed on the edges of the holes 8 formed by etching.
メッキは微小孔9が所要の径になるまで続ける。このよ
うにメッキすることにより板厚が大きくなって剛性を増
し、又孔の径は小さくなるという二重の効果がある。無
電解〆ツキの基板となる金属薄板6は上記リン青銅板の
他、無電解〆ッキが可能な金属板であれば使用できる。Plating is continued until the micropores 9 have the required diameter. Plating in this manner has the dual effect of increasing the plate thickness and increasing rigidity, and also reducing the diameter of the holes. In addition to the phosphor bronze plate mentioned above, any metal plate that is capable of electroless finishing can be used as the thin metal plate 6 that serves as a substrate for electroless finishing.
無電解〆ツキの種類も特に限定されるものではなく、イ
オン状態からの還元が困難でない金属であればよい。よ
く知られているものとしては銅、ニッケル、ニッケル合
金(Ni一Co、Ni一Co−P等)、コバルト、コバ
ルト合金(Co−Fe一P、Co−W−P等)、クロム
、スズ、銀、金、白金属金属(パラジウム、白金、ロジ
ウム、ルテニウム)等を挙げることができる。これらの
うち特にコバルト、ク。ム、パラジウム等は硬いので傷
のつき難いメッキ層を形成でき、又、鋼以外は空気中で
化学的に安定であるのでベアリング表面の防錆効果も果
す。さらにニッケル合金、コバルト、コバルト合金等は
磁性体であるので、磁気テープに影響を及ぼす懸念もあ
るが、メッキ層は薄く、磁気テープの保磁力が十分に大
きいので、影響は無視することができる。この無電藤メ
ッキの工程を、リン青銅板にニッケルメッキを行う場合
を例にして説明する。The type of electroless finish is not particularly limited, and any metal may be used as long as it is not difficult to reduce from an ionic state. Well-known examples include copper, nickel, nickel alloys (Ni-Co, Ni-Co-P, etc.), cobalt, cobalt alloys (Co-Fe-P, Co-W-P, etc.), chromium, tin, Examples include silver, gold, platinum metals (palladium, platinum, rhodium, ruthenium), and the like. Among these, especially cobalt and cobalt. Since aluminum, palladium, etc. are hard, they can form a plating layer that is hard to scratch, and other materials other than steel are chemically stable in the air, so they also have a rust-preventing effect on the bearing surface. Furthermore, since nickel alloys, cobalt, cobalt alloys, etc. are magnetic materials, there is a concern that they may affect the magnetic tape, but since the plating layer is thin and the coercive force of the magnetic tape is sufficiently large, the effect can be ignored. . The process of electroless plating will be explained using an example in which nickel plating is performed on a phosphor bronze plate.
まずリン青銅板を脱脂処理し、水洗した後パラジウムメ
ッキを行う。パラジウムメッキは1その水溶液中に塩化
パラジウム0.1夕と濃塩酸10の上を含む〆ッキ浴中
にリン青銅板を6q砂程度浸潰して行う。パラジウムメ
ッキはニッケルメッキの触媒として必要な工程である。
このパラジウムメッキを施したリン青銅板を水洗した後
、ニッケルメッキ格に浸潰してニッケルメッキを行う。
ニッケルメッキ格の組成の一例を挙げれば、1その水溶
液中に硫酸ニッケル30夕、次亜リン酸ナトリウム(還
元剤)10夕、酢酸ナトリウム(pH緩衝剤、鍔化剤)
10夕を含み軸4.5〜5.5に調整され90℃前後に
保たれた酸性格である。このようなニッケルメッキの一
例として0.1帆の板厚のリン青銅板に0.2風径の孔
をエッチング法であげ、その上に0.05凧の厚さに無
電解〆ツキを行うと、板厚が0.2肋、孔径が0.1帆
の孔をもつ薄板が得られた。First, the phosphor bronze plate is degreased, washed with water, and then palladium plated. Palladium plating is carried out by immersing a phosphor bronze plate in about 6 q of sand in a plating bath containing 0.1 part of palladium chloride and 10 parts of concentrated hydrochloric acid in the aqueous solution. Palladium plating is a necessary process as a catalyst for nickel plating.
After washing the palladium-plated phosphor bronze plate with water, it is immersed in nickel plating to perform nickel plating.
An example of a composition for nickel plating is: 1) In the aqueous solution, 30 parts of nickel sulfate, 10 parts of sodium hypophosphite (reducing agent), and 10 parts of sodium acetate (pH buffering agent, galvanizing agent).
It has an acidic character that is adjusted to an axis of 4.5 to 5.5 and maintained at around 90°C. As an example of such nickel plating, holes with a diameter of 0.2 wind are etched on a phosphor bronze plate with a thickness of 0.1 sail, and then electroless finishing is performed on the holes to a thickness of 0.05 sail. A thin plate with a thickness of 0.2 ribs and a hole of 0.1 rib diameter was obtained.
他のニッケル浴及び上記例示の他の金属のメッキ格につ
いても知られているが、例えば「金属表面工業全書、無
電鱗メッキ・亀鏡」(横書店発行、昭和47年)にも記
載されているので割愛する。Other nickel baths and plating grades of other metals as exemplified above are also known; for example, they are also described in "Metal Surface Industry Complete Book, Electroless Scale Plating/Kamegami" (published by Yokoshoten, 1972). I will omit it because there is.
本発明‘こよる空気べァリングの空気供給孔の作成にお
いて、初めにあげる孔は要求するものより大きな孔で良
いので、容易にしかも孔径の精度も良く、バラツキを小
さくすることができ、次のメッキ処理ではメッキ層は初
めの孔形状に追従するためメッキ後の孔径の精度も良い
。特に無電解ニッケルメッキの場合メッキ層は時間と相
関の関係にあるので空気ベアリングの孔径をメッキ時間
によって制御できる特徴がある。第4図は本発明の一実
施例を示すもので、第3図で示した如き構成をもつ薄板
を従来の菱贋(第1図及び第2図)と同じようにベアリ
ング支持体に巻きつけて接合した空気ベアリングの構成
図である。In creating the air supply holes of the air bearing according to the present invention, the first hole to be made can be larger than the required hole, so it is easy to make, the accuracy of the hole diameter is good, and the variation can be reduced. In the plating process, the plating layer follows the initial hole shape, so the accuracy of the hole diameter after plating is good. In particular, in the case of electroless nickel plating, the plating layer has a correlation with time, so the hole diameter of the air bearing can be controlled by the plating time. FIG. 4 shows an embodiment of the present invention, in which a thin plate having the structure shown in FIG. FIG. 3 is a configuration diagram of an air bearing joined together.
また第5図は第4図に示す空気ベアリングの断面図であ
る。1は第1図及び第2図と同機に内部に加圧空気源を
有するベアリング支持体でその側面には薄板にあげる微
づ・孔の孔配列と同じ配列で孔径の大きな孔2を穿設し
てある点も同様である。Further, FIG. 5 is a sectional view of the air bearing shown in FIG. 4. 1 is the same bearing support as shown in Figures 1 and 2, and has a pressurized air source inside, and holes 2 with large diameters are drilled on the side of the bearing support in the same arrangement as the holes in the thin plate. The same applies to the points mentioned above.
11は第3図に示したメッキ後の薄板である。11 is the plated thin plate shown in FIG.
本発明による空気ベアリング装置で磁気テーブの浮揚量
の実験を行なったが、空気圧、テープ張力の変動に対し
て変動の少ないテープ浮揚を美現することが出釆た。例
えば、ベアリング装置の空気供給孔の径を0.1風とす
るとき、空気圧500±low舷日20、テープ張力6
.6士2夕/肌の変動に対し磁気テープの浮揚量の変動
は44±5山肌であった。本実施例ではベアリング支持
体1の側面に円周に沿って溝10を設け、そこに接着剤
を充填して薄板11を接合している。Experiments were conducted on the amount of magnetic tape levitation using the air bearing device according to the present invention, and it was found that the tape levitation could be achieved with little variation in air pressure and tape tension. For example, when the diameter of the air supply hole of the bearing device is 0.1 air, the air pressure is 500±low, the ship's day is 20, and the tape tension is 6.
.. The variation in the amount of levitation of the magnetic tape was 44±5 peaks relative to the variation in the skin. In this embodiment, a groove 10 is provided along the circumference on the side surface of the bearing support 1, and a thin plate 11 is bonded to the groove by filling the groove with an adhesive.
このように溝を設けることによりベアリング支持体1と
薄板1 1の均一な接合が達成できる。以上説明したよ
うに本発明によれば空気ベアリングにおいて薄板にメッ
キを行なうことによって孔径を制御し、精度の長い微小
孔を形成するとともに板厚を厚くして変形し‘こく〈空
気ベアリング面を持つ空気ベアリング装直を達成するこ
とができる。By providing the grooves in this manner, uniform bonding between the bearing support 1 and the thin plate 11 can be achieved. As explained above, according to the present invention, by plating a thin plate in an air bearing, the hole diameter is controlled, a long precision hole is formed, and the plate thickness is thickened so that it is not deformed and has a hard air bearing surface. Air bearing refitting can be achieved.
図面の節単な説明
第1図は従来のベアリング装置を示す分解図、第2図は
第1図に示すベアリング装置の断面図、第3図は本発明
における薄板の小孔の断面図、第4図は本発明の空気ベ
アリング装置の一実施例を示す分解図、第5図は第4図
に示したベアリング菱道の断面図である。BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is an exploded view showing a conventional bearing device, FIG. 2 is a sectional view of the bearing device shown in FIG. 1, FIG. 3 is a sectional view of a small hole in a thin plate according to the present invention, FIG. 4 is an exploded view showing one embodiment of the air bearing device of the present invention, and FIG. 5 is a sectional view of the bearing rhombus shown in FIG. 4.
図中1はベアリング支持体、2はベアリング支持体の孔
、3は薄板、4は薄板の微小孔、5はテープ、6は金属
簿板、7はメッキ層、8は金属薄板の微小孔、9はメッ
キ後の微小孔、10は溝、11はメッキ後の薄板を表わ
す。In the figure, 1 is a bearing support, 2 is a hole in the bearing support, 3 is a thin plate, 4 is a small hole in the thin plate, 5 is a tape, 6 is a metal board, 7 is a plating layer, 8 is a small hole in a thin metal plate, 9 represents a microhole after plating, 10 represents a groove, and 11 represents a thin plate after plating.
才2図 オ3図 オ1図 オ4図 オ5図2nd figure Figure 3 Figure 1 Figure 4 Figure 5
Claims (1)
したベアリング支持体の側面に、前記孔と同じ配列状態
に微小孔を穿設した薄板を前記孔と微小孔とを対応して
合致するように接合し、前記ベアリング支持体内部より
微小孔を経て空気を噴出せしめその空気膜によつてテー
プを浮揚し支持する空気ベアリング装置において、前記
薄板は所要寸法より大きな直径の微小孔をあけた金属薄
板にこの微小孔が所要の径になるまで無電解メツキが施
されてなることを特徴とする空気ベアリング装置。1. A thin plate with micro holes drilled in the same arrangement as the holes is placed on the side surface of the bearing support body, which has a hollow cylindrical side surface with a large number of relatively large diameter holes, so that the holes and the micro holes correspond to each other. In an air bearing device in which air is jetted from the inside of the bearing support through micro holes and the tape is suspended and supported by the air film, the thin plate has micro holes with a diameter larger than the required size. An air bearing device characterized in that a drilled thin metal plate is subjected to electroless plating until the minute holes reach the required diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15523477A JPS6021420B2 (en) | 1977-12-22 | 1977-12-22 | air bearing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15523477A JPS6021420B2 (en) | 1977-12-22 | 1977-12-22 | air bearing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5487203A JPS5487203A (en) | 1979-07-11 |
| JPS6021420B2 true JPS6021420B2 (en) | 1985-05-27 |
Family
ID=15601459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15523477A Expired JPS6021420B2 (en) | 1977-12-22 | 1977-12-22 | air bearing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6021420B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4414588A (en) * | 1980-04-11 | 1983-11-08 | Ampex Corporation | Fluid bearing tape scanning drum |
| JP2017036146A (en) * | 2015-08-14 | 2017-02-16 | 富士フイルム株式会社 | Web guidance device |
-
1977
- 1977-12-22 JP JP15523477A patent/JPS6021420B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5487203A (en) | 1979-07-11 |
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